FFA60UP20DN
Ultrafast Rectifier
FFA60UP20DN
Features
• Ultrafast with soft recovery (@ IF = 1A), < 40ns • Reverse Voltage, 200V • Forward Voltage (@ TC = 100°C), < 1V TO-3P
Applications
• • • • Power switching circuits Output rectifiers Freewheeling diodes Switching mode power supply
123
1. Anode 2.Cathode 3. Anode
Absolute Maximum Ratings
Symbol VRRM IF(AV) IFSM TJ, TSTG
(per diode) TC=25°C unless otherwise noted Value 200 @ TC = 100°C 30 300 - 65 to +150 Units V A A °C
Parameter Peak Repetitive Reverse Voltage Average Rectified Forward Current Non-repetitive Peak Surge Current 60Hz Single Half-Sine Wave Operating Junction and Storage Temperature
Thermal Characteristics
Symbol RθJC Parameter Maximum Thermal Resistance, Junction to Case (per diode) TC=25 °C unless otherwise noted Min. TC = 25 °C TC = 100 °C TC = 25 °C TC = 100 °C 2 Typ. 32 2.4 38.4 Max. 1.15 1.0 µA 10 100 40 ns A nC ns mJ Units V Value 1.4 Units °C/W
Electrical Characteristics
Symbol VFM *
Parameter Maximum Instantaneous Forward Voltage IF = 30A IF = 30A Maximum Instantaneous Reverse Current @ rated VR Reverse Recovery Time Reverse Recovery Current Reverse Recovery Charge (IF =30A, di/dt = 200A/µs) Maximum Reverse Recovery Time (IF =1A, di/dt = 100A/µs) Avalanche Energy (L=40mH)
IRM *
trr Irr Qrr trr WAVL
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
©2004 Fairchild Semiconductor Corporation
Rev. A, August 2004
FFA60UP20DN
Typical Characteristics
10
100
TC = 100 C
TC = 100 C
10
o
o
Reverse Current , I R [µA]
Forward Current , IF [A]
1
TC = 25 C
o
0.1
TC = 25 C
o
1
0.01
0.1 0.0
0.001
0.5 1.0 1.5 2.0
0
50
100
150
200
Forward Voltage , VF [V]
Reverse Voltage , VR [V]
Figure 1. Typical Forward Voltage Drop vs. Forward Current
40
Figure 2. Typical Reverse Current vs. Reverse Voltage
500
Reverse Recovery Time , trr [ns]
Typical Capacitance at 0V = 473.9 pF
400
IF = 30A Tc = 25 C
35
o
Capacitance , Cj [pF]
200
30
0.1
1
10
100
25 100
500
Reverse Voltage , VR [V]
di/dt [A/µs]
Figure 3. Typical Junction Capacitance
Figure 4. Typical Reverse Recovery Time vs. di/dt
35 30 25
Reverse Recovery Current , Irr [A]
IF = 30A
5
T C = 25 C
o
4
Average Forward Current , IF(AV) [A]
6
DC
20 15 10 5 0 60
3
2
1
0 100
500
80
100
120
o
140
160
di/dt [A/µs]
Case Temperature , TC [ C]
Figure 5. Typical Reverse Recovery Current vs. di/dt
©2004 Fairchild Semiconductor Corporation
Figure 6. Forward Current Derating Curve
Rev. A, August 2004
FFA60UP20DN
Package Dimensions
TO-3P
15.60 ±0.20
3.80 ±0.20
13.60 ±0.20 ø3.20 ±0.10 9.60 ±0.20
4.80 ±0.20 1.50 –0.05
+0.15
12.76 ±0.20
19.90 ±0.20
16.50 ±0.30
3.00 ±0.20 1.00 ±0.20
3.50 ±0.20
2.00 ±0.20
13.90 ±0.20
23.40 ±0.20
18.70 ±0.20
1.40 ±0.20
5.45TYP [5.45 ±0.30]
5.45TYP [5.45 ±0.30]
0.60 –0.05
+0.15
Dimensions in Millimeters
©2004 Fairchild Semiconductor Corporation Rev. A, August 2004
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™
ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™
FAST® FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™
ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™
Power247™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER® SMART START™ SPM™ Stealth™
SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™ UltraFET® VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness. provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
©2004 Fairchild Semiconductor Corporation
Rev. I11
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