74LCX244WMX

74LCX244 Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs February 1994 Revised March 2005 74LCX244 Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs General Description The LCX244 contains eight non-inverting buffers with 3-STATE outputs. The device may be employed as a memory address driver, clock driver and bus-oriented transmitter/receiver. The LCX244 is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The LCX244 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation. Features s 5V tolerant inputs and outputs s 2.3V to 3.6V VCC specifications provided s 6.5 ns tPD max (VCC 3.3V), 10 PA ICC max s Power down high impedance inputs and outputs s Supports live insertion/withdrawal (Note 1) s r24 mA output drive (VCC 3.0V) s Implements patented noise/EMI reduction circuitry s Latch-up performance exceeds 500 mA s ESD performance: Human body model ! 2000V Machine model ! 200V s Leadless DQFN Pb-Free package Note 1: To ensure the high-impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number 74LCX244WM (Note 2) 74LCX244WMX_NL (Note 4) 74LCX244SJ (Note 2) 74LCX244BQX (Note 3) 74LCX244MSA (Note 2) 74LCX244MTC (Note 2) 74LCX244MTC_NL (Note 4) 74LCX244MTCX_NL (Note 4) Package Number M20B M20B M20D Package Description 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm MSA20 MTC20 MTC20 MTC20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free package per JEDEC J-STD-020B. Note 2: D evices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 3: D QFN package available in Tape and Reel only. Note 4: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Please use order number as indicated. © 2005 Fairchild Semiconductor Corporation DS500107 www.fairchildsemi.com 74LCX244 Logic Symbol IEEE/IEC Pin Descriptions Pin Names OE1, OE2 I0 – I7 O0 – O7 Description 3-STATE Output Enable Inputs Inputs Outputs Truth Tables Inputs OE1 L L In L H X Outputs (Pins 12, 14, 16, 18) L H Z Outputs (Pins 3, 5, 7, 9) L H Z Connection Diagrams Pin Assignments for SOIC, SOP, SSOP, and TSSOP H Inputs OE2 L L H H H IGH Voltage Level L LOW Voltage Level X Immaterial Z High Impedance In L H X Pad Assignments for DQFN (Top Through View) www.fairchildsemi.com 2 74LCX244 Absolute Maximum Ratings(Note 5) Symbol VCC VI VO IIK IOK IO ICC IGND TSTG Parameter Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Value Conditions Units V V Output in 3-STATE Output in HIGH or LOW State (Note 6) VI  GND VO  GND VO ! VCC V mA mA mA mA mA 0.5 to 7.0 0.5 to 7.0 0.5 to 7.0 0.5 to VCC  0.5 50 50 50 r50 r100 r100 65 to 150 qC Recommended Operating Conditions (Note 7) Symbol VCC VI VO IOH/IOL Supply Voltage Input Voltage Output Voltage Output Current HIGH or LOW State 3-STATE VCC VCC VCC TA Free-Air Operating Temperature Input Edge Rate, VIN 0.8V to 2.0V, VCC 3.0V 3.0V to 3.6V 2.7V to 3.0V 2.3V to 2.7V Parameter Operating Data Retention Min 2.0 1.5 0 0 0 Max 3.6 3.6 5.5 VCC 5.5 Units V V V r24 r12 r8 40 0 85 10 mA qC ns/V 't/'V Note 5: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 6: IO Absolute Maximum Rating must be observed. Note 7: U nused inputs or I/Os must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol VIH VIL VOH Parameter HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage IOH IOH IOH IOH IOH VOL LOW Level Output Voltage IOL IOL IOL IOL IOL II IOZ IOFF Input Leakage Current 3-STATE Output Leakage Power-Off Leakage Current Conditions VCC (V) 2.3 to 2.7 2.7 to 3.6 2.3 to 2.7 2.7 to 3.6 TA 40qC to 85qC Max Min 1.7 2.0 Units V 0.7 0.8 VCC  0.2 1.8 2.2 2.4 2.2 0.2 0.6 0.4 0.4 0.55 V 100 PA 8 mA 12 mA 18 mA 24 mA 100 PA 8 mA 12 mA 16 mA 24 mA 2.3 to 3.6 2.3 2.7 3.0 3.0 2.3 to 3.6 2.3 2.7 3.0 3.0 2.3 to 3.6 2.3 to 3.6 0 V V 0 d VI d 5.5V 0 d VO d 5.5V VI VIH or VIL 5.5V VI or VO r5.0 r5.0 10 PA PA PA 3 www.fairchildsemi.com 74LCX244 DC Electrical Characteristics Symbol ICC Parameter Quiescent Supply Current Increase in ICC per Input VI VIH (Continued) VCC (V) VCC or GND VCC 0.6V 2.3  3.6 2.3  3.6 2.3  3.6 TA Conditions 40qC to 85qC Max 10 Units Min 3.6V d VI, VO d 5.5V (Note 8) r10 500 PA PA 'ICC Note 8: Outputs disabled or 3-STATE only. AC Electrical Characteristics TA Symbol Parameter VCC 3.3V r 0.3V 40qC to 85qC, RL VCC CL Min 1.5 1.5 1.5 1.5 1.5 1.5 2.7V 50 pF Max 7.5 7.5 9.0 9.0 8.0 8.0 500: VCC CL Min 1.5 1.5 1.5 1.5 1.5 1.5 2.5V r 0.2 30 pF Max 7.8 7.8 10.0 10.0 8.4 8.4 ns ns ns ns Units CL 50 pF Min Max 6.5 6.5 8.0 8.0 7.0 7.0 1.0 1.0 1.5 1.5 1.5 1.5 1.5 1.5 tPHL tPLH tPZL tPZH tPLZ tPHZ tOSHL tOSLH Propagation Delay Data to Output Output Enable Time Output Disable Time Output to Output Skew (Note 9) Note 9: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Dynamic Switching Characteristics Symbol VOLP VOLV Parameter Quiet Output Dynamic Peak VOL Quiet Output Dynamic Valley VOL CL CL CL CL 50 pF, VIH 30 pF, VIH 50 pF, VIH 30 pF, VIH Conditions 3.3V, VIL 2.5V, VIL 3.3V, VIL 2.5V, VIL 0V 0V 0V 0V VCC (V) 3.3 2.5 3.3 2.5 TA 25qC 0.8 0.6 Typical Units V V 0.8 0.6 Capacitance Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance Parameter VCC VCC VCC Open, VI 3.3V, VI 3.3V, VI Conditions 0V or VCC 0V or VCC 0V or VCC, f 10 MHz Typical 7.0 8.0 25.0 Units pF pF pF www.fairchildsemi.com 4 74LCX244 AC LOADING and WAVEFORMS Generic for LCX Family FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Test tPLH, tPHL tPZL, tPLZ tPZH , tPHZ Switch Open 6V at VCC 3.3V r 0.3V 2.5V r 0.2V VCC x 2 at VCC GND Waveform for Inverting and Non-Inverting Functions 3-STATE Output High Enable and Disable Times for Logic Propagation Delay. Pulse Width and trec Waveforms Setup Time, Hold Time and Recovery Time for Logic 3-STATE Output Low Enable and Disable Times for Logic FIGURE 2. Waveforms (Input Characteristics; f =1MHz, tr = tf = 3ns) Symbol Vmi Vmo Vx Vy VCC 3.3V r 0.3V 1.5V 1.5V VOL  0.3V VOH  0.3V 2.7V 1.5V 1.5V VOL  0.3V VOH  0.3V trise and tfall 2.5V r 0.2V VCC/2 VCC/2 VOL  0.15V VOH  0.15V 5 www.fairchildsemi.com 74LCX244 Schematic Diagram Generic for LCX Family FIGURE 3. www.fairchildsemi.com 6 74LCX244 Tape and Reel Specification Tape Format for DQFN Package Designator BQX Tape Section Leader (Start End) Carrier Trailer (Hub End) TAPE DIMENSIONS inches (millimeters) Number Cavities 125 (typ) 3000 75 (typ) Cavity Status Empty Filled Empty Cover Tape Status Sealed Sealed Sealed REEL DIMENSIONS inches (millimeters) Tape Size 12 mm A 13.0 (330.0) B 0.059 (1.50) C 0.512 (13.00) D 0.795 (20.20) N 2.165 (55.00) W1 0.488 (12.4) W2 0.724 (18.4) 7 www.fairchildsemi.com 74LCX244 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B www.fairchildsemi.com 8 74LCX244 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 9 www.fairchildsemi.com 74LCX244 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm Package Number MLP020B www.fairchildsemi.com 10 74LCX244 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide Package Number MSA20 11 www.fairchildsemi.com 74LCX244 Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 12 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com