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74VCXH16373

74VCXH16373

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    74VCXH16373 - Low Voltage 16-Bit Transparent Latch with Bushold - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
74VCXH16373 数据手册
74VCXH16373 Low Voltage 16-Bit Transparent Latch with Bushold January 2000 Revised June 2005 74VCXH16373 Low Voltage 16-Bit Transparent Latch with Bushold General Description The VCXH16373 contains sixteen non-inverting latches with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. The flip-flops appear to be transparent to the data when the Latch Enable (LE) is HIGH. When LE is LOW, the data that meets the setup time is latched. Data appears on the bus when the Output Enable (OE) is LOW. When OE is HIGH, the outputs are in a high impedance state. The VCXH16373 data inputs include active bushold circuitry, eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level. The 74VCXH16373 is designed for low voltage (1.2V to 3.6V) VCC applications with output compatibility up to 3.6V. The 74VCXH16373 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining low CMOS power dissipation. Features s 1.2V to 3.6V VCC supply operation s 3.6V tolerant control inputs and outputs s Bushold on data inputs eliminates the need for external pull-up/pull-down resistors s tPD (In to On) 3.0 ns max for 3.0V to 3.6V VCC s Static Drive (IOH/IOL) r24 mA @ 3.0V VCC s Uses patented noise/EMI reduction circuitry s Latch-up performance exceeds 300 mA s ESD performance: Human body model ! 2000V Machine model ! 200V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Order Number 74VCXH16373G (Note 1)(Note 2) 74VCXH16373MTD (Note 2) Package Number BGA54A (Preliminary) MTD48 Package Description 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Note 1: Ordering Code “G” indicates Tray. Note 2: D evices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol © 2005 Fairchild Semiconductor Corporation DS500229 www.fairchildsemi.com 74VCXH16373 Connection Diagrams Pin Assignment for TSSOP Pin Descriptions Pin Names OEn LEn I0–I15 O0–O15 NC Description Output Enable Input (Active LOW) Latch Enable Input Bushold Inputs Outputs No Connect FBGA Pin Assignments 1 A B C D E F G H J O0 O2 O4 O6 O8 O10 O12 O14 O15 2 NC O1 O3 O5 O7 O9 O11 O13 NC 3 OE1 NC VCC GND GND GND VCC NC OE2 4 LE1 NC VCC GND GND GND VCC NC LE2 5 NC I1 I3 I5 I7 I9 I11 I13 NC 6 I0 I2 I4 I6 I8 I10 I12 I14 I15 Truth Tables Inputs LE1 Pin Assignment for FBGA X H H L OE1 H L L L Inputs LE2 X H H L (Top Thru View) H L X Z O0 Outputs I0–I7 X L H X O0–O7 Z L H O0 Outputs I8–I15 X L H X O8–O15 Z L H O0 OE2 H L L L HIGH Voltage Level LOW Voltage Level Immaterial (HIGH or LOW, control inputs may not float) High Impedance Previous O0 before HIGH-to-LOW of Latch Enable www.fairchildsemi.com 2 74VCXH16373 Functional Description The 74VCXH16373 contains sixteen edge D-type latches with 3-STATE outputs. The device is byte controlled with each byte functioning identically, but independent of the other. Control pins can be shorted together to obtain full 16-bit operation. The following description applies to each byte. When the Latch Enable (LEn) input is HIGH, data on the In enters the latches. In this condition the latches are transparent, i.e., a latch output will change state each time its I input changes. When LEn is LOW, the latches store information that was present on the I inputs a setup time preceding the HIGH-to-LOW transition on LEn. The 3-STATE outputs are controlled by the Output Enable (OEn) input. When OEn is LOW the standard outputs are in the 2-state mode. When OEn is HIGH, the standard outputs are in the high impedance mode but this does not interfere with entering new data into the latches. Logic Diagram Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. 3 www.fairchildsemi.com 74VCXH16373 Absolute Maximum Ratings(Note 3) Supply Voltage (VCC) DC Input Voltage (VI) Output Voltage (VO) Outputs 3-STATED Outputs Active (Note 4) DC Input Diode Current (IIK) VI  0V DC Output Diode Current (IOK) VO  0V VO ! VCC DC Output Source/Sink Current (IOH/IOL) DC VCC or GND Current per Supply Pin (I CC or GND) Storage Temperature Range (TSTG) 0.5V to 4.6V 0.5V to 4.6V 0.5V to 4.6V 0.5V to VCC 0.5V 50 mA 50 mA 50 mA r50 mA r100 mA 65qC to 150qC Recommended Operating Conditions (Note 5) Power Supply Operating Input Voltage Output Voltage (VO) Output in Active States Output in “OFF” State Output Current in IOH/IOL VCC VCC VCC VCC VCC 3.0V to 3.6V 2.3V to 2.7V 1.65V to 2.3V 1.4V to 1.6V 1.2V 0V to VCC 0V to 3.6V 1.2V to 3.6V 0.3V to 3.6V Free Air Operating Temperature (TA) Minimum Input Edge Rate ('t/'V) VIN 0.8V to 2.0V, VCC 3.0V r24 mA r18 mA r6 mA r2 mA r100 PA 40qC to 85qC 10 ns/V Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 4: IO Absolute Maximum Rating must be observed. Note 5: Floating or unused inputs must be held HIGH or LOW. DC Electrical Characteristics Symbol VIH Parameter HIGH Level Input Voltage Conditions VCC (V) 2.7  3.6 2.3  2.7 1.65  2.3 1.4  1.6 1.2 VIL LOW Level Input Voltage 2.7  3.6 2.3  2.7 1.65  2.3 1.4  1.6 1.2 VOH HIGH Level Output Voltage IOH IOH IOH IOH IOH IOH IOH IOH IOH IOH IOH IOH IOH 2.0 1.6 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.8 0.7 0.35 x VCC 0.35 x VCC 0.05 x VCC VCC  0.2 2.2 2.4 2.2 VCC  0.2 2.0 1.8 1.7 VCC  0.2 1.25 VCC  0.2 1.05 VCC  0.2 V V V Min Max Units 100 PA 12 mA 18 mA 24 mA 100 PA 6 mA 12 mA 18 mA 100 PA 6 mA 100 PA 2 mA 100 PA 2.7  3.6 2.7 3.0 3.0 2.3  2.7 2.3 2.3 2.3 1.65  2.3 1.65 1.4  1.6 1.4 1.2 www.fairchildsemi.com 4 74VCXH16373 DC Electrical Characteristics Symbol VOL Parameter LOW Level Output Voltage (Continued) VCC (V) IOL IOL IOL IOL IOL IOL IOL IOL IOL IOL IOL IOL 100 PA 12 mA 18 mA 24 mA 100 PA 12 mA 18 mA 100 PA 6 mA 100 PA 2 mA 100 PA VCC or GND 0.8V 2.0V 0.7V 1.6V 0.57V 1.07V 2.7 3.6 2.7 3.0 3.0 2.3 - 2.7 2.3 2.3 1.65  2.3 1.65 1.4  1.6 1.4 1.2 1.4  3.6 1.4  3.6 3.0 3.0 2.3 2.3 1.65 1.65 3.6 3.6 2.7 2.7 1.95 1.95 1.2  3.6 0 1.2  3.6 1.2  3.6 2.7  3.6 75.0 0.2 0.4 0.4 0.55 0.2 0.4 0.6 0.2 0.3 0.2 0.35 0.05 V Conditions Min Max Units II II(HOLD) Input Leakage Current Bushold Input Minimum Drive Hold Current Control Pins Data Pins 0 d VI d 3.6V VI VIN VIN VIN VIN VIN VIN r5.0 r5.0 75.0 45.0 PA PA 45.0 25.0 PA 25.0 450 II(OD) Bushold Input Over-Drive Current to Change State (Note 6) (Note 7) (Note 6) (Note 7) (Note 6) (Note 7) 450 300 300 200 PA 200 r10.0 10.0 20.0 IOZ IOFF ICC 3-STATE Output Leakage Power-OFF Leakage Current Quiescent Supply Current Increase in ICC per Input 0 d VO d 3.6V VI VI VIH VIH or VIL VCC or GND VCC - 0.6V 0 d (VO) d 3.6V VCC d (VO) d 3.6V (Note 8) PA PA PA PA r20.0 750 'ICC Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW. Note 8: Outputs disabled or 3-STATE only. 5 www.fairchildsemi.com 74VCXH16373 AC Electrical Characteristics (Note 9) Symbol tPHL, tPLH Parameter Propagation Delay LE to On CL tPHL, tPLH Propagation Delay In t o O n CL tPZL, tPZH CL tPLZ, tPHZ CL tS Setup Time CL 15 pF, RL 30 pF, RL 2 5: 500: Output Disable Time CL 15 pF, RL 30 pF, RL 2 5: 500: Output Enable Time CL 15 pF, RL 30 pF, RL 2 5: 500: CL 15 pF, RL 30 pF, RL 2 5: 500: CL Conditions 30 pF, RL 500: V CC (V) 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 1.5 r 0.1 1.2 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 1.5 r 0.1 1.2 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 1.5 r 0.1 1.2 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 1.5 r 0.1 1.2 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 CL tH Hold Time CL 15 pF, RL 30 pF, RL 2 5: 500: 1.5 r 0.1 1.2 3.3 r 1.0 2.5 r 0.2 1.8 r 0.15 CL tW Pulse Width CL 15 pF, RL 30 pF, RL 2 5: 500: 1.5 r 0.1 1.2 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 CL tOSHL tOSLH Output to Output Skew (Note 10) CL Note 9: For CL TA 40qC to 85qC Max 3.0 3.9 7.8 15.6 39.0 3.0 3.4 6.8 13.6 34.0 3.5 4.6 9.2 18.4 46.0 3.5 3.8 6.8 13.6 34.0 Min 0.8 1.0 1.5 1.0 1.5 0.8 1.0 1.5 1.0 1.5 0.8 1.0 1.5 1.0 1.5 0.8 1.0 1.5 1.0 1.5 1.5 1.5 2.5 3.0 6.0 1.0 1.0 1.0 1.2 3.6 1.5 1.5 4.0 4.0 8.0 Units Figure Number Figures 1, 2 ns Figures 7, 8 Figures 1, 2 ns Figures 7, 8 Figures 1, 3, 4 ns Figures 7, 9, 10 Figures 1, 3, 4 ns Figures 7, 9, 10 Figures 1, 6 ns Figures 6, 7 Figures 1, 6 ns Figures 6, 7 Figures 1, 4 ns Figures 4, 7 15 pF, RL 30 pF, RL 2 5: 500: 1.5 r 0.1 1.2 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 CL 0.5 0.5 0.75 1.5 1.5 ns 15 pF, RL 2 5: 1.5 r 0.1 1.2 50PF, add approximately 300 ps to the AC maximum specification. Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). www.fairchildsemi.com 6 74VCXH16373 Dynamic Switching Characteristics Symbol VOLP Parameter Quiet Output Dynamic Peak VOL CL 30 pF, VIH Conditions VCC, VIL 0V V CC (V) 1.8 2.5 3.3 VOLV Quiet Output Dynamic Valley VOL CL 30 pF, VIH VCC, VIL 0V 1.8 2.5 3.3 VOHV Quiet Output Dynamic Valley VOH CL 30 pF, VIH VCC, VIL 0V 1.8 2.5 3.3 TA 25qC Typical 0.25 0.6 0.8 V Units 0.25 0.6 0.8 1.5 1.9 2.2 V V Capacitance Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance Parameter VCC VI VI VCC Conditions 1.8V, 2.5V or 3.3V, VI 0V or VCC, VCC 0V or VCC, f 10 MHz, 0V or VCC TA 25qC Typical 6.0 7.0 20.0 Units pF pF pF 1.8V, 2.5V or 3.3V 1.8V, 2.5V or 3.3V 7 www.fairchildsemi.com 74VCXH16373 AC Loading and Waveforms (VCC 3.3V r 0.3V to 1.8V r 0.15V) TEST tPLH, tPHL tPZL, tPLZ tPZH, tPHZ VCC x 2 at VCC SWITCH Open 6V at VCC 3.3 r 0.3V; 2.5 r 0.2V; 1.8V r 0.15V GND FIGURE 1. AC Test Circuit FIGURE 2. Waveform for Inverting and Non-Inverting Functions FIGURE 3. 3-STATE Output HIGH Enable and Disable Times for Low Voltage Logic FIGURE 4. 3-STATE Output LOW Enable and Disable Times for Low Voltage Logic FIGURE 5. Propagation Delay, Pulse Width and tREC Waveforms Symbol Vmi Vmo VX VY FIGURE 6. Setup Time, Hold Time and Recovery Time for Low Voltage Logic VCC 3.3V r 0.3V 1.5V 1.5V VOL  0.3V VOH  0.3V 2.5V r 0.2V VCC/2 VCC/2 VOL  0.15V VOH  0.15V 1.8V r 0.15V VCC/2 VCC/2 VOL  0.15V VOH  0.15V www.fairchildsemi.com 8 74VCXH16373 AC Loading and Waveforms (VCC 1.5 r 0.1V to 1.2V) TEST tPLH, tPHL tPZL, tPLZ tPZH, tPHZ VCC x 2 at VCC SWITCH Open 6V at VCC 3.3 r 0.3V; 2.5 r 0.2V; 1.8V r 0.15V GND FIGURE 7. AC Test Circuit FIGURE 8. Waveform for Inverting and Non-Inverting Functions FIGURE 9. 3-STATE Output High Enable and Disable Times for Low Voltage Logic FIGURE 10. 3-STATE Output Low Enable and Disable Times for Low Voltage Logic Symbol Vmi Vmo VX VY VCC 1.5V r 0.1V VCC/2 VCC/2 VOL  0.1V VOH  0.1V 9 www.fairchildsemi.com 74VCXH16373 Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A (Preliminary) www.fairchildsemi.com 10 74VCXH16373 Low Voltage 16-Bit Transparent Latch with Bushold Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com
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