CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
September 2006
CNY171, CNY172, CNY173, CNY174, CNY17F1, CNY17F2, CNY17F3, CNY17F4, MOC8101, MOC8102, MOC8103, MOC8104, MOC8105, MOC8106, MOC8107, MOC8108 Phototransistor Optocouplers
Features
■ UL recognized (File # E90700) ■ VDE recognized – Add option V for white package (e.g., CNY17F2VM) – File #102497 – Add option ‘300’ for black package (e.g., CNY17F2300) – File #94766 ■ Current transfer ratio in select groups ■ High BVCEO—70V minimum (CNY17X/M, CNY17FX/M, MOC8106/7/8) ■ Closely matched current transfer ratio (CTR) minimizes unit-to-unit variation. ■ Very low coupled capacitance along with no chip to pin 6 base connection for minimum noise susceptability (CNY17FX/M, MOC810X)
Applications
■ ■ ■ ■ ■ Power supply regulators Digital logic inputs Microprocessor inputs Appliance sensor systems Industrial controls
Description
The CNY17, CNY17F and MOC810X devices consist of a Gallium Arsenide IRED coupled with an NPN phototransistor in a dual in-line package.
White Package (-M Suffix)
Black Package (No -M Suffix)
6 6 1 1
6 1
6
1
6
6
1
1
Schematic
ANODE 1
6 NC
ANODE 1
6 BASE
CATHODE 2
5 COLLECTOR
CATHODE 2
5 COLLECTOR
NC 3
4 EMITTER
NC 3
4 EMITTER
CNY17F1/2/3/4 CNY17F1M/2M/3M/4M MOC8101/2/3/4/5/6/7/8
CNY171/2/3/4 CNY171M/2M/3M/4M
©2006 Fairchild Semiconductor Corporation
1
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Absolute Maximum Ratings
Symbol
TOTAL DEVICE TSTG TOPR TSOL PD Storage Temperature M non M Operating Temperature M non M Lead Solder Temperature Total Device Power Dissipation @ 25°C (LED plus detector) Derate Linearly From 25°C All M non M M non M EMITTER IF VR IF (pk) PD Continuous Forward Current M non M Reverse Voltage Forward Current - Peak (1 µs pulse, 300 pps) All M non M LED Power Dissipation 25°C Ambient Derate Linearly From 25°C M non M M non M DETECTOR IC VCEO Continuous Collector Current Collector-Emitter Voltage All CNY17X/M, CNY17FX/M, MOC8106/7/8 MOC8101/2/3/4/5 VECO PD Emitter Collector Voltage Detector Power Dissipation @ 25°C Derate Linearly from 25°C All M non M M non M 50 70 30 7 150 150 1.76 2.0 mW/°C mA V V V mW 60 100 6 1.5 1.0 120 150 1.41 1.8 mW/°C mW V A mA -40 to +150 -55 to +150 -40 to +100 -55 to +100 260 for 10 sec 250 250 2.94 3.30 mW/°C °C mW °C °C
Parameters
Device
Value
Units
2 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Electrical Characteristics (TA = 25°C Unless otherwise specified.)(1)
Individual Component Characteristics
Symbol
EMITTER VF Input Forward Voltage IF = 60mA IF = 10mA CJ IR Capacitance VF = 0 V, f = 1.0MHz Reverse Leakage Current VR = 6 V DETECTOR BVCEO Breakdown Voltage Collector to Emitter IC = 1.0mA, IF = 0 CNY17FX/M CNY17X/M MOC810X All All 1.0 1.0 1.35 1.15 18 0.001 10 1.65 1.50 pF µA V
Parameters
Test Conditions
Device
Min.
Typ.
Max.
Units
MOC8101/2/3/4/5 MOC8106/7/8 CNY17F1/2/3/4/M CNY171/2/3/4/M CNY171/2/3/4/M All All CNY171/2/3/4/M All CNY171/2/3/4/M CNY171/2/3/4/M
30 70
100 100
V
BVCBO BVECO ICEO ICBO CCE CCB CEB
Collector to Base Emitter to Collector Leakage Current Collector to Emitter Collector to Base Capacitance Collector to Emitter Collector to Base Emitter to Base
IC = 10µA, IF = 0 IE = 100µA, IF = 0 VCE = 10 V, IF = 0 VCB = 10 V, IF = 0 VCE = 0, f = 1MHz VCB = 0, f = 1MHz VEB = 0, f = 1MHz
70 7
120 10 1 50 20 8 20 10 nA nA pF pF pF
Isolation Characteristics
Symbol
VISO
Characteristic
Input-Output Isolation Voltage
Test Conditions
f = 60 Hz, t = 1 min., II-O ≤ 2µA(4) f = 60 Hz, t = 1 sec., II-O ≤ 2µA(4)
Device
Black Package ‘M’ White Package All Black Package ‘M’ White Package
Min.
5300 7500 1011
Typ.** Max.
Units
Vac(rms)* Vac(pk) Ω
RISO CISO
Isolation Resistance Isolation Capacitance
VI-O = 500 VDC(4) VI-O = Ø, f = 1MHz(4)
0.5 0.2
pF
Note: * 5300 Vac(rms) for 1 minute equates to approximately 9000 Vac (pk) for 1 second ** Typical values at TA = 25°C
3 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Transfer Characteristics (TA = 25°C Unless otherwise specified.)(1)
Symbol
COUPLED (CTR)(2) Output Collector Current MOC8101 MOC8102 MOC8103 MOC8104 MOC8105 MOC8106 MOC8107 MOC8108 CNY17F1/1M CNY17F2/2M CNY17F3/3M CNY17F4/4M CNY171/1M CNY172/2M CNY173/3M CNY174/4M VCE(sat) Collector-Emitter Saturation Voltage CNY17XM/FXM IC = 2.5mA, IF = 10mA IF = 10mA, IC = 2.5mA IF = 10mA, VCE = 5V IF = 10mA, VCE = 10V 50 73 108 160 65 50 100 250 40 63 100 160 40 63 100 160 80 117 173 256 133 150 300 600 80 125 200 320 80 125 200 320 0.4 V %
DC Characteristics
Test Conditions
Min.
Typ.
Max.
Units
MOC8101/2/3/4/5/6/7/8 IC = 500µA, IF = 5.0mA CNY17X/FX 0.3 V
Symbol
ton
AC Characteristics(3)
Turn-On Time MOC8101/2/3/4/5 MOC8106/7/8 CNY17X/FX
Test Conditions
IC = 2.0mA, VCC = 10V, RL = 100Ω
Min. Typ.* Max.
2 20
Units
µs
NON-SATURATED SWITCHING TIME
10 IC = 2.0mA, VCC = 10V, RL = 100Ω 3 20
toff
Turn-Off Time
MOC8101/2/3/4/5 MOC8106/7/8 CNY17X/FX
10 IF = 10mA, VCC = 5V, RL = 75Ω IC = 2.0mA, VCC = 10V, RL = 100Ω IF = 10mA, VCC = 5V, RL = 75Ω IF = 10mA, VCC = 5V, RL = 75Ω IC = 2.0mA, VCC = 10V, RL = 100Ω IF = 10mA, VCC = 5V, RL = 75Ω 2 3.5 1 4.0 4.1 µs µs 5.6 µs µs
td tr
Delay Time Rise Time
CNY17XM/FXM All Devices CNY17XM/FXM
ts tf
Storage Time Fall Time
CNY17XM/FXM All Devices CNY17XM/FXM
4 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Transfer Characteristics (Continued)
Symbol
ton
(TA = 25°C Unless otherwise specified.)(1)
AC Characteristics(3)
Turn-on Time CNY171/F1 CNY172/F2 CNY173/F3 CNY174/F4
Test Conditions
IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V
Min.
Typ.
Max. Units
5.5 8.0 µs
SATURATED SWITCHING TIMES
tr
Rise Time
CNY171/F1 CNY172/F1 CNY173/F3 CNY174/F4 CNY171M/F1M CNY172M/3M/4M CNY17F2M/F3M/F4M
IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V
4.0 6.0
µs
IF = 20mA, VCC = 5V, RL = 1kΩ IF = 10mA, VCC = 5V, RL = 1kΩ IF = 20mA, VCC = 5V, RL = 1kΩ IF = 10mA, VCC = 5V, RL = 1kΩ IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V
4.0 6.0 5.5 8.0 34 39 µs µs
Delay Time td toff Turn-off Time
CNY171M/F1M CNY172M/3M/4M CNY17F2M/F3M/F4M CNY171/F1 CNY172/F2 CNY173/F3 CNY174/F4
tf
Fall Time
CNY171/F1 CNY172/F2 CNY173/F3 CNY174/F4 CNY171M/F1M CNY172M/3M/4M CNY17F2M/F3M/F4M
IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V
20 24
µs
IF = 20mA, VCC = 5V, RL = 1kΩ IF = 10mA, VCC = 5V, RL = 1kΩ IF = 20mA, VCC = 5V, RL = 1kΩ IF = 10mA, VCC = 5V, RL = 1kΩ
20.0 24.0 34.0 39.0 µs µs
ts
Storage Time
CNY171M/F1M CNY172M/3M/4M CNY17F2M/F3M/F4M
** All typicals at TA = 25°C
Notes: 1. Always design to the specified minimum/maximum electrical limits (where applicable). 2. Current Transfer Ratio (CTR) = IC/IF x 100%. 3. For test circuit setup and waveforms, refer to Figures 20. 4, For this test, Pins 1 and 2 are common, and Pins 4 are 5 are common.
5 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Fig.1 Normalized CTR vs. Forward Current (Black Package)
1.4 VCE = 5.0V TA = 25˚C 1.2 Normalized to IF = 10 mA 1.6
Fig.2 Normalized CTR vs. Forward Current (White Package)
VCE = 5.0V TA = 25˚C Normalized to IF = 10 mA
1.4
1.2 1.0
NORMALIZED CTR
1.0 0.8
NORMALIZED CTR
0 5 10 15 20
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0 0 2 4 6 8 10 12 14 16 18 20
IF - FORWARD CURRENT (mA)
IF - FORWARD CURRENT (mA)
Fig. 3 Normalized CTR vs. Ambient Temperature (Black Package)
1.6
Fig. 4 Normalized CTR vs. Ambient Temperature (White Package)
1.4
1.4 IF = 5 mA
1.2 IF = 5 mA
1.2
1.0
NORMALIZED CTR
IF = 10 mA 1.0
NORMALIZED CTR
IF = 10 mA
0.8
IF = 20 mA 0.6
0.8
0.6
Normalized to IF = 10 mA TA = 25˚C -50 -25
0.4 IF = 20 mA
Normalized to IF = 10 mA TA = 25˚C -40 -20
0
0.4 -75
0
25
50
75
100
125
0.2 -60
20
40
60
80
100
TA - AMBIENT TEMPERATURE (˚C)
TA - AMBIENT TEMPERATURE (˚C)
Fig. 5 CTR vs. RBE (Unsaturated) (Black Package)
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10 100 1000 IF = 5 mA IF = 20 mA IF = 10 mA VCE= 5.0 V
Fig. 6 CTR vs. RBE (Unsaturated) (White Package)
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
1.0 0.9 0.8 IF = 10 mA 0.7 IF = 5 mA 0.6 0.5 0.4 0.3 0.2 VCE= 5.0 V 0.1 0.0 10 100 1000 IF = 20 mA
1.0
RBE- BASE RESISTANCE (kΩ)
RBE- BASE RESISTANCE (kΩ)
6 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Fig. 7 CTR vs. RBE (Saturated) (Black Package)
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10 100 1000 IF = 5 mA IF = 10 mA IF = 20 mA VCE= 0.3 V
Fig. 8 CTR vs. RBE (Saturated) (White Package)
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10 100 1000 IF = 5 mA IF = 10 mA IF = 20 mA VCE= 0.3 V
RBE- BASE RESISTANCE (k Ω)
RBE- BASE RESISTANCE (k Ω)
Fig. 9 Switching Speed vs. Load Resistor (Black Package)
1000 IF = 10 mA VCC = 10 V TA = 25˚C 1000
Fig. 10 Switching Speed vs. Load Resistor (White Package)
IF = 10 mA VCC = 10 V TA = 25˚C 100
SWITCHING SPEED - (µs)
100
SWITCHING SPEED - (µs)
Toff Tf 10
Toff Tf 10
Ton
1
Ton
1
Tr
Tr
0.1 0.1 1 10 100
0.1 0.1 1 10 100
R-LOAD RESISTOR (kΩ)
R-LOAD RESISTOR (kΩ)
Fig. 11 Normalized ton vs. RBE (Black Package)
5.0 5.0 VCC = 10 V IC = 2 mA RL = 100 Ω
Fig. 12 Normalized ton vs. RBE (White Package)
NORMALIZED ton - (ton(RBE) / ton(open))
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 10 100 1000
NORMALIZED ton - (ton(RBE) / ton(open))
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5
VCC = 10 V IC = 2 mA RL = 100 Ω
10000
100000
10
100
1000
10000
100000
RBE- BASE RESISTANCE (k Ω)
RBE- BASE RESISTANCE (k Ω)
7 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Fig. 13 Normalized toff vs. RBE (Black Package)
1.4 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10 100 1000 10000 100000 VCC = 10 V IC = 2 mA RL = 100 Ω 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10
Fig. 14 Normalized toff vs. RBE (White Package)
NORMALIZED toff - (toff(RBE) / toff(open))
NORMALIZED toff - (toff(RBE) / toff(open))
VCC = 10 V IC = 2 mA RL = 100 Ω
100
1000
10000
100000
RBE- BASE RESISTANCE (k Ω)
RBE- BASE RESISTANCE (k Ω)
Fig. 15 LED Forward Voltage vs. Forward Current (Black Package)
1.8
Fig. 16 LED Forward Voltage vs. Forward Current (White Package)
1.8
1.7
1.7
VF - FORWARD VOLTAGE (V)
1.6
VF - FORWARD VOLTAGE (V)
1.6
1.5
1.5
1.4 TA = -55°C 1.3 TA = 25°C 1.2 TA = 100°C 1.1
1.4 TA = -55°C 1.3 TA = 25°C 1.2 TA = 100°C 1.1
1.0
1.0 1 10 100
1
10
100
IF - LED FORWARD CURRENT (mA)
IF - LED FORWARD CURRENT (mA)
Fig. 17 Collector-Emitter Saturation Voltage vs Collector Current (Black Package)
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
100
Fig. 18 Collector-Emitter Saturation Voltage vs Collector Current (White Package)
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
100
TA = 25˚C 10
10
1
1 IF = 2.5 mA 0.1
IF = 2.5 mA 0.1
0.01
IF = 10 mA IF = 5 mA
IF = 20 mA
0.01 IF = 5 m A IF = 10 mA
IF = 20 mA
TA = 25˚C 0.1 1 10
0.001 0.01
0.001 0.01
0.1
1
10
IC - COLLECTOR CURRENT (mA)
IC - COLLECTOR CURRENT (mA)
8 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Fig. 19 Dark Current vs. Ambient Temperature (Black Package)
101
ICEO - COLLECTOR-EMITTER DARK CURRENT (µA)
VCE = 10 V 100
10-1
10-2
10-3
10-4
10-5
10-6 0 25 50 75 100 125
TA - AMBIENT TEMPERATURE (°C)
VCC
10%
INPUT PULSE
IF INPUT
IC
RL
90%
OUTPUT PULSE
OUTPUT (VCE)
td tr ton
ts tf toff
Figure 20. Switching Time Test Circuit
Figure 21. Switching Time Test Circuit
9 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Black Package (No -M Suffix)
Package Dimensions (Through Hole)
PIN 1 ID.
3
Package Dimensions (Surface Mount)
0.350 (8.89) 0.330 (8.38)
2
1
PIN 1 ID.
0.270 (6.86) 0.240 (6.10)
0.270 (6.86) 0.240 (6.10)
SEATING PLANE
0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14)
4
5
6
0.070 (1.78) 0.045 (1.14)
0.300 (7.62) TYP
0.200 (5.08) 0.115 (2.92)
0.200 (5.08) 0.165 (4.18) 0.020 (0.51) MIN 0.100 (2.54) TYP
0.016 (0.41) 0.008 (0.20)
0.154 (3.90) 0.100 (2.54)
0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20)
0.022 (0.56) 0.016 (0.41)
0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX
0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP
0° to 15°
0.300 (7.62) TYP
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4” Lead Spacing)
PIN 1 ID
Recommended Pad Layout for Surface Mount Leadform (Black Package Only)
0.070 (1.78)
0.270 (6.86) 0.240 (6.10)
0.060 (1.52)
0.415 (10.54)
0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14)
0.100 (2.54) 0.295 (7.49) 0.030 (0.76)
SEATING PLANE
0.200 (5.08) 0.135 (3.43)
0.154 (3.90) 0.100 (2.54)
0.004 (0.10) MIN
0.016 (0.40) 0.008 (0.20)
0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP
0° to 15° 0.400 (10.16) TYP
Note: All dimensions are in inches (millimeters)
10 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
White Package (-M Suffix)
Package Dimensions (Through Hole)
0.350 (8.89) 0.320 (8.13) Pin 1 ID
Package Dimensions (Surface Mount)
0.350 (8.89) 0.320 (8.13)
Pin 1 ID 0.390 (9.90) 0.332 (8.43)
0.260 (6.60) 0.240 (6.10)
0.260 (6.60) 0.240 (6.10)
SEATING PLANE
Seating Plane
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25)
0.320 (8.13)
0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25)
0.320 (8.13)
0.200 (5.08) 0.115 (2.93)
0.200 (5.08) 0.115 (2.93)
0.012 (0.30) 0.008 (0.20)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15° 0.012 (0.30)
0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)
0.100 [2.54] 0.035 (0.88) 0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
0.350 (8.89) 0.320 (8.13) PIN 1 ID
Recommended Pad Layout for Surface Mount Leadform (White Package Only)
0.070 (1.78)
0.060 (1.52)
0.260 (6.60) 0.240 (6.10)
0.425 (10.79)
0.070 (1.77) 0.040 (1.02) SEATING PLANE 0.014 (0.36) 0.010 (0.25)
0.100 (2.54) 0.305 (7.75) 0.030 (0.76)
0.200 (5.08) 0.115 (2.93)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16)
Note: All dimensions are in inches (millimeters)
11 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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Ordering Information
Black Package Part Number Example (No Suffix)
CNY171S CNY171SD CNY171W CNY171300 CNY171300W CNY1713S CNY1713SD
White Package Part Number Example (M Suffix)
CNY171SM CNY171SR2M CNY171TM CNY171VM CNY171TVM CNY171SVM CNY171SR2VM
Description
Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE Approved VDE Approved, 0.4" Lead Spacing VDE Approved, Surface Mount VDE Approved, Surface Mount, Tape & Reel
Carrier Tape Specifications (Black Package, No Suffix)
12.0 ± 0.1 4.85 ± 0.20 0.30 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 Ø1.55 ± 0.05 1.75 ± 0.10
7.5 ± 0.1 13.2 ± 0.2 9.55 ± 0.20 16.0 ± 0.3
0.1 MAX
10.30 ± 0.20
Ø1.6 ± 0.1
User Direction of Feed
Carrier Tape Specifications (White Package, M Suffix)
12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 0.30 ± 0.05 4.0 ± 0.1 Ø1.5 MIN 1.75 ± 0.10
11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 24.0 ± 0.3
0.1 MAX
10.1 ± 0.20
Ø1.5 ± 0.1/-0
User Direction of Feed
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Marking Information (Black package non ‘M’ suffix)
1
CNY17-1 V XX YY K
3 4 5
2 6
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) Two digits year code, e.g., ‘03’; One digit year code for ‘M’ version, e.g. ‘5’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code
Reflow Profile (Black Package, No Suffix)
300 Temperature (°C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute)
Time above 183°C, 60–150 sec 215°C, 10–30 s
225 C peak
Ramp up = 3C/sec
• Peak reflow temperature: 225°C (package surface temperature) • Time of temperature higher than 183°C for 60–150 seconds • One time soldering reflow is recommended
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Marking Information (White package M suffix)
1
CNY17-1 V X YY Q
3 4 5
2 6
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) Single digit year code, e.g. ‘5’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code
Reflow Profile (White Package, M Suffix)
300 280 260 240 220 200 180 Time above 183°C = 90 Sec 260°C >245°C = 42 Sec
°C
160 140 120 100 80 60 40 20 0 0 60 120 180 33 Sec 1.822°C/Sec Ramp up rate
270
360
Time (s)
14 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FAST® FASTr™ FPS™ FRFET™ DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™
SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I20
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
15 CNY17X, CNY17FX, MOC810X Rev. 1.0.6
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