MM74HC02MTC

MM74HC02 Quad 2-Input NOR Gate September 1983 Revised January 2005 MM74HC02 Quad 2-Input NOR Gate General Description The MM74HC02 NOR gates utilize advanced silicon-gate CMOS technology to achieve operating speeds similar to LS-TTL gates with the low power consumption of standard CMOS integrated circuits. All gates have buffered outputs, providing high noise immunity and the ability to drive 10 LS-TTL loads. The 74HC logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground. Features s Typical propagation delay: 8 ns s Wide power supply range: 2–6V s Low quiescent supply current: 20 µA maximum (74HC Series) s Low input current: 1 µA maximum s High output current: 4 mA minimum Ordering Code: Order Number MM74HC02M MM74HC02SJ MM74HC02MTC MM74HC02MTCX_NL MM74HC02N Package Number M14A M14D MTC14 MTC14 N14A Package Description 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. (Tape and Reel not available in N14A.) Pb-Free package per JEDEC J-STD-020B. Connection Diagram Pin Assignment for DIP, SOIC, SOP and TSSOP Top View Logic Diagram © 2005 Fairchild Semiconductor Corporation DS005294 www.fairchildsemi.com MM74HC02 Absolute Maximum Ratings(Note 1) (Note 2) Supply Voltage (VCC ) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Power Dissipation (PD) (Note 3) S.O. Package only Lead Temperature (TL) (Soldering 10 seconds) 260 °C (Note 4) VCC 2.0V 4.5V 6.0V VIL Maximum LOW Level Input Voltage VOH Minimum HIGH Level Output Voltage VIN = VIL |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = VIL |IOUT| ≤ 4.0 mA |IOUT| ≤ 5.2 mA VOL Maximum LOW Level Output Voltage VIN = VIH or VIL |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = VIH or VIL |IOUT| ≤ 4.0 mA |IOUT| ≤ 5.2 mA IIN ICC Maximum Input Current Maximum Quiescent Supply Current VIN = VCC or GND IOUT = 0 µA 6.0V VIN = VCC or GND 4.5V 6.0V 6.0V 4.5V 6.0V 2.0V 4.5V 6.0V Recommended Operating Conditions Min Supply Voltage (VCC) DC Input or Output Voltage (VIN, VOUT) Operating Temperature Range (TA) Input Rise or Fall Times (tr, tf) VCC = 2.0V VCC = 4.5V VCC = 6.0V 2 0 Max 6 VCC Units V V −0.5 to +7.0V −1.5 to VCC +1.5V −0.5 to VCC +0.5V ±20 mA ±25 mA ±50 mA −65°C to +150 °C 600 mW 500 mW −40 +125 1000 500 400 °C ns ns ns Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. DC Electrical Characteristics Symbol VIH Parameter Minimum HIGH Level Input Voltage Conditions TA = 25°C Typ 1.5 3.15 4.2 0.5 1.35 1.8 2.0 4.5 6.0 4.2 5.7 0 0 0 0.2 0.2 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 2.0 TA = −40 to 85°C TA = −40 to 125°C Guaranteed Limits 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 20 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 ±1.0 40 Units V V V V V V V V V V V V V V V V µA µA Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC=5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. www.fairchildsemi.com 2 MM74HC02 AC Electrical Characteristics VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns Symbol tPHL, tPLH Parameter Maximum Propagation Delay Conditions Typ 8 Guaranteed Limit 15 Units ns AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) Symbol tPHL, tPLH Parameter Maximum Propagation Delay tTLH, tTHL Maximum Output Rise and Fall Time CPD CIN Power Dissipation Capacitance (Note 5) Maximum Input Capacitance Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. Conditions VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V TA = 25°C Typ 45 9 8 30 8 7 20 5 10 90 18 15 75 15 13 TA = −40 to 85°C TA = −55 to 125°C Guaranteed Limits 113 23 19 95 19 16 134 27 23 110 22 19 Units ns ns ns ns ns ns pF (per gate) 10 10 pF 3 www.fairchildsemi.com MM74HC02 Physical Dimensions inches (millimeters) unless otherwise noted 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M14A www.fairchildsemi.com 4 MM74HC02 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M14D 5 www.fairchildsemi.com MM74HC02 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC14 www.fairchildsemi.com 6 MM74HC02 Quad 2-Input NOR Gate Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N14A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 7 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com