FDP2710 250V N-Channel PowerTrench MOSFET
November 2007
FDP2710
250V N-Channel PowerTrench MOSFET
General Description
This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance.
tm
Description
• • • • • • 50A, 250V, RDS(on) = 36.3mΩ @VGS = 10 V Fast switching speed Low gate charge High performance trench technology for extremely low RDS(on) High power and current handling capability RoHS compliant
Application
• PDP application
D
G GDS
TO-220
S
Absolute Maximum Ratings
Symbol
VDS VGS ID IDM EAS dv/dt PD TJ, TSTG TL Drain-Source Voltage Gate-Source voltage Drain Current Drain Current - Continuous (TC = 25°C) - Continuous (TC = 100°C) - Pulsed
(Note 1) (Note 2) (Note 3)
Parameter
Ratings
250 ± 30 50 31.3 See Figure 9 145 4.5 260 2.1 -55 to +150 300
Unit
V V A A A mJ V/ns W W/°C °C °C
Single Pulsed Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25°C) - Derate above 25°C
Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
Thermal Characteristics
Symbol
RθJC RθJA
Parameter
Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient
Min
---
Max
0.48 62.5
Unit
°C/W °C/W
©2007 Fairchild Semiconductor Corporation
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FDP2710 Rev. A
FDP2710 250V N-Channel PowerTrench MOSFET
Package Marking and Ordering Information
Device Marking
FDP2710
Device
FDP2710
Package
TO-220
Reel Size
-
Tape Width
-
Quantity
50
Electrical Characteristics
Symbol
Off Characteristics BVDSS ΔBVDSS ΔTJ IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS ISM VSD trr Qrr
Notes:
TC = 25°C unless otherwise noted
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
Conditions
VGS = 0V, ID = 250μA, TJ = 25°C ID = 250μA, Referenced to 25°C VDS = 250V, VGS = 0V VDS = 250V, VGS = 0V,TC = 125°C VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VDS = VGS, ID = 250μA VGS = 10V, ID = 25A VDS = 10V, ID = 25A
(Note 4)
Min
250 -----3.0 ----
Typ
-0.25 ----4.0 36.3 63 5470 426 97 80 252 112 154 78 34 18
Max Units
--10 500 100 -100 5.0 42.5 -7280 570 146 170 515 235 320 101 --V V/°C μA μA nA nA V mΩ S pF pF pF ns ns ns ns nC nC nC
On Characteristics
Dynamic Characteristics VDS = 25V, VGS = 0V, f = 1.0MHz ---VDD = 125V, ID = 50A VGS = 10V, RGEN = 25Ω
(Note 4, 5)
Switching Characteristics ----VDS = 125V, ID = 50A VGS = 10V
(Note 4, 5)
---
Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 50A VGS = 0V, IS = 50A dIF/dt =100A/μs
(Note 4)
------
---163 1.3
50 150 1.2 ---
A A V ns μC
1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. L = 1mH, IAS = 17A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C 3. ISD ≤ 50A, di/dt ≤ 100A/μs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature Typical Characteristics
FDP2710 Rev. A
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FDP2710 250V N-Channel PowerTrench MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
500
VGS
Top : 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V
Figure 2. Transfer Characteristics
250 100
150 C
o
100
ID,Drain Current[A]
ID,Drain Current[A]
-55 C
o
10
10
25 C
o
* Notes : 1. 250μs Pulse Test
1 0.1
2. TC = 25 C
o
1
* Notes : 1. VDS = 20V 2. 250μs Pulse Test
1 VDS,Drain-Source Voltage[V]
10
4
6 8 VGS,Gate-Source Voltage[V]
10
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
0.07
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature
150 100 * Notes :
IS, Reverse Drain Current [A]
1. VGS=0V
RDS(ON) [Ω], Drain-Source On-Resistance
0.06
2. 250μs Pulse Test
0.05
VGS = 10V
0.04
10
TA = 150 C
o
TA = 25 C
o
VGS = 20V
0.03
* Note : TJ = 25 C
o
0.02
0
25
50 75 100 ID, Drain Current [A]
125
150
1 0.2
0.4 0.6 0.8 1.0 VSD, Body Diode Forward Voltage [V]
1.2
Figure 5. Capacitance Characteristics
9000
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
Figure 6. Gate Charge Characteristics
10
VGS, Gate-Source Voltage [V]
VDS = 50V VDS = 125V VDS = 200V
8
Capacitances [pF]
6000
Ciss
6
Coss
4
3000
Crss
* Note: 1. VGS = 0V 2. f = 1MHz
2
* Note : ID = 50A
0 -1 10
10 10 VDS, Drain-Source Voltage [V]
0
1
30
0
0
10
20 30 40 50 60 Qg, Total Gate Charge [nC]
70
80
FDP2710 Rev. A
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FDP2710 250V N-Channel PowerTrench MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation vs. Temperature
1.2 BVDSS, [Normalized] Drain-Source Breakdown Voltage
Figure 8. On-Resistance Variation vs. Temperature
2.5 rDS(on), [Normalized] Drain-Source On-Resistance 2
1.1
1.0
1
0.9
* Notes : 1. VGS = 0V 2. ID = 250μA
0.8 -100
-50 0 50 100 150 o TJ, Junction Temperature [ C]
200
0 -100
* Notes : 1. VGS = 10V 2. ID = 25A
-50 0 50 100 150 o TJ, Junction Temperature [ C]
200
Figure 9. Maximum Safe Operating Area
500 100
100μs
Figure 10. Maximum Drain Current vs. Case Temperature
60 50 ID, Drain Current [A]
400
Drain Current, ID [A]
10
1ms
40 30 20 10 0 25
1
Operation in This Area is Limited by R DS(on) * Notes : 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse
o o
10 ms DC
0.1
0.01
1
10 100 Drain-Source Voltage, VDS [V]
50 75 100 125 o TC, Case Temperature [ C]
150
Figure 11. Transient Thermal Response Curve
10
0
Thermal Response [ZθJC]
0.5
10
-1
0.2 0.1 0.05
PDM t1
* Notes : 1. Zθ JC(t) = 0.48 C/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * Zθ JC(t)
-4
10
-2
0.02 0.01
t2
o
Single pulse
10
-3
10
-5
10
10
-3
10
-2
10
-1
10
0
10
1
Rectangular Pulse Duration [sec]
FDP2710 Rev. A
4
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FDP2710 250V N-Channel PowerTrench MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDP2710 Rev. A
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FDP2710 250V N-Channel PowerTrench MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
FDP2710 Rev. A
6
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FDP2710 250V N-Channel PowerTrench MOSFET
Mechanical Dimensions
TO-220
9.90 ±0.20 1.30 ±0.10 2.80 ±0.10 (8.70) ø3.60 ±0.10 (1.70) 4.50 ±0.20
1.30 –0.05
+0.10
9.20 ±0.20
(1.46)
13.08 ±0.20
(1.00)
(3.00)
15.90 ±0.20
1.27 ±0.10
1.52 ±0.10
0.80 ±0.10 2.54TYP [2.54 ±0.20] 2.54TYP [2.54 ±0.20]
10.08 ±0.30
18.95MAX.
(3.70)
(45° )
0.50 –0.05
+0.10
2.40 ±0.20
10.00 ±0.20
FDP2710 Rev. A
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FDP2710 250V N-Channel PowerTrench MOSFET
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK®
®
Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FPS™ FRFET® Global Power ResourceSM
Green FPS™ Green FPS™ e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR®
®
PDP-SPM™ Power220®
Power247® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6
SuperSOT™-8 SyncFET™ The Power Franchise®
TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® UniFET™ VCX™
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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
Rev. I31
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
FDP2710 Rev. A
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