XRP2527EVB

X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch July 2011 Rev. 1.1.0 GENERAL DESCRIPTION APPLICATIONS The XRP2527 and XRP2528 devices are respectively single and dual channel integrated high-side power distribution switches with independent enables, fault flags and precise programmable current limit thresholds. A wide 1.8V to 5.5V input voltage range allows for operations from industry standard 1.8V, 3.3V and 5V power rails. Current limit thresholds can be programmed accurately and independently for each channel via an external resistor. A simple setting optimizes the XRP2527 and XRP2528 for use in USB 2.0 or 3.0 compliant VBUS power distribution architectures. These devices can be used in any self or bus powered USB applications. The power-switch rise and fall times are controlled to minimize current surges during turn on/off. Built-in over current, under voltage lockout (UVLO), reverse current and over temperature protections insure safe operations under abnormal operating conditions. XRP2527 and XRP2528 are offered respectively in RoHS compliant “green”/halogen free 3mm x 3mm 8-pin and 10-pin TDFN packages.  Generic Power Switching  Self Powered USB 2.0 and 3.0 Hubs  USB Compliant VBUS Power Distribution  Audio-Video Equipments FEATURES  Single/Dual Channel Current Switch  1A per channel capable  1.8V to 5.5V Input Voltage Range  Programmable Over-Current Limit  300mA to 1A set via external resistor  ±8% threshold accuracy at 1A  USB 2.0/3.0 Compliant  Individual Channel Enable  Individual Channel Fault Flag Indicator  Under voltage Lockout, Reverse Current and Thermal Shutdown Protection  RoHS Compliant, Green/Halogen Free 8-Pin and 10-Pin TDFN Package TYPICAL APPLICATION DIAGRAM Fig. 1: XRP2528 Application Diagram Exar Corporation 48720 Kato Road, Fremont CA 94538, USA www.exar.com Tel. +1 510 668-7000 – Fax. +1 510 668-7001 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch ABSOLUTE MAXIMUM RATINGS OPERATING RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Input Voltage Range VIN ............................. 1.75V to 5.5V Junction Temperature Range ....................-40°C to 125°C Thermal Resistance θJA ................................................. TDFN-8L .................................................... 43.0°C/W TDFN-10L .................................................. 40.5°C/W VIN .......................................................... -0.3V to 7.0V VEN, VFLG ............................................................... 7.0V Storage Temperature .............................. -65°C to 150°C Power Dissipation ................................ Internally Limited Lead Temperature (Soldering, 10 sec) ................... 300°C ESD Rating (HBM - Human Body Model) .................... 2kV ESD Rating (MM - Machine Model) ...........................200V ELECTRICAL SPECIFICATIONS Specifications are for an Operating Junction Temperature of TJ = 25°C only; limits applying over the full Operating Junction Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise indicated, VIN = 1.8V to 5.5V, CIN = 47µF//1 µF, COUT = 10µF, TJ = –40°C to 125°C. Parameter Input Supply Voltage Min. Typ. 1.8 Max. Units Conditions 5.5 V • Input Quiescent Current 80 150 µA • XRP2528, (Both Channels enabled) VIN=5V, IOUT1 = IOUT2 =0mA Input Quiescent Current 52 100 µA • XRP2527 and XRP2528 (1 Channel enabled) VIN=5V, IOUT1 =0mA 3 µA • VIN=5V, Channel(s) disabled Input Shutdown Current Maximum Output Current per channel A 1 • XRP2527 and XRP2528. RSET=100kΩ Output Leakage Current 10 µA VIN=5V, VOUT=0V, Each channel, Switch off Reverse Leakage Current 10 µA 140 mΩ VIN=0V, VOUT=5V, Each channel, Switch off • IOUT=0.3A, Each channel µs VIN=5V, RL=10Ω, COUT=1µF, each output Output MOSFET Resistance 80 Output turn-on delay 1000 Output turn-on rise time 2000 4000 µs VIN=5V, RL=10Ω, COUT=1µF, each output Output turn-off delay 10 20 µs VIN=5V, RL=10Ω, COUT=1µF, each output Output turn-off fall time 22 50 µs 0.90 1.15 1.4 A 0.68 0.85 1.02 A VIN=5V, RL=10Ω, COUT=1µF, each output • VIN – VOUT =0.3V, RSET floating, USB 3.0 • VIN – VOUT =0.3V, RSET tied to VIN, USB 2.0 1 A Current limit threshold Current limit threshold range Current limit threshold accuracy 0.3 1 Short Circuit Current Limit 1.087 1.174 A • RSET=100kΩ for ILIM(min)=1A, VIN-VOUT=0.3V 0.66xILIM A 925 mV 3 A Over temperature shutdown threshold 135 °C Temperature rising Over temperature shutdown threshold hysteresis 10 °C Temperature decreasing V VIN rising or falling Output Voltage Short Circuit Detect Threshold Safe Operating Area (SOA) Current Limit Under-voltage lockout threshold Under-voltage lockout hysteresis FLG output logic low voltage FLG output high leakage © 2011 Exar Corporation 1.55 1.68 1.75 50 100 VOUT =0V Device operates in short circuit current limit mode when output voltage is below the threshold. mV 250 mV 1 µA 2/13 IFLG=10mA, VIN=5.5V Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch Parameter Min. FLG blanking time EN input logic high voltage Typ. Units -1 0 Conditions ms V • 0.5 V • 1 µA 1.5 EN input logic low voltage EN input leakage current Max. 10 VEN=0V or VEN=5.5V BLOCK DIAGRAM Fig. 2: XRP2527-XRP2528 Block Diagrams © 2011 Exar Corporation 3/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch PIN ASSIGNMENT XRP2528   ENA 1 10 OUTA FLGA 2 9 IN FLGB 3 ENB RSETA 11 8 GND 4 7 OUTB 5 6 RSETB GND TDFN-10L 3mm x 3mm Fig. 3: XRP2527/28 Pin Assignment PIN DESCRIPTION – XRP2527 Name Pin Number Description EN 1 Channel Enable Input FLG 2 Error Flag Signal Active low open drain output. Active on over-current, over-temperature or UVLO conditions. GND 3 NC 5,6 IN 7 Voltage Input Pin OUT 8 Voltage Output Pin 4 Current Limiting Threshold setting RSET floating: USB 3.0 current limit settings RSET tied to IN: USB 2.0 current limit settings RSET tied to GND via resistor R: Adjustable current limit RSET Ground Signal No Connect PIN DESCRIPTION – XRP2528 Name Pin Number ENX 1,4 Channel Enable Input Description FLGX 2,3 Error Flag Signal Active low open drain output. Active on over-current, over-temperature or UVLO conditions. GND 8 Ground Signal IN 9 Voltage Input Pin OUTX 7,10 RSETX 5,6 Voltage Output Pin Current Limiting Threshold setting RSET floating: USB 3.0 current limit settings RSET tied to IN: USB 2.0 current limit settings RSET tied to GND via resistor R: Adjustable current limit ORDERING INFORMATION Part Number Temperature Range Marking 2527I YYWW 1 XRP2527IHBTR-1-F X 2528I XRP2528IHB-1-F YYWW 1 -40°C≤TA≤+85°C XRP2528IHBTR-1-F X XRP2527 Evaluation Board XRP2527EVB XRP2528 Evaluation Board XRP2528EVB XRP2527IHB-1-F -40°C≤TA≤+85°C Package TDFN8 TDFN10 Packing Quantity Bulk 2.5K/Tape & Reel Bulk 2.5K/Tape & Reel Note 1 Note 2 Lead Free and Halogen Free Single Channel Active high Lead Free and Halogen Free Dual Channel Active high “YY” = Year – “WW” = Work Week – “X” = Lot Number © 2011 Exar Corporation 4/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch TYPICAL PERFORMANCE CHARACTERISTICS All data taken at VIN = 5V, CIN = 47µF//1µF, COUT = 10µF, TJ = TA = 25°C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Output On-Resistance vs. Temperature (XRP2527) Fig. 5: Output On-Resistance vs. Temperature (XRP2528) Fig. 7: Quiescent Current vs. Temperature Fig. 6: Off Supply Current vs. Temperature XRP2527 and XRP2528 (1-channel on) Fig. 8: Quiescent Current vs. Temperature Fig. 9: FLG Logic Low Voltage vs. Temperature XRP2528 (2-channels on) © 2011 Exar Corporation 5/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch Fig. 10: Quiescent Current vs. Input Voltage XRP2527 and XRP2528 (1-channel on) Fig. 11: Quiescent Current vs. Input Voltage XRP2528 (2-channels on) Fig. 12: Output Turn-Off Delay vs. Temperature Fig. 13: Output Turn-on Delay vs. Temperature Fig. 14: Output Fall Time vs. Temperature Fig. 15: Output Rise Time vs. Temperature © 2011 Exar Corporation 6/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch Fig. 16: Output Turn-Off Delay Time vs. Input Voltage Fig. 17: Output Turn-On Delay Time vs. Input Voltage Fig. 18: Output Fall Time vs. Input Voltage Fig. 19: Output Rise Time vs. Input Voltage Fig. 20: Current Limit Threshold vs. Temperature (XRP2527) Fig. 21: Current Limit Threshold vs. Temperature (XRP2528) © 2011 Exar Corporation 7/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch Current limit Threshold vs. RSET resistor XRP2527 & XRP2528 (Both channels) Current limit Threshold (mA) 1200 1000 800 600 400 200 0 100 150 200 250 300 350 RSET (kOhm) VIN=5V VIN=3.3V VIN=1.8V Fig. 22: Under-voltage lockout trip level vs. Temperature (VIN Rising) Fig. 23: Current Limit Threshold vs. RSET resistor value Fig. 24: Turn-On, Turn-Off Characteristics (XRP2528): Fig. 25: Turn-On, Turn-Off Characteristics (XRP2528): COUT = 1uF, Rload = 10Ω, RSET floating COUT = 1uF, Rload = 5Ω, RSET floating Fig. 26: Current Limit Operation (XRP2527): Fig. 27: Current Limit Operation (XRP2528): VIN=5.5V, Rload = 3.9Ω, USB3.0 VIN=1.8V, Rload = 1.5Ω, USB2.0 © 2011 Exar Corporation 8/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch Fig. 28: Current Limit Operation (XRP2527): VIN=5V, Rload = 10Ω, RSET = 330kΩ Over-temperature and under voltage lockout conditions are flagged immediately while the output over – current condition is reported if continuously persistent for longer than the blanking time of 10ms. The blanking time prevents erroneous reporting of current faults due to brief output current spikes. THEORY OF OPERATION The XRP2527 and XRP2528 devices are respectively single and dual channel integrated high-side power distribution switches with programmable current limit threshold feature. They can be used in any self or bus powered USB applications and are compliant with the latest USB 3.0 specifications. The reverse current protection feature prevents current to flow from OUT to IN when the device is disabled. Once activated, the error flag signal remains low until all fault conditions have been removed and is independent for each individual channel. INPUT & OUTPUT CURRENT LIMIT Placing bulk capacitances of at least 47μF and 10μF at the input and output pins respectively reduces power supply transients under heavy current load conditions. The current limit feature protects the output MOSFET switches from damages resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. Upon detection of overcurrent condition, the output current is limited to a constant current limit threshold value and the output voltage is reduced accordingly. Triggering the current limit function is signaled by the Error Flag after 10ms of blanking time period. It is important to place a 1μF ceramic bypass capacitor from IN to GND as close as possible to the device in order to control supply transients. Furthermore, bypassing the output pin with a 0.1μF to 1μF ceramic capacitor improves the device response to short-circuit transients. The minimum current limit threshold can be programmed from 300mA to 1A set via an external resistor at the RSET pin. If RSET pin is left floating, then the device is set to USB 3.0 current limit setting. For USB 2.0 current limit setting, the RSET pin must be tied to VIN. The current limit threshold value is set using the resistor at RSET pin by the following equation: ERROR FLAG The error flag signal (FLGX output pin) is an open-drain output and is pulled low (active low) upon detection of the following conditions:    Over-current condition Over-temperature condition Under voltage lockout condition © 2011 Exar Corporation 9/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch typ. A preventing any damages to the device while a fault condition is reported by the error flag signal. A built-in 10°C hysteresis allows the device to cool down to 125°C before resuming normal operations on the faulty channel at which point the error flag signal is cleared. 108.7 kohm Please note that the allowed values for RSET resistor are 100kohm < RSET < 330kohm. UNDER-VOLTAGE LOCKOUT TEST CIRCUIT Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.68V, even if the switch is enabled. Upon detection of an input voltage below approximately 1.68V, the power switch is turned off while a fault condition is reported by the error flag signal. THERMAL PROTECTION Internal thermal sensing circuitry monitors the operating temperature of the device for each channel independently. Upon detection of a temperature in excess of 135°C, the power switch for the given channel is disabled © 2011 Exar Corporation 10/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch PACKAGE SPECIFICATION 8-PIN TDFN © 2011 Exar Corporation 11/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch 10-PIN TDFN © 2011 Exar Corporation 12/13 Rev. 1.1.0 X RP 2 5 2 7 - X RP 2 5 2 8 Single/Dual Channel Adjustable Current Power Distribution Switch REVISION HISTORY Revision Date 1.0.0 05/13/2011 Initial release of datasheet Description 1.1.0 07/14/2011 Corrections of typographical errors FOR FURTHER ASSISTANCE Email: customersupport@exar.com Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx? EXAR CORPORATION HEADQUARTERS AND SALES OFFICES 48720 Kato Road Fremont, CA 94538 – USA Tel.: +1 (510) 668-7000 Fax: +1 (510) 668-7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. or its in all Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. © 2011 Exar Corporation 13/13 Rev. 1.1.0