MM74HC154MTC

MM74HC154 4-to-16 Line Decoder September 1983 Revised July 2003 MM74HC154 4-to-16 Line Decoder General Description The MM74HC154 decoder utilizes advanced silicon-gate CMOS technology, and is well suited to memory address decoding or data routing applications. It possesses high noise immunity, and low power consumption of CMOS with speeds similar to low power Schottky TTL circuits. The MM74HC154 have 4 binary select inputs (A, B, C, and D). If the device is enabled these inputs determine which one of the 16 normally HIGH outputs will go LOW. Two active LOW enables (G1 and G2) are provided to ease cascading of decoders with little or no external logic. Each output can drive 10 low power Schottky TTL equivalent loads, and is functionally and pin equivalent to the 74LS154. All inputs are protected from damage due to static discharge by diodes to VCC and ground. Features s Typical propagation delay: 21 ns s Power supply quiescent current: 80 µA s Wide power supply voltage range: 2–6V s Low input current: 1 µA maximum Ordering Code: Order Number MM74HC154WM MM74HC154MTC MM74HC154N Package Number M24B MTC24 N24C Package Description 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagram Pin Assignments for DIP, SOIC and TSSOP Truth Table Inputs G1 G2 L L L L L L L L L L L L L L L L L L L L L L L L L L L H L H D L L L L L L L L H H H H H H H H X X X C L L L L H H H H L L L L H H H H X X X B L L H H L L H H L L H H L L H H X X X A L H L H L H L H L H L H L H L H X X X Low Output (Note 1) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 — — — Top View L L L L L L H H Note 1: All others HIGH © 2003 Fairchild Semiconductor Corporation DS005122 www.fairchildsemi.com MM74HC154 Logic Diagram www.fairchildsemi.com 2 MM74HC154 Absolute Maximum Ratings(Note 2) (Note 3) Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Power Dissipation (PD) (Note 4) S.O. Package only Lead Temperature (TL) (Soldering 10 seconds) 260°C (Note 5) Conditions Recommended Operating Conditions Min Max Units Supply Voltage (VCC) DC Input or Output Voltage (VIN, VOUT) Operating Temperature Range (TA) Input Rise or Fall Times (tr, tf) VCC = 2.0V VCC = 4.5V VCC = 6.0V 1000 500 400 ns ns ns 2 0 6 VCC V V −0.5 to +7.0V −1.5 to VCC +1.5V −0.5 to VCC +0.5V ±20 mA ±25 mA ±50 mA −65°C to +150°C 600 mW 500 mW −40 +85 °C Note 2: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 3: Unless otherwise specified all voltages are referenced to ground. Note 4: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. DC Electrical Characteristics Symbol VIH Parameter Minimum HIGH Level Input Voltage VIL Maximum LOW Level Input Voltage VOH Minimum HIGH Level Output Voltage VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V TA = 25°C Typ 1.5 3.15 4.2 0.5 1.35 1.8 2.0 4.5 6.0 4.2 5.7 0 0 0 0.2 0.2 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 8.0 TA = −40 to 85°C Guaranteed Limits 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 80 Units V V VIN = VIH or VIL |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = VIH or VIL |IOUT| ≤ 4.0 mA |IOUT| ≤ 5.2 mA 4.5V 6.0V 2.0V 4.5V 6.0V VIN = VIH or VIL |IOUT| ≤ 4.0 mA |IOUT| ≤ 5.2 mA 4.5V 6.0V 6.0V 6.0V V µA µA V V VOL Maximum LOW Level Output Voltage VIN = VIH or VIL |IOUT| ≤ 20 µA V IIN ICC Maximum Input Current Maximum Quiescent Supply Current VIN = VCC or GND VIN = VCC or GND IOUT = 0 µA Note 5: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. 3 www.fairchildsemi.com MM74HC154 AC Electrical Characteristics VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns Symbol Parameter tPHL, tPLH Maximum Propagation Delay, G1 , G2 or A, B, C, D Conditions Typ 21 Guaranteed Limit 32 Units ns AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) Symbol tPHL, tPLH Parameter Maximum Propagation Delay, G1 or G2 or A, B, C, D tTLH, tTHL Maximum Output Rise and Fall Time CPD CIN Power Dissipation Capacitance (Note 6) Maximum Input Capacitance Conditions VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V T A = 2 5 °C Typ 63 24 20 25 7 6 90 5 10 10 160 36 30 75 15 13 TA = −40 to 85°C Guaranteed Limits 190 42 35 95 19 16 pF pF ns ns Units Note 6: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD V CC f + ICC. www.fairchildsemi.com 4 MM74HC154 Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M24B 5 www.fairchildsemi.com MM74HC154 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC24 www.fairchildsemi.com 6 MM74HC154 4-to-16 Line Decoder Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N24C Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 7 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com