FDFMA2N028Z Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
March 2008
FDFMA2N028Z
20V, 3.7A, 68mΩ Features
MOSFET
Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
General Description
This device is designed specifically as a single package solution for a boost topology in cellular handset and other ultra-portable applications. It features a MOSFET with low on-state resistance, and an independently connected schottky diode with low forward voltage. The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to switching and linear mode applications.
Max rDS(on) = 68mΩ at VGS = 4.5V, ID = 3.7A Max rDS(on) = 86mΩ at VGS = 2.5V, ID = 3.3A HBM ESD protection level > 2kV (Note 3)
Schottky
VF < 0.37V @ 500mA Low profile - 0.8 mm maximum - in the new package MicroFET 2x2 mm RoHS Compliant
Application
DC - DC Conversion
Pin 1 A NC D A1 NC 2 D3 C MicroFET 2X2 G S 6C 5G 4S
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted
Symbol VDS VGS ID PD TJ, TSTG VRR IO Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous -Pulsed Power Dissipation Power Dissipation Operating and Storage Junction Temperature Range Schottky Repetitive Peak Reverse Voltage Schottky Average Forward Current (Note 1a) (Note 1b) (Note 1a) Ratings 20 ±12 3.7 6 1.4 0.7 -55 to +150 20 2 Units V V A W °C V A
Thermal Characteristics
RθJA RθJA RθJA RθJA Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Ambient (Note 1a) (Note 1b) (Note 1c) (Note 1d) 86 173 86 140 °C/W
Package Marking and Ordering Information
Device Marking .N28 Device FDFMA2N028Z Package MicroFET 2X2
1
Reel Size 7’’
Tape Width 8mm
Quantity 3000 units
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©2008 Fairchild Semiconductor Corporation FDFMA2N028Z Rev.B1
FDFMA2N028Z Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS ΔBVDSS ΔTJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250μA, VGS = 0V ID = 250μA, referenced to 25°C VDS = 16V, VGS = 0V VGS = ±12V, VDS = 0V 20 15 1 ±10 V mV/°C μA μA
On Characteristics
VGS(th) ΔVGS(th) ΔTJ rDS(on) gFS Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient Static Drain to Source On Resistance Forward Trans conductance VGS = VDS, ID = 250μA ID = 250μA, referenced to 25°C VGS = 4.5V, ID = 3.7A VGS = 2.5V, ID = 3.3A VGS = 4.5V, ID = 3.7A, TJ = 125°C VDS = 10V, ID = 3.7A 0.6 1.0 –4 37 50 53 16 68 86 90 S mΩ 1.5 V mV/°C
Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 10V, VGS = 0V, f = 1.0MHz 340 80 60 455 110 90 pF pF pF
Switching Characteristics
td(on) tr td(off) tf Qg(TOT) Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate to Source Gate Charge Gate to Drain “Miller” Charge VDS = 10V ID = 3.7A VGS = 4.5V VDD = 10V, ID = 1A VGS = 4.5V, RGEN = 6Ω 8 8 14 3 4 0.7 1.1 16 16 26 6 6 ns ns ns ns nC nC nC
Drain-Source Diode Characteristics
IS VSD trr Qrr Maximum Continuous Drain-Source Diode Forward Current Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 1.1A (Note 2) 0.7 11 2 1.1 1.2 A V ns nC
IF = 3.7A, di/dt = 100A/μs
Schottky Diode Characteristics
VR IR Reverse Voltage Reverse Leakage IR = 1mA VR = 20V IF = 500mA VF Forward Voltage IF = 1A TJ = 25°C TJ = 25°C TJ = 125°C TJ = 25°C TJ = 125°C TJ = 25°C TJ = 125°C 20 30 10 0.32 0.21 0.37 0.28 300 45 0.37 0.26 0.435 0.33 V V μA mA
FDFMA2N028Z Rev.B1
2
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FDFMA2N028Z Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
Electrical Characteristics TJ = 25°C unless otherwise noted
Notes: 1: RθJA is determined with the device mounted on a 1in2 pad 2 oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθJA is determined by the user's board design. (a) MOSFET RθJA = 86oC/W when mounted on a 1in2 pad of 2 oz copper, 1.5” x 1.5” x 0.062” thick PCB. (b) MOSFET RθJA = 173oC/W when mounted on a minimum pad of 2 oz copper. (c) Schottky RθJA = 86oC/W when mounted on a 1in2 pad of 2 oz copper, 1.5” x 1.5” x 0.062” thick PCB. (d) Schottky RθJA = 140oC/W when mounted on a minimum pad of 2 oz copper.
a)86oC/W when mounted on a 1in2 pad of 2 oz copper.
b)173oC/W when mounted on a minimum pad of 2 oz copper.
c)86oC/W when mounted on a 1in2 pad of 2 oz copper.
d)140oC/W when mounted on a minimum pad of 2 oz copper.
2: Pulse Test: Pulse Width < 300μs, Duty cycle < 2.0%.
3. The diode connected between the gate and source serves only protection against ESD. No gate overvoltage rating is implied.
FDFMA2N028Z Rev.B1
3
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FDFMA2N028Z Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
Typical Characteristics TJ = 25°C unless otherwise noted
6 5
ID, DRAIN CURRENT (A)
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
2.0
VGS = 2.0V
1.8 1.6 1.4 1.2 1.0 0.8
PULSE DURATION = 300μs DUTY CYCLE =2%MAX
4 3 2 1 0 0.0
VGS = 4.5V VGS = 3.0V VGS = 2.5V VGS = 2.0V PULSE DURATION = 300μs DUTY CYCLE = 2%MAX VGS = 1.5V
VGS = 2.5V VGS = 3.0V VGS = 3.5V VGS = 4.5V
0.2 0.4 0.6 0.8 1.0 VDS, DRAIN TO SOURCE VOLTAGE (V)
1.2
0
1
2 3 4 ID, DRAIN CURRENT(A)
5
6
Figure 1. On-Region Characteristics
Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage
150
rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ)
ID = 1.85A
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
1.6 1.4 1.2 1.0 0.8 0.6 -50
ID = 3.7A VGS = 4.5V
125 100 75 50 25
TJ = 25oC
PULSE DURATION = 300μs DUTY CYCLE = 2%MAX
TJ = 125oC
-25
0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (oC)
150
0
2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V)
10
Figure 3. Normalized On- Resistance vs Junction Temperature
IS, REVERSE DRAIN CURRENT (A)
Figure 4. On-Resistance vs Gate to Source Voltage
10
VGS = 0V
6 5 4 3 2 1 0 0.5
TJ = -55oC TJ = 125oC
PULSE DURATION = 300μs DUTY CYCLE = 2%MAX
VDD=5V
ID, DRAIN CURRENT (A)
1 0.1
TJ = 125oC TJ = 25oC
0.01 0.001
TJ = 25oC
TJ = -55oC
1.0 1.5 2.0 VGS, GATE TO SOURCE VOLTAGE (V)
2.5
0.0001 0.0
0.2 0.4 0.6 0.8 1.0 VSD, BODY DIODE FORWARD VOLTAGE (V)
1.2
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward Voltage vs Source Current
FDFMA2N028Z Rev.B1
4
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FDFMA2N028Z Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
Typical Characteristics TJ = 25°C unless otherwise noted
VGS, GATE TO SOURCE VOLTAGE(V)
10
ID = 3.7A
1000
Ciss
8 6 4 2 0
VDD = 5V VDD = 15V
CAPACITANCE (pF)
Coss
100
Crss
f = 1MHz VGS = 0V
VDD = 10V
0
2
4 6 Qg, GATE CHARGE(nC)
8
10
10 0.1
1 10 VDS, DRAIN TO SOURCE VOLTAGE (V)
20
Figure 7. Gate Charge Characteristics
P(PK), PEAK TRANSIENT POWER (W)
20 10
Figure 8. Capacitance Characteristics
50 40 30 20 10 0 -4 10
SINGLE PULSE SINGLE PULSE o RθJA = 173 C/W TA=25 C
o
rDS(on) LIMIT
ID, DRAIN CURRENT (A)
100us 1ms 10ms
1
0.1
VGS=4.5V SINGLE PULSE R
θJA
=173
o
100ms
C/W
TA = 25 C
o
1s 10s DC
0.01 0.1
1
10
60
10
-3
VDS, DRAIN to SOURCE VOLTAGE (V)
10 10 10 10 t, PULSE WIDTH (s)
-2
-1
0
1
10
2
10
3
Figure 9. Forward Bias Safe Operating Area
10
IF, FORWARD CURRENT(A)
TJ = 125oC
Figure 10. Single Pulse Maximum Power Dissipation
IR, REVERSE LEAKAGE CURRENT (mA)
100
TJ = 125oC
1
10 1 0.1 0.01 0.001
0.1
TJ = 85oC
TJ = 85oC
0.01
TJ = 25oC
TJ = 25oC
0.001
0
200 400 600 VF, FORWARD VOLTAGE(mV)
800
0
5
10 15 20 VR, REVERSE VOLTAGE (V)
25
30
Figure 11. Schottky Diode Forward Current
Figure 12. Schottky Diode Reverse Current
FDFMA2N028Z Rev.B1
5
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FDFMA2N028Z Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
Typical Characteristics TJ = 25°C unless otherwise noted
2
1
NORMALIZED THERMAL IMPEDANCE, ZθJA
DUTY CYCLE-DESCENDING ORDER
0.1
D = 0.5 0.2 0.1 0.05 0.02 0.01
PDM
t1
SINGLE PULSE
t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TA
0.01
0.005 -4 10
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
t, RECTANGULAR PULSE DURATION (s)
Figure 13. Transient Thermal Response Curve
FDFMA2N028Z Rev.B1
6
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FDFMA2N028Z Integrated N-Channel PowerTrench® MOSFET and Schottky Diode
Dimensional Outline and Pad Layout
rev3
FDFMA2N028Z Rev.B1
7
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FDFMA2N028Z Integrated N-Channel PowerTrench. MOSFET and Schottky Diode
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EfficentMax™ EZSWITCH™ *
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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I34
Preliminary
First Production
No Identification Needed Obsolete
Full Production Not In Production
FDFMA2N028Z Rev.B1
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