FDB33N25 / FDI33N25 250V N-Channel MOSFET
FDB33N25 / FDI33N25
250V N-Channel MOSFET Features
• 33A, 250V, RDS(on) = 0.094Ω @VGS = 10 V • Low gate charge ( typical 36.8 nC) • Low Crss ( typical 39 pF) • Fast switching • 100% avalanche tested • Improved dv/dt capability
UniFET
Description
May 2006
TM
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction.
D
D
G G S
D -PAK
FDB Series
2
GDS
I -PAK
FDI Series
2
S
Absolute Maximum Ratings
Symbol
VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current Gate-Source voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25°C) - Derate above 25°C
(Note 2) (Note 1) (Note 1) (Note 3)
Parameter
- Continuous (TC = 25°C) - Continuous (TC = 100°C) - Pulsed
(Note 1)
FDB33N25 / FDI33N25
250 33 20.4 132 ±30 918 33 23.5 4.5 235 1.89 -55 to +150 300
Unit
V A A A V mJ A mJ V/ns W W/°C °C °C
Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
Thermal Characteristics
Symbol
RθJC RθJA* RθJA
Parameter
Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient* Thermal Resistance, Junction-to-Ambient
Min.
----
Max.
0.53 40 62.5
Unit
°C/W °C/W °C/W
* When mounted on the minimum pad size recommended (PCB Mount)
©2006 Fairchild Semiconductor Corporation
1
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FDB33N25 / FDI33N25 Rev A
FDB33N25 / FDI33N25 250V N-Channel MOSFET
Package Marking and Ordering Information
Device Marking
FDB33N25 FDI33N25
Device
FDB33N25TM FDI33N25TU
Package
D2-PAK I2-PAK
TC = 25°C unless otherwise noted
Reel Size
330mm -
Tape Width
24mm -
Quantity
800 50
Electrical Characteristics
Symbol
Off Characteristics BVDSS ΔBVDSS / ΔTJ IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS ISM VSD trr Qrr
NOTES:
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
Conditions
VGS = 0V, ID = 250μA ID = 250μA, Referenced to 25°C VDS = 250V, VGS = 0V VDS = 200V, TC = 125°C VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VDS = VGS, ID = 250μA VGS = 10V, ID = 16.5A VDS = 40V, ID =16.5A VDS = 25V, VGS = 0V, f = 1.0MHz
(Note 4)
Min.
250 -----3.0 ------
Typ.
-0.25 -----0.077 26.6 1640 330 39 35 230 75 120 36.8 10 17
Max Units
--1 10 100 -100 5.0 0.094 -2135 430 59 80 470 160 250 48 --V V/°C μA μA nA nA V Ω S pF pF pF ns ns ns ns nC nC nC
On Characteristics
Dynamic Characteristics
Switching Characteristics VDD = 125V, ID = 33A RG = 25Ω
(Note 4, 5)
------(Note 4, 5)
VDS = 200V, ID = 33A VGS = 10V
--
Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 33A VGS = 0V, IS = 33A dIF/dt =100A/μs
(Note 4)
------
---220 1.71
33 132 1.4 ---
A A V ns μC
1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. L = 1.35mH, IAS = 33A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C 3. ISD ≤ 33A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature Typical Characteristics
FDB33N25 / FDI33N25 Rev A
2
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FDB33N25 / FDI33N25 250V N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
10
2
VGS Top : 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V
10
2
ID, Drain Current [A]
10
1
ID, Drain Current [A]
10
1
150 C 25 C -55 C
* Notes : 1. VDS = 40V 2. 250μs Pulse Test
o o
o
10
0
* Notes : 1. 250μs Pulse Test o 2. TC = 25 C
-1
10
10
0
10
1
10
0
2
4
6
8
10
12
VDS, Drain-Source Voltage [V]
V GS, Gate-Source Voltage [V]
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue
0.25
10
2
RDS(ON) [Ω], Drain-Source On-Resistance
VGS = 10V
0.15
IDR, Reverse Drain Current [A]
0.20
10
1
0.10
150 C 25 C
o
o
VGS = 20V
0.05
* Note : TJ = 25 C
o
* Notes : 1. VGS = 0V 2. 250μs Pulse Test
0.00
0
20
40
60
80
100
10
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
ID, Drain Current [A]
VSD, Source-Drain voltage [V]
Figure 5. Capacitance Characteristics
12
4000
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd
Figure 6. Gate Charge Characteristics
VGS, Gate-Source Voltage [V]
Crss = Cgd
10
VDS = 50V VDS = 125V VDS = 200V
3000
Coss Ciss
8
Capacitances [pF]
2000
6
4
1000
Crss
* Note ; 1. VGS = 0 V 2. f = 1 MHz
2
* Note : ID = 33A
0 -1 10
0
10
0
10
1
0
10
20
30
40
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
FDB33N25 / FDI33N25 Rev A
3
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FDB33N25 / FDI33N25 250V N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation vs. Temperature
1.2
Figure 8. On-Resistance Variation vs. Temperature
3.0
BVDSS, (Normalized) Drain-Source Breakdown Voltage
1.1
RDS(ON), (Normalized) Drain-Source On-Resistance
2.5
2.0
1.0
1.5
1.0
* Notes : 1. VGS = 10 V 2. ID = 16.5 A
0.9
* Notes : 1. VGS = 0 V 2. ID = 250 μA
0.5
0.8 -100
-50
0
50
100
o
150
200
0.0 -100
-50
0
50
100
o
150
200
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current vs. Case Temperature
40
10
2
10 μs 100 μs
ID, Drain Current [A]
10
1
Operation in This Area is Limited by R DS(on)
10 ms 100 ms DC
ID, Drain Current [A]
1 ms
30
20
10
0
* Notes : o 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse
o
10
10
-1
10
0
10
1
10
2
0 25
50
75
100
o
125
150
VDS, Drain-Source Voltage [V]
TC, Case Temperature [ C]
Figure 11. Transient Thermal Response Curve
10
0
ZθJC(t), Thermal Response
D =0.5
10
-1
0.2 0.1 0.05 0.02 0.01 single pulse
PDM t1 t2
10
-2
* N o te s : o 1 . Z θ JC (t) = 0 .5 3 C /W M ax. 2 . D u ty F a ctor, D = t 1 /t 2 3 . T JM - T C = P D M * Z θ JC (t)
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q uare W ave P ulse D uration [sec]
FDB33N25 / FDI33N25 Rev A
4
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FDB33N25 / FDI33N25 250V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDB33N25 / FDI33N25 Rev A
5
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FDB33N25 / FDI33N25 250V N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
FDB33N25 / FDI33N25 Rev A
6
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FDB33N25 / FDI33N25 250V N-Channel MOSFET
Mechanical Dimensions
D2-PAK
FDB33N25 / FDI33N25 Rev A
7
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FDB33N25 / FDI33N25 250V N-Channel MOSFET
Mechanical Dimensions
I2-PAK
9.90 ±0.20 (0.40)
4.50 ±0.20 1.30 –0.05
+0.10
1.20 ±0.20
9.20 ±0.20 MAX 3.00
(1.46)
13.08 ±0.20
(0.94)
1.27 ±0.10
1.47 ±0.10
0.80 ±0.10
10.08 ±0.20
MAX13.40
(4 5° )
2.54 TYP
2.54 TYP
0.50 –0.05
+0.10
2.40 ±0.20
10.00 ±0.20
FDB33N25 / FDI33N25 Rev A
8
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FDB33N25 / FDI33N25 250V N-Channel MOSFET
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PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I19
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
9 FDB33N25 / FDI33N25 Rev A
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