FDS5351 N-Channel PowerTrench® MOSFET
April 2008
FDS5351
N-Channel PowerTrench® MOSFET
60V, 6.1A, 35mΩ
Features
Max rDS(on) = 35mΩ at VGS = 10V, ID = 6.1A Max rDS(on) = 42mΩ at VGS = 4.5V, ID = 5.5A High performance trench technology for extremely low rDS(on) 100% UIL Tested RoHS Compliant
General Description
This N-Channel MOSFET is produced using Fairchild Semiconductor‘s advanced Power Trench® process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance.
Application
Inverter Switch Synchronous Rectifier Load Switch
D D D D D D D SO-8 S Pin 1 S G S D 8 1 S 5 6 7 4 3 2 G S S
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol VDS VGS ID EAS PD TJ, TSTG Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous -Pulsed Single Pulse Avalanche Energy Power Dissipation Power Dissipation TA = 25°C TA = 25°C (Note 3) (Note 1a) (Note 1b) Ratings 60 ±20 6.1 30 73 5 2.5 -55 to +150 Units V V A mJ W °C
Operating and Storage Junction Temperature Range
Thermal Characteristics
RθJC RθJA Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient (Note 1) (Note 1a) 25 50 °C/W
Package Marking and Ordering Information
Device Marking FDS5351 Device FDS5351 Package SO-8 Reel Size 13’’ Tape Width 12mm Quantity 2500units
©2008 Fairchild Semiconductor Corporation FDS5351 Rev.C
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FDS5351 N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS ∆BVDSS ∆TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250µA, VGS = 0V ID = 250µA, referenced to 25°C VDS = 48V, VGS = 0V VGS = ±20V, VDS = 0V 60 55 1 ±100 V mV/°C µA nA
On Characteristics
VGS(th) ∆VGS(th) ∆TJ rDS(on) gFS Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient Static Drain to Source On Resistance Forward Transconductance VGS = VDS, ID = 250µA ID = 250µA, referenced to 25°C VGS = 10V, ID = 6.1A VGS = 4.5V, ID = 5.5A VGS = 10V, ID = 6.1A, TJ= 125°C VDD = 5V, ID = 6.1A 1.0 2.0 -6.2 26.5 32.4 44.5 24 35.0 42.0 58.8 S mΩ 3.0 V mV/°C
Dynamic Characteristics
Ciss Coss Crss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = 30V, VGS = 0V, f = 1MHz f = 1MHz 985 90 50 1.7 1310 120 75 pF pF pF Ω
Switching Characteristics
td(on) tr td(off) tf Qg Qg Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Total Gate Charge Gate to Source Charge Gate to Drain “Miller” Charge VGS = 0V to 10V VGS = 0V to 4.5V VDD = 30V, ID = 6.1A VDD = 30V, ID = 6.1A, VGS = 10V, RGEN = 6Ω 8 3 21 2 19 9 3 3.5 16 10 34 10 27 13 ns ns ns ns nC nC nC nC
Drain-Source Diode Characteristics
VSD trr Qrr Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 6.1A VGS = 0V, IS = 2.1A IF = 6.1A, di/dt = 100A/µs (Note 2) (Note 2) 0.82 0.76 24 15 1.3 1.2 38 27 V ns nC
NOTES: 1. RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 50°C/W when mounted on a 1in2 pad of 2 oz copper.
b) 125°C/W when mounted on a minimum pad.
2. Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%. 3. UIL condition: Starting TJ = 25°C, L = 3mH, IAS = 7A, VDD = 60V, VGS = 10V.
©2008 Fairchild Semiconductor Corporation FDS5351 Rev.C
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FDS5351 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
30
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE VGS = 10V VGS = 4.5V ID, DRAIN CURRENT (A) VGS = 4V PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
3.0
VGS = 3V VGS = 3.5V
2.5
VGS = 4V
20
2.0 1.5
VGS = 4.5V
VGS = 3.5V
10
VGS = 3V
1.0
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
VGS = 10V
0 0 1 2 3
VDS, DRAIN TO SOURCE VOLTAGE (V)
0.5 0 10
ID, DRAIN CURRENT(A)
20
30
Figure 1. On-Region Characteristics
Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage
100
SOURCE ON-RESISTANCE (mΩ)
2.0
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
1.8 1.6
ID = 6.1A VGS = 10V
rDS(on), DRAIN TO
ID = 6.1A
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
80 60
TJ = 125oC
1.4 1.2 1.0 0.8 0.6 -75 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (oC)
40 20 0
TJ = 25oC
2
4
6
8
10
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. Normalized On- Resistance vs Junction Temperature
30
IS, REVERSE DRAIN CURRENT (A) PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
Figure 4. On-Resistance vs Gate to Source Voltage
100
VGS = 0V
10 1 0.1 0.01
TJ = 125oC TJ = 25oC
ID, DRAIN CURRENT (A)
VDS = 5V
20
TJ = 125oC
10
TJ = 25oC TJ = -55oC
TJ = -55oC
0
1
2
3
4
5
0.001 0.0
0.2
0.4
0.6
0.8
1.0
1.2
VGS, GATE TO SOURCE VOLTAGE (V)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward Voltage vs Source Current
©2008 Fairchild Semiconductor Corporation FDS5351 Rev.C
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FDS5351 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
10
VGS, GATE TO SOURCE VOLTAGE(V) ID = 6.1A
4000
Ciss
CAPACITANCE (pF)
VDD = 30V
8 6
VDD = 20V VDD = 40V
1000
Coss
4 2 0 0 4 8 12 16 20
Qg, GATE CHARGE(nC)
100
Crss
f = 1MHz VGS = 0V
10 0.1
1
10
100
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics
Figure 8. Capacitance vs Drain to Source Voltage
10
ID, DRAIN CURRENT (A)
8
IAS, AVALANCHE CURRENT(A)
8
VGS = 10V
6
TJ = 25oC
6
VGS = 4.5V
4
TJ = 125oC
4 2
RθJA = 50 C/W
o
2 1 0.01 0.1 1 10 30 0 25
50
75
100
o
125
150
tAV, TIME IN AVALANCHE(ms)
TA, AMBIENT TEMPERATURE ( C)
Figure 9. Unclamped Inductive Switching Capability
100
P(PK), PEAK TRANSIENT POWER (W)
Figure 10. Maximum Continuous Drain Current vs Ambient Temperature
1000
VGS = 10V
SINGLE PULSE RθJA = 125oC/W TA = 25oC
ID, DRAIN CURRENT (A)
10
1ms
100
1
THIS AREA IS LIMITED BY rDS(on)
10ms 100ms
10
0.1
SINGLE PULSE TJ = MAX RATED RθJA = 125oC/W TA = 25oC
1s 10s DC
0.01 0.01
0.1
1
10
100 300
1 0.5 -4 10
10
-3
10
-2
10
-1
1
10
100
1000
VDS, DRAIN to SOURCE VOLTAGE (V)
t, PULSE WIDTH (sec)
Figure 11. Forward Bias Safe Operating Area
Figure 12. Single Pulse Maximum Power Dissipation
©2008 Fairchild Semiconductor Corporation FDS5351 Rev.C
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FDS5351 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
2
1
NORMALIZED THERMAL IMPEDANCE, ZθJA
DUTY CYCLE-DESCENDING ORDER
0.1
D = 0.5 0.2 0.1 0.05 0.02 0.01
PDM
t1
0.01
SINGLE PULSE RθJA = 125 C/W
o
t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TA
0.001 -4 10
10
-3
10
-2
10
-1
1
10
100
1000
t, RECTANGULAR PULSE DURATION (sec)
Figure 13. Transient Thermal Response Curve
©2008 Fairchild Semiconductor Corporation FDS5351 Rev.C
5
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FDS5351 N-Channel PowerTrench® MOSFET
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The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EfficentMax™ EZSWITCH™ *
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®
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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I34
Preliminary
First Production
No Identification Needed Obsolete
Full Production Not In Production
©2008 Fairchild Semiconductor Corporation FDS5351 Rev.C
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