FDD6796A / FDU679A_F071 N-Channel PowerTrench® MOSFET
March 2009
FDD6796A / FDU6796A_F071
N-Channel PowerTrench® MOSFET
25 V, 5.7 mΩ Features General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(on) and fast switching speed.
Max rDS(on) = 5.7 mΩ at VGS = 10 V, ID = 20 A Max rDS(on) = 15.0 mΩ at VGS = 4.5 V, ID = 15.2 A 100% UIL tested RoHS Compliant
Applications
Vcore DC-DC for Desktop Computers and Servers VRM for Intermediate Bus Architecture
D
D G G D S D-PAK (TO-252) S Short-Lead I-PAK (TO-251AA) S G
MOSFET Maximum Ratings TC = 25 °C unless otherwise noted
Symbol VDS VGS Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous (Package limited) ID -Continuous (Silicon limited) -Continuous -Pulsed EAS PD TJ, TSTG Single Pulse Avalanche Energy Power Dissipation Power Dissipation TC = 25 °C TA = 25 °C (Note 1a) (Note 3) TC = 25 °C TC = 25 °C TA = 25 °C (Note 1a) Ratings 25 ±20 40 67 20 150 40 42 3.7 -55 to +175 mJ W °C A Units V V
Operating and Storage Junction Temperature Range
Thermal Characteristics
RθJC RθJA Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient (Note 1a) 3.6 40 °C/W
Package Marking and Ordering Information
Device Marking FDD6796A FDU6796A Device FDD6796A FDU6796A_F071 Package D-PAK (TO-252) TO-251AA Reel Size 13 ’’ N/A(Tube) Tape Width 12 mm N/A Quantity 2500 units 75 units
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FDD6796A / FDU679A_F071 N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25 °C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS ∆BVDSS ∆TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250 µA, VGS = 0 V ID = 250 µA, referenced to 25 °C VDS = 20 V, VGS = 0 V VGS = ±20 V, VDS = 0 V 25 16 1 ±100 V mV/°C µA nA
On Characteristics
VGS(th) ∆VGS(th) ∆TJ rDS(on) gFS Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient Static Drain to Source On Resistance Forward Transconductance VGS = VDS, ID = 250 µA ID = 250 µA, referenced to 25 °C VGS = 10 V, ID = 20 A VGS = 4.5 V, ID = 15.2 A VGS = 10 V, ID = 20 A, TJ = 150 °C VDS = 5 V, ID = 20 A 1.0 1.9 -6 4.3 11.1 6.5 118 5.7 15.0 8.6 S mΩ 3.0 V mV/°C
Dynamic Characteristics
Ciss Coss Crss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = 13 V, VGS = 0 V, f = 1 MHz 1336 298 266 1.2 1780 400 400 pF pF pF Ω
Switching Characteristics
td(on) tr td(off) tf Qg Qg Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Total Gate Charge Gate to Source Charge Gate to Drain “Miller” Charge VGS = 0 V to 10 V VGS = 0 V to 5 V VDD = 13 V, ID = 2 0 A VDD = 13 V, ID = 20 A, VGS = 10 V, RGEN = 6 Ω 8 7 19 4 24 14 4.0 5.7 16 14 34 10 34 20 ns ns ns ns nC nC nC nC
Drain-Source Diode Characteristics
VSD trr Qrr Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = 3.1 A VGS = 0 V, IS = 20 A (Note 2) (Note 2) 0.8 0.9 15 4 1.2 1.3 27 10 V ns nC
IF = 20 A, di/dt = 100 A/µs
Notes: 1: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user’s board design.
a) 40 °C/W when mounted on a 1 in2 pad of 2 oz copper
b) 96 °C/W when mounted on a minimum pad
2: Pulse Test: Pulse Width < 300 µs, Duty cycle < 2.0%. 3: EAS of 40 mJ is based on starting TJ = 25 °C, L = 1 mH, IAS = 9 A, VDD = 23 V, VGS = 10 V. 100% test at L = 0.1 mH, IAS = 21 A.
©2009 Fairchild Semiconductor Corporation FDD6796A / FDU6796A_F071 Rev.C1
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FDD6796A / FDU679A_F071 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted
VGS = 8 V VGS = 10 V ID, DRAIN CURRENT (A) NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
150 120 90 60
VGS = 3.5 V VGS = 6 V
4
PULSE DURATION = 80 µs DUTY CYCLE = 0.5% MAX
VGS = 4.5 V
3
VGS = 3.5 V VGS = 4 V
VGS = 4 V
2
VGS = 8 V
VGS = 4.5 V VGS = 6 V
30
PULSE DURATION = 80 µs DUTY CYCLE = 0.5% MAX
1
VGS = 10 V
0 0.0
0 0.5 1.0 1.5 2.0 2.5 0 30 60 90 120 150
VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)
Figure 1. On Region Characteristics
Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage
1.8
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
20
SOURCE ON-RESISTANCE (mΩ)
ID = 20 A VGS = 10 V
1.6 1.4 1.2 1.0 0.8
PULSE DURATION = 80 µs DUTY CYCLE = 0.5% MAX
15
ID = 20 A
rDS(on), DRAIN TO
10
TJ = 150 oC
5
TJ = 25 oC
0.6 -75 -50 -25 0 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (oC)
0 2 4 6 8 10
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. Normalized On Resistance vs Junction Temperature
150
IS, REVERSE DRAIN CURRENT (A) PULSE DURATION = 80 µs DUTY CYCLE = 0.5% MAX
Figure 4. On-Resistance vs Gate to Source Voltage
200 100
VGS = 0 V
120
ID, DRAIN CURRENT (A) VDS = 3 V
90 60
TJ = 175 oC
10
TJ = 175 oC TJ = -55 oC
1
TJ = 25 oC
30
TJ = 25 oC TJ = -55 oC
0 0 1 2 3 4 5 6
VGS, GATE TO SOURCE VOLTAGE (V)
0.1 0.2
0.4
0.6
0.8
1.0
1.2
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward Voltage vs Source Current
©2009 Fairchild Semiconductor Corporation FDD6796A / FDU6796A_F071 Rev.C1
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FDD6796A / FDU679A_F071 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted
10
VGS, GATE TO SOURCE VOLTAGE (V) ID = 20 A
5000
8
VDD = 10 V
6
VDD = 13 V VDD = 16 V
CAPACITANCE (pF)
Ciss
1000
4 2
Coss
f = 1 MHz VGS = 0 V
Crss
0 0 5 10 15 20 25 30
Qg, GATE CHARGE (nC)
100 0.1
1
10
30
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics
Figure 8. Capacitance vs Drain to Source Voltage
80
ID, DRAIN CURRENT (A)
100
IAS, AVALANCHE CURRENT (A)
40
TJ = 125 oC
60
VGS = 10 V
10
TJ = TJ = 150 oC 25 oC
40
Limited by Package
20
RθJC = 3.6 C/W
o
VGS = 4.5 V
1 0.001
0.01
0.1
1
10
100
0 25
50
75
100
125
o
150
175
tAV, TIME IN AVALANCHE (ms)
TC, CASE TEMPERATURE ( C)
Figure 9. Unclamped Inductive Switching Capability
200 100
ID, DRAIN CURRENT (A)
Figure 10. Maximum Continuous Drain Current vs Case Temperature
2000
P(PK), PEAK TRANSIENT POWER (W)
10 us
1000
VGS = 10 V
10
THIS AREA IS LIMITED BY rDS(on)
100 us
SINGLE PULSE RθJC = 3.6 oC/W
1 ms 10 ms 100 ms DC
100
TC = 25 oC
1
SINGLE PULSE TJ = MAX RATED RθJC = 3.6 oC/W TC = 25 oC
0.1 0.1
1
10
100
10 -5 10
10
-4
10
-3
10
-2
10
-1
1
10
VDS, DRAIN to SOURCE VOLTAGE (V)
t, PULSE WIDTH (sec)
Figure 11. Forward Bias Safe Operating Area
Figure 12. Single Pulse Maximum Power Dissipation
©2009 Fairchild Semiconductor Corporation FDD6796A / FDU6796A_F071 Rev.C1
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FDD6796A / FDU679A_F071 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted
2
1
NORMALIZED THERMAL IMPEDANCE, ZθJC
DUTY CYCLE-DESCENDING ORDER
0.1
D = 0.5 0.2 0.1 0.05 0.02 0.01
PDM
t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJC x RθJc + TC
SINGLE PULSE RθJC = 3.6 C/W
o
0.01 -5 10
10
-4
10
-3
10
-2
10
-1
1
t, RECTANGULAR PULSE DURATION (sec)
Figure 13. Junction-to-Case Transient Thermal Response Curve
2 1
DUTY CYCLE-DESCENDING ORDER NORMALIZED THERMAL IMPEDANCE, ZθJA
0.1
0.01
D = 0.5 0.2 0.1 0.05 0.02 0.01 SINGLE PULSE
PDM
t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TA
0.001 0.0005 -4 10 10
-3
RθJA = 96 C/W
(Note 1b)
-2 -1
o
10
10
1
10
100
1000
t, RECTANGULAR PULSE DURATION (sec)
Figure 14. Junction-to-Ambient Transient Thermal Response Curve
©2009 Fairchild Semiconductor Corporation FDD6796A / FDU6796A_F071 Rev.C1
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FDD6796A / FDU679A_F071 N-Channel PowerTrench® MOSFET
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Rev. I37
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