6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
PACKAGE
SCHEMATIC
ANODE 1
6 MAIN TERM.
6 6 1
N/C 3 4 MAIN TERM. CATHODE 2 5 NC*
1
*DO NOT CONNECT (TRIAC SUBSTRATE)
6
1
DESCRIPTION
The MOC301XM and MOC302XM series are optically isolated triac driver devices. These devices contain a GaAs infrared emitting diode and a light activated silicon bilateral switch, which functions like a triac. They are designed for interfacing between electronic controls and power triacs to control resistive and inductive loads for 115 VAC operations.
FEATURES
• • • • Excellent IFT stability—IR emitting diode has low degradation High isolation voltage—minimum 5300 VAC RMS Underwriters Laboratory (UL) recognized—File #E90700 Peak blocking voltage – 250V-MOC301XM – 400V-MOC302XM • VDE recognized (File #94766) – Ordering option V (e.g. MOC3023VM)
APPLICATIONS
• • • • • Industrial controls Traffic lights Vending machines Solid state relay Lamp ballasts • • • • Solenoid/valve controls Static AC power switch Incandescent lamp dimmers Motor control
© 2003 Fairchild Semiconductor Corporation
Page 1 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Parameters TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Junction Temperature Range Isolation Surge Voltage(1) (peak AC voltage, 60Hz, 1 sec duration) Total Device Power Dissipation @ 25°C Derate above 25°C EMITTER Continuous Forward Current Reverse Voltage Total Power Dissipation 25°C Ambient Derate above 25°C DETECTOR Off-State Output Terminal Voltage Peak Repetitive Surge Current (PW = 1 ms, 120 pps) Total Power Dissipation @ 25°C Ambient Derate above 25°C Note 1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common. VDRM ITSM PD MOC3010M/1M/2M MOC3020M/1M/2M/3M All All 250 400 1 300 4 V A mW mW/°C IF VR PD All All All 60 3 100 1.33 mA V mW mW/°C TSTG TOPR TSOL TJ VISO PD All All All All All All -40 to +150 -40 to +85 260 for 10 sec -40 to +100 7500 330 4.4 °C °C °C °C Vac(pk) mW mW/°C Symbol Device Value Units
© 2003 Fairchild Semiconductor Corporation
Page 2 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Peak Blocking Current,Either Direction Peak On-State Voltage,Either Direction Rated VDRM, IF = 0 (note 1) ITM = 100 mA peak, IF = 0 IDRM VTM All All 10 1.8 100 3 nA V IF = 10 mA VR = 3 V, TA = 25°C VF IR All All 1.15 0.01 1.5 100 V µA Test Conditions Symbol Device Min Typ Max Units
TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified.)
DC Characteristics Test Conditions Symbol Device MOC3020M MOC3010M MOC3021M LED Trigger Current Voltage = 3V (note 3) IFT MOC3011M MOC3022M MOC3012M MOC3023M Holding Current, Either Direction Note 1. Test voltage must be applied within dv/dt rating. 2. This is static dv/dt. See Figure 5 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only. 3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (30 mA for MOC3020M, 15 mA for MOC3010M and MOC3021M, 10 mA for MOC3011M and MOC3022M, 5 mA for MOC3012M and MOC3023M) and absolute max IF (60 mA). IH All 100 Min Typ Max 30 15 10 5 µA mA Units
© 2003 Fairchild Semiconductor Corporation
Page 3 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
Fig. 1 LED Forward Voltage vs. Forward Current
1.8
Fig. 2 On-State Characteristics
800
1.7
600
ON-STATE CURRENT - I TM (mA)
VF - FORWARD VOLTAGE (V)
1.6
400
1.5
200
1.4
0
TA = -55oC
-200
1.3
TA = 25oC
-400
1.2
TA = 100oC
-600
1.1
-800
1.0 1 10 100
-3
-2
-1
0
1
TM
2
3
ON-STATE VOLTAGE - V
(V)
IF - LED FORWARD CURRENT (mA)
Fig. 3 Trigger Current vs. Ambient Temperature
1.4 25
Fig. 4 LED Current Required to Trigger vs. LED Pulse Width
1.3
TRIGGER CURRENT - I FT (NORMALIZED)
TRIGGER CURRENT - I FT (NORMALIZED)
20
NORMALIZED TO: PWin ≥ 100 µs
1.2
15
1.1
1.0
10
0.9
5
0.8
0 0.7 NORMALIZED TO T A = 25∞C 0.6 -40 -20 0 20 40 60 80 100
1
2
5
10
20
50
100
LED TRIGGER WIDTH - PWin (µs) AMBIENT TEMPERATURE - TA (oC)
Fig. 6 Leakage Current, IDRM vs. Temperature
10000
Fig. 5 dv/dt vs. Temperature
12
1000
8
IDRM, LEAKAGE CURRENT (nA)
100
10
STATIC dv/dt CIRCUIT IN FIGURE 5
STATIC - dv/dt (V/µs)
100
6
4
10
2
1
0 25 30 40 50 60 70 80 90
Ambient Temperature - TA (oC)
0.1 -40 -20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE ( oC)
© 2003 Fairchild Semiconductor Corporation
Page 4 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
400V (MOC302X) 250V (MOC301X) Vdc
1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T.
RTEST R = 10 kΩ CTEST
2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τRC is measured at this point and recorded.
PULSE INPUT
MERCURY WETTED RELAY
D.U.T.
X100 SCOPE PROBE
APPLIED VOLTAGE WAVEFORM
Vmax = 400 V (MOC302X) = 250 V (MOC301X) 252 V (MOC302X) 158 V (MOC301X) dv/dt =
τRC
0.63 Vmax
τRC
0 VOLTS
252 =τ (MOC302X) RC 158 =τ (MOC301X) RC
Figure 5. Static dv/dt Test Circuit
Note: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.
RL Rin VCC 2 MOC3010M MOC3011M MOC3012M 5 1 6 180 120 V 60 Hz
3
4
Figure 6. Resistive Load
ZL Rin VCC 2 MOC3010M MOC3011M MOC3012M 5 0.1 µF C1 1 6 180 2.4k 120 V 60 Hz
3
4
Figure 7. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
© 2003 Fairchild Semiconductor Corporation
Page 5 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
ZL VCC Rin 1 2 MOC3010M MOC3011M MOC3012M 6 5 180 1.2 k 120 V 60 Hz C1
0.2 µF
3
4
Figure 8. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
Rin VCC
1 2 MOC3020M MOC3021M MOC3022M MOC3023M
6 5
360
470 HOT
0.05 µF
39 240 VAC 0.01 µF LOAD GROUND
3
4
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side. The 39 ohm resistor and 0.01µF capacitor are for snubbing of the triac, and the 470 ohm resistor and 0.05 µF capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.
Figure 9. Typical Application Circuit
© 2003 Fairchild Semiconductor Corporation
Page 6 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
Package Dimensions (Through Hole)
0.350 (8.89) 0.320 (8.13)
Package Dimensions (Surface Mount)
0.350 (8.89) 0.320 (8.13)
0.260 (6.60) 0.240 (6.10)
0.260 (6.60) 0.240 (6.10)
0.390 (9.90) 0.332 (8.43)
0.070 (1.77) 0.040 (1.02)
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25) 0.320 (8.13)
0.320 (8.13) 0.014 (0.36) 0.010 (0.25)
0.200 (5.08) 0.115 (2.93)
0.200 (5.08) 0.115 (2.93)
0.012 (0.30) 0.008 (0.20)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15° 0.012 (0.30)
0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)
0.100 [2.54] 0.035 (0.88) 0.006 (0.16)
Package Dimensions (0.4” Lead Spacing)
0.350 (8.89) 0.320 (8.13)
Recommended Pad Layout for Surface Mount Leadform
0.260 (6.60) 0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25)
0.425 (10.79)
0.100 (2.54) 0.305 (7.75) 0.030 (0.76)
0.200 (5.08) 0.115 (2.93)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16)
NOTE All dimensions are in inches (millimeters)
© 2003 Fairchild Semiconductor Corporation
Page 7 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
ORDERING INFORMATION
Option S SR2 T V TV SV SR2V Order Entry Identifier S SR2 T V TV SV SR2V Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
1
MOC3010 V
3 4
2 6
X YY Q
5
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One digit year code, e.g., ‘3’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format.
© 2003 Fairchild Semiconductor Corporation
Page 8 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
Carrier Tape Specifications
12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 0.30 ± 0.05 4.0 ± 0.1 Ø1.5 MIN 1.75 ± 0.10
11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 24.0 ± 0.3
0.1 MAX
10.1 ± 0.20
Ø1.5 ± 0.1/-0
User Direction of Feed
NOTE All dimensions are in inches (millimeters)
Reflow Profile (White Package, -M Suffix)
300 Temperature (°C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 245°C peak
230°C, 10–30 s
Time above 183°C, 120–180 sec Ramp up = 2–10°C/sec • Peak reflow temperature: 245°C (package surface temperature) • Time of temperature higher than 183°C for 120–180 seconds • One time soldering reflow is recommended 3.5 4 4.5
3
Time (Minute)
© 2003 Fairchild Semiconductor Corporation
Page 9 of 10
4/30/03
6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
© 2003 Fairchild Semiconductor Corporation
Page 10 of 10
4/30/03
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