FDN5618

FDN5618P July 2000 PRELIMINARY FDN5618P 60V P-Channel Logic Level PowerTrench MOSFET General Description This 60V P-Channel MOSFET uses Fairchild’s high voltage PowerTrench process. It has been optimized for power management applications. Features • –1.25 A, –60 V. RDS(ON) = 0.170 Ω @ VGS = –10 V RDS(ON) = 0.230 Ω @ VGS = –4.5 V • Fast switching speed • High performance trench technology for extremely low RDS(ON) Applications • DC-DC converters • Load switch • Power management D D S SuperSOT -3 TM G TA=25oC unless otherwise noted G S Absolute Maximum Ratings Symbol VDSS VGSS ID Drain-Source Voltage Gate-Source Voltage Drain Current – Continuous – Pulsed PD TJ, TSTG Maximum Power Dissipation Parameter Ratings –60 ±20 (Note 1a) Units V V A W °C –1.25 –10 0.5 0.46 –55 to +150 (Note 1a) (Note 1b) Operating and Storage Junction Temperature Range Thermal Characteristics RθJA RθJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 1a) (Note 1) 250 75 °C/W °C/W Package Marking and Ordering Information Device Marking 618 Device FDN5618P Reel Size 7’’ Tape width 8mm Quantity 3000 units 2000 Fairchild Semiconductor Corporation FDN5618P Rev B(W) FDN5618P Electrical Characteristics Symbol BVDSS ∆BVDSS ===∆TJ IDSS IGSSF IGSSR VGS(th) ∆VGS(th) ===∆TJ RDS(on) TA = 25°C unless otherwise noted Parameter Drain–Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate–Body Leakage, Forward Gate–Body Leakage, Reverse (Note 2) Test Conditions VGS = 0 V, ID = –250 µA ID = –250 µA,Referenced to 25°C VDS = –48 V, VGS = 20V, VGS = –20 V VGS = 0 V VDS = 0 V VDS = 0 V Min -60 Typ Max Units V Off Characteristics –58 –1 100 –100 –1 –1.6 4 0.148 0.185 0.245 –5 4.3 430 52 19 6.5 8 16.5 4 VDS = –30 V, VGS = –10 V ID = –1.25 A, 8.6 1.5 1.3 –0.42 –1.2 13 16 30 8 13.8 0.170 0.230 0.315 –3 mV/°C µA nA nA V mV/°C Ω On Characteristics Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain–Source On–Resistance On–State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance (Note 2) VDS = VGS, ID = –250 µA ID = –250 µA,Referenced to 25°C VGS = –10 V, ID = –1.25 A VGS = –4.5 V, ID = –1.0 A VGS = –10 V, ID = –3 A TJ=125°C VGS = –10 V, VDS = –5 V VDS = –5 V, ID = –1.25 A ID(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS VSD A S pF pF pF ns ns ns ns nC nC nC A V Dynamic Characteristics VDS = –30 V, f = 1.0 MHz V GS = 0 V, Switching Characteristics Turn–On Delay Time Turn–On Rise Time Turn–Off Delay Time Turn–Off Fall Time Total Gate Charge Gate–Source Charge Gate–Drain Charge VDD = –30 V, VGS = –10 V, ID = –1 A, RGEN = 6 Ω Drain–Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain–Source Diode Forward Current Drain–Source Diode Forward VGS = 0 V, IS = –0.42 Voltage (Note 2) –0.7 Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 250°C/W when mounted on a 0.02 in2 pad of 2 oz. copper. b) 270°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width ≤=300 µs, Duty Cycle ≤=2.0 FDN5618P Rev B(W) FDN5618P Typical Characteristics 5 VGS = -10V -6.0V -4.5V 2.2 2 4 -4.0V -3.5V -3.0V VGS = -3.0V 1.8 1.6 1.4 1.2 3 -3.5V -4.0V -4.5V -6.0V -10V 2 1 -2.5V 1 0.8 0 0 1 2 3 4 -VDS, DRAIN-SOURCE VOLTAGE (V) 0 1 2 3 4 5 -ID, DRAIN CURRENT (A) Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.6 1.3 ID = -1.25A VGS = -10V 0.5 ID = -0.65 A 1.2 1.1 0.4 TA = 125 C o 1 0.3 0.9 0.2 TA = 25 C 0.8 -50 -25 0 25 50 75 100 o o 125 150 0.1 2 4 6 8 10 -VGS, GATE TO SOURCE VOLTAGE (V) TJ, JUNCTION TEMPERATURE ( C) Figure 3. On-Resistance Variation withTemperature. 6 VDS = - 5V 5 4 3 TA = 125 C o o Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 10 VGS = 0V o 25 C -55 C 1 TA = 125 C o 0.1 25 C 0.01 2 0.001 1 0 1 1.5 2 2.5 3 3.5 4 0.0001 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -VSD, BODY DIODE FORWARD VOLTAGE (V) -55 C o o -VGS, GATE TO SOURCE VOLTAGE (V) Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDN5618P Rev B(W) FDN5618P Typical Characteristics 10 ID = -1.25A 8 -40V 6 VDS = -20V -30V 700 600 500 400 300 200 f = 1MHz VGS = 0 V CISS 4 2 100 0 0 2 4 6 8 10 0 2 COSS CRSS 0 4 6 8 10 12 Qg, GATE CHARGE (nC) -VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics. 100 20 Figure 8. Capacitance Characteristics. -ID, DRAIN CURRENT (A) 10 RDS(ON) LIMIT 10ms 100ms DC 10s 1s 1ms 15 SINGLE PULSE RθJA = 270°C/W TA = 25°C 1 10 0.1 0.01 VGS =-10V SINGLE PULSE RθJA = 270oC/W TA = 25 C o 5 0.001 0.1 1 10 100 -VDS, DRAIN-SOURCE VOLTAGE (V) 0 0.001 0.01 0.1 1 t1, TIME (sec) 10 100 1000 Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. 1 D = 0.5 0.2 0.1 RθJA(t) = r(t) + RθJA RθJA = 270 °C/W P(pk) t1 t2 SINGLE PULSE 0.1 0.05 0.02 0.01 0.01 TJ - TA = P * RθJA(t) Duty Cycle, D = t1 / t2 0.01 0.1 t1, TIME (sec) 1 10 100 1000 0.001 0.0001 0.001 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDN5618P Rev B(W) SuperSOTTM-3 Tape and Reel Data and Package Dimensions SSOT-3 Packaging Configuration: Figure 1.0 Customize Label Packaging Description: SSOT-3 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 10,000 units per 13" or 330cm diameter reel. This and some other options are described in the Packaging Information table. These full reels are individually labeled and placed inside a standard intermediate made of recyclable corrugated brown paper with a Fairchild logo printing. One pizza box contains eight reels maximum. And these intermediate boxes are placed inside a labeled shipping box which comes in different sizes depending on the number of parts shipped. Antistatic Cover Tape Human Readable Embossed Label Carrier Tape 3P SSOT-3 Std Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 3,000 7" Dia D87Z TNR 10,000 13" 3P 3P 3P SSOT-3 Std Unit Orientation 343mm x 342mm x 64mm Intermediate box for D87Z Option Human Readable Label 187x107x183 343x343x64 24,000 0.0097 0.1230 30,000 0.0097 0.4150 Human Readable Label sample Human Readable Label SSOT-3 Tape Leader and Trailer Configuration: Figure 2.0 187mm x 107mm x 183mm Intermediate Box for Standard Option Carrier Tape Cover Tape Components Trailer Tape 300mm minimum or 75 empty pockets Leader Tape 500mm minimum or 125 empty pockets August 1999, Rev. C SuperSOTTM-3 Tape and Reel Data and Package Dimensions, continued SSOT-3 Embossed Carrier Tape Configuration: Figure 3.0 P0 T E1 P2 D0 D1 F E2 B0 Wc W Tc K0 P1 A0 User Direction of Feed Dimensions are in millimeter Pkg type SSOT-3 (8mm) A0 3.15 +/-0.10 B0 2.77 +/-0.10 W 8.0 +/-0.3 D0 1.55 +/-0.05 D1 1.125 +/-0.125 E1 1.75 +/-0.10 E2 6.25 min F 3.50 +/-0.05 P1 4.0 +/-0.1 P0 4.0 +/-0.1 K0 1.30 +/-0.10 T 0.228 +/-0.013 Wc 5.2 +/-0.3 Tc 0.06 +/-02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 20 deg maximum Typical component cavity center line 0.5mm maximum B0 20 deg maximum component rotation 0.5mm maximum Sketch A (Side or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement SSOT-3 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max Dim N See detail AA 7" Diameter Option B Min Dim C See detail AA W3 Dim D min 13" Diameter Option W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size 8mm Reel Option 7" Dia Dim A 7.00 177.8 13.00 330 Dim B 0.059 1.5 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 0.795 20.2 Dim N 2.165 55 4.00 100 Dim W1 0.331 +0.059/-0.000 8.4 +1.5/0 0.331 +0.059/-0.000 8.4 +1.5/0 Dim W2 0.567 14.4 0.567 14.4 Dim W3 (LSL-USL) 0.311 – 0.429 7.9 – 10.9 0.311 – 0.429 7.9 – 10.9 8mm 13" Dia July 1999, Rev. C SuperSOTTM-3 Tape and Reel Data and Package Dimensions, continued SuperSOT™-3 (FS PKG Code 32) 1:1 Scale 1:1 on letter size paper Di mensions shown below are in: inches [mil limeters] Part Weight per unit (gram): 0.0097 September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ E2CMOSTM FACT™ FACT Quiet Series™ FAST FASTr™ GTO™ DISCLAIMER HiSeC™ ISOPLANAR™ MICROWIRE™ POP™ PowerTrench  QFET™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. E