FDPF14N30

FDP14N30 / FDPF14N30 300V N-Channel MOSFET FDP14N30 / FDPF14N30 300V N-Channel MOSFET Features • 14A, 300V, RDS(on) = 0.29Ω @VGS = 10 V • Low gate charge ( typical 18 nC) • Low Crss ( typical 17 pF) • Fast switching • 100% avalanche tested • Improved dv/dt capability UniFET Description February 2007 TM These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction. D G GDS TO-220 FDP Series GD S TO-220F FDPF Series S Absolute Maximum Ratings Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current Gate-Source voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25°C) - Derate above 25°C (Note 2) (Note 1) (Note 1) (Note 3) Parameter - Continuous (TC = 25°C) - Continuous (TC = 100°C) - Pulsed (Note 1) FDP14N30 300 14 8.4 56 ±30 330 14 14 4.5 140 1.12 FDPF14N30 14 * 8.4 ∗ 56 ∗ Unit V A A A V mJ A mJ V/ns 35 0.28 -55 to +150 300 W W/°C °C °C Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds * Drain current limited by maximum junction temperature Thermal Characteristics Symbol RθJC RθCS RθJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Typ. Thermal Resistance, Junction-to-Ambient FDP14N30 0.89 0.5 62.5 FDPF14N30 3.56 -62.5 Unit °C/W °C/W °C/W ©2007 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDP14N30 / FDPF14N30 Rev. A FDP14N30 / FDPF14N30 300V N-Channel MOSFET Package Marking and Ordering Information Device Marking FDP14N30 FDPF14N30 Device FDP14N30 FDPF14N30 Package TO-220 TO-220F TC = 25°C unless otherwise noted Reel Size - Tape Width - Quantity 50 50 Electrical Characteristics Symbol Off Characteristics BVDSS ΔBVDSS / ΔTJ IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS ISM VSD trr Qrr NOTES: Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Conditions VGS = 0V, ID = 250μA ID = 250μA, Referenced to 25°C VDS = 300V, VGS = 0V VDS = 240V, TC = 125°C VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VDS = VGS, ID = 250μA VGS = 10V, ID = 7A VDS = 40V, ID = 7A VDS = 25V, VGS = 0V, f = 1.0MHz (Note 4) Min. 300 -----3.0 ------ Typ. -0.3 -----0.24 10.5 815 150 17 20 105 30 75 18 4.5 8 Max Units --1 10 100 -100 5.0 0.29 -1060 195 25 50 120 70 160 25 --V V/°C μA μA nA nA V Ω S pF pF pF ns ns ns ns nC nC nC On Characteristics Dynamic Characteristics Switching Characteristics VDD = 150V, ID = 14A RG = 25Ω (Note 4, 5) ------(Note 4, 5) VDS = 240V, ID = 14A VGS = 10V -- Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 14A VGS = 0V, IS = 14A dIF/dt =100A/μs (Note 4) ------ ---235 1.6 14 56 1.4 --- A A V ns μC 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. L = 2.8mH, IAS = 14A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C 3. ISD ≤ 14A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature Typical Characteristics FDP14N30 / FDPF14N30 Rev. A 2 www.fairchildsemi.com FDP14N30 / FDPF14N30 300V N-Channel MOSFET Typical Performance Characteristics Figure 1. On-Region Characteristics VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V Top : Figure 2. Transfer Characteristics 10 2 10 2 ID, Drain Current [A] 10 1 ID, Drain Current [A] 10 1 150 C 25 C o o 10 0 -55 C * Notes : 1. VDS = 40V 2. 250 μs Pulse Test o 10 -1 * Notes : 1. 250μs Pulse Test 2. TC = 25 C -1 o 10 0 2 4 6 8 10 12 10 10 0 10 1 VGS, Gate-Source Voltage [V] VDS, Drain-Source Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 1.3 RDS(ON) [Ω], Drain-Source On-Resistance 1.2 10 2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 5 10 15 20 25 30 * Note : TJ = 25 C o VGS = 10V IDR, Reverse Drain Current [A] 1.1 10 1 VGS = 20V 150oC 25 C o * Notes : 1. VGS = 0V 2. 250μs Pulse Test 35 40 45 10 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 ID, Drain Current [A] VSD, Source-Drain voltage [V] Figure 5. Capacitance Characteristics 2000 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd Figure 6. Gate Charge Characteristics 12 Coss VGS, Gate-Source Voltage [V] 10 VDS = 60V VDS = 150V VDS = 240V Capacitances [pF] 8 Ciss 1000 6 Crss * Note : 1. VGS = 0 V 2. f = 1 MHz 4 2 * Note : ID = 14A 0 -1 10 10 0 10 1 0 0 2 4 6 8 10 12 14 16 18 20 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] FDP14N30 / FDPF14N30 Rev. A 3 www.fairchildsemi.com FDP14N30 / FDPF14N30 300V N-Channel MOSFET Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature 1.2 Figure 8. On-Resistance Variation vs. Temperature 3.0 BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.1 RDS(ON), (Normalized) Drain-Source On-Resistance 2.5 2.0 1.0 1.5 1.0 * Notes : 1. VGS = 10 V 2. ID = 7 A 0.9 * Notes : 1. VGS = 0 V 2. ID = 250μA 0.5 0.8 -100 -50 0 50 100 o 150 200 0.0 -100 -50 0 50 100 o 150 200 TJ, Junction Temperature [ C] TJ, Junction Temperature [ C] Figure 9-1. Maximum Safe Operating Area - FDP14N30 Figure 9-2. Maximum Safe Operating Area - FDPF14N30 10 2 10 2 10 μs 100 μs 10 μs ID, Drain Current [A] 10 1 1 ms 10 ms 100 ms DC ID, Drain Current [A] 100 μs 10 1 1 ms 10 ms Operation in This Area is Limited by R DS(on) 10 0 Operation in This Area is Limited by R DS(on) 10 0 100 ms DC 10 -1 * Notes : 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse o o 10 -1 * Notes : 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse o o 10 -2 10 0 10 1 10 2 10 -2 10 0 10 1 10 2 VDS, Drain-Source Voltage [V] VDS, Drain-Source Voltage [V] Figure 10. Maximum Drain Currentvs. Case Temperature 15 ID, Drain Current [A] 10 5 0 25 50 75 100 o 125 150 TC, Case Temperature [ C] FDP14N30 / FDPF14N30 Rev. A 4 www.fairchildsemi.com FDP14N30 / FDPF14N30 300V N-Channel MOSFET Typical Performance Characteristics (Continued) Figure 11-1. Transient Thermal Response Curve - FDP14N30 10 0 ZθJC(t), Thermal Response D = 0 .5 0 .2 10 -1 0 .1 0 .0 5 0 .0 2 0 .0 1 PDM t1 t2 o * N o te s : 1 . Z θ J C ( t) = 0 .8 9 C /W M a x . 2 . D u ty F a c to r , D = t 1 /t 2 3 . T J M - T C = P D M * Z θ J C ( t) 10 -2 s in g le p u ls e 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ] Figure 11-2. Transient Thermal Response Curve - FDPF14N30 10 1 ZθJC(t), Thermal Response D = 0 .5 10 0 0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1 * N o te s : 1 . Z θ J C ( t) = 3 .5 6 C /W M a x . 2 . D u ty F a c to r , D = t 1 /t 2 3 . T J M - T C = P D M * Z θ J C ( t) o PDM t1 t2 10 -1 10 -2 s in g le p u ls e 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ] FDP14N30 / FDPF14N30 Rev. A 5 www.fairchildsemi.com FDP14N30 / FDPF14N30 300V N-Channel MOSFET Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms FDP14N30 / FDPF14N30 Rev. A 6 www.fairchildsemi.com FDP14N30 / FDPF14N30 300V N-Channel MOSFET Peak Diode Recovery dv/dt Test Circuit & Waveforms FDP14N30 / FDPF14N30 Rev. A 7 www.fairchildsemi.com FDP14N30 / FDPF14N30 300V N-Channel MOSFET Mechanical Dimensions TO-220 FDP14N30 / FDPF14N30 Rev. A 8 www.fairchildsemi.com FDP14N30 / FDPF14N30 300V N-Channel MOSFET Mechanical Dimensions TO-220F 3.30 ±0.10 10.16 ±0.20 (7.00) ø3.18 ±0.10 2.54 ±0.20 (0.70) 6.68 ±0.20 15.80 ±0.20 (1.00x45°) MAX1.47 9.75 ±0.30 0.80 ±0.10 (3 ) 0° 0.35 ±0.10 2.54TYP [2.54 ±0.20] #1 2.54TYP [2.54 ±0.20] 4.70 ±0.20 0.50 –0.05 +0.10 2.76 ±0.20 9.40 ±0.20 FDP14N30 / FDPF14N30 Rev. A 9 15.87 ±0.20 www.fairchildsemi.com TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Across the board. 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FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I23 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. No Identification Needed Full Production Obsolete Not In Production © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com