FOD852

FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler May 2006 FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Features ■ Applicable to Pb-free IR reflow soldering ■ Compact 4-pin package ■ High current transfer ratio: 1000% minimum ■ C-UL, UL, and VDE approved ■ High input-output isolation voltage of 5000Vrms ■ High operating temperature of 100°C tm Applications ■ Power supply regulators ■ Digital logic inputs ■ Microprocessor inputs Description The FOD852 consists of gallium arsenide infrared emitting diode driving a silicon photodarlington output (with integral base-emitter resistor) in a 4-pin dual in-line package. Functional Block Diagram ANODE 1 4 COLLECTOR 4 CATHODE 2 3 EMITTER 1 Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.) Symbol TOTAL DEVICE TSTG TOPR TSOL PTOT INPUT IF VR PD OUTPUT VCEO VECO IC PC Collector-Emitter Voltage Emitter-Collector Voltage Continuous Collector Current Collector Power Dissipation 300 0.1 150 150 V V mA mW Continuous Forward Current Reverse Voltage LED Power Dissipation 50 6 70 mA V mW Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation -55 to +125 -30 to +100 260 for 10 sec 200 °C °C °C mW Parameter Value Units ©2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FOD852 Rev. 1.0.4 FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Electrical Characteristics (TA = 25°C Unless otherwise specified.) Individual Component Characteristics Symbol INPUT VF IR Ct OUTPUT ICEO BVCEO BVECO Collector Dark Current Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage VCE = 200V, IF = 0 IC = 0.1mA, IF = 0 IE = 10µA, IF = 0 – 300 0.1 – – – 200 – – nA V V Forward Voltage Reverse Current Terminal Capacitance IF = 10mA VR = 4V V = 0, f = 1kHz – – – 1.2 – 30 1.4 10 250 V µA pF Parameter Test Conditions Min. Typ. Max. Unit Transfer Characteristics (TA = 25°C Unless otherwise specified.) Symbol DC Characteristic IC CTR VCE (sat) Riso Cf fC tr tf Collector Current Current Transfer Ratio(1) IF = 20mA, IC = 100mA DC500V 40~60% R.H. V = 0, f = 1MHz VCE = 2V, IC = 20mA, RL = 100Ω, -3dB VCE = 2V, IC = 20mA, RL = 100Ω Collector-Emitter Saturation Voltage Isolation Resistance Floating Capacitance Cut-Off Frequency Response Time (Rise) Response Time (Fall) Test Conditions IF = 1mA, VCE = 2V Min. 10 1,000 – Typ. 40 4,000 – Max. 150 15,000 1.2 – 1 – 300 100 Unit mA % V Ω pF kHz µs µs 5x1010 1x1011 – 1 – – 0.6 7 100 20 Isolation Characteristics Symbol VISO RISO CISO Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance Test Conditions f = 60Hz, t = 1 min, II-O ≤ 2µA VI-O = 500 VDC VI-O = 0, f = 1MHz Min. 5000 5 x 1010 – Typ. – 1011 0.6 Max. – – 1.0 Units Vac(rms) Ω pf Note: 1. Current Transfer Ratio (CTR) = IC/IF x 100%. 2 FOD852 Rev. 1.0.4 www.fairchildsemi.com FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Typical Electrical/Optical Characteristic Curves (TA = 25°C Unless otherwise specified.) COLLECTOR POWER DISSIPATION PC (mW) Fig. 1 Forward Current vs. Ambient Temperature 60 FORWARD CURRENT IF (mA) 50 40 30 20 10 0 -30 Fig. 2 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 25 50 75 100 125 AMBIENT TEMPERATURE TA (°C) 0 -30 0 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) Fig. 3 Collector-Emitted Saturation Voltage vs. Forward Current COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) 5 4. 5 4 3. 5 3 2. 5 2 1. 5 1 0. 5 0 0 1 2 3 4 5 FORWARD CURRENT IF (mA) Fig. 5 Current Transfer Ratio vs. Forward Current CURRENT TRANSFER RATIO CTR ( %) 7000 VCE = 2V 6000 5000 4000 3000 2000 1000 0 0. 1 Ic =5mA 10mA 30mA 50mA 70mA 100mA Fig. 4 Forward Current vs. Forward Voltage 100 FORWARD CURRENT IF (mA) 100°C 80°C 60°C 10 40 °C 20°C 1 0. 5 0.7 0.9 1.1 1. 3 1.5 1. 7 1.9 FORWARD VOLTAGE VF (V) Fig. 6 Collector Current vs. Collector-Emitter Voltage 100 10m A COLLECTOR CURRENT IC (mA) 80 5m A 3m A 2. 5mA 2mA 60 1. 5mA 1mA PC (M AX .) 40 20 IF = 0.5mA 0 0 1 2 3 4 5 1 FORWARD CURRENT IF (mA) 10 COLLECTOR-EMITTER VOLTAGE VCE (V) 3 FOD852 Rev. 1.0.4 www.fairchildsemi.com FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Typical Electrical/Optical Characteristic Curves (TA = 25°C Unless otherwise specified.) Fig. 7. Relative Current Transfer Ratio vs. Ambient Temperature 1.0 RELATIVE CURRENT TRANSFER RATIO (%) IF = 1mA VCE = 2V 0.8 COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) Fig. 8 Collector-Emitter Saturation Voltage vs. Ambient Temperature 1.20 IF = 20mA 1.10 IC = 100mA 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 20 80 40 60 100 AMBIENT TEMPERATURE TA (°C) 0.6 0.4 0. 2 0 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) COLLECTOR DARK CURRENT ICEO (A) Fig. 9 Collector Dark Current vs. Ambient Temperature 1000 VCE = 200V RESPONSE TIME (µs) 1000 Fig. 10. Response Time vs. Load Resistance tr VCE = 2V 500 I = 20mA C 200 100 50 20 10 5 2 tf 100 td ts 10 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 1 0.1 1 10 LOAD RESISTANCE RL (kΩ) Fig. 11. Frequency Response 0 VOLTAGE GAIN AV (dB) -5 VCE = 2V IC = 2mA Test Circuit for Response Time Input Output 10% Output 90% td ts tr Test Circuit for Frequency Response tf Vcc Input RD RL -10 -15 -20 -25 0.1 1 10 100 FREQUENCY f (kHz) 500 RD Vcc RL Output RL=1kΩ 100Ω 10Ω 4 FOD852 Rev. 1.0.4 www.fairchildsemi.com FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions (Through Hole) 0.312 (7.92) 0.288 (7.32) Package Dimensions (Surface Mount) 0.312 (7.92) 0.288 (7.32) SEATING PLANE 0.157 (4.00) 0.118 (3.00) SEATING PLANE 0.200 (5.10) 0.161 (4.10) 0.276 (7.00) 0.236 (6.00) 0.200 (5.10) 0.161 (4.10) 0.276 (7.00) 0.236 (6.00) 0.157 (4.00) 0.118 (3.00) 0.010 (0.26) 0.130 (3.30) 0.091 (2.30) 0.020 (0.51) TYP 0.051 (1.30) 0.043 (1.10) 0.024 (0.60) 0.004 (0.10) 0.049 (1.25) 0.030 (0.76) 0.412 (10.46) 0.388 (9.86) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.010 (0.26) 0.300 (7.62) typ 0.110 (2.79) 0.090 (2.29) Lead Coplanarity 0.004 (0.10) MAX 0.110 (2.79) 0.090 (2.29) Footprint Dimensions (Surface Mount)) Package Dimensions (0.4" Lead Spacing) SEATING PLANE 1.5 1.3 0.200 (5.10) 0.161 (4.10) 0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.276 (7.00) 0.236 (6.00) 9 0.291 (7.40) 0.252 (6.40) 0.130 (3.30) 0.091 (2.30) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) 0.42 (10.66) 0.38 (9.66) 0.110 (2.80) 0.011 (1.80) 0.010 (0.26) 2.54 Note: All dimensions are in inches (millimeters) 5 FOD852 Rev. 1.0.4 www.fairchildsemi.com FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Ordering Information Option S SD W 300 300W 3S 3SD Order Entry Identifier .S .SD .W .300 .300W .3S .3SD Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE Approved VDE Approved, 0.4" Lead Spacing VDE Approved, Surface Mount VDE Approved, Surface Mount, Tape & Reel Marking Information 4 5 V X ZZ Y 3 6 852 1 2 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One digit year code Two digit work week ranging from ‘01’ to ‘53’ Assembly package code 6 FOD852 Rev. 1.0.4 www.fairchildsemi.com FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Carrier Tape Specifications Ø1.55±0.05 P2 P0 1.75±0.1 F W B0 A0 P1 0.3±0.05 K0 Note: All dimensions are in millimeters. Description Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment Symbol W P0 F P2 P1 A0 B0 K0 Dimensions in mm (inches) 16 ± 0.3 (.63) 4 ± 0.1 (.15) 7.5 ± 0.1 (.295) 2 ± 0.1 (.079) 12 ± 0.1 (.472) 10.45 ± 0.1 (.411) 5.30 ± 0.1 (.209) 4.25 ± 0.1 (.167) 7 FOD852 Rev. 1.0.4 www.fairchildsemi.com FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Lead Free Recommended IR Reflow Condition Tp Temperature (°C) Tsmax Ramp-down Tsmin 25°C ts (Preheat) Time (sec) Profile Feature Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate Soldering zon Pb-Sn solder assembly 100°C ~ 150°C 60 ~ 120 sec 183°C 60 ~ 120 sec 240 +0/-5°C 6°C/sec max. Lead Free assembly 150°C ~ 200°C 60 ~120 sec 217°C 30 ~ 90 sec 260 +0/-5°C 6°C/sec max. Recommended Wave Soldering condition Profile Feature Peak temperature (Tp) For all solder assembly Max 260°C for 10 sec 8 FOD852 Rev. 1.0.4 www.fairchildsemi.com FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FAST® FASTr™ ActiveArray™ FPS™ Bottomless™ FRFET™ Build it Now™ GlobalOptoisolator™ CoolFET™ GTO™ CROSSVOLT™ HiSeC™ DOME™ I2C™ EcoSPARK™ i-Lo™ E2CMOS™ ImpliedDisconnect™ EnSigna™ IntelliMAX™ FACT™ FACT Quiet Series™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™ UniFET™ UltraFET® VCX™ Wire™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDíS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I19 Preliminary No Identification Needed Full Production Obsolete Not In Production 9 FOD852 Rev. 1.0.4 www.fairchildsemi.com