FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
August 2008
FOD3180 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Features
■ Guaranteed operating temperature range of -40°C to ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■
Description
The FOD3180 is a 2A Output Current, High Speed MOSFET Gate Drive Optocoupler. It consists of a aluminium gallium arsenide (AlGaAs) light emitting diode optically coupled to a CMOS detector with PMOS and NMOS output power transistors integrated circuit power stage. It is ideally suited for high frequency driving of power MOSFETs used in Plasma Display Panels (PDPs), motor control inverter applications and high performance DC/DC converters. The device is packaged in an 8-pin dual in-line housing compatible with 260°C reflow processes for lead free solder compliance.
+100°C 2A minimum peak output current High speed response: 200ns max propagation delay over temperature range 250kHz maximum switching speed 30ns typ pulse width distortion Wide VCC operating range: 10V to 20V 5000Vrms, 1 minute isolation Under voltage lockout protection (UVLO) with hysteresis Minimum creepage distance of 7.0mm Minimum clearance distance of 7.0mm C-UL, UL and VDE* approved RDS(ON) of 1.5Ω (typ.) offers lower power dissipation 15kV/µs minimum common mode rejection
Applications
■ ■ ■ ■ ■
Plasma Display Panel High performance DC/DC convertor High performance switch mode power supply High performance uninterruptible power supply Isolated Power MOSFET gate drive
*Requires ‘V’ ordering option
Functional Block Diagram
FOD3180
Package Outlines
NO CONNECTION 1
8 VCC
8
ANODE 2
7 OUTPUT
1
CATHODE 3
6 OUTPUT
NO CONNECTION 4
5 VEE
8 1
8 1
Note: A 0.1µF bypass capacitor must be connected between pins 5 and 8.
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
www.fairchildsemi.com
FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Absolute Maximum Ratings (TA = 25°C unless otherwise specified) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
TSTG TOPR TJ TSOL IF(AVG) IF(tr, tf) IF(TRAN) VR IOH(PEAK) IOL(PEAK) VCC – VEE VO(PEAK) PO PD Parameter Storage Temperature Operating Temperature Junction Temperature Lead Solder Temperature Average Input Current(1) LED Current Minimum Rate of Rise/Fall Peak Transient Input Current ( 5V
Min.
0.5 2.0 0.5 2.0 VCC – 0.5
Typ.*
Max.
Unit
A A V
Output Voltage(6)(7)
Low Level Output Voltage(6)(7) High Level Supply Current Low Level Supply Current Threshold Input Current Low to High Input Forward Voltage Temperature Coefficient of Forward Voltage UVLO Threshold
VEE + 0.5 4.8 5.0 6.0 6.0 8.0 0.8 1.2 1.43 -1.5 8.3 7.7 0.6 1.8
V mA mA mA V V mV/°C V V V V pF
Threshold Input Voltage High to Low IO = 0mA, VO < 5V IF = 10mA IF = 10mA VO > 5V, IF = 10mA VO < 5V, IF = 10mA
*Typical values at TA = 25°C
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
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FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Switching Characteristics
Over recommended operating conditions unless otherwise specified.
Symbol
tPLH tPHL PWD
Parameter Propagation Delay Time to High Output Level(8) Propagation Delay Time to Low Output Level(8) Pulse Width Distortion(9)
Test Conditions Min.
IF = 10mA, Rg = 10Ω, f = 250kHz, Duty Cycle = 50%, Cg = 10nF CL = 10nF, Rg = 10Ω 50 50 -90
Typ.* Max.
135 105 200 200 65 90 75 55 2.0 0.3
Unit
ns ns ns ns ns ns µs µs kV/µs
Propagation Delay Difference Between Any PDD (tPHL – tPLH) Two Parts(10) tr tf tUVLO ON tUVLO OFF | CMH | Rise Time Fall Time UVLO Turn On Delay UVLO Turn Off Delay Output High Level Common Mode Transient Immunity(11) (12)
TA = +25°C, If = 10 to 16mA, VCM = 1.5kV, VCC = 20V TA = +25°C, Vf = 0V, VCM = 1.5kV, VCC = 20V
15
| CML |
Output Low Level Common Mode Transient Immunity(11) (13)
15
kV/µs
*Typical values at TA = 25°C
Isolation Characteristics
Symbol Parameter
VISO
Test Conditions
Min.
5000
Typ.*
Max.
Unit
Vrms
Withstand Isolation Voltage(14) (15) TA = 25°C, R.H. < 50%, t = 1min., II-O ≤ 20µA Resistance (input to output)(15) Capacitance (input to output) VI-O = 500V Freq. = 1MHz
RI-O CI-O
1011 1
Ω pF
*Typical values at TA = 25°C
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
www.fairchildsemi.com 4
FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Notes: 1. Derate linearly above +70°C free air temperature at a rate of 0.3mA/°C. 2. The output currents IOH and IOL are specified with a capacitive current limited load = (3 x 0.01µF) + 0.5Ω, frequency = 8kHz, 50% DF. 3. The output currents IOH and IOL are specified with a capacitive current limited load = (3 x 0.01µF) + 8.5Ω, frequency = 8kHz, 50% DF. 4. Derate linearly above +87°C, free air temperature at the rate of 0.77mW/°C. Refer to Figure 12. 5. No derating required across operating temperature range. 6. In this test, VOH is measured with a dc load current of 100mA. When driving capacitive load VOH will approach VCC as IOH approaches zero amps. 7. 8. Maximum pulse width = 1ms, maximum duty cycle = 20%. tPHL propagation delay is measured from the 50% level on the falling edge of the input pulse to the 50% level of the falling edge of the VO signal. tPLH propagation delay is measured from the 50% level on the rising edge of the input pulse to the 50% level of the rising edge of the VO signal. PWD is defined as | tPHL – tPLH | for any given device.
9.
10. The difference between tPHL and tPLH between any two FOD3180 parts under same test conditions. 11. Pin 1 and 4 need to be connected to LED common. 12. Common mode transient immunity in the high state is the maximum tolerable dVCM/dt of the common mode pulse VCM to assure that the output will remain in the high state (i.e. VO > 10.0V). 13. Common mode transient immunity in a low state is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a low state (i.e. VO < 1.0V). 14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000Vrms, 60Hz for 1 second (leakage detection current limit II-O < 5µA). 15. Device considered a two-terminal device: pins on input side shorted together and pins on output side shorted together.
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
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FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Typical Performance Curves
Fig. 1 Input Forward Current vs. Forward Voltage
100
6
Fig. 2 Low To High Input Current Threshold vs. Ambient Temperature
V = 10 to 20V CC VEE = 0 Output = Open
IFLH – LOW TO HIGH INPUT CURRENT THRESHOLD (mA)
I F – FORWARD CURRENT (mA)
10
5
4
1
TA = 100°C
TA = -40°C
3
0.1
TA = 25°C
2
0.01
1
0.001 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
0 -40 -20 0 20 40 60 80 100
VF – FORWARD VOLTAGE (V)
TA – AMBIENT TEMPERATURE (°C)
Fig. 3 Output Low Voltage vs. Ambient Temperature
0.30 VF(OFF) = -3.0V to 0.8V IOUT = 100mA V = 10V to 20V
CC
Fig. 4 High Output Voltage Drop vs. Ambient Temperature
(VOH - VCC) – HIGH OUTPUT VOLTAGE DROP (V)
0.00 V -0.05
CC
= 10 to 20V, VEE = 0
V OL – OUTPUT LOW VOLTAGE (V)
0.25
IF = 10mA to 16mA IOUT = -100 mA
VEE = 0 0.20
-0.10
0.15
-0.15
0.10
-0.20
0.05
-0.25
0.00 -40 -20 0 20 40 60 80 100
-0.30 -40 -20 0 20 40 60 80 100
TA – AMBIENT TEMPERATURE (°C)
TA – AMBIENT TEMPERATURE (°C)
Fig. 5 Supply Current vs. Ambient Temperature
6.2 V 5.8
CC
Fig. 6 Supply Current vs. Supply Voltage
6.2 IF = 10mA (for ICCH) IF = 0mA (for ICCL) TA = 25oC, VEE = 0V
= 20V, VEE = 0
I CC – SUPPLY CURRENT (mA)
5.4 ICCL 5.0 ICCH 4.6
I CC – SUPPLY CURRENT (mA)
IF = 10mA (for ICCH) IF = 0mA (for ICCL)
5.8
5.4
5.0
ICCL ICCH
4.6
4.2
4.2
3.8 -40 -20 0 20 40 60 80 100
3.8 10 12 14 16 18 20
TA – AMBIENT TEMPERATURE (°C)
VCC – SUPPLY VOLTAGE (V)
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
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FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Typical Performance Curves (Continued)
Fig. 7 Propagation Delay vs. Load Capacitance
200 VCC = 20V, VEE = 0 IF = 10mA, TA = 25oC
Fig. 8 Propagation Delay vs. Forward LED Current
200 VCC = 20V, VEE = 0 RG = 10Ω, CG = 10nF f = 250 kHz, D. Cycle = 50% TA = 25oC
t P – PROPAGATION DELAY (ns)
t P – PROPAGATION DELAY (ns)
180
RG = 10Ω, CG = 10nF f = 250 kHz, D. Cycle = 50%
180
160 tPHL
160 tPHL
140
140
120 tPLH 100
120 tPLH 100
80
80
60 5 10 15 20 25
60 6 8 10 12 14 16
CG – LOAD CAPACITANCE (nF)
IF – FORWARD LED CURRENT (mA)
Fig. 9 Propagation Delay vs. Series Load Resistance
200 VCC = 20V, VEE = 0 IF = 10mA, TA = 25oC CG = 10nF f = 250 kHz, D. Cycle = 50%
Fig. 10 Propagation Delay vs. Ambient Temperature
200 VCC = 20V, VEE = 0 IF = 10mA RG = 10Ω, CG = 10nF f = 250kHz, D. Cycle = 50%
t P – PROPAGATION DELAY (ns)
160
t P – PROPAGATION DELAY (ns)
180
180
160
140 tPHL 120 tPLH
140
tPHL
120 tPLH 100
100
80
80
60 10 20 30 40 50
60 -40 -20 0 20 40 60 80 100
RG – SERIES LOAD RESISTANCE (Ω)
TA – AMBIENT TEMPERATURE (°C)
Fig. 11 Propagation Delay vs. Supply Voltage
180 IF = 10mA, TA = 25oC
t P – PROPAGATION DELAY (ns)
160
RG = 10Ω, CG = 10nF f = 250 kHz, D. Cycle = 50%
140
tPHL
120 tPLH 100
80
60 10 15 20 25
VCC – SUPPLY VOLTAGE (V)
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
www.fairchildsemi.com 7
FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Package Dimensions
Through Hole
PIN 1 ID.
4 3 2 1
4 3 2 1
0.4" Lead Spacing
PIN 1 ID.
0.270 (6.86) 0.250 (6.35)
5 6 7 8
0.270 (6.86) 0.250 (6.35)
0.390 (9.91) 0.370 (9.40)
5
6
7
8
SEATING PLANE
0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.140 (3.55) 0.020 (0.51) MIN
SEATING PLANE
0.390 (9.91) 0.370 (9.40) 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.140 (3.55) 0.004 (0.10) MIN
0.154 (3.90) 0.120 (3.05) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.016 (0.40) 0.008 (0.20) 15° MAX 0.300 (7.62) TYP
0.154 (3.90) 0.120 (3.05) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.016 (0.40) 0.008 (0.20) 0° to 15° 0.400 (10.16) TYP
Surface Mount
0.390 (9.91) 0.370 (9.40)
4 3 2 1
8-Pin DIP – Land Pattern
0.070 (1.78)
PIN 1 ID.
0.270 (6.86) 0.250 (6.35)
0.060 (1.52)
5
6
7
8
0.100 (2.54) 0.295 (7.49) 0.415 (10.54) 0.030 (0.76)
0.070 (1.78) 0.045 (1.14) 0.020 (0.51) MIN
0.300 (7.62) TYP 0.016 (0.41) 0.008 (0.20)
0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP Lead Coplanarity : 0.004 (0.10) MAX
0.045 (1.14) 0.315 (8.00) MIN 0.405 (10.30) MAX.
Note: All dimensions are in inches (millimeters)
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
www.fairchildsemi.com 8
FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Ordering Information
Option
No option S SD T V TV SV SDV
Order Entry Identifier (Example)
FOD3180 FOD3180S FOD3180SD FOD3180T FOD3180V FOD3180TV FOD3180SV FOD3180SDV
Description
Standard Through Hole Device Surface Mount, Lead Bend Surface Mount, Tape and Reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape and Reel
Marking Information
1
3180 V
3 4
2 6
XX YY B
5
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) Two digit year code, e.g., ‘03’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
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FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Carrier Tape Specifications
D0 K0
t
P0
P2
E
A0 W1 B0
F W
d
User Direction of Feed
P
D1
Symbol
W t P0 D0 E F P2 P A0 B0 K0 W1 d R Pocket Pitch Tape Width
Description
Tape Thickness Sprocket Hole Pitch Sprocket Hole Diameter Sprocket Hole Location Pocket Location
Dimension in mm
16.0 ± 0.3 0.30 ± 0.05 4.0 ± 0.1 1.55 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 4.0 ± 0.1 12.0 ± 0.1 10.30 ±0.20 10.30 ±0.20 4.90 ±0.20
Pocket Dimensions
Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt Min. Bending Radius
1.6 ± 0.1 0.1 max 10° 30
©2005 Fairchild Semiconductor Corporation FOD3180 Rev. 1.0.6
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FOD3180 — 2A Output Current, High Speed MOSFET Gate Driver Optocoupler
Reflow Profile
300 Temperature (°C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) • Peak reflow temperature: 260 C (package surface temperature) • Time of temperature higher than 183 C for 160 seconds or less • One time soldering reflow is recommended Time above 183C,