FSUSB23L10X

FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch March 2006 FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Features ■ 10µA maximum ICCT current over an expanded control ■ ■ ■ ■ ■ General Description The FSUSB23 is a low power high bandwidth analog switch specifically designed for high speed USB 2.0 applications. The FSUSB23 features very low quiescent current even when the control voltage is lower than the VCC supply. This feature services mobile handset applications well allowing for direct interface with the baseband processor general purpose I/Os. Typical applications involve switching in portables and consumer applications such as cell phones, digital cameras, and notebooks with hubs or controllers. The wide bandwidth (>720MHz) of this switch exceeds the bandwidth needed to pass the 3rd harmonic which results in signals with minimum edge and phase distortion. Superior channelto-channel crosstalk results in minimal interference. ■ voltage range (VIN = 2.6V, VCC = 3.6V) Lower Capacitance: Con = 9pF Typ 7Ω typical On Resistance (RON) −3dB bandwidth: > 720MHz Low power consumption (1µA maximum) Packaged in: Pb-Free 10-lead MicroPak (1.6mm x 2.1mm) Pb-Free 16-lead DQFN Pb-Free 10-lead MSOP 7kV I/O to GND ESD performance Applications ■ Cell phone, PDA, Digital Camera, and Notebook ■ LCD Monitor, TV, and Set-top Box Ordering Information Order Number FSUSB23L10X FSUSB23BQX FSUSB23MUX (Preliminary) Package Number MAC010A MLP016E MUA10A Product Code Top Mark EZ USB23 USB23 Package Description Pb-Free 10-Lead MicroPak, 1.6mm x 2.1mm Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Pb-Free 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide Pb-Free package per JEDEC J-STD-020B. MicroPak is a trademark of Fairchild Semiconductor Corporation. ©2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FSUSB23 Rev. 1.0.0 FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Connection Diagrams Pad Assignments for MicroPak D1– D2– OE Analog Symbol D1+ D2+ D1– D2– S Control D+ D– 9 8 7 D– 6 OE VCC 10 5 GND 1 2 3 4 Pin Descriptions Pin Name OE S D+, D−, Dn+, Dn− S D1+ D2+ D+ Description Bus Switch Enable Select Input Data Ports (Top View) Pad Assignments for DQFN S 1 VCC 16 15 14 13 12 11 10 Truth Table/s OE D1+ D2+ D+ NC NC NC 2 3 4 5 6 7 8 9 S D1– D2– D– NC NC OE H L L Function Disconnect D+, D− = D1n D+, D− = D2n X L H GND NC (Top Through View) Pin Assignment for MSOP S D1+ D2+ D+ GND VCC OE D1– D2– D– 1 10 2 3 4 9 8 7 5 6 (Top Through View) 2 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Absolute Maximum Ratings The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Symbol VCC VIN Supply Voltage DC DC Switch Voltage(1) Input Voltage(1) Parameter Rating −0.5V to +4.6V −0.5V to VCC + 0.5V −0.5V to +4.6V −50mA 50mA −65°C to +150°C 7kV 7kV DC Input Diode Current DC Output Current Storage Temperature ESD (Human Body Model) All Pins I/O to GND Recommended Operating Conditions(2) Symbol VCC Supply Voltage Control Input Voltage Switch Input Voltage Operating Temperature Thermal Resistance 10 MicroPak Parameter Rating 3.0V to 3.6V 0V to VCC 0V to VCC −40°C to +85°C 250°C/W Notes: 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V. 2. Control input must be held HIGH or LOW and it must not float. 3 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch DC Electrical Characteristics (All typical values are @ 25°C unless otherwise specified.) TA = −40°C to +85°C Symbol VIK VIH VIL IIN IOZ RON ∆RON RON Flatness ICC ICCT Parameter Clamp Diode Voltage Input Voltage HIGH Input Voltage LOW Control Input Leakage OFF State Leakage Switch On Resistance(3) Conditions IIN = −18mA VCC (V) 3.0 3.0 to 3.6 3.0 to 3.6 Min. 1.2 Typ. Max. Units −1.2 0.50 1.0 1.0 V V V µA µA Ω Ω Ω 1.0 10.0 µA µA VIN = 0V to VCC 0 ≤ Dn, D1n, D2n ≤ VCC VIN = 0.4V, ION = −8mA VIN = 0.8V, ION = −8mA VIN = 0.8V, ION = −8mA VIN = 0.0V − 1.0V, ION = −8mA VIN = 0.0V or VCC, IOUT = 0 VIN = 2.6V, VCC = 3.6V 3.6 3.0 3.0 3.0 3.6 3.6 6.0 7.0 0.3 2.0 9.0 10.0 Delta RON(4) RON Flatness(3) Quiescent Supply Current Increase in ICC Current per Control Voltage and VCC Levels AC Electrical Characteristics (All typical values are for VCC = 3.3V @ 25°C unless otherwise specified.) TA = −40°C to +85°C Symbol tON tOFF tPD OIRR Xtalk BW Parameter Turn On Time S, OE to Output Turn OFF Time S, OE to Output Propagation Delay(4) OFF Isolation (Non-Adjacent) Non-Adjacent Channel Crosstalk −3dB Bandwidth Conditions VD1n, D2n = 0.8V, RL = 50Ω, CL = 10pF VD1n, D2n = 0.8V, RL = 50Ω, CL = 10pF RL = 50Ω, CL = 10pF f = 250MHz, RT = 50Ω RT = 50Ω, f = 250MHz RT = 50Ω VCC (V) 3.0 to 3.6 3.0 to 3.6 3.3 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 Min. Typ. 10.0 8.0 0.25 −30.0 −43.0 720 Figure Max. Units Number 13.0 11.0 ns ns ns dB dB MHz Figure 5 Figure 5 Figure 3 Figure 4 Figure 8 Figure 9 Figure 7 Notes: 3. Measured by the voltage drop between Dn, D1n, D2n pins at the indicated current through the switch. On Resistance is determined by the lower of the voltage on the two ports. 4. Guaranteed by characterization. 4 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch USB Related AC Electrical Characteristics Symbol tSK(O) tSK(P) Parameter Channel-to-Channel Skew(5) Skew of Opposite Transitions of the Same Output(5) Total Jitter(5) Conditions RL = 50Ω, CL = 10pF RL = 50Ω, CL = 10pF VCC (V) 3.0 to 3.6 3.0 to 3.6 TA = −40°C to +85°C Min. Typ. 40.0 20.0 Figure Max. Units Number ps ps Figure 3 Figure 6 Figure 3 Figure 6 tJ RL = 50Ω, CL = 10pF, 3.0 to 3.6 tR = tF = 750ps at 480 Mbps (PRBS = 215 − 1) 150 ps Note: 5. Guaranteed by design. Capacitance TA = −40°C to +85°C Symbol CIN CON COFF Parameter Control Pin Input Capacitance D1n, D2n, Dn ON Capacitance D1n, D2n OFF Capacitance Conditions VCC = 0V VCC = 3.3, OE = 0V VCC and OE = 3.3 Min. Typ. 2.0 9.0 4.0 Figure Max. Units Number pF pF pF Figure 11 Figure 10 Figure 11 5 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Test Diagrams VON FSUSB23 NC Dn VIN GND Select VS = 0 to VCC RON = VON / ION GND ION Select GND VS = 0 or VCC Note: Each switch port is tested separately. IDn(OFF) FSUSB23 D1n, D2n A VIN Figure 1. On Resistance Figure 2. OFF Leakage FSUSB23 D1+, D1– D+, D– VIN GND RS CL GND VSel GND Output: D+, D– Note: RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values). Note: CL includes test fixture and stray capacitance. VOL tPLH tPHL VOH 50% 50% tRISE = 500ps RL VOUT 800mV Input: Dn+, Dn– 400mV 10% 90% 50% 90% 50% tFALL = 500ps 10% Figure 3. AC Test Circuit Load Figure 4. Switch Propagation Delay Waveforms tRISE = 2.5ns VCC Input – S, OE GND 10% 90% VCC/2 90% VCC/2 tFALL = 2.5ns 10% VOH Output – VOUT VOL tON 90% 90% tOFF Figure 5. Turn ON/Turn OFF Waveform 6 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Test Diagrams (continued) tRISE = 750ps 800mV Input: D+, D– 400mV tRISE = 750ps 800mV Input: Dn+, Dn– 400mV 10% 90% 50% 10% 90% 50% 90% 50% 10% tFALL = 750ps tFALL = 750ps VOH Output1: D1+, D1– VOL 10% 90% 50% 50% 50% tPLH1 tPHL1 VOH Output: D+, D– VOL tPLH TSK(P) = | tPHL – tPLH | Pulse Skew, TSK(P) tPHL 50% 50% VOH Output1: D2+, D2– VOL tPLH2 tPHL2 50% 50% TSK(OUT) = | tPHL1 – tPHL2 | or | tPLH1 – tPLH2 | Output Skew, TSK(OUT) Figure 6. Switch Skew Tests Network Analyzer FSUSB23 VIN GND VSel GND VOUT GND Note: RS and RT are functions of the application environment (See AC Electrical Tables for specific values). RT GND RS VS GND Figure 7. Bandwidth Network Analyzer FSUSB23 VIN RT VSel GND GND GND OFF-Isolation = 20 Log (VOUT / VIN) VOUT RT GND GND RS VS GND Figure 8. Channel OFF Isolation 7 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Test Diagrams (Continued) NC FSUSB23 VIN GND VSel GND RT GND Network Analyzer RS VS GND GND RS and RT are functions of the application environment (50, 75 or 100Ω) RT GND VOUT Crosstalk = 20 Log (VOUT / VIN) Figure 9. Non-Adjacent Channel-to-Channel Crosstalk Capacitance Meter F = 1MHz Dn FSUSB23 S VSel = 0 or VCC Capacitance Meter F = 1MHz Dn FSUSB23 S VSel = 0 or VCC D1n, D2n D1n, D2n Figure 10. Channel ON Capacitance Figure 11. Channel OFF Capacitance 8 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Tape and Reel Specifications Tape Format for MicroPak Package Designator L10X Tape Section Leader (Start End) Carrier Trailer (Hub End) Number Cavities 125 (typ) 5000 75 (typ) Cavity Status Empty Filled Empty Cover Tape Status Sealed Sealed Sealed Tape Dimension millimeters 9 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Reel Dimension for MicroPak inches (millimeters) Tape Size 8mm A 7.0 (177.8) B 0.059 (1.50) C 0.512 (13.00) D 0.795 (20.20) N 2.165 (55.00) W1 0.331 +0.059/−0.000 (8.40 +1.50/−0.00) W2 0.567 (14.40) W3 W1 +0.078/−0.039 (W1 +2.00/−1.00) 10 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Tape Format for DQFN Package Designator BQX Tape Section Leader (Start End) Carrier Trailer (Hub End) Number Cavities 125 (typ) 2500/3000 75 (typ) Cavity Status Empty Filled Empty Cover Tape Status Sealed Sealed Sealed Tap Dimensions millimeters 11 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Reel Dimensions for DQFN inches (millimeters) Tape Size 12mm A 13.0 (330) B 0.059 (1.50) C 0.512 (13.00) D 0.795 (20.20) N 7.008 (178) W1 0.488 (12.4) W2 0.724 (18.4) 12 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Physical Dimensions millimeters unless otherwise noted Pb-Free 10-Lead MicroPak, 1.6mm x 2.1mm Package Number MAC010A 13 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Physical Dimensions millimeters unless otherwise noted Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016A 14 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch Physical Dimensions millimeters unless otherwise noted SEE DETAIL A DETAIL A Pb-Free 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide Package Number MUA10A 15 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FAST® ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DOME™ HiSeC™ EcoSPARK™ I2C™ E2CMOS™ i-Lo™ EnSigna™ ImpliedDisconnect™ FACT™ IntelliMAX™ FACT Quiet Series™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ DISCLAIMER ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™ UltraFET® UniFET™ VCX™ Wire™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I18 16 FSUSB23 Rev. 1.0.0 www.fairchildsemi.com