4N323S

4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler April 2007 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Features ■ High sensitivity to low input drive current ■ Meets or exceeds all JEDEC Registered tm Description The 4N29, 4N30, 4N31, 4N32, 4N33 have a gallium arsenide infrared emitter optically coupled to a silicon planar photodarlington. Specifications ■ VDE 0884 approval available as a test option – add option .300. (e.g., 4N29.300) Applications ■ Low power logic circuits ■ Telecommunications equipment ■ Portable electronics ■ Solid state relays ■ Interfacing coupling systems of different potentials and impedances Packages White Package (-M Suffix) Schematic 6 1 6 1 ANODE 1 6 BASE CATHODE 2 6 1 5 COLLECTOR N/C 3 4 EMITTER Black Package (No -M Suffix) 6 1 6 1 6 1 ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.) Symbol TOTAL DEVICE TSTG TOPR TSOL PD EMITTER IF VR IF(pk) PD DETECTOR BVCEO BVCBO BVECO PD IC Collector-Emitter Breakdown Voltage Collector-Base Breakdown Voltage Emitter-Collector Breakdown Voltage Detector Power Dissipation @ TA = 25°C Derate above 25°C Continuous Collector Current All All All All All 30 30 5 150 2.0 150 V V V mW mW/°C mA Continuous Forward Current Reverse Voltage Forward Current – Peak (300µs, 2% Duty Cycle) LED Power Dissipation @ TA = 25°C Derate above 25°C All All All All 80 3 3.0 150 2.0 mA V A mW mW/°C Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation @ TA = 25°C Derate above 25°C Non M M Non M M All All -55 to +150 -40 to +150 -55 to +100 -40 to +100 260 for 10 sec 250 3.3 °C mW mW/°C °C °C Parameter Device Value Units ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 2 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Electrical Characteristics (TA = 25°C Unless otherwise specified.) Individual Component Characteristics Symbol Parameter EMITTER VF IR C BVCEO BVCBO BVECO ICEO hFE Input Forward Voltage* Reverse Leakage Current* Capacitance* IF = 10mA VR = 3.0V VF = 0V, f = 1.0MHz – – – 30 30 5.0 – – 1.2 0.001 150 60 100 8 1 5000 1.5 100 – – – – 100 – V µA pF V V V nA Test Conditions Min. Typ. Max. Unit DETECTOR Collector-Emitter Breakdown Voltage* IC = 1.0mA, IB = 0 Collector-Base Breakdown Voltage* Collector-Emitter Dark Current* DC Current Gain IC = 100µA, IE = 0 VCE = 10V, Base Open VCE = 5.0V, IC = 500µA Emitter-Collector Breakdown Voltage* IE = 100µA, IB = 0 Transfer Characteristics Symbol Parameter DC CHARACTERISTICS IC(CTR) Test Conditions Min. Typ. Max. Unit Collector Output Current*(1, 2) IF = 10mA, VCE = 10V, IB = 0 4N32, 4N33 4N29, 4N30 4N31 50 (500) 10 (100) 5 (50) IF = 8mA, IC = 2.0mA – – IF = 200mA, IC = 50mA, VCC = 10V IF = 200mA, IC = 50mA, VCC = 10V – – – – 1.0 1.2 5.0 µS V – – – – – – mA (%) VCE(SAT) Saturation Voltage*(2) 4N29, 4N30, 4N32, 4N33 4N31 AC CHARACTERISTICS ton toff Turn-on Time Turn-off Time 4N32, 4N33 4N29, 4N30, 4N31 BW Bandwidth(3, 4) – – – – – 30 100 40 – µS kHz Isolation Characteristics Symbol VISO Characteristic Input-Output 4N32* 4N33* Isolation Voltage(5) 4N29, 4N30, 4N31, 4N32, 4N33 Test Conditions II-O ≤ 1µA, Vrms, t = 1min. VDC VDC VI-O = 500VDC VI-O = Ø, f = 1MHz Min. 5300 2500 1500 – – Typ. – – – 1011 0.8 Max. – – – – – Units Vac(rms) V Ω pF RISO CISO Isolation Resistance(5) Isolation Capacitance(5) Notes: * Indicates JEDEC registered data. 1. The current transfer ratio(IC/IF) is the ratio of the detector collector current to the LED input current with VCE @ 10V. 2. Pulse test: pulse width = 300µs, duty cycle ≤ 2.0% . 4. IF adjusted to IC = 2.0mA and IC = 0.7mA rms. 5. The frequency at which IC is 3dB down from the 1kHz value. 6. For this test, LED pins 1 and 2 are common, and phototransistor pins 4, 5 and 6 are common. ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 3 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Typical Performance Curves Fig. 1 LED Forward Voltage vs. Forward Current (Black Package) 1.8 1.8 Fig. 2 LED Forward Voltage vs. Forward Current (White Package) 1.7 1.7 VF - FORWARD VOLTAGE (V) 1.6 VF - FORWARD VOLTAGE (V) 1.6 1.5 1.5 1.4 TA = -55°C 1.3 TA = 25°C 1.4 TA = -55°C 1.3 TA = 25°C 1.2 TA = 100°C 1.2 1.1 TA = 100°C 1.1 1.0 1 10 100 1.0 1 10 100 IF - LED FORWARD CURRENT (mA) IF - LED FORWARD CURRENT (mA) Fig.3 Normalized CTR vs. Forward Current (Black Package) 1.4 VCE = 5.0V TA = 25°C 1.2 Normalized to IF = 10 mA 1.6 Fig.4 Normalized CTR vs. Forward Current (White Package) VCE = 5.0V TA = 25°C Normalized to IF = 10 mA 1.4 1.2 1.0 NORMALIZED CTR NORMALIZED CTR 0 5 10 15 20 1.0 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0.0 0.0 0 2 4 6 8 10 12 14 16 18 20 IF - FORWARD CURRENT (mA) IF - FORWARD CURRENT (mA) Fig. 5 Normalized CTR vs. Ambient Temperature (Black Package) 1.6 1.4 Fig. 6 Normalized CTR vs. Ambient Temperature (White Package) 1.4 IF = 5 mA 1.2 IF = 5 mA NORMALIZED CTR 1.2 IF = 10 mA 1.0 NORMALIZED CTR 1.0 IF = 10 mA 0.8 0.8 0.6 IF = 20 mA 0.6 Normalized to IF = 10 mA TA = 25°C 0.4 IF = 20 mA Normalized to IF = 10 mA TA = 25°C 0.4 -75 -50 -25 0 25 50 75 100 125 0.2 -60 -40 -20 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (°C) TA - AMBIENT TEMPERATURE (°C) ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 4 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Typical Performance Curves (Continued) Fig. 7 CTR vs. RBE (Unsaturated) (Black Package) 1.0 1.0 Fig. 8 CTR vs. RBE (Unsaturated) (White Package) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 0.8 IF = 10 mA 0.7 IF = 5 mA 0.6 0.5 0.4 0.3 0.2 VCE= 5.0 V 0.1 0.0 NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 0.8 IF = 20 mA 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10 100 1000 IF = 5 mA IF = 10 mA VCE= 5.0 V IF = 20 mA 10 100 1000 RBE- BASE RESISTANCE (kΩ) RBE- BASE RESISTANCE (kΩ) Fig. 9 CTR vs. RBE (Saturated) (Black Package) 1.0 1.0 Fig. 10 CTR vs. RBE (Saturated) (White Package) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 VCE= 0.3 V 0.8 IF = 20 mA 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10 100 1000 IF = 5 mA IF = 10 mA 0.9 VCE= 0.3 V 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10 100 1000 IF = 5 mA IF = 10 mA IF = 20 mA RBE- BASE RESISTANCE (k Ω) RBE- BASE RESISTANCE (k Ω) Fig. 11 Collector-Emitter Saturation Voltage vs Collector Current (Black Package) VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 100 Fig. 12 Collector-Emitter Saturation Voltage vs Collector Current (White Package) VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 100 TA = 25˚C 10 10 1 1 IF = 2.5 mA 0.1 IF = 2.5 mA 0.1 0.01 IF = 10 mA IF = 5 mA IF = 20 mA 0.01 IF = 5 mA IF = 10 mA IF = 20 mA TA = 25˚C 0.1 1 10 0.001 0.01 0.001 0.01 0.1 1 10 IC - COLLECTOR CURRENT (mA) IC - COLLECTOR CURRENT (mA) ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 5 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Typical Performance Curves (Continued) Fig. 13 Switching Speed vs. Load Resistor (Black Package) 1000 IF = 10 mA VCC = 10 V TA = 25°C 1000 IF = 10 mA VCC = 10 V TA = 25°C Fig. 14 Switching Speed vs. Load Resistor (White Package) SWITCHING SPEED - (µs) Toff 10 Tf Ton SWITCHING SPEED - (µs) 100 100 10 Toff Tf Ton 1 1 Tr Tr 0.1 0.1 1 10 100 0.1 0.1 1 10 100 R-LOAD RESISTOR (kΩ) R-LOAD RESISTOR (kΩ) Fig. 15 Normalized ton vs. RBE (Black Package) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 10 100 1000 10000 100000 VCC = 10 V IC = 2 mA RL = 100 Ω 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 10 Fig. 16 Normalized ton vs. RBE (White Package) NORMALIZED ton - (ton(RBE) / ton(open)) NORMALIZED ton - (ton(RBE) / ton(open)) VCC = 10 V IC = 2 mA RL = 100 Ω 100 1000 10000 100000 RBE- BASE RESISTANCE (k Ω) RBE- BASE RESISTANCE (k Ω) Fig. 17 Normalized toff vs. RBE (Black Package) 1.4 1.3 1.4 1.3 Fig. 18 Normalized toff vs. RBE (White Package) NORMALIZED toff - (toff(RBE) / toff(open)) NORMALIZED toff - (toff(RBE) / toff(open)) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10 100 1000 10000 100000 VCC = 10 V IC = 2 mA RL = 100 Ω 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10 100 1000 10000 100000 VCC = 10 V IC = 2 mA RL = 100 Ω RBE- BASE RESISTANCE (k Ω) RBE- BASE RESISTANCE (k Ω) ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 6 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Typical Performance Curves (Continued) Fig. 19 Dark Current vs. Ambient Temperature 10000 ICEO - COLLECTOR -EMITTER DARK CURRENT (nA) VCE = 10 V TA = 25°C 1000 100 10 1 0.1 0.01 0.001 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (°C) TEST CIRCUIT VCC = 10V WAVE FORMS INPUT PULSE IF INPUT RBE IC RL 10% 90% tr ton Adjust IF to produce IC = 2 mA tf toff OUTPUT PULSE OUTPUT Figure 20. Switching Time Test Circuit and Waveforms ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 7 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Black Package (No -M Suffix) Package Dimensions (Through Hole) PIN 1 ID. Package Dimensions (Surface Mount) 0.350 (8.89) 0.320 (8.13) 0.270 (6.86) 0.240 (6.10) Pin 1 ID 0.390 (9.90) 0.332 (8.43) 0.260 (6.60) 0.240 (6.10) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) Seating Plane 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.200 (5.08) 0.115 (2.92) 0.154 (3.90) 0.100 (2.54) 0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0° to 15° 0.300 (7.62) TYP 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.035 (0.88) 0.012 (0.30) Package Dimensions (0.4” Lead Spacing) PIN 1 ID Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.270 (6.86) 0.240 (6.10) 0.060 (1.52) 0.350 (8.89) 0.330 (8.38) 0.415 (10.54) SEATING PLANE 0.070 (1.78) 0.045 (1.14) 0.100 (2.54) 0.295 (7.49) 0.030 (0.76) 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0° to 15° 0.400 (10.16) TYP Note: All dimensions are in inches (millimeters). ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 8 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler White Package (-M Suffix) Package Dimensions (Through Hole) 0.350 (8.89) 0.320 (8.13) Pin 1 ID Package Dimensions (Surface Mount) 0.350 (8.89) 0.320 (8.13) PIN 1 ID 0.260 (6.60) 0.240 (6.10) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) SEATING PLANE SEATING PLANE 0.070 (1.77) 0.040 (1.02) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15° 0.012 (0.30) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.035 (0.88) 0.006 (0.16) Package Dimensions (0.4” Lead Spacing) 0.350 (8.89) 0.320 (8.13) PIN 1 ID Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.260 (6.60) 0.240 (6.10) 0.060 (1.52) 0.070 (1.77) 0.040 (1.02) SEATING PLANE 0.014 (0.36) 0.010 (0.25) 0.415 (10.54) 0.100 (2.54) 0.295 (7.49) 0.030 (0.76) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) Note: All dimensions are in inches (millimeters). ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 9 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Ordering Information Black Package (No Suffix) No Suffix .S .SD .W .300 .300W .3S .3SD Example 4N32 4N32S 4N32SD 4N32W 4N32300 4N32300W 4N323S 4N323SD White Package (-M Suffix) No Suffix S SR2 T V TV SV SR2V Example 4N32M 4N32SM 4N32SR2M 4N32TM 4N32VM 4N32TVM 4N32SVM 4N32SR2VM Option Standard Through Hole Device Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel Marking Information 1 1 4N29 V XX YY K 3 4 5 2 6 4N29 V 3 4 2 6 X YY Q 5 Black Package, No Suffix Definitions 1 2 3 Fairchild logo Device number White Package, -M Suffix VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One or two digit year code • Two digits for black package parts, e.g., ‘07’ • One digit for white package parts, e.g., ‘7’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code 4 5 6 *Note – Parts built in the white package (M suffix) that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in the portrait format. ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 10 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Tape Dimensions Black Package, No Suffix 12.0 ± 0.1 4.85 ± 0.20 0.30 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 Ø1.55 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 13.2 ± 0.2 9.55 ± 0.20 16.0 ± 0.3 0.1 MAX 10.30 ± 0.20 Ø1.6 ± 0.1 User Direction of Feed White Package, -M Suffix 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 0.30 ± 0.05 4.0 ± 0.1 Ø1.5 MIN 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 24.0 ± 0.3 0.1 MAX 10.1 ± 0.20 Ø1.5 ± 0.1/-0 User Direction of Feed Note: All dimensions are in millimeters. ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 11 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler Reflow Soldering Profile Black Package, No Suffix 300 Temperature (°C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) Time above 183°C, 60–150 sec 215°C, 10–30 s 225 C peak Ramp up = 3C/sec • Peak reflow temperature: 225°C (package surface temperature) • Time of temperature higher than 183°C for 60–150 seconds • One time soldering reflow is recommended White Package, -M Suffix 300 280 260 240 220 200 180 160 °C 140 120 100 80 60 40 20 0 0 260°C >245°C = 42 Sec Time above 183°C = 90 Sec 1.822°C/Sec Ramp up rate 33 Sec 60 120 180 270 360 Time (s) ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 12 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Across the board. Around the world.™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ CTL™ Current Transfer Logic™ DOME™ 2 E CMOS™ ® EcoSPARK EnSigna™ FACT Quiet Series™ ® FACT ® FAST FASTr™ FPS™ ® FRFET GlobalOptoisolator™ GTO™ HiSeC™ ® i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ MICROCOUPLER™ MicroPak™ MICROWIRE™ Motion-SPM™ MSX™ MSXPro™ OCX™ OCXPro™ ® OPTOLOGIC ® OPTOPLANAR PACMAN™ PDP-SPM™ POP™ ® Power220 ® Power247 PowerEdge™ PowerSaver™ Power-SPM™ ® PowerTrench Programmable Active Droop™ ® QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ ScalarPump™ SMART START™ ® SPM STEALTH™ SuperFET™ SuperSOT™ -3 SuperSOT™ -6 SuperSOT™ -8 SyncFET™ TCM™ ® The Power Franchise ™ TinyBoost™ TinyBuck™ ® TinyLogic TINYOPTO™ TinyPower™ TinyWire™ TruTranslation™ µSerDes™ ® UHC UniFET™ VCX™ Wire™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I26 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. No Identification Needed Full Production Obsolete Not In Production ©2006 Fairchild Semiconductor Corporation 4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 www.fairchildsemi.com 13