Chip Beads (2533121018Y10)
Part Number: 2533121018Y10
MULTI-LAYER CHIP BEAD
Fair-Rite offers a broad selection of cost effective multi-layer chip beads to suppress conducted EMI signals. Chip beads
can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes
accommodate automated placements and allow for a dense packaging of circuit boards.
Chip Beads are available in standard, high and GHz signal speeds.
Recommended Soldering Profile
Packaging Options:
-All multi-layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.
Recommended storage and operating temperature is -55ºC to +125ºC.
The suggested land patterns are in accordance to the latest revision of IPC-7351.
Weight: 0.25 (g)
Package Size: 3312 (8530)
Dim
A
B
C
D
mm
2.28
3.05
8.5
1.09
mm tol
±0.2
±0.2
±0.2
±0.4
Land Patterns
V
W
6.00
9.50
(0.236”)
(0.374”)
Chart Legend
+ Test frequency
nominal inch
0.090
0.120
0.335
0.043
X
3.40
(0.134”)
inch misc.
_
_
_
_
Y
3.60
(0.142”)
Reel Information
Tape Width Pitch
mm
mm
16
8
Z
_
Parts 7"
Reel
-
Parts 13"
Reel
2500
Parts 14"
Reel
_
Typical Impedance (Ω)
50 MHz
71
+
100 MHz 100 +/- 125%
500 MHz 154
1000 MHz+ Electrical Properties
Max DCR
0.004
(Ω)
Max Current
10000
(mA)
The impedance values listed are typical values. The nominal impedance with a +/- 25% tolerance is specified for the +
marked 100 MHz. Chip beads are measured for impedance on the HP 4291A and fixture HP 16192A.
Chip beads are 100% tested for impedance and dc resistance.
CSV Download
Fair-Rite Products Corp.
888-324-7748
•
845-895-2055
•
•
One Commercial Row, Wallkill, New York 12589-0288
Fax: 845-895-2629
•
ferrites@fair-rite.com
•
www.fair-rite.com
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