74HC541

MM74HC540 • MM74HC541 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer September 1983 Revised February 1999 MM74HC540 • MM74HC541 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer General Description The MM74HC540 and MM74HC541 3-STATE buffers utilize advanced silicon-gate CMOS technology. They possess high drive current outputs which enable high speed operation even when driving large bus capacitances. These circuits achieve speeds comparable to low power Schottky devices, while retaining the advantage of CMOS circuitry, i.e., high noise immunity, and low power consumption. Both devices have a fanout of 15 LS-TTL equivalent inputs. The MM74HC540 is an inverting buffer and the MM74HC541 is a non-inverting buffer. The 3-STATE control gate operates as a two-input NOR such that if either G1 or G2 are HIGH, all eight outputs are in the high-impedance state. In order to enhance PC board layout, the MM74HC540 and MM74HC541 offers a pinout having inputs and outputs on opposite sides of the package. All inputs are protected from damage due to static discharge by diodes to VCC and ground. Features s Typical propagation delay: 12 ns s 3-STATE outputs for connection to system buses s Wide power supply range: 2–6V s Low quiescent current: 80 µA maximum (74HC Series) s Output current: 6 mA Ordering Code: Order Number MM74HC540WM MM74HC540SJ MM74HC540MTC MM74HC540N MM74HC541WM MM74HC541SJ MM74HC541MTC MM74HC541N Package Number M20B M20D MTC20 N20A M20B M20D MTC20 N20A Package Description 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagrams Pin Assignments for DIP, SOIC, SOP and TSSOP Top View MM74HC540 Top View MM74HC541 © 1999 Fairchild Semiconductor Corporation DS005341.prf www.fairchildsemi.com MM74HC540 • MM74HC541 Absolute Maximum Ratings(Note 1) (Note 2) Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (ICD) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Power Dissipation (PD) (Note 3) S.O. Package only Lead Temperature (TL) (Soldering 10 seconds) 260°C (Note 4) VCC 2.0V 4.5V 6.0V VIL Maximum LOW Level Input Voltage VOH Minimum HIGH Level Output Voltage VIN = VIH or VIL |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = VIH or VIL |IOUT| ≤ 6.0 mA |IOUT| ≤ 7.8 mA VOL Maximum LOW Level Output Voltage VIN = VIH or VIL |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = VIH or VIL |IOUT| ≤ 6.0 mA |IOUT| ≤ 7.8 mA IIN IOZ Maximum Input Current Maximum 3-STATE Output Leakage Current ICC Maximum Quiescent Supply Current VIN = VCC or GND IOUT = 0 µA 6.0V VIN = VIH or VIL, G = VIH VOUT = VCC or GND 6.0V VIN = VCC or GND 4.5V 6.0V 6.0V 4.5V 6.0V 2.0V 4.5V 6.0V Recommended Operating Conditions Min Supply Voltage (VCC) DC Input or Output Voltage (VIN, VOUT) Operating Temperature Range (TA) Input Rise or Fall Times (tr, tf) VCC = 2.0V VCC = 4.5V VCC = 6.0V 0 −40 VCC +85 1000 500 400 V °C ns ns ns 2 Max 6 Units V −0.5 to +7.0V −1.5 to VCC +1.5V −0.5 to VCC +0.5V ±20 mA ±35 mA ±70 mA −65°C to +150°C 600 mW 500 mW Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. DC Electrical Characteristics Symbol VIH Parameter Minimum HIGH Level Input Voltage Conditions T A = 2 5 °C Typ 1.5 3.15 4.2 0.5 1.35 1.8 2.0 4.5 6.0 4.2 5.7 0 0 0 0.2 0.2 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 ±0.5 TA = −40 to 85°C TA = −55 to 125°C Guaranteed Limits 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 ±5 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 ±1.0 ±10 Units V V V V V V V V V V V V V V V V µA µA 8.0 80 160 µA Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. www.fairchildsemi.com 2 MM74HC540 • MM74HC541 AC Electrical Characteristics VCC = 5V, TA = 25°C, tr = tf = 6 ns Symbol tPHL, tPLH tPHL, tPLH tPZH, tPZL tPHZ, tPLZ Parameter Maximum Propagation Delay (540) Maximum Propagation Delay (541) Maximum Output Enable Time Maximum Output Disable Time RL = 1 kΩ CL = 45 pF RL = 1 kΩ CL = 5 pF 15 25 ns 17 28 ns CL = 45 pF 14 20 ns CL = 45 pF Conditions Typ 12 Guaranteed Limit 18 Units ns AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) Symbol Parameter Conditions CL = 50 pF CL = 150 pF CL = 50 pF CL = 150 pF CL = 50 pF CL = 150 pF tPHL, tPLH Maximum Propagation Delay (541) CL = 50 pF CL = 150 pF CL = 50 pF CL = 150 pF CL = 50 pF CL = 150 pF tPZH, tPZL Maximum Output Enable Time RL = 1 kΩ CL = 50 pF CL = 150 pF CL = 50 pF CL = 150 pF CL = 50 pF CL = 150 pF tPHZ, tPLZ Maximum Output Disable Time tTHL, tTLH Maximum Output Rise and Fall Time CPD CIN COUT Power Dissipation Capacitance (Note 5) Maximum Input Capacitance Maximum Output Capacitance 15 20 20 20 pF Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. VCC 2.0V 2.0V 4.5V 4.5V 6.0V 6.0V 2.0V 2.0V 4.5V 4.5V 6.0V 6.0V 2.0V 2.0V 4.5V 4.5V 6.0V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V TA = 25°C Typ 55 83 12 22 11 18 58 83 14 17 11 14 75 100 15 30 13 17 75 15 13 25 7 6 10 50 5 10 100 150 20 30 17 26 115 165 23 33 20 28 150 200 30 40 26 34 150 30 26 60 12 10 TA = −40 to 85°C TA = −55 to 125°C Guaranteed Limits 126 190 25 38 21 32 145 208 29 42 25 35 189 252 38 50 32 43 189 38 32 75 15 13 149 224 30 45 25 38 171 246 34 49 29 42 224 298 45 60 38 51 224 45 38 90 18 15 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF pF tPHL, tPLH Maximum Propagation Delay (540) RL = 1 kΩ CL = 50 pF CL = 50 pF G = VIH G = VIL 10 10 pF 3 www.fairchildsemi.com MM74HC540 • MM74HC541 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Package Number M20B 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D www.fairchildsemi.com 4 MM74HC540 • MM74HC541 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 5 www.fairchildsemi.com MM74HC540 • MM74HC541 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Package Number N20A LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or systems device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the sonably expected to cause the failure of the life support body, or (b) support or sustain life, and (c) whose failure device or system, or to affect its safety or effectiveness. to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the www.fairchildsemi.com user. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.