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74VCXH16374

74VCXH16374

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    74VCXH16374 - Low Voltage 16-Bit D-Type Flip-Flop with Bushold - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
74VCXH16374 数据手册
74VCXH16374 Low Voltage 16-Bit D-Type Flip-Flops with Bushold January 2000 Revised June 2005 74VCXH16374 Low Voltage 16-Bit D-Type Flip-Flops with Bushold General Description The VCXH16374 contains sixteen non-inverting D-type flip-flops with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. A buffered clock (CP) and output enable (OE) are common to each byte and can be shorted together for full 16-bit operation. The VCXH16374 data inputs include active bushold circuitry, eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level. The 74VCXH16374 is designed for low voltage (1.4V to 3.6V) VCC applications with output compatibility up to 3.6V. The 74VCXH16374 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining low CMOS power dissipation. Features s 1.4V to 3.6V VCC supply operation s 3.6V tolerant control inputs and outputs s Bushold on data inputs eliminates the need for external pull-up/pull-down resistors s tPD 3.0 ns max for 3.0V to 3.6V VCC s Static Drive (IOH/IOL) r24 mA @ 3.0V VCC s Uses patented noise/EMI reduction circuitry s Latch-up performance exceeds 300 mA s ESD performance: Human body model ! 2000V Machine model ! 200V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Order Number 74VCXH16374GX (Note 1) 74VCXH16374MTD (Note 2) Package Number BGA54A (Preliminary) MTD48 Package Descriptions 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide [TAPE and REEL] 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Note 1: BGA package available in Tape and Reel only. Note 2: D evices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol © 2005 Fairchild Semiconductor Corporation DS500228 www.fairchildsemi.com 74VCXH16374 Connection Diagrams Pin Assignment for TSSOP Pin Descriptions Pin Names OEn CPn I0–I15 O0–O15 NC Description Output Enable Input (Active LOW) Clock Pulse Input Bushold Inputs Outputs No Connect FBGA Pin Assignments 1 A B C D E F G H J O0 O2 O4 O6 O8 O10 O12 O14 O15 2 NC O1 O3 O5 O7 O9 O11 O13 NC 3 OE1 NC VCC GND GND GND VCC NC OE2 4 CP1 NC VCC GND GND GND VCC NC CP2 5 NC I1 I3 I5 I7 I9 I11 I13 NC 6 I0 I2 I4 I6 I8 I10 I12 I14 I15 Truth Tables Inputs Pin Assignment for FBGA CP1 Outputs I0–I7 H L X X O0–O7 H L O0 Z Outputs I8–I15 H L X X O8–O15 H L O0 Z OE1 L L L H Inputs CP2   L X   L X OE2 L L L H (Top Thru View) H L X Z O0 HIGH Voltage Level LOW Voltage Level Immaterial (HIGH or LOW, control inputs may not float) High Impedance Previous O0 before HIGH-to-LOW of CP www.fairchildsemi.com 2 74VCXH16374 Functional Description The 74VCXH16374 consists of sixteen edge-triggered flip-flops with individual D-type inputs and 3-STATE true outputs. The device is byte controlled with each byte functioning identically, but independent of the other. The control pins can be shorted together to obtain full 16-bit operation. Each clock has a buffered clock and buffered Output Enable common to all flip-flops within that byte. The description which follows applies to each byte. Each flip-flop will store the state of their individual I inputs that meet the setup and hold time requirements on the LOW-to-HIGH Clock (CPn) transition. With the Output Enable (OEn) LOW, the contents of the flip-flops are available at the outputs. When OEn is HIGH, the outputs go to the high impedance state. Operations of the OEn input does not affect the state of the flip-flops. Logic Diagram Byte 1 (0:7) Byte 2 (8:15) Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. 3 www.fairchildsemi.com 74VCXH16374 Absolute Maximum Ratings(Note 3) Supply Voltage (VCC) DC Input Voltage (VI) OEn, CPn I0 – I15 Output Voltage (VO) Outputs 3-STATED Outputs Active (Note 4) DC Input Diode Current (IIK) VI  0 V DC Output Diode Current (IOK) VO  0V VO ! VCC DC Output Source/Sink Current (IOH/IOL) DC VCC or GND Current per Supply Pin (ICC or GND) Storage Temperature Range (TSTG) 0.5V to 4.6V 0.5V to 4.6V 0.5V to VCC  0.5V 0.5V to 4.6V 0.5V to VCC 0.5V 50 mA 50 mA 50 mA r50 mA r100 mA 65qC to 150qC Recommended Operating Conditions (Note 5) Power Supply Operating Input Voltage Output Voltage (VO) Output in Active States Output in “OFF” State Output Current in IOH/IOL VCC VCC VCC VCC 3.0V to 3.6V 2.3V to 2.7V 1.65V to 2.3V 1.4V to 1.6V 0V to VCC 0.0V to 3.6V 1.4V to 3.6V 0.3V to VCC Free Air Operating Temperature (TA) Minimum Input Edge Rate ('t/'V) VIN 0.8V to 2.0V, VCC 3.0V r24 mA r18 mA r6 mA r2 mA 40qC to 85qC 10 ns/V Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 4: IO Absolute Maximum Rating must be observed. Note 5: Floating or unused control inputs must be held HIGH or LOW. DC Electrical Characteristics Symbol VIH Parameter HIGH Level Input Voltage Conditions VCC (V) 2.7 - 3.6 2.3 - 2.7 1.65 - 2.3 1.4 - 1.6 VIL LOW Level Input Voltage 2.7 - 3.6 2.3 - 2.7 1.65 - 2.3 1.4 - 1.6 VOH HIGH Level Output Voltage IOH IOH IOH IOH IOH IOH IOH IOH IOH IOH IOH IOH Min 2.0 1.6 0.65 x VCC 0.65 x VCC 0.8 0.7 1.35 x VCC 1.35 x VCC VCC - 0.2 2.2 2.4 2.2 VCC - 0.2 2.0 1.8 1.7 VCC - 0.2 1.25 VCC - 0.2 1.05 V V V Max Units 100 PA 12 mA 18 mA 24 mA 100 PA 6 mA 12 mA 18 mA 100 PA 6 mA 100 PA 2 mA 2.7 - 3.6 2.7 3.0 3.0 2.3 - 2.7 2.3 2.3 2.3 1.65 - 2.3 1.65 1.4 - 1.6 1.4 www.fairchildsemi.com 4 74VCXH16374 DC Electrical Characteristics Symbol VOL Parameter LOW Level Output Voltage (Continued) VCC (V) IOL IOL IOL IOL IOL IOL IOL IOL IOL IOL IOL 100 PA 12 mA 18 mA 24 mA 100 PA 12 mA 18 mA 100 PA 6 mA 100 PA 2 mA VCC or GND 0.8V 2.0V 0.7V 1.6V 0.57V 1.07V 2.7 - 3.6 2.7 3.0 3.0 2.3 - 2.7 2.3 2.3 1.65 - 2.3 1.65 1.4 - 1.6 1.4 2.7 - 3.6 2.7 - 3.6 3.0 3.0 2.3 2.3 1.65 1.65 3.6 3.6 2.7 2.7 1.95 1.95 1.4 - 3.6 0 1.4 - 3.6 1.4 - 3.6 2.7 - 3.6 75.0 0.2 0.4 0.4 0.55 0.2 0.4 0.6 0.2 0.3 0.2 0.35 V Conditions Min Max Units II II(HOLD) Input Leakage Current Bushold Input Minimum Drive Hold Current Control Pins Data Pins 0 d VI d 3.6V VI VIN VIN VIN VIN VIN VIN r5.0 r5.0 75.0 45.0 PA 45.0 25.0 PA 25.0 450 II(OD) Bushold Input Over-Drive Current to Change State (Note 6) (Note 7) (Note 6) (Note 7) (Note 6) (Note 7) 450 300 300 200 PA 200 r10.0 10.0 20.0 IOZ IOFF ICC 3-STATE Output Leakage Power-OFF Leakage Current Quiescent Supply Current Increase in ICC per Input 0 d VO d 3.6V VI VI VIH VIH or VIL VCC or GND VCC 0.6V 0 d (VO) d 3.6V VCC d (VO) d 3.6V (Note 8) PA PA PA PA PA r20.0 750 'ICC Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW. Note 8: Outputs disabled or 3-STATE only. 5 www.fairchildsemi.com 74VCXH16374 AC Electrical Characteristics Symbol fMAX Parameter Maximum Clock Frequency CL (Note 9) Conditions VCC (V) 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 TA 40qC to 85qC Max Units Figure Number Min 250 200 100 80.0 0.8 1.0 1.5 1.0 0.8 1.0 1.5 1.0 0.8 1.0 1.5 1.0 1.5 1.5 2.5 3.0 1.0 1.0 1.0 2.0 1.5 1.5 4.0 4.0 30 pF MHz CL tPHL tPLH CL tPZL tPZH CL tPLZ Output Disable Time CL Output Enable Time CL Propagation Delay CL 15 pF pF, RL 500: 1.5 r 0.1 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 3.0 3.9 7.8 15.6 3.5 4.6 9.2 18.4 3.5 3.8 6.8 13.6 ns Figures 1, 3, 4 Figures 7, 9, 10 ns Figures 1, 3, 4 Figures 7, 9, 10 ns Figures 1, 2 Figures 7, 8 15 pF, RL 30 pF, RL 2 k: 500: 1.5 r 0.1 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 15 pF, RL 30 pF, RL 2 k: 500: 1.5 r 0.1 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 CL tS Setup Time CL 15 pF, RL 30 pF, RL 2 k: 500: 1.5 r 0.1 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 ns Figure 6 CL tH Hold Time CL 15 pF, RL 30 pF, RL 500: 500: 1.5 r 0.1 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 ns Figure 6 CL tW Pulse Width CL 15 pF, RL 30 pF, RL 500: 500: 1.5 r 0.1 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 ns Figure 5 CL tOSHL tOSLH Output to Output Skew (Note 10) CL Note 9: For CL 15 pF, RL 30 pF, RL 500: 500: 1.5 r 0.1 3.3 r 0.3 2.5 r 0.2 1.8 r 0.15 CL 0.5 0.5 0.75 1.5 ns 15 pF, RL 2 k: 1.5 r 0.1 50PF, add approximately 300 ps to the AC maximum specification. Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). www.fairchildsemi.com 6 74VCXH16374 Dynamic Switching Characteristics Symbol VOLP Parameter Quiet Output Dynamic Peak VOL CL 30 pF, VIH Conditions VCC, VIL 0V VCC (V) 1.8 2.5 3.3 VOLV Quiet Output Dynamic Valley VOL CL 30 pF, VIH VCC, VIL 0V 1.8 2.5 3.3 VOHV Quiet Output Dynamic Valley VOH CL 30 pF, VIH VCC, VIL 0V 1.8 2.5 3.3 TA 25qC Typical 0.25 0.6 0.8 V Units 0.25 0.6 0.8 1.5 1.9 2.2 V V Capacitance Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance Parameter VCC VI VI VCC Conditions 1.8V, 2.5V or 3.3V, VI 0V or VCC, VCC 0V or VCC, f 10 MHz, 0V or VCC TA 25qC Typical 6.0 7.0 20.0 Units pF pF pF 1.8V, 2.5V or 3.3V 1.8V, 2.5V or 3.3V 7 www.fairchildsemi.com 74VCXH16374 AC Loading and Waveforms (VCC 3.3V r 0.3V to 1.8V r 0.15V) TEST tPLH, tPHL tPZL, tPLZ tPZH, tPHZ SWITCH Open 6V at VCC 3.3V r 0.3V; VCC x 2 at VCC 2.5V r 0.2V; 1.8V r 0.15V GND FIGURE 1. AC Test Circuit FIGURE 2. Waveform for Inverting and Non-Inverting Functions FIGURE 3. 3-STATE Output High Enable and Disable Times for Low Voltage Logic FIGURE 4. 3-STATE Output Low Enable and Disable Times for Low Voltage Logic FIGURE 5. Propagation Delay, Pulse Width and tREC Waveforms Symbol Vmi Vmo VX VY FIGURE 6. Setup Time, Hold Time and Recovery Time for Low Voltage Logic VCC 3.3V r 0.3V 1.5V 1.5V VOL 0.3V VOH 0.3V 2.5V r 0.2V VCC/2 VCC/2 VOL 0.15V VOH 0.15V 1.8V r 0.15V VCC/2 VCC/2 VOL 0.15V VOH 0.15V www.fairchildsemi.com 8 74VCXH16374 AC Loading and Waveforms (VCC 1.5V r 0.1V) TEST tPLH, tPHL tPZL, tPLZ tPZH, tPHZ SWITCH Open VCC x 2 at VCC GND FIGURE 7. AC Test Circuit 1.5 r 0.1V FIGURE 8. Waveform for Inverting and Non-Inverting Functions FIGURE 9. 3-STATE Output High Enable and Disable Times for Low Voltage Logic FIGURE 10. 3-STATE Output Low Enable and Disable Times for Low Voltage Logic Symbol Vmi Vmo VX VY VCC 1.5V r 0.1V VCC/2 VCC/2 VOL 0.1V VOH 0.1V 9 www.fairchildsemi.com 74VCXH16374 Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A (Preliminary) www.fairchildsemi.com 10 74VCXH16374 Low Voltage 16-Bit D-Type Flip-Flops with Bushold Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com
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