ES29BDS160ET-90RTGI

E S II ES Excel Semiconductor inc. ES29LV400E 4Mbit(512Kx 8/256K x 16) CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Single power supply operation - 2.7V -3.6V for read, program and erase operations • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC SOFTWARE FEATURES • Sector Structure - 16Kbyte x 1, 8Kbyte x 2, 32Kbyte x 1 boot sectors - 64Kbyte x 7sectors • Top or Bottom boot block - ES29LV400ET for Top boot block device - ES29LV400EB for Bottom boot block device • Package Options - 48-pin TSOP - 48-ball FBGA ( 6 x 8 mm ) - Pb-free packages - All Pb-free products are RoHS-Compliant • Low Vcc write inhibit • Manufactured on 0.18um process technology • Compatible with JEDEC standards - Pinout and software compatible with single-power supply flash standard • • • • • Erase Suspend / Erase Resume Data# poll and toggle for Program/erase status Unlock Bypass program Autoselect mode Auto-sleep mode after tACC + 30ns HARDWARE FEATURES • Hardware reset input pin ( RESET#) - Provides a hardware reset to device - Any internal device operation is terminated and the device returns to read mode by the reset • Ready/Busy# output pin ( RY/BY#) - Provides a program or erase operational status about whether it is finished for read or still being progressed • Sector protection / unprotection ( RESET# , A9 ) - Hardware method of locking a sector to prevent any program or erase operation within that sector - Two methods are provided : - In-system method by RESET# pin - A9 high-voltage method for PROM programmers • Temporary Sector Unprotection ( RESET# ) - Allows temporary unprotection of previously protected sectors to change data in-system DEVICE PERFORMANCE • Read access time - 70ns / 90ns • Program and erase time - Program time : 6us/byte, 8us/word ( typical ) - Sector erase time : 0.7sec/sector ( typical ) • Power consumption (typical values) - 200nA in standby or automatic sleep mode - 7mA active read current at 5 MHz - 15mA active write current during program or erase ES29LV400E 1 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. GENERAL PRODUCT DESCRIPTION The ES29LV400 is a 4 megabit, 3.0 volt-only flash memory device, organized as 512K x 8 bits (Byte mode) or 256K x 16 bits (Word mode) which is configurable by BYTE#. Four boot sectors and seven main sectors are provided : 16Kbytes x 1, 8Kbytes x 2, 32Kbytes x 1 and 64Kbytes x 7. The device is manufactured with ESI’s proprietary, high performance and highly reliable 0.18um CMOS flash technology. The device can be programmed or erased in-system with standard 3.0 Volt Vcc supply ( 2.7V-3.6V) and can also be programmed in standard EPROM programmers. The device offers minimum endurance of 100,000 program/erase cycles and more than 10 years of data retention. The ES29LV400 offers access time as fast as 70ns, allowing operation of high-speed microprocessors without wait states. Three separate control pins are provided to eliminate bus contention : chip enable (CE#), write enable (WE#) and output enable (OE#). All program and erase operation are automatically and internally performed and controlled by embedded program/erase algorithms built in the device. The device automatically generates and times the necessary high-voltage pulses to be applied to the cells, performs the verification, and counts the number of sequences. Some status bits (DQ7, DQ6 and DQ5) read by data# polling or toggling between consecutive read cycles provide to the users the internal status of program/erase operation: whether it is successfully done or still being progressed. The ES29LV400 is completely compatible with the JEDEC standard command set of single power supply Flash. Commands are written to the internal command register using standard write timings of microprocessor and data can be read out from the cell array in the device with the same way as used in other EPROM or flash devices. ES29LV400E 2 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. PRODUCT SELECTOR GUIDE Family Part Number Voltage Range Speed Option Max Access Time (ns) CE# Access (ns) OE# Access (ns) 70 70 70 35 ES29LV400 2.7 ~ 3.6V 90 90 90 40 FUNCTION BLOCK DIAGRAM RY/BY# Vcc Vss Vcc Detector Timer/ Counter DQ0-DQ15(A-1) Analog Bias Generator WE# RESET# Command Register Write State Machine Input/Output Buffers Sector Switches Data Latch/ Sense Amps Y-Decoder A Y-Decoder Address Latch CE# OE# BYTE# X-Decoder Cell Array Chip Enable Output Enable Logic ES29LV400E 3 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. PIN DESCRIPTION Pin A0-A17 DQ0-DQ14 DQ15/A-1 CE# OE# WE# RESET# BYTE# RY/BY# Vcc Vss NC 18 Addresses 15 Data Inputs/Outputs DQ15 (Data Input/Output, Word Mode) A-1 (LSB Address Input, Byte Mode) Chip Enable Output Enable Write Enable Hardware Reset Pin, Active Low Selects 8-bit or 16-bit mode Ready/Busy Output 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) Device Ground Pin Not Connected Internally Description LOGIC SYMBOL 18 A0 ~ A17 DQ0 ~ DQ15 (A-1) 16 or 8 CE# OE# WE# RESET# BYTE# RY/BY# ES29LV400E 4 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. CONNECTION DIAGRAM A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# NC A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48-Pin Standard TSOP ES29LV400 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# Vss DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 Vcc DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# Vss CE# A0 48-Ball FBGA (6 x 8 mm) (Top View, Balls Facing Down) A B C D E F G H 6 A13 A12 A14 A15 A16 BYTE# DQ15/ A-1 Vss 5 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 4 WE# RESET# NC NC DQ5 DQ12 Vcc DQ4 3 RY/ BY# NC NC NC DQ2 DQ10 DQ11 DQ3 2 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 1 A3 A4 A2 A1 A0 CE# OE# Vss ES29LV400E 5 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. DEVICE BUS OPERATIONS Several device operational modes are provided in the ES29LV400 device. Commands are used to initiate the device operations. They are latched and stored into internal registers with the address and data information needed to execute the device operation. The available device operational modes are listed in Table 1 with the required inputs, controls, and the resulting outputs. Each operational mode is described in further detail in the following subsections. on the device address inputs produce valid data on the device data outputs. The device stays at the read mode until another operation is activated by writing commands into the internal command register. Refer to the AC read cycle timing diagrams for further details ( Fig. 16 ). Word/Byte Mode Configuration ( BYTE# ) The device data output can be configured by BYTE# into one of two modes : word and byte modes. If the BYTE# pin is set at logic ‘1’, the device is configured in word mode, DQ0 - DQ15 are active and controlled by CE# and OE#. If the BYTE# pin is set at logic ‘0’, the device is configured in byte mode, and only data I/O pins DQ0 - DQ7 are active and controlled by CE# and OE#. The data I/O pins DQ8 - DQ14 are tristated, and the DQ15 pin is used as an input for the LSB (A-1) address. Read The internal state of the device is set for the read mode and the device is ready for reading array data upon device power-up, or after a hardware reset. To read the stored data from the cell array of the device, CE# and OE# pins should be driven to VIL while WE# pin remains at VIH. CE# is the power control and selects the device. OE# is the output control and gates array data to the output pins. Word or byte mode of output data is determined by the BYTE# pin. No additional command is needed in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses Standby Mode When the device is not selected or activated in a system, it needs to stay at the standby mode, in which current consumption is greatly reduced with outputs in the high impedance state. ES29LV400E 6 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. The device enters the CMOS standby mode when CE# and RESET# pins are both held at Vcc+0.3V. (Note that this is a more restricted voltage range than VIH.) If CE# and RESET# are held at VIH, but not within Vcc+0.3V, the device will be still in the standby mode, but the standby current will be greater than the CMOS standby current (0.2uA typically). When the device is in the standby mode, only standard access time (tCE) is required for read access, before it is ready for read data. And even if the device is deselected by CE# pin during erase or programming operation, the device draws active current until the operation is completely done. While the device stays in the standby mode, the output is placed in the high impedance state, independent of the OE# input. The device can enter the deep power-down mode where current consumption is greatly reduced down to less than 0.2uA typically by the following three ways: - CMOS standby ( CE#, RESET# = Vcc + 0.3V ) - During the device reset ( RESET# = Vss + 0.3V ) - In Autosleep Mode ( after tACC + 30ns ) set-up cycle and the last cycle with the program data and addresses. In this mode, two unlock cycles are saved ( or bypassed ). Sector Addresses The entire memory space of cell array is divided into a many of small sectors: 16Kbytes x 1, 8Kbytes x 2, 32Kbytes x 1 and 64Kbytes x 7 main sectors. In erase operation, a single sector, multiple sectors, or the entire device (chip erase) can be selected for erase. The address space that each sector occupies is shown in detail in the Table 3-4. Autoselect Mode Flash memories are intended for use in applications where the local CPU alters memory contents. In such applications, manufacturer and device identification (ID) codes must be accessible while the device resides in the target system ( the so called “in-system program”). On the other hand, signature codes have been typically accessed by raising A9 pin to a high voltage in PROM programmers. However, multiplexing high voltage onto address lines is not the generally desired system design practice. Therefore, in the ES29LV400 device an autoselect command is provided to allow the system to access the signature codes without any high voltage. The conventional A9 high-voltage method used in the PROM programers for signature codes are still supported in this device. If the system writes the autoselect command sequence, the device enters the Autoselect mode. The system can then read some useful codes such as manufacturer and device ID from the internal registers on DQ7 - DQ0. Standard read cycle timings apply in this mode. In the Autoselect mode, the following three informations can be accessed through either autoselect command method or A9 high-voltage autoselect method. Refer to the Table 2. - Manufacturer ID - Device ID - Sector protection verify Refer to the CMOS DC characteristics Table 7 for further current specification. Autosleep Mode The device automatically enters a deep power-down mode called the autosleep mode when addresses remain stable for tACC+30ns. In this mode, current consumption is greatly reduced ( less than 0.2uA typical ), regardless of CE#, WE# and OE# control signals. Writing Commands To write a command or command sequences to initiate some operations such as program or erase, the system must drive WE# and CE# to VIL, and OE# to VIH. For program operations, the BYTE# pin determines whether the device accepts program data in bytes or words. Refer to “BYTE# timings for Write Operations” in the Fig. 19 for more information. Hardware Device Reset ( RESET# ) The RESET# pin provides a hardware method of resetting the device to read array data. When the RESET# pin is driven low for at least a period of tRP , Unlock Bypass Mode To reduce more the programming time, an unlockbypass mode is provided. Once the device enters this mode, only two write cycles are required to initiate the programming operation instead of four cycles in the normal program command sequences which are composed of two unlock cycles, program ES29LV400E 7 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once after the device is ready to accept another command sequence, to ensure data integrity. Sector protection can be implemented via two methods. - In-system protection - A9 High-voltage protection To check whether the sector protection was successfully executed or not, another operation called “protect verification” needs to be performed after the protection operation on a sector. All protection and protect verifications provided in the device are summarized in detail at the Table 1. CMOS Standby during Device Reset Current is reduced for the duration of the RESET# pulse. When RESET# is held at Vss + 0.3V, the device draws the greatly reduced CMOS standby current ( ICC4 ). If RESET# is held at VIL but not within Vss+0.3V, the standby current will be greater. In-System Protection “In-system protection”, the primary method, requires VID (11.5V~12.5V) on the RESET# with A6=0, A1=1, and A0=0. This method can be implemented either in-system or via programming equipment. This method uses standard microprocessor bus cycle timing. Refer to Fig. 26 for timing diagram and Fig. 2 for the protection algorithm. RY/BY# and Terminating Operations If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is completed, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether the reset operation is completed. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed within a time of tREADY (not during Embedded Algorithms). The system can read data after the RESET# pin returns to VIH, which requires a time of tRH. A9 High-Voltage Protection “High-voltage protection”, the alternate method intended only for programming equipment, must force VID (11.5~12.5V) on address pin A9 and control pin OE# with A6=0, A1=1 and A0=0. Refer to Fig. 28 for timing diagram and Fig. 4 for the protection algorithm. RESET# tied to the System Reset The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the system to read the bootup firmware from the Flash memory.Refer to the AC Characteristics tables for RESET# parameters and to Fig. 17 for the timing diagram. SECTOR UNPROTECTION The previously protected sectors must be unprotected before modifying any data in the sectors. The sector unprotection algorithm unprotects all sectors in parallel. All unprotected sectors must first be protected prior to the first sector unprotection write cycle to avoid any over-erase due to the intrinsic erase characteristics of the protection cell. After the unprotection operation, all previously protected sectors will need to be individually re-protected. Standard microprocessor bus cycle timings are used in the unprotection and unprotect verification operations. Three unprotect methods are provided in the ES29LV400 device. All unprotection and unprotect verification cycles are summarized in detail at the Table 1. - In-system unprotection - A9 High-voltage unprotection - Temporary sector unprotection SECTOR PROTECTION The ES29LV400 features hardware sector protection. In the device, sector protection is performed on the sector previously defined in the Table 3-4. Once after a sector is protected, any program or erase operation is not allowed in the protected sector. The previously protected sectors must be unprotected by one of the unprotect methods provided here before changing data in those sectors. ES29LV400E 8 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. In-System Unprotection “In-system unprotection”, the primary method, requires VID (11.5V~12.5V) on the RESET# with A6=1, A1=1, and A0=0. This method can be implemented either in-system or via programming equipment. This method uses standard microprocessor bus cycle timing. Refer to Fig. 26 for timing diagram and Fig. 3 for the unprotection algorithm. The command register and all internal program/ erase circuits are disabled, and the device resets to the read mode. Subsequent writes are ignored until Vcc is greater than VLKO. The system must provide proper signals to the control pins to prevent unintentional writes when Vcc is greater than VLKO. Write Pulse “Glitch” Protection Noise pulses of less than 5ns (typical) on OE#, CE# or WE# do not initiate a write cycle. A9 High-Voltage Unprotection “High-voltage unprotection”, the alternate method intended only for programming equipment, must force VID (11.5~12.5V) on address pin A9 and control pin OE# with A6=1, A1=1 and A0=0. Refer to Fig. 29 for timing diagram and Fig. 5 for the unprotection algorithm. Logical inhibit Write cycles are inhibited by holding any one of OE#=VIL, CE#=VIH or WE#=VIH. To initiate a write cycle, CE# and WE# must be a logical zero while OE# is a logical one. Temporary Sector Unprotect This feature allows temporary unprotection of previously protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET# pin to VID (11.5V-12.5V). During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the RESET# pin, all the previously protected sectors are protected again. Fig. 1 shows the algorithm, and Fig. 25 shows the timing diagrams for this feature. Power-up Write Inhibit If WE#=CE#=VIL and OE#=VIH during power up, the device does not accept any commands on the rising edge of WE#. The internal state machine is automatically reset to the read mode on power-up. START HARDWARE DATA PROTECTION The ES29LV400 device provides some protection measures against accidental erasure or programming caused by spurious system level signals that may exist during power transition. During power-up, all internal registers and latches in the device are cleared and the device automatically resets to the read mode. In addition, with its internal state machine built-in the device, any alteration of the memory contents or any initiation of new operationcan only occur after successful completion of specific command sequences. And several features are incorporated to prevent inadvertent write cycles resulting from Vcc power-up and power-down transition or system noise. RESET# = VID (Note 1) Perform Erase or Program Operations RESET# = VIH Temporary Sector Unprotect Completed (Note 2) Notes: 1. All protected sectors are unprotected . 2. All previously protected sectors are protected once again. Low Vcc Write inhibit When Vcc is less than VLKO, the device does not accept any write cycles. This protects data during Vcc power-up and power-down. Figure 1. Temporary Sector Unprotect Operation 9 ES29LV400E Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Table 1. ES29LV400 Device Bus Operations DQ0 ~ DQ7 DQ8~DQ15 BYTE# = VIH DOUT (Note 3) High-Z High-Z Output Disable Reset L X Sector Protect (Note 2) Sector Unprotect (Note 2) Temporary Sector Unprotect L H X H H X L H L VID X X SA,A6=L, A1=H,A0=L SA,A6=H, A1=H,A0=L High-Z High-Z (Note 3) High-Z High-Z X X Operation CE# OE# WE# RESET# Addresses (Note 1) BYTE# = VIL DQ8~DQ14 = High-Z, DQ15 = A-1 Read Write Standby L L Vcc+ 0.3V L H X H L H H Vcc+ 0.3V AIN AIN X DOUT (Note 3) High-Z X In-system L H L VID (Note 3) X X X X X VID AIN SA,A9=VID, A6=L, A1=H,A0=L (Note 3) (Note 3) High-Z Sector protect A9 High-Voltage Method Sector unprotect L VID L H (Note 3) L VID L H SA,A9=VID, A6=H, A1=H,A0=L (Note 3) High-Z Legend: L=Logic Low=VIL, H=Logic High=VIH, VID=11.5-12.5V, X=Don’t Care, SA=Sector Address, AIN=Address In, DIN=Data In, DOUT=Data Out Notes: 1. Addresses are A17:A0 in word mode (BYTE#=VIH) , A17:A-1 in byte mode (BYTE#=VIL). 2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector Protection and Unprotection” section. 3. DIN or DOUT as required by command sequence, data polling, or sector protection algorithm. Table 2. Autoselect Codes (A9 High-Voltage Method) A17 to A12 X X Description CE# OE# WE# A11 to A10 X X A9 A8 to A7 X X A6 A5 to A2 X X DQ8~DQ15 A1 A0 BYTE# BYTE# = VIH = VIL X 22h X X DQ7~DQ0 ManufactureID:ESI Device ID: ES29LV400 Sector Protection Verification L L L L H H VID VID VID L L L L L H 4Ah B9h(T),BAh(B) 01h(protected) 00h(unprotected) L L H SA X X L X H L X X Legend: T= Top Boot Block, B = Bottom Boot Block, L=Logic Low=VIL, H=Logic High=VIH, SA=Sector Address, X = Don’t care ES29LV400E 10 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Table 3. Top Boot Sector Addresses (ES29LV400ET) Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 Sector address A17~A12 000XXX 001XXX 010XXX 011XXX 100XXX 101XXX 110XXX 1110XX 111100 111101 11111X Sector Size (Kbytes/Kwords) 64/32 64/32 64/32 64/32 64/32 64/32 64/32 32/16 8/4 8/4 16/8 (X8) Address Range 00000h~0FFFFh 10000h~1FFFFh 20000h~2FFFFh 30000h~3FFFFh 40000h~4FFFFh 50000h~5FFFFh 60000h~6FFFFh 70000h~77FFFh 78000h~79FFFh 7A000h~7BFFFh 7C000h~7FFFFh (X16) Address Range 00000h~07FFFh 08000h~0FFFFh 10000h~17FFFh 18000h~1FFFFh 20000h~27FFFh 28000h~2FFFFh 30000h~37FFFh 38000h~3BFFFh 3C000h~3CFFFh Remark Main Sector Boot Sector 3D000h~3DFFFh 3E000h~3FFFFh Note: The addresses range is A17:A-1 in byte mode (BYTE#=VIL) or A17:A0 in word mode (BYTE#=VIH). Table 4. Bottom Boot Sector Addresses (ES29LV400EB) Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 Sector address A17~A12 00000X 000010 000011 0001XX 001XXX 010XXX 011XXX 100XXX 101XXX 110XXX 111XXX Sector Size (Kbytes/Kwords) 16/8 8/4 8/4 32/16 64/32 64/32 64/32 64/32 64/32 64/32 64/32 (X8) Address Range 00000h~03FFFh 04000h~05FFFh 06000h~07FFFh 08000h~0FFFFh 10000h~1FFFFh 20000h~2FFFFh 30000h~3FFFFh 40000h~4FFFFh 50000h~5FFFFh 60000h~6FFFFh 70000h~7FFFFh (X16) Address Range 00000h~01FFFh 02000h~02FFFh Boot Sector 03000h~03FFFh 04000h~07FFFh 08000h~0FFFFh 10000h~17FFFh 18000h~1FFFFh 20000h~27FFFh 28000h~2FFFFh 30000h~37FFFh 38000h~3FFFFh Main Sector Remark Note: The addresses range is A17:A-1 in byte mode (BYTE#=VIL) or A17:A0 in word mode (BYTE#=VIH). ES29LV400E 11 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. In-System Protection / Unprotection Method START COUNT = 1 RESET# = VID Wait 1us Protect all sectors: The indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address START COUNT = 1 RESET# = VID Wait 1us Temporary Sector Unprotect Mode No First Write Cycle = 60h? Yes Set up sector address Sector Protect: Write 60h to sector address with A6 = 0, A1 = 1, A0 = 0 Wait 150us Verify Sector Protect: Write 40h to sector address with A6 = 0, A1 = 1, A0 = 0 Read from sector address with A6 = 0, A1 = 1, A0 = 0 First Write Cycle = 60h? Yes No All sectors protected ? Yes Set up first sector address Sector Unprotect: Write 60h to sector address with A6 = 1, A1 = 1, No Temporary Sector Unprotect Mode Increment COUNT Reset COUNT = 1 Wait 15ms Verify Sector Unprotect: Write 40h to sector address with A6 = 1, A1 = 1, A0 = 0 Read from sector address with A6 = 1, A1 = 1, A0 = 0 No No Increment COUNT Set up next sector address No No COUNT=25? Yes Device failed Data = 01h? Yes Protect another sector? No Remove VID from RESET# Write reset command Sector Protect complete Yes COUNT =1000? Yes Device failed Data = 00h? Yes Last sector verified? Yes Remove VID from RESET# Write reset command Sector Unprotect complete No Figure 2. In-System Sector Protect Algorithm Figure 3. In-System Sector Unprotect Algorithm ES29LV400E 12 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. A9 High-Voltage Method Start Start Note: All sectors must be previously protected. COUNT = 1 COUNT = 1 SET A9=OE#=VID SET A9=OE#=VID Set Sector Address A CE#, A6, A0=VIL RESET#, A1=VIH CE#, A0=VIL , RESET#, A6, A1=VIH SET WE# = VIL SET WE# = VIL Wait 15ms Wait 150 us SET WE# = VIH Increase COUNT SET WE# = VIH Increase COUNT CE#,OE#,A6,A0=VIL RESET#, A1 = VIH CE#,OE#, A0=VIL RESET#, A6, A1=VIH Set Sector AddressA Read Data No No No COUNT= 25? Data = 01h? No COUNT=1000? Yes Yes Yes Device failed Protect Another Sector ? Yes Device failed The Last Sector Address ? No Remove VID from A9 and Write Reset Command Yes Remove VID from A9 and Write Reset Command No Yes Data = 00h? Increase Sector Address Read Data Sector Protection Complete Sector Unprotection Complete Figure 4. Sector Protection Algorithm (A9 High-Voltage Method) Figure 5. Sector Un-Protection Algorithm (A9 High-Voltage Method) 13 Rev.0B January 5, 2006 ES29LV400E E S II ES Excel Semiconductor inc. COMMAND DEFINITIONS Writing specific address and data commands or sequences into the command register initiates device operations. Table 5 defines the valid register command sequences. Note that writing incorrect address and data values or writing them in the improper sequence may place the device in an unknown state. A reset command is required to return the device to normal operation. All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on the rising edge of WE# or CE#, whichever happens first. Refer to the AC Characteristics section for timing diagrams. the Device Bus Operations section for more information.The Read-Only Operations table provides the read parameters, and Fig. 16 shows the timing diagram RESET COMMAND Writing the reset command resets the device to the read or erase-suspend-read mode. Address bits are don’t cares for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to which the system was writing to the read mode. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to which the system was writing to the read mode. If the program command sequence is written to a sector that is in the Erase Suspend mode, writing the reset command returns the device to the erase-suspend-read mode. Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to the read mode. If the device entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns the device to the erase-suspendread mode. If DQ5 goes high during a program or erase operation, writing the reset command returns the device to the read mode (or erase-suspend-read mode if the device was in Erase-Suspend). 14 Rev.0B January 5, 2006 READING ARRAY DATA The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is ready to read array data after completing an Embedded Program or Embedded Erase algorithm. After the device accepts an Erase Suspend command, the device enters the erase-suspend-read mode, after which the system can read data from any non-erase-suspended sector. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See the Erase Suspend/Erase Resume Commands section for more information. The system must issue the reset command to return the device to the read (or erase-suspend-read) mode if DQ5 goes high during an active program or erase operation, or if the device is in the autoselect mode. See the next section, Reset Command, for more information. See also Requirements for Reading Array Data in ES29LV400E E S II ES Excel Semiconductor inc. Command Definitions Table 5. ES29LV400 Command Definitions Command Sequence (Note 1) Read (Note 6) Reset (Note 7) Manufacturer ID Word Byte Word Byte Word Byte Word Byte Word Byte Word Byte Cycles Bus Cycles (Notes 2~5) First Addr RA XXX 555 AAA 555 AAA 555 AAA 555 AAA 555 AAA 555 AAA XXX XXX 555 AAA 555 AAA XXX XXX Data RD F0 AA 2AA 555 2AA 555 2AA 555 2AA 555 2AA 555 2AA 555 PA XXX 2AA 555 2AA 555 55 555 AAA 555 AAA 555 AAA 555 AAA 555 AAA 555 AAA 90 X00 X01 X02 X01 X02 (SA)X02 (SA)X04 PA 4A Second Addr Data Third Addr Data Fourth Addr Data Fifth Addr Data Sixth Addr Data 1 1 4 Autoselect (Note 8) Device ID (Top) 4 AA 55 90 B9 Device ID (Bottom) Sector Protect Verify (Note 9) 4 AA 55 90 BA 4 AA 55 90 00/01 Program 4 AA 55 A0 PD Unlock Bypass Unlock Bypass Program (Note 10) Unlock Bypass Reset (Note 11) Chip Erase 3 2 2 AA A0 90 AA 55 PD 00 55 20 Word Byte Word Byte 6 555 AAA 555 AAA 80 555 AAA 555 AAA AA 2AA 555 2AA 555 55 555 AAA SA 10 Sector Erase Erase Suspend (Note 12) Erase Resume (Note 13) 6 1 1 AA B0 30 55 80 AA 55 30 Legend: X = Don’t care RA = Address of the memory location to be read. RD = Data read from location RA during read operation PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE# or CE# pulse, whichever happens later. PD = Data to be programmed at location PA. Data latches on the rising edge of WE# or CE# pulse, whichever happens first. SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A17-A12 uniquely select any sector. Notes: 1. See Table 1 for description of bus operations. 2. All values are in hexadecimal. 3. Except for the read cycle and the fourth cycle of the autoselect command sequence, all bus cycles are write cycles. 4. Data bits DQ15-DQ8 are don’t care in command sequences, except for RD and PD 5. Unless otherwise noted, address bits A17-A11 are don’t cares. 6. No unlock or command cycles required when device is in read mode. 7. The Reset command is required to return to the read mode (or to the erase-suspend-read mode if previously in Erase Suspend) when a device is in the autoselect mode, or if DQ5 goes high (while the device is providing status information). 8. The fourth cycle of the autoselect command sequence is a read cycle. Data bits DQ15-DQ8 are don’t care. See the Autoselect Command Sequence section for more information. 9. The data is 00h for an unprotected sector and 01h for a protected sector. 10. The Unlock Bypass command is required prior to the UnlockBypass Program command. 11. The Unlock Bypass Reset command is required to return to the read mode when the device is in the unlock bypass mode. 12. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only during a sector erase operation. 13. The Erase Resume command is valid only during the Erase Suspend mode. ES29LV400E 15 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AUTOSELECT COMMAND The autoselect command sequence allows the host system to access the manufacturer and device codes, and determine whether or not a sector is protected, including information about factorylocked or customer lockable version. Identifier Code Manufacturer ID Device ID BYTE / WORD PROGRAM The system may program the device by word or byte, depending on the state of the BYTE# pin. Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verifies the programmed cell margin. Table 5 shows the address and data requirements for the byte program command sequence. Note that the autoselect is unavailable while a programming operation is in progress. Address 00h 01h Data 4Ah B9h(T), BAh(B) 00 / 01 Sector Protect Verify (SA)02h Table 5 shows the address and data requirements. This method is an alternative to “A9 high-voltage method” shown in Table 2, which is intended for PROM programmers and requires VID on address pin A9. The autoselect command sequence may be written to an address within sector that is either in the read mode or erase-suspend-read mode. The auto-select command may not be written while the device is actively programming or erasing. The autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle that contains the autoselect command. The device then enters the autoselect mode. The system may read at any address any number of times without initiating another autoselect command sequence. Once after the device enters the auto-select mode, the manufacture ID code ( 4Ah ) can be accessed by one of two ways. Just one read cycle ( with A6, A1 and A0 = 0 ) can be used. Or four consecutive read cycles ( with A6 = 1 and A1, A0 = 0 ) for continuation codes (7Fh) and then another last cycle for the code (4Ah) (with A6, A1 and A0 = 0) can be used for reading the manufacturer code. - 4Ah (One-cycle read) - 7Fh 7Fh 7Fh 7Fh 4Ah (Five-cycle read) START Write Program Command Sequence Embedded Program algorithm in progress Data Poll from System No Verify Data? Yes No Increment Address Last Address? Yes Programming Completed The system must write the reset command to return to the read mode (or erase-suspend-read mode if the device was previously in Erase Suspend). Note: See Table 5 for program command sequence Figure 6. Program Operation ES29LV400E 16 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Program Status Bits : DQ7, DQ6 or RY/BY# When the Embedded Program algorithm is complete, the device then returns to the read mode and addresses are no longer latched. The system can determine the status of the program operation by using DQ7, DQ6, or RY/BY#. Refer to the Write Operation Status section Table 6 for information on these status bits. During the unlock-bypass mode, only the unlockbypass program and unlock-bypass reset commands are valid. To exit the unlock-bypass mode, the system must issue the two-cycle unlock-bypass reset command sequence. The first cycle must contain the data 90h. The second cycle need to only contain the data 00h. The device then returns to the read mode. - Unlock Bypass Enter Command - Unlock Bypass Reset Command - Unlock Bypass Program Command Any Commands Ignored during Programming Operation Any commands written to the device during the Embedded Program algorithm are ignored. Note that a hardware reset can immediately terminates the program operation. The program command sequence should be reinitiated once the device has returned to the read mode, to ensure data integrity. CHIP ERASE COMMAND To erase the entire memory, a chip erase command is used. This command is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The chip erase command erases the entire memory including all other sectors except the protected sectors, but the internal erase operation is performed on a single sector base. Programming from “0” back to “1” Programming is allowed in any sequence and across sector boundaries. But a bit cannot be programmed from “0” back to a ”1”. Attempting to do so may cause the device to set DQ5 = 1, or cause the DQ7 and DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the data is still “0”. Only erase operations can convert a “0” to a “1” Embedded Erase Algorithm The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. Table 5 shows the address and data requirements for the chip erase command sequence. Note that the autoselect is unavailable while an erase operation is in progress Unlock Bypass In the ES29LV400 device, an unlock bypass program mode is provided for faster programming operation. In this mode, two cycles of program command sequences can be saved. To enter this mode, an unlock bypass enter command should be first written to the system. The unlock bypass enter command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. The device then enters the unlock-bypass program mode. A two-cycle unlock bypass program command sequence is all that is required to program in this mode. The first cycle in this sequence contains the unlock bypass program set-up command, A0h; the second cycle contains the program address and data. Additional data is programmed in the same manner. This mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in faster total programming time. Table 5 shows the requirements for the command sequence. Erase Status Bits : DQ7, DQ6, DQ2, or RY/ BY# When the Embedded Erase algorithm is complete, the device returns to the read mode and addresses are no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or RY/BY#. Refer to the Write Operation Status section Table 6 for information on these status bits. Commands Ignored during Erase Operation Any command written during the chip erase operation are ignored. However, note that a hardware ES29LV400E 17 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. reset immediately terminates the erase operation.If that occurs, the chip erase command sequence should be reinitiated once the device has returned to reading array data. to ensure data integrity. Fig. 7 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters, and Fig. 21 section for timing diagrams. to the read mode. The system must rewrite the command sequence and any additional addresses and commands. Status Bits : DQ7,DQ6,DQ2, or RY/BY# When the Sector Erase Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. Note that while the Embedded Erase operation is in progress, the system can read data from the nonerasing sector. The system can determine the status of the erase operation by reading DQ7,DQ6,DQ2, or RY/BY# in the erasing sector. Refer to the Write Operation Status section Table 6 for information on these status bits. SECTOR ERASE COMMAND By using a sector erase command, a single sector or multiple sectors can be erased. The sector erase command is a six bus cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed by the address of the sector to be erased, and the sector erase command. Table 5 shows the address and data requirements for the sector erase command sequence. Note that the autoselect is unavailable while an erase operation is in progress. Valid Command during Sector Erase Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the sector erase command Embedded Sector Erase Algorithm The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings these operations. START Write Erase Command Sequence (Notes 1,2) Sector Erase Time-out Window and DQ3 After the command sequence is written, a sector erase time-out of 50us occurs. During the time-out period, additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50 us, otherwise the last address and command may not be accepted, and erasure may begin. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase command is written. The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3:Sector Erase Timer.). The time-out begins from the rising edge of the final WE# pulse in the command sequence. Any command other than Sector Erase or Erase Suspend during the time-out period resets the device Embedded Erase algorithm in progress No Data = FFh? Yes Erasure Completed Data Poll to Erasing Bank from System No Notes: 1. See Table 5 for erase command sequence 2. See the section on DQ3 for information on the sector erase timer Figure 7. Erase Operation ES29LV400E 18 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. sequence should be reinitiated once the device has returned to reading array data, to ensure data integrity. Fig. 7 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters, and Fig. 21 section for timing diagrams. After an erase-suspended program operation is complete, the device returns to the erase-suspendread mode. The system can determine the status for the program operation using the DQ7 or DQ6 status bits, just as in the standard Byte Program operation. Refer to the Write Operation Status section for more information. ERASE SUSPEND/ERASE RESUME An erase operation is a long-time operation so that two useful commands are provided in the ES29LV400 device Erase Suspend and Erase Resume Commands. Through the two commands, erase operation can be suspended for a while and the suspended operation can be resumed later when it is required. While the erase is suspended, read or program operations can be performed by the system. Autoselect during Erase-Suspend- Read Mode In the erase-suspend-read mode, the system can also issue the autoselected command sequence. Refer to the Autoselect Mode and Autoselect Command Sequence section for details (Table 5). Erase Resume Command To resume the sector erase operation, the system must write the Erase Resume command. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after the chip has resumed erasing. Erase Suspend Command, (B0h) The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. This command is valid only during the sector erase operation, including the 50us time-out period during the sector erase command sequence. The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm. When the Erase Suspend command is written during the sector erase operation, the device requires a maximum of 20us to suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the timeout period and suspends the erase operation. Read and Program during Erase-SuspendRead Mode After the erase operation has been suspended, the device enters the erase-suspend-read mode. The system can read data from or program data to any sector not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at any address within erase-suspended sectors produces status information on DQ7-DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a sector is actively erasing or is erasesuspended. Refer to the Write Operation Status section for information on these status bits (Table 6). ES29LV400E 19 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. COMMAND DIAGRAM PA/PD Done Program 20 Unlock Bypass A0 80 AA 90 55 90 Autoselect 55 10 AA F0 Chip Erase Done Read 50us SA/30 SA/30 00 Done Sector Erase Resume 30 B0 Suspend Erasesuspend Read Figure 8. Command Diagram ES29LV400E 20 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. WRITE OPERATION STATUS In the ES29LV400 device, several bits are provided to determine the status of a program or erase operation: DQ2, DQ3, DQ5, DQ6, DQ7 and RY/BY#. Table 6 and the following subsections describe the function of these bits. DQ7 and DQ6 each offer a method for determining whether a program or erase operation is complete or in progress. The device also provides a hardware-based output signal, RY/ BY#, to determine whether an Embedded Program or Erase operation is in progress or has been completed. Erase algorithm is complete, or if the device enters the Erase Suspend mode, Data# polling produces a “1” on DQ7. The system must provide an address within any of the sectors selected for erasure to read valid status information on DQ7. Erase on the Protected Sectors After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 1.8us, then the device returns to the read mode. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected sector, the status may not be valid. DQ7 (DATA# POLLING) The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm is in progress or completed, or whether a device is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the command sequence. Data# Polling Algorithm Just prior to the completion of an Embedded Program or Ease operation, DQ7 may change asynchronously with DQ0-DQ6 while Output Enable(OE#) is asserted low. That is, this device may change from providing status information to valid data on DQ7. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed the program or erase operation and DQ7 has valid data, the data outputs on DQ0-DQ7 will appear on successive read cycles. Table 6 shows the outputs for Data# Polling on DQ7. Fig. 9 shows the Data# Polling algorithm. Fig. 22 in the AC Characteristics section shows the Data# Polling timing diagram. During Programming During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7 status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program address falls within a protected sector, Data# Polling on DQ7 is active for approximately 250ns, then the device returns to the read mode. During Erase During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded ES29LV400E 21 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. START Read DQ7-DQ0 Addr = VA DQ7 = Data ? No No DQ5 = 1 ? Yes Read DQ7-DQ0 Addr = VA Yes Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE# pulse in the command sequence ( prior to the program or erase operation), and during the sector erase time-out. During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause DQ6 to toggle. The system may use either OE# or CE# to control the read cycles. When the operation is complete, DQ6 stops toggling. The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system must also use DQ2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use DQ7(see the subsection on DQ7:Data# Polling). DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete. Table 6 shows the outputs for Toggle Bit I on DQ6. Fig. 10 shows the toggle bit algorithm. Fig. 23 in the “AC Characteristics” section shows the toggle bit timing diagrams. Fig. 24 shows the differences between DQ2 and DQ6 in graphical form. See also the subsection on DQ2 : (Toggle Bit II). Yes DQ7 = Data ? No FAIL PASS Notes: 1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being erased. During chip erase, a valid address in any non-protected sector address. 2. DQ7 should be rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5 Figure 9. Data# Polling Algorithm Toggling on the Protected Sectors RY/BY# ( READY/BUSY# ) The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command sequence. Since RY/BY# is an opendrain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to Vcc. If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is in the read mode, the standby mode, or in the erase-suspend-read mode. Table 6 shows the outputs for RY/BY#. After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for approximately 1.8us, then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. If a program address falls within a protected sector, DQ6 toggles for approximately 250ns after the program command sequence is written, then returns to reading array data. DQ2 ( TOGGLE BIT II ) The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE# pulse in the command sequence DQ2 DQ6 ( TOGGLE BIT I ) Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the ES29LV400E 22 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE# or CE# to control the read cycles.) But DQ2 cannot distinguish whether the sector is actively erasing or is erasesuspended. DQ6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to Table 6 to compare outputs for DQ2 and DQ6. Fig. 10 shows the toggle bit algorithm in flowchart form, and the section “DQ2: Toggle Bit II” explains the algorithm. See also the DQ6: Toggle Bit I subsection. Fig. 23 shows the toggle bit timing diagram. Fig. 24 shows how differently DQ2 operates compared with DQ6. START Read DQ7-DQ0 Read DQ7-DQ0 Toggle Bit = Toggle ? Yes No DQ5 = 1 ? Yes Read DQ7-DQ0 Twice No Reading Toggle Bits DQ6/DQ2 Refer to Fig. 10 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read DQ7-DQ0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on DQ7-DQ0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not completed the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, this system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of Fig. 10). Toggle Bit = Toggle ? Yes Program/Erase Operation Not Complete, Write Reset Command No Program/Erase Operation Complete Note: The system should recheck the toggle bit even if DQ5 = “1” because the toggle bit may stop toggling as DQ5 changes to “1”. See the subsections on DQ6 and DQ2 for more information. Figure 10. Toggle Bit Algorithm ES29LV400E 23 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. DQ5 ( EXCEEDED TIMING LIMITS ) DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions DQ5 produces a “1”, indicating that the program or erase cycle was not successfully completed. The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was previously programmed to “0” Only an erase operation can change a “0” back to a “1”. Under this condition, the device halts the operation, and when the timing limit has been exceeded, DQ5 produces a ”1”. Under both these conditions, the system must write the reset command to return to the read mode. DQ3 ( SECTOR ERASE TIMER ) After writing a sector erase command sequence, the system may read DQ3 to determine whether or not erasure has begun. (The sector erase time does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. When the time-out period is complete, DQ3 switches from a “0” to a”1”. If the time between additional sector erase commands from the system can be assumed to be less than 50us, the system need not monitor DQ3. See also the Sector Erase Command Sequence section. After the sector erase command is written, the system should read the status of DQ7 (Data# Polling) or DQ6 (Toggle Bit I) to ensure that the device has accepted the command sequence, and then read DQ3. If DQ3 is “1”, the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored until the erasure operation is complete. If DQ3 is “0”, the device will accept additional sector erase commands. To ensure the command has been accepted, the system software should check the status of DQ3 prior to and following each subsequent sector erase command. If DQ3 is high on the second status check, the last command might not have been accepted. In Table 6, DQ3 status operation is well defined and summarized with other status bits, DQ7, DQ6, DQ5, and DQ2. Table 6. Write Operation Status Status Standard Mode Embedded Program Algorithm Embedded Erase Algorithm Erase Suspended Sector Non-Erase Suspended Sector DQ7 (Note 2) DQ7# 0 1 Data DQ7# DQ6 Toggle Toggle No toggle Data Toggle DQ5 (Note 1) 0 0 0 Data 0 DQ3 N/A 1 N/A Data N/A DQ2 (Note 2) No toggle Toggle Toggle Data N/A RY/ BY# 0 0 1 1 0 Erase Suspend Mode Erase-SuspendRead Erase-Suspend-Program Notes : 1. DQ5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. Refer to the section on DQ5 for more information. 2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details. ES29LV400E 24 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages ..............................................-65oC to +150oC Ambient Temperature with Power Applied ...........................................-65oC to +125oC 20ns +0.8V Vss-0.5V Vss-2.0V 20ns Voltage with Respect to Ground 20ns Vcc (Note 1) ..........................................................-0.5V to +4.0V A9, OE# and RESET# (Note 2) ........................-0.5V to +12.5V All other pins (Note 1) ...................................-0.5V to Vcc + 0.5V Negative Overshoot Output Short Circuit Current (Note 3) ................. 200 mA 20ns Notes: 1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, input or I/O pins may overshoot Vss to -2.0V for periods of up to 20ns. Maximum DC voltage on input or I/O pins is Vcc+0.5V. See Fig. 11. During voltage transition, input or I/O pins may overshoot to Vcc+2.0V for periods up to 20ns. See Fig. 11. 2. Minimum DC input voltage on pins A9, OE# and RESET# is -0.5V . During voltage transitions, A9, OE# and RESET# may overshoot Vss to -2.0V for periods of up to 20ns. See Fig. 11. Maximum DC input voltage on pin A9 is +12.5V which may overshoot to +14.0V for periods up to 20ns. 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this datasheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. 20ns Vcc+2.0V Vcc+0.5V 2.0V 20ns Positive Overshoot Figure 11. Maximum Overshoot Waveform OPERATING RANGES Industrial (I) Devices Ambient Temperature (TA).................................-40oC to +85oC Commercial Devices Ambient Temperature (TA)....................................0oC to +70oC Vcc Supply Voltages Vcc for all devices ............................................2.7V to 3.6V Operating ranges define those limits between which the functionality of the device is guaranteed. ES29LV400E 25 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. DC CHARACTERISTICS Table 7. CMOS Compatible Parameter Symbol ILI ILIT ILR ILO Parameter Description Input Load Current Test Conditions VIN=Vss to Vcc Vcc=Vcc max Vcc=Vcc max; A9=12.5V Vcc=Vcc max; RESET#=12.5V Vout=Vss to Vcc, Vcc=Vcc max 5MHz Min Typ Max + 1.0 Unit uA A9 Input Load Current RESET# Input Load Current Output Leakage Current 35 35 + 1.0 7 2 7 2 15 0.2 0.2 0.2 12 4 uA uA uA ICCI Vcc Active Read Current (Notes 1,2) CE#=VIL OE#=VIH, Byte mode CE#=VIL, OE#=VIH, Word mode 1MHz 5MHz 1MHz mA 12 4 30 10 10 10 mA uA uA uA ICC2 ICC3 ICC4 ICC5 VIL VIH VID VOL VOH1 Vcc Active Write Current (Note 2,3) Vcc Standby Current (Note 2) Vcc Reset Current (Note 2) Automatic Sleep Mode (Notes2,4) Input Low Voltage Input High Voltage Voltage for Autoselect and Temporary Sector Unprotect Output Low Voltage CE#=VIL, OE#=VIH, WE#=VIL CE#, RESET#= Vcc+0.3V RESET#=Vss + 0.3V VIH = Vcc + 0.3V VIL = Vss + 0.3V -0.5 0.7xVcc Vcc = 3.0V + 10% IOL = 4.0 mA, Vcc = Vcc min IOH = -2.0mA, Vcc = Vcc min 0.85 Vcc 11.5 0.5 Vcc+0.3 12.5 0.45 V V V V Output High Voltage VOH2 VLKO Low Vcc Lock-Out Voltage (Note 5) IOH = -100 uA, Vcc = Vcc min Vcc - 0.4 2.3 2.5 V V Notes: 1. The Icc current listed is typically less than 2 mA/MHz, with OE# at VIH , Typical condition : 25oC, Vcc = 3V 2. Maximum ICC specifications are tested with Vcc = Vcc max. 3. Icc active while Embedded Erase or Embedded Program is in progress. 4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30ns. Typical sleep mode current is 200 nA. 5. Not 100% tested. ES29LV400E 26 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. DC CHARACTERISTICS Zero-Power Flash 15 Supply Current in mA Icc1 (Active Read current) Icc5 (Automatic Sleep Mode) 10 5 0 500 1000 1500 2000 Time in ns 2500 3000 3500 4000 Note: Addresses are switching at 1 MHz Figure 12. Icc1 Current vs. Time (Showing Active and Automatic Sleep Currents) 12 3.6V 10 2.7V 8 Supply Current in mA 6 4 2 0 1 2 3 Frequency in MHz 4 5 Note: T = 25oC Figure 13. Typical Icc1 vs. Frequency ES29LV400E 27 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. 3.3V Table 8. Test Specifications 2.7kΩ Device Under Test Test Condition Output Load 70 1TTL gate 30 pF 90 CL 6.2kΩ Output Load Capacitance, CL (including jig capacitance) Input Rise and Fall Times Input Pulse Levels Input timing measurement reference levels 100 pF 5 ns 0.0 - 3.0 V 1.5 V 1.5 V Figure 14. Test Setup Note: Diodes are IN3064 or equivalent Output timing measurement reference levels Key To Switching Waveforms WAVEFORM INPUTS Steady Changing from H to L Changing from L to H Don’t Care, Any Change Permitted Does Not Apply Changing, State Unknown Center Line is High Impedance State (High Z) OUTPUTS 3.0V Input 0.0V 1.5V Measurement Level 1.5V Output Figure 15. Input Waveforms and Measurement Levels ES29LV400E 28 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Table 9. Read-Only Operations Parameter JEDEC Std. tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX tRC tACC tCE tOE tDF tDF tOH tOEH Speed Options Description Read Cycle Time(Note 1) Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay Chip Enable to Output High Z (Note 1) Output Enable to Output High Z (Note 1) Output Hold Time From Addresses, CE# or OE#, Whichever Occurs First Output Enable Hold Time (Note 1) Read Toggle and Data# Polling CE#,OE#=VIL OE#=VIL Unit Test Setup Min Max Max Max Max Max Min Min Min 70 70 70 70 30 16 16 0 0 10 90 90 90 90 35 ns ns ns ns ns ns ns ns ns Note : 1. Not 100% tested tRC Address Address Stable tACC CE# tRH tRH tOE OE# tOEH WE# tCE tOH OUTPUTS High-Z High-Z Output Valid tDF RESET# RY/BY# 0V Figure 16. Read Operation Timings ES29LV400E 29 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Table 10. Hardware Reset ( RESET #) Parameter JEDEC Std. tReady tReady tRP tRH tRPD tRB Description RESET# Pin Low (During Embedded Algorithms) to Read Mode (See Note) RESET# Pin Low (Not During Embedded Algorithms) to Read Mode (See Note) RESET# Pulse Width RESET High Time Before Read (See Note) RESET# Low to Standby Mode RY/BY# Recovery Time Max Max Min Min Min Min All Speed Options 20 500 500 50 20 0 Unit us ns ns ns us ns Note : Not 100% tested RY/BY# 0V CE#,OE# tRH RESET# tRP tREADY (A) Not During Embedded Algorithm tREADY RY/BY# tRB CE#,OE# RESET# tRP (B) During Embedded Algorithm Figure 17. Reset Timings 30 Rev.0B January 5, 2006 ES29LV400E E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Table 11. Word/Byte Configuration (BYTE#) Parameter JEDEC Std. tELFL/tELFH tFLQZ tFHQV Description CE# to BYTE# Switching Low or High BYTE# Switching Low to Output HIGH Z BYTE# Switching High to Output Active Max Max Min 70 5 16 70 90 Unit ns ns 90 ns CE# OE# BYTE# tELFL BYTE# Switching Switching from word to byte mode DQ0-DQ14 Data Output (DQ0-DQ14) DQ15 Output Data Output (DQ0-DQ7) Address Input DQ15/A-1 tELFH tFLQZ BYTE# BYTE# Switching Switching from byte to word mode DQ0-DQ14 Data Output (DQ0-DQ7) Address Input Data Output (DQ0-DQ14) DQ15 Output DQ15/A-1 tFHQV Figure 18. BYTE# Timing for Read Operations CE# The falling edge of the last WE# signal WE# BYTE# tSET (tAS) tHOLD (tAH) Note : Refer to the Erase/Program Operations table for tAS and tAH specifications. Figure 19. BYTE# Timing for Write Operations ES29LV400E 31 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Table 12. Erase and Program Operations Parameter JEDEC tAVAV tAVWL Std. tWC tAS tASO Write Cycle Time (Note 1) Address Setup Time Description Min Min Min Min Min Min Min Min Min Min Min Min Min Min Typ Typ Typ Min Min Max 70 70 90 90 0 15 45 0 35 45 0 20 0 0 0 35 30 0 6 8 0.7 50 0 90 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns Address Setup Time to OE# low during toggle bit polling Address Hold Time Address Hold Time From CE# or OE# high during toggle bit polling Data Setup Time Data Hold Time Output Enable High during toggle bit polling Read Recovery Time Before Write (OE# High to WE# Low) CE# Setup Time CE# Hold Time Write Pulse Width Write Pulse Width High Latency Between Read and Write Operations Byte tWLAX tAH tAHT tDVWH tWHDX tDS tDH tOEPH tGHWL tELWL tWHEH tWLWH tWHDL tGHWL tCS tCH tWP tWPH tSR/W tWHWH1 tWHWH2 tWHWH1 tWHWH2 tVCS tRB tBUSY Programming Operation (Note 2) Sector Erase Operation (Note 2) Vcc Setup Time (Note 1) Write Recovery Time from RY/BY# Word us sec us ns ns Program/Erase Valid to RY/BY# Delay Notes: 1. Not 100% tested. 2. See the “Erase And Programming Performance” section for more information. ES29LV400E 32 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Program Command Sequence (last two cycles) Read Status Data(last two cycles) tWC Address 555h tAS PA tAH PA PA CE# tCH OE# tCS tWP WE# tWPH tDS tDH A0h PD tBUSY RY/BY# tVCS Status Dout tRB tWHWH1 DATA Vcc NOTES : 1. PA = program address, PD = program data, Dout is the true data at the program address. 2. Illustration shows device in word mode. Figure 20. Program Operation Timings ES29LV400E 33 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Erase Command Sequence (last two cycles) Read Status Data tWC Address 2AAh tAS SA 555h for chip erase tAH VA VA CE# tCH OE# tCS tWP WE# tWPH tDS tDH 10h for chip erase tWHWH2 DATA 55h 30h tBUSY In Progress Complete tRB RY/BY# tVCS Vcc NOTES : 1. SA = sector address(for Sector Erase), VA = valid address for reading status data(see “Write Operation Status”). 2. These waveforms are for the word mode. Figure 21. Chip/Sector Erase Operation Timings ES29LV400E 34 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS tRC Address VA tACC tCE CE# tCH OE# tOEH tDF tOE VA VA WE# DQ7 DQ0-DQ6 tBUSY RY/BY# tOH HIGH-Z Complement Complement True Valid Data HIGH-Z Status Data Status Data True Valid Data NOTE : VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle Figure 22. Data# Polling Timings (During Embedded Algorithms) ES29LV400E 35 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS tAHT Address tASO CE# tOEH WE# tOEPH OE# tDH DQ6/DQ2 RY/BY# Valid Data Valid Status tAS tAHT tCEPH tOE Valid Status Valid Status Valid Data (first read) (second read) (stops toggling) NOTE : VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle. Figure 23. Toggle Bit Timings (During Embedded Algorithms) Enter Embedded Erasing Enter Suspend Enter Erase Suspend Program Erase Suspend Program Erase Resume WE# Erase Erase Suspend Read Erase Suspend Read Erase Erase Complete DQ6 DQ2 NOTE : DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE# to toggle DQ2 and DQ6. Figure 24. DQ2 vs. DQ6 ES29LV400E 36 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Table 13. Temporary Sector Unprotect Parameter JEDEC Std. tVIDR tRSP tRRB Description VID Rise and Fall Time (See Note) RESET# Setup Time for Temporary Sector Unprotect RESET# Hold Time from RY/BY# High for Temporary Sector Unprotect Min Min Min All Speed Options 500 4 4 Unit ns us us Note: Not 100% tested. VID RESET# Vss,VIL, or VIH tVIDR Program or Erase Command Sequence tVIDR CE# WE# tRSP RY/BY# tRRB Figure 25. Temporary Sector Unprotect Timing Diagram ES29LV400E 37 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS VID VIH RESET# SA,A6, A1,A0 DQ 60h 1us Valid* Sector Protect or Unprotect Valid* Valid* Verify 60h Sector Protect : 150us, Sector Unprotect: 15ms 40h Status CE# WE# OE# * For sector protect, A6=0,A1=1,A0=0 For sector unprotect, A6=1,A1=1,A0=0 Figure 26. Sector Protect & Unprotect Timing Diagram ES29LV400E 38 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS Table 14. Alternate CE# Controlled Erase and Program Operations Parameter JEDEC tAVAV tAVWL tELAX tDVEH tEHDX tGHEL tWLEL tEHWH tELEH tELEL tWHWH1 tWHWH2 Std. tWC tAS tAH tDS tDH tGHEL tWS tWH tCP tCPH tWHWH1 tWHWH2 Description Write Cycle Time( Note 1) Address Setup Time Address Hold Time Data Setup Time Data Hold Time Read Recovery Time Before Write (OE# High to WE# Low) WE# Setup Time WE# Hold Time CE# Pulse Width CE# Pulse Width High Byte Programming Operation (Note 2) Sector Erase Operation (Note 2) Word Min Min Min Min Min Min Min Min Min Min Typ Typ Typ 70 70 0 45 35 0 0 0 0 35 30 6 8 0.7 90 90 Unit ns ns ns 45 ns ns ns ns ns ns ns us sec Notes : 1. Not 100% tested 2. See the “Erase And Programming Performance” section for more information. ES29LV400E 39 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS 555 for program 2AA for erase PD for program SA for sector erase 555 for chip erase Data Polling Address tWC WE# tGHEL OE# tCP CE# tWS tDS DATA tRH RESET# RY/BY# A0 for program 55 for erase PD for program 30 for sector erase 10 for chip erase PA tAS tWH tAH tWHWH1 or 2 tCPH tDH DQ7# DOUT tBUSY NOTES : 1. Figure indicates last two bus cycles of a program or erase operation. 2. PA = program address, SA = sector address, PD = program data 3. DQ7# is the complement of the data written to the device. Dout is the data written to the device. 4. Waveforms are for the word mode. Figure 27. Alternate CE# Controlled Write(Erase/Program) Operation Timings ES29LV400E 40 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Table 15. AC CHARACTERISTICS Parameter tOE tVIDR tWPP1 tWPP2 tOESP tCSP tST Description Output Enable to Output Delay Voltage Transition Time Write Pulse Width for Protection Operation Write Pulse Width for Unprotection Operation OE# Setup Time to WE# Active CE# Setup Time to WE# Active Voltage Setup Time Max Min Min Min Min Min Min Value 30/35 500 150 15 4 4 4 Unit ns ns us ms us us us A SAx SAy A A A tVIDR VID A tST VID OE# tOESP tWPP1 tST tCSP CE# DQ RESET# Vcc 0x01 tOE tVIDR WE# Figure 28. Sector Protection timings (A9 High-Voltage Method) ES29LV400E 41 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. AC CHARACTERISTICS A SA0 SA1 A A A tVIDR VID A tST VID OE# tOESP tWPP2 tST tCSP CE# DQ RESET# Vcc 0x00 tOE tVIDR WE# NOTE : It is recommended to verify for all sectors. Figure 29. Sector Unprotection timings (A9 High-Voltage Method) ES29LV400E 42 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Table 16. ERASE AND PROGRAMMING PERFORMANCE Parameter Sector Erase Time Chip Erase Time Byte Program Time Word Program Time Byte Mode Chip Program Time (Note 3) Word Mode Typ (Note 1) 0.7 8 6 8 3.1 2.1 Max (Note 2) 10 Unit sec sec Comments Excludes 00h programming prior to erasure (Note 4) 150 210 9.3 6.3 us us sec Exclude system level overhead (Note 5) Notes: 1. Typical program and erase times assume the following conditions: 25oC, 3.0V Vcc, 10,000 cycles. Additionally, programming typicals assume checkerboard pattern. 2. Under worst case conditions of 90oC, Vcc = 2.7V, 100,000 cycles. 3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum program times listed. 4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure. 5. System-level overhead is the time required to execute the two-or-four-bus-cycle sequence for the program command. See Table 5 for further information on command definitions. 6. The device has a minimum erase and program cycle endurance of 100,000 cycles. Table 17. LATCHUP CHARACTERISTICS Description Input voltage with respect to Vss on all pins except I/O pins (including A9, OE#, and RESET#) Input voltage with respect to Vss on all I/O pins Vcc Current - 1.0V - 1.0V - 100 mA Min 12.5 V Max Vcc + 1.0 V +100 mA Note: Includes all pins except Vcc. Test conditions: Vcc = 3.0 V, one pin at a time Table 18. TSOP, SO, AND BGA PACKAGE CAPACITANCE Parameter Symbol CIN Parameter Description Input Capacitance VIN = 0 Test Setup TSOP FBGA TSOP Typ 6 4.2 8.5 5.4 7.5 3.9 Max 7.5 5.0 12 6.5 9 4.7 Unit pF pF pF pF pF pF COUT Output Capacitance VOUT = 0 FBGA TSOP CIN2 Control Pin Capacitance VIN = 0 FBGA Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25oC, f=1.0MHz. Table 19. DATA RETENTION Parameter Description Minimum Pattern Data Retention Time 125oC 20 Years Test conditions 150oC Min 10 Unit Years ES29LV400E 43 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. PHYSICAL DIMENSIONS 48-Pin Standard TSOP (measured in millimeters) 0.10 C 2 1 -AE5 A2 SEE DETAIL B N -B- e N --2 9 N+1 --2 D1 D 5 4 A1 -CSEATING PLANE 0.08MM (0.0031”) M C A-B S B A B b 67 WITH PLATING c1 BASE METAL SEE DETAIL A 7 (c) b1 R c GAUGE PLANE SECTION B-B PARALLEL TO SEATING PLANE θ° L 0.25MM (0.0098”) BSC e/2 -X- DETAIL A DETAIL B Package JEDEC Symbol A A1 A2 b1 b c1 c D D1 E e L 0.50 MIN 0.05 0.95 0.17 0.17 0.10 0.10 19.80 18.30 11.90 TS 48 MO-142 (B) DD NOM 1.00 0.20 0.22 20.00 18.40 12.00 0.50 BASIC 0.60 0.70 MAX 1.20 0.15 1.05 0.23 0.27 0.16 0.21 20.20 18.50 12.10 X = A OR B NOTES: 1. Controlling dimensions are in millimeters(mm). (Dimensioning and tolerancing conforms to ANSI Y14.5M-1982) 2. Pin 1 identifier for standard pin out (Die up). 3. Pin 1 identifier for reverse pin out (Die down): Ink or Laser mark 4. To be determined at the seating plane. The seating plane is defined as the plane of contact that is made when the package leads are allowed to rest freely on a flat horizontal surface. 5. Dimension D1 and E do not include mold protrusion. Allowable mold protrusion is 0.15mm (0.0059”) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.0031”) total in excess of b dimension at max. material condition. Minimum space between protrusion and an adjacent lead to be 0.07mm (0.0028”). 7. These dimensions apply to the flat section of the lead between 0.10mm (0.0039”) and 0.25mm (0.0098”) from the lead tip. 8. Lead coplanarity shall be within 0.10mm (0.004”) as measured from the seating plane. 9. Dimension “e” is measured at the centerline of the leads. θ R N 0° 0.08 - 3° 5° 0.20 48 ES29LV400E 44 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. PHYSICAL DIMENSIONS 48-Ball FBGA (6 x 8 mm) 0.20 (4x) D A D1 H 6 GF E D C B A 7 5 e E SE 4 E1 3 2 1 6 A1 CORNER INDEX MARK 11 B b 0.15 M Z A B 0.08 M Z SD 7 PIN 1 ID. 10 // 0.25 Z A2 A 0.08 Z A1 Z PACKAGE JEDEC SYMBOL A A1 A2 D E D1 E1 MD ME N b e SD / SE 0.30 0.21 0.7 MIN xFBD 048 N/A 6.00 mm x 8.00 mm PACKAGE NOM MAX 1.10 0.25 0.76 8.00 BSC 6.00 BSC 5.60 BSC 4.00 BSC 8 6 48 0.35 0.40 0.80 BSC 0.40 BSC 0.29 0.82 NOTE OVERALL THICK NESS BALL HEIGHT BODY THICKNESS BODY SIZE BODY SIZE BALL FOOTPRINT BALL FOOTPRINT ROW MATRIX SIZED DIRECTION ROW MATRIX SIZED DIRECTION TOTAL BALL COUNT BALL DIAMETER BALL PITCH SOLDER BALL PLACEMENT NOTES: 1. Dimensioning and tolerancing per ASME Y14.5M-1994 2. All dimensions are in millimeters. 3. Ball position designation per JESD 95-1, SPP-010. 4. e represents the solder ball grid pitch. 5. Symbol “MD” is the ball row matrix size in the “D” direction. Symbol “ME” is the ball column matrix size in the “E” direction. N is the maximum number of solder balls for matrix size MD X ME. 6. Dimension “b” is measured at the maximum ball diameter in a plane parallel to datum Z. 7. SD and SE are measured with respect to datums A and B and define the position of the center solder ball in the outer row. When there is an odd number of solder balls in the outer row parallel to the D or E dimension, respectively, SD or SE = 0.000 when there is an even number of solder balls in the outer row, SD or SE = e/2 8. “X” in the package variations denotes part is outer qualification. 9. “+” in the package drawing indicate the theoretical center of depopulated balls. 10. For package thickness A is the controlling dimension. 11. A1 corner to be indentified by chamfer, ink mark, metallized markings indention or other means. ES29LV400E 45 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. ORDERNG INFORMATION Standard Products ESI standard products are available in several package and operating ranges. The order number (Valid Combination) is formed by a combination of the following: ES 29 LV 400 X X - XX X X X X TEMPERATURE RANGE Blank : Commercial (0oC to + 70oC) I : Industrial (- 40oC to + 85oC) Pb-free C G : : Pb product Pb-free product PACKAGE TYPE T : Standard TSOP (48-pin), W : FBGA(48-ball) VOLTAGE RANGE Blank : 2.7 ~ 3.6V R : 3.0 ~ 3.6V SPEED OPTION 70 : 70ns 90 : 90ns SECTOR ARCHITECTURE Blank : Uniform sector T : Top sector B : Bottom sector TECHNOLOGY D : 0.18um E : 0.18um (2nd Gen.) F : 0.13um DENSITY & ORGANIZATION 400 : 4M ( x8 / x16) 160 : 16M ( x8 / x16) 640 : 64M ( x8 / x16) 800 : 8M ( x8 / x16) 320 : 32M ( x8 / x16) POWER SUPPLY AND INTERFACE F : 5.0V LV : 3.0V DL : 3.0V, Dual Bank DS : 1.8V, Dual Bank BDS : 1.8V, Burst mode, Dual Bank COMPONENT GROUP 29 : Flash Memory EXCEL SEMICONDUCTOR ES29LV400E 46 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Product Selection Guide Industrial Device Part No. ES29LV400ET-70TGI ES29LV400ET-70TCI ES29LV400EB-70TGI ES29LV400EB-70TCI ES29LV400ET-90TGI ES29LV400ET-90TCI ES29LV400EB-90TGI ES29LV400EB-90TCI Speed Vcc 70ns 70ns 70ns 70ns 90ns 90ns 90ns 90ns 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V Boot Sector Package Top Top Bottom Bottom Top Top Bottom Bottom 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP Pb Pb-free Pb-free Pb-free Pb-free - Ball Pitch/Size Body Size ES29LV400E 47 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Product Selection Guide Industrial Device Part No. ES29LV400ET-70WGI ES29LV400ET-70WCI ES29LV400EB-70WGI ES29LV400EB-70WCI ES29LV400ET-90WGI ES29LV400ET-90WCI ES29LV400EB-90WGI ES29LV400EB-90WCI Speed Vcc 70ns 70ns 70ns 70ns 90ns 90ns 90ns 90ns 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V Boot Sector Package Top Top Bottom Bottom Top Top Bottom Bottom 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA Pb Pb-free Pb-free Pb-free Pb-free - Ball Pitch/Size 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm Body Size 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm ES29LV400E 48 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Product Selection Guide Commercial Device Part No. ES29LV400ET-70TG ES29LV400ET-70TC ES29LV400EB-70TG ES29LV400EB-70TC ES29LV400ET-90TG ES29LV400ET-90TC ES29LV400EB-90TG ES29LV400EB-90TC Speed Vcc 70ns 70ns 70ns 70ns 90ns 90ns 90ns 90ns 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V Boot Sector Package Top Top Bottom Bottom Top Top Bottom Bottom 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP 48-pin TSOP Pb Pb-free Pb-free Pb-free Pb-free - Ball Pitch/Size Body Size ES29LV400E 49 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Product Selection Guide Commercial Device Part No. ES29LV400ET-70WG ES29LV400ET-70WC ES29LV400EB-70WG ES29LV400EB-70WC ES29LV400ET-90WG ES29LV400ET-90WC ES29LV400EB-90WG ES29LV400EB-90WC Speed Vcc 70ns 70ns 70ns 70ns 90ns 90ns 90ns 90ns 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V 2.7 - 3.6V Boot Sector Package Top Top Bottom Bottom Top Top Bottom Bottom 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA 48-Ball FBGA Pb Pb-free Pb-free Pb-free Pb-free - Ball Pitch/Size 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm 0.8mm/0.3mm Body Size 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm 6mm x 8mm ES29LV400E 50 Rev.0B January 5, 2006 E S II ES Excel Semiconductor inc. Document Title 4M Flash Memory Revision History Revision Number Rev. 0A Rev. 0B Data Sep. 1, 2005 Jan. 5, 2006 Initial release version. Add RoHS-Compliant Package Option. Items Excel Semiconductor Inc. 1010 Keumkang Hightech Valley, Sangdaewon1-Dong 133-1, Jungwon-Gu, Seongnam-Si, Kyongki-Do, Rep. of Korea. Zip Code : 462-807 Tel : +82-31-777-5060 Fax : +82-31-740-3798 / Homepage : www.excelsemi.com The attached datasheets are provided by Excel Semiconductor.inc (ESI). ESI reserves the right to change the specifications and products. ESI will answer to your questions about device. If you have any questions, please contact the ESI office. ES29LV400E 51 Rev.0B January 5, 2006