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MOC8050VM

MOC8050VM

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    MOC8050VM - Photodarlington Optocoupler (No Base Connection) - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
MOC8050VM 数据手册
MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) November 2007 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Features ■ High BVCEO tm Description The MOC8021M and MOC8050M are photodarlingtontype optically coupled optocoupler. The devices have a gallium arsenide infrared emitting diode coupled with a silicon darlington phototransistor. ■ ■ ■ ■ ■ – Minimum 50V (MOC8021M) – Minimum 80V (MOC8050M) High current transfer ratio: – Minimum 1,000% (MOC8021M) – Minimum 500% (MOC8050M) 500% No base connection for improved noise immunity Underwriters Laboratory (UL) recognized File #E90700, Volume 2 IEC 60747-5-2 approved (ordering option V) Applications ■ Appliances, measuring instruments ■ I/O interface for computers ■ Programmable controllers ■ Portable electronics ■ Interfacing and coupling systems of different potentials and impedance ■ Solid state relays Schematic ANODE 1 6 N/C CATHODE 2 5 COLLECTOR N/C 3 4 EMITTER ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol TOTAL DEVICE TSTG TOPR TSOL PD EMITTER IF VR PD DETECTOR VCEO Collector-Emitter Voltage MOC8021M MOC8050M Storage Temperature Operating Temperature Parameter Value -55 to +150 -40 to +100 260 for 10 sec 250 2.94 60 3 120 1.41 Units °C °C °C mW mW/°C mA V mW mW/°C Lead Solder Temperature (Wave solder) Total Device Power Dissipation @ TA = 25°C Derate above 25°C DC/Average Forward Input Current Reverse Input Voltage LED Power Dissipation @ TA = 25°C Derate above 25°C 50 80 150 1.76 150 V mW mW/°C mA PD IC Detector Power Dissipation @ TA = 25°C Derate above 25°C Continuous Collector Current ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 2 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Electrical Characteristics (TA = 25°C Unless otherwise specified.) Individual Component Characteristics Symbol Parameter EMITTER VF IR BVCEO Input Forward Voltage Reverse Leakage Current Collector-Emitter Breakdown Voltage MOC8021M MOC8050M Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current Capacitance IF = 10mA VR = 3.0V IC = 1.0mA, IF = 0 50 80 IE = 100µA, IF = 0 VCE = 60V, IF = 0 VCE = 0V, f = 1MHz 8 5 100 100 10 1 V V µA pF 1.18 0.001 2.00 10 V µA Test Conditions Min. Typ.* Max. Unit DETECTOR BVECO ICEO CCE Transfer Characteristics Symbol Parameter DC CHARACTERISTICS CTR Current Transfer Ratio, Collector to Emitter MOC8021M MOC8050M AC CHARACTERISTICS ton toff Non-Saturated Turn-on Time Turn-off Time Test Conditions Min. Typ.* Max. Unit IF = 10mA, VCE = 5V IF = 10mA, VCE = 1.5V IF = 5mA, VCC = 10V, RL = 100Ω IF = 5mA, VCC = 10V, RL = 100Ω 1,000 500 8.5 95 % µs µs Isolation Characteristics Symbol VISO RISO CISO Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance Test Conditions f = 60Hz, t = 1 sec. VI-O = 500VDC VI-O = Ø, f = 1MHz Min. 7500 1011 Typ. Max. Units Vac(pk) Ω 0.2 2 pF Note: *Typical values at TA = 25°C ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 3 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Typical Performance Curves Fig. 1 LED Forward Voltage vs. Forward Current NORMALIZED CTR – CURRENT TRANSFER RATIO 1.8 Fig. 2 Normalized CTR vs. Forward Current VCE = 10V TA = 25 C o Normalized to IF = 10 mA 1.6 VF - FORWARD VOLTAGE (V) 1.4 TA = -40oC TA = 0 C, 25 C o o TA = -40 C o 1 TA = 7 0 C TA = 110oC o 1.2 1.0 TA = 25 C TA = 110oC o 0.8 0.6 0.1 1 10 100 0.1 0.1 1 10 100 IF - LED FORWARD CURRENT (mA) IF - FORWARD CURRENT (mA) Fig. 4 Turn-on Time vs. Forward Current 1000 Fig. 3 Normalized CTR vs. Ambient Temperature NORMALIZED CTR – CURRENT TRANSFER RATIO 1.6 IF = 10mA V = 10V Normalized to TA = 25 C o RL = 1k Ω VCC = 10V TA = 25oC 1.4 CE 100 TON - TURN-ON TIME (µs) RL = 100Ω RL = 10Ω 1.2 10 1.0 0.8 1 0.6 0.4 -40 -20 0 20 40 60 80 100 120 0.1 0.1 1 10 100 TA - AMBIENT TEMPERATURE (°C) IF - FORWARD CURRENT (mA) Fig. 5 Turn-off Time vs. Forward Current VCC = 10V TA = 25oC 1000 Fig. 6 Normalized Collector-Emitter Current vs. Collector-Emitter Voltage NORMALIZED ICE - COLLECOTR-EMITTER CURRENT 16 TA = 25 C 14 IF = 10 mA 12 10 IF = 5 mA 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 o Normalized to: IF = 1 mA, VCE = 5V TOFF - TURN-ON TIME (µs) RL = 1KΩ 100 RL = 100Ω RL = 10Ω 10 IF = 2 mA IF = 1 mA 1 0 1 10 100 IF - FORWARD CURRENT (mA) VCE - COLLECTOR-EMITTER VOLTAGE (V) ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 4 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Typical Performance Curves (Continued) Fig. 7 Dark Current vs. Ambient Temperature 100,000 ICEO - COLLECTOR -EMITTER DARK CURRENT (nA) V CE = 10V 10,000 1.000 100 10 1 0.1 0.01 -40 -20 0 20 40 60 80 100 120 TA - AMBIENT TEMPERATURE (°C) TEST CIRCUIT VCC = 10V WAVE FORMS INPUT PULSE IF INPUT RBE IC RL 10% 90% tr ton Adjust IF to produce IC = 2 mA tf toff OUTPUT PULSE OUTPUT Figure 8. Switching Time Test Circuit and Waveforms ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 5 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Package Dimensions Through Hole 0.350 (8.89) 0.320 (8.13) Pin 1 ID Surface Mount 0.350 (8.89) 0.320 (8.13) PIN 1 ID 0.260 (6.60) 0.240 (6.10) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) SEATING PLANE SEATING PLANE 0.070 (1.77) 0.040 (1.02) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15° 0.012 (0.30) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.035 (0.88) 0.006 (0.16) 0.4" Lead Spacing 0.350 (8.89) 0.320 (8.13) PIN 1 ID Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.260 (6.60) 0.240 (6.10) 0.060 (1.52) 0.070 (1.77) 0.040 (1.02) SEATING PLANE 0.014 (0.36) 0.010 (0.25) 0.415 (10.54) 0.100 (2.54) 0.295 (7.49) 0.030 (0.76) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) Note: All dimensions are in inches (millimeters). ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 6 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Ordering Information Option No suffix S SR2 T V TV SV SR2V Order Entry Identifier (Example) MOC8050M MOC8050SM MOC8050SR2M MOC8050TM MOC8050VM MOC8050TVM MOC8050SVM MOC8050SR2VM Description Standard Through Hole Device (50 parts per tube) Surface Mount Lead Bend Surface Mount; Tape and Reel 0.4" Lead Spacing IEC60747-5-2 IEC60747-5-2, 0.4" Lead Spacing IEC60747-5-2, Surface Mount IEC60747-5-2, Surface Mount, Tape and Reel Marking Information 1 MOC8050 V 3 2 6 X YY Q 4 5 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One digit year code, e.g., ‘7’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 7 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) Tape Dimensions 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 0.30 ± 0.05 4.0 ± 0.1 Ø1.5 MIN 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 24.0 ± 0.3 0.1 MAX 10.1 ± 0.20 Ø1.5 ± 0.1/-0 User Direction of Feed Note: All dimensions are in millimeters. Reflow Soldering Profile 300 280 260 240 220 200 180 160 °C 140 120 100 80 60 40 20 0 0 260°C >245°C = 42 Sec Time above 183°C = 90 Sec 1.822°C/Sec Ramp up rate 33 Sec 60 120 180 270 360 Time (s) ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 8 MOC8021M, MOC8050M Photodarlington Optocoupler (No Base Connection) TRADEMARKS The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FPS™ FRFET® Global Power ResourceSM Green FPS™ Green FPS™ e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® PDP-SPM™ Power220® Power247® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® UniFET™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I31 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. No Identification Needed Full Production Obsolete Not In Production ©2000 Fairchild Semiconductor Corporation MOC8021M, MOC8050M Rev. 1.0.3 www.fairchildsemi.com 9
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