MM74HCU04MXNLX

MM74HCU04 Hex Inverter September 1983 Revised January 2005 MM74HCU04 Hex Inverter General Description The MM74HCU04 inverters utilize advanced silicon-gate CMOS technology to achieve operating speeds similar to LS-TTL gates with the low power consumption of standard CMOS integrated circuits. The MM74HCU04 is an unbuffered inverter. It has high noise immunity and the ability to drive 15 LS-TTL loads. The 74HCU logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground. Features s Typical propagation delay: 7 ns s Fanout of 15 LS-TTL loads s Quiescent power consumption: 10 µA maximum at room temperature s Low input current: 1 µA maximum Ordering Code: Order Number MM74HCU04M MM74HCU04MX_NL MM74HCU04SJ MM74HCU04MTC MM74HCU04N MM74HCU04N_NL Package Number M14A M14A M14D MTC14 N14A N14A Package Description 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Pb-Free 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Pb-Free package per JEDEC J-STD-020B. Connection Diagram Pin Assignments for DIP, SOIC, SOP and TSSOP Schematic Diagram Top View © 2005 Fairchild Semiconductor Corporation DS005296 www.fairchildsemi.com MM74HCU04 Absolute Maximum Ratings(Note 1) (Note 2) Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Power Dissipation (PD) (Note 3) S.O. Package only Lead Temperature (TL) (Soldering 10 seconds) 260°C (Note 4) VCC 2.0V 4.5V 6.0V VIL Maximum LOW Level Input Voltage VOH Minimum HIGH Level Output Voltage VIN = VIL |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = GND |IOUT| ≤ 4.0 mA |IOUT| ≤ 5.2 mA VOL Maximum LOW Level Output Voltage VIN = VIH |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = VCC |IOUT| ≤ 6.0 mA |IOUT| ≤ 7.8 mA IIN ICC Maximum Input Current Maximum Quiescent Supply Current VIN = VCC or GND IOUT = 0 µA 6.0V VIN = VCC or GND 4.5V 6.0V 6.0V 4.5V 6.0V 2.0V 4.5V 6.0V Recommended Operating Conditions Min Supply Voltage (VCC) DC Input or Output Voltage (VIN, VOUT ) Operating Temperature Range (TA) 2 0 Max 6 VCC Units V V −0.5 to +7.0V −1.5 to VCC +1.5V −0.5 to VCC +0.5V ±20 mA ±25 mA ±50 mA −65°C to +150°C 600 mW 500 mW −40 +85 °C Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. DC Electrical Characteristics Symbol VIH Parameter Minimum HIGH Level Input Voltage Conditions TA = 25°C Typ 1.7 3.6 4.8 0.3 0.8 1.1 2.0 4.5 6.0 4.2 5.7 0 0 0 0.2 0.2 1.8 4.0 5.5 3.98 5.48 0.2 0.5 0.5 0.26 0.26 ±0.1 2.0 TA = −40 to 85°C TA = −55 to 125°C Guaranteed Limits 1.7 3.6 4.8 0.3 0.8 1.1 1.8 4.0 5.5 3.84 5.34 0.2 0.5 0.5 0.33 0.33 ±1.0 20 1.7 3.6 4.8 0.3 0.8 1.1 1.8 4.0 5.5 3.7 5.2 0.2 0.5 0.5 0.4 0.4 ±1.0 40 Units V V V V V V V V V V V V V V V V µA µA Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. www.fairchildsemi.com 2 MM74HCU04 AC Electrical Characteristics VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns Symbol tPHL, tPLH Parameter Maximum Propagation Delay Conditions Typ 7 Guaranteed Limit 13 Units ns AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) Symbol tPHL, tPLH Parameter Maximum Propagation Delay tTLH, tTHL Maximum Output Rise and Fall Time CPD CIN Power Dissipation Capacitance (Note 5) Maximum Input Capacitance Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. Conditions VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V TA=25°C Typ 49 9.9 8.4 30 8 7 90 8 15 82 16 14 75 15 13 TA=−40 to 85°C TA=−55 to 125°C Guaranteed Limits 103 21 18 95 19 16 120 24 20 110 22 19 Units ns ns ns ns ns ns pF (per gate) 15 15 pF Typical Applications FIGURE 1. Crystal Oscillator FIGURE 2. Stable RC Oscillator FIGURE 3. Schmitt Trigger 3 www.fairchildsemi.com MM74HCU04 Physical Dimensions inches (millimeters) unless otherwise noted 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M14A www.fairchildsemi.com 4 MM74HCU04 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M14D 5 www.fairchildsemi.com MM74HCU04 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC14 www.fairchildsemi.com 6 MM74HCU04 Hex Inverter Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N14A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 7 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com