FYV0203S/DN/DP/DS
FYV0203S/DN/DP/DS
3
3
Connection Diagram
3 3
YB1
2 1
1
2
1
FYV0203S 3
1
FYV0203DP 2 3
Marking
FYV0203S = YB1 FYV0203DN = YB2 FYV0203DP = YB3 FYV0203DS = YB4
SOT-23
1 FYV0203DN 2
1 FYV0203DS 2
Schottky Diode
Absolute Maximum Ratings TA=25°C unless otherwise noted
Symbol VRRM IF(AV) IFSM TSTG TJ Parameter Maximum Repetitive Reverse Voltage Average Rectified Forward Current Non-repetitive Peak Surge Current Pulse Width = 1.0s Storage Temperature Range Operating Junction Temperature Value 30 0.2 0.6 -65 to +150 150 Units V A A °C °C
Thermal Characteristics
Symbol RθJA Parameter Thermal Resistance, Junction to Ambient Value 430 Units °C/W
Electrical Characteristics TA=25°C unless otherwise noted
Symbol VF * Parameter Forward Voltage Drop IF = 0.1mA IF = 1mA IF = 10mA IF = 30mA IF = 100mA IF = 200mA Reverse Current @ Rated VR Total Capacitance VR = 1V , f = 1.0 MHz Reverse Recovery Time IF = IR = 10mA, IRR = 1mA, RL = 100Ω TA = 25 °C TA= 125 °C Min. Typ. 210 270 340 390 485 600 0.2 130 Max. 240 320 400 500 800 1000 uA 2 pF 10 ns 5 Units mV
IR *
CT trr
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
©2001 Fairchild Semiconductor Corporation
Rev. A, September 2001
FYV0203S/DN/DP/DS
Typical Characteristics
1000
0.1
TJ=125 oC
Reverse Current, I R[㎂ ]
Forward Current, I F[A]
100
0.01
10
TJ=75 oC
TJ=125 C TJ=75 oC
o
1
0.001
0.1
TJ=25 oC
TJ=25 C
0.0001 0.0
0.01 0 10 20 30
o
0.2
0.4
0.6
0.8
1.0
Forward Voltage Drop, VF[V]
Reverse Voltage, VR[V]
Figure 1. Typical Forward Voltage Characteristics
Figure 2. Typical Reverse Current vs. Reverse Voltage
12 11
Total Diode Capacitance, CT[pF]
TJ=25 oC
10 9 8 7 6 5 4 3 2 1 0 1 2 3 4 5 6 7 8 9 10
Reverse Voltage, VR[V]
Figure 3. Total Diode Capacitance
©2001 Fairchild Semiconductor Corporation
Rev. A, September 2001
FYV0203S/DN/DP/DS
Package Dimensions
SOT-23
0.20 MIN 2.40
±0.10
0.40 ±0.03
1.30
±0.10
0.45~0.60
0.03~0.10 0.38 REF
0.40 ±0.03 0.96~1.14 2.90 ±0.10
0.12 –0.023
+0.05
0.95 ±0.03 0.95 ±0.03 1.90 ±0.03 0.508REF
0.97REF
Dimensions in Millimeters
Rev. A, September 2001
©2001 Fairchild Semiconductor Corporation
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FACT Quiet Series™
FAST® FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™
OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ SLIENT SWITCHER®
SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TruTranslation™ TinyLogic™ UHC™ UltraFET®
VCX™
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
©2001 Fairchild Semiconductor Corporation
Rev. H4
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