FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
January 2007
FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
20V, 35A, 5.5mΩ Features General Description
Max rDS(on) = 5.5mΩ at VGS = 10V, ID = 35A Max rDS(on) = 8.5mΩ at VGS = 4.5V, ID = 33A Low gate charge: Qg(TOT) = 34nC(Typ), VGS = 10V Low gate resistance 100% Avalanche tested RoHS compliant Vcore DC-DC for Desktop Computers and Servers VRM for Intermediate Bus Architecture
tm
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(on) and fast switching speed.
Application
D
G GDS I-PAK (TO-251AA) S
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol VDS VGS ID EAS PD TJ, TSTG Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous (Package Limited) -Continuous (Die Limited) -Pulsed Single Pulse Avalanche Energy Power Dissipation Operating and Storage Temperature (Note 1) (Note 2) Ratings 20 ±20 35 93 354 144 77 -55 to 175 mJ W °C A Units V V
Thermal Characteristics
RθJC RθJA RθJA Thermal Resistance, Junction to Case TO-252,TO-251 Thermal Resistance, Junction to Ambient TO-252,TO-251 Thermal Resistance, Junction to Ambient TO-252,1in2 copper pad area 1.94 100 52 °C/W °C/W °C/W
Package Marking and Ordering Information
Device Marking FDD8586 FDU8586 Device FDD8586 FDU8586 Package TO-252AA TO-251AA Reel Size 13’’ N/A(Tube) Tape Width 12mm N/A Quantity 2500 units 75 units
©2007 Fairchild Semiconductor Corporation FDD8586/FDU8586 Rev. B
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FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS ∆BVDSS ∆TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250µA, VGS = 0V ID = 250µA, referenced to 25°C VDS = 16V, VGS = 0V VGS = ±20V TJ = 150°C 20 14.6 1 250 ±100 V mV/°C µA nA
On Characteristics
VGS(th) ∆VGS(th) ∆TJ rDS(on) gFS Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient VGS = VDS, ID = 250µA ID = 250µA, referenced to 25°C VGS = 10V, ID = 35A Drain to Source On Resistance VGS = 4.5V, ID = 33A VGS = 10V, ID = 35A TJ = 175°C VDS = 10V,ID = 35A 1.2 1.6 -6.7 4.0 5.7 6.5 175 5.5 8.5 8.9 S mΩ 2.5 V mV/°C
Forward Transcondductance
Dynamic Characteristics
Ciss Coss Crss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = 10V, VGS = 0V, f = 1MHz f = 1MHz 1865 550 335 1.2 2480 730 445 pF pF pF Ω
Switching Characteristics
td(on) tr td(off) tf Qg(TOT) Qg(5) Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge at 10V Total Gate Charge at 5V Gate to Source Gate Charge Gate to Drain “Miller”Charge VGS = 0V to 10V VGS = 0V to 5V VDD = 10V ID = 35A Ig = 1.0mA VDD = 10V, ID = 35A VGS = 10V, RGS = 10Ω 9 11 47 25 34 16 3.2 5.9 18 20 75 40 48 22 ns ns ns ns nC nC nC nC
Drain-Source Diode Characteristics
VSD trr Qrr Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 35A VGS = 0V, IS = 15A IF = 35A, di/dt = 100A/µs IF = 35A, di/dt = 100A/µs 0.89 0.82 30 23 1.25 1.2 45 35 V ns nC
Notes: 1: Pulse time < 300µs, Duty cycle = 2%. 2: Starting TJ = 25oC, L = 0.3mH, IAS = 31A ,VDD = 18V, VGS = 10V.
FDD8586/FDU8586 Rev. B
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FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
140 120
ID, DRAIN CURRENT (A)
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE PULSE DURATION = 80µs VGS = 10V DUTY CYCLE = 0.5%MAX VGS = 5.0V VGS = 4.0V VGS = 4.5V
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5
VGS = 10V VGS = 5V VGS = 4.5V VGS = 3.5V PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX VGS = 4V
100 80 60 40 20 0 0.0 0.5 1.0
VGS = 3.5V
VGS = 3.0V
1.5
2.0
2.5
3.0
3.5
4.0
0
20
VDS, DRAIN TO SOURCE VOLTAGE (V)
40 60 80 100 ID, DRAIN CURRENT(A)
120
140
Figure 1. On Region Characteristics
Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage
15
rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ)
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
1.8 1.6 1.4 1.2 1.0 0.8 0.6 -80
ID = 35A VGS = 10V
ID = 35A
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
12
9
TJ = 175oC
6
TJ = 25oC
-40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
200
3 3.0
4.5 6.0 7.5 9.0 VGS, GATE TO SOURCE VOLTAGE (V)
10
Figure 3. Normalized On Resistance vs Junction Temperature
140 ID, DRAIN CURRENT (A) 120 100 80 60 40 20 0 1.0
TJ = 25oC TJ = - 55oC TJ = 175oC VDD = 5V
Figure 4. On-Resistance vs Gate to Source Voltage
200 100
VGS = 0V
IS, REVERSE DRAIN CURRENT (A)
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
10 1 0.1 0.01 1E-3 0.0
TJ = 175oC
TJ = 25oC
TJ = -55oC
1.5 2.0 2.5 3.0 3.5 4.0 4.5 VGS, GATE TO SOURCE VOLTAGE (V)
5.0
0.2 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V)
1.4
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward Voltage vs Source Current
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FDD8586/FDU8586 Rev. B
FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
VGS, GATE TO SOURCE VOLTAGE(V)
10 8 6 4 2 0
VDD = 10V VDD = 13V VDD = 7V
5000
Ciss
f = 1MHz VGS = 0V
CAPACITANCE (pF)
Coss
1000
Crss
0
5
10 15 20 25 Qg, GATE CHARGE(nC)
30
35
100 0.1
1 10 VDS, DRAIN TO SOURCE VOLTAGE (V)
30
Figure 7. Gate Charge Characteristics
50
IAS, AVALANCHE CURRENT(A)
Figure 8. Capacitance vs Drain to Source Voltage
100
VGS = 10V
ID, DRAIN CURRENT (A)
80 60
VGS = 4.5V
TJ = 25oC
CURRENT LIMITED BY PACKAGE
10
TJ = 125oC TJ = 150oC
40 20
RθJC = 1.94 C/W
o
1 0.01
0.1 1 10 100 tAV, TIME IN AVALANCHE(ms)
1000
0 25
50
75
100
125
o
150
175
TC, CASE TEMPERATURE ( C)
Figure 9. Unclamped Inductive Switching Capability
1000
10us
Figure 10. Maximum Continuous Drain Current vs Case Temperature
P(PK), PEAK TRANSIENT POWER (W)
10000
VGS = 10V
TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: 175 – T C --------------------150
ID, DRAIN CURRENT (A)
100
100us
1000
10
LIMITED BY PACKAGE
I = I25
1ms 10ms
SINGLE PULSE TJ = MAX RATED TC = 25OC
1
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on)
DC
100 50 -5 10
SINGLE PULSE
0.1 1
10 VDS, DRAIN-SOURCE VOLTAGE (V)
50
10
-4
10 10 10 t, PULSE WIDTH (s)
-3
-2
-1
10
0
10
1
Figure 11. Forward Bias Safe Operating Area
Figure 12. Single Pulse Maximum Power Dissipation
FDD8586/FDU8586 Rev. B
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FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
2
DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01
1
NORMALIZED THERMAL IMPEDANCE, ZθJC
0.1
PDM
t1 t2
0.01
SINGLE PULSE
NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJC x RθJC + TC
0.005 -5 10
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t, RECTANGULAR PULSE DURATION (s)
Figure 13. Transient Thermal Response Curve
FDD8586/FDU8586 Rev. B
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FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
FDD8586/FDU8586 Rev. B
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FDD8586/FDU8586 N-Channel PowerTrench® MOSFET
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT® FAST® FASTr™ FPS™ FRFET™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC® UniFET™ VCX™ Wire™
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As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
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Datasheet Identification Advance Information
Product Status Formative or In Design First Production
Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I22
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
FDD8586/FDU8586 Rev. B
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