MTP2955V

M TP2955V May 1999 DISTRIBUTION GROUP* MTP2955V P-Channel Enhancement Mode Field Effect Transistor General Description This P-Channel MOSFET has been designed specifically for low voltage, high speed switching applications i.e. power supplies and power motor controls. These MOSFETs feature faster switching and lower gate charge than other MOSFETs with comparable RDS(ON) specifications. The result is a MOSFET that is easy and safer to drive (even at very high frequencies). Features • -12 A, -60 V. RDS(ON) = 0.230 Ω @ VGS = -10 V • Critical DC electrical parameters specified at elevated temperature. • Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor. • 175°C maximum junction temperature rating. 6 * * ' 6 72 ' $EVROXWH 0D[LPXP 5DWLQJV 6\PERO W'66 W*66 D' Bh‡rT‚ˆ…prÃW‚y‡htr 9…hvÃ8ˆ……r‡ Ã8‚‡vˆ‚ˆ†Ã ÃQˆy†rq Q' 9…hvT‚ˆ…prÃW‚y‡htr U Ã2Ã!$ƒ8ȁyr††Ã‚‡ur…v†rÁ‚‡rq & 3DUDPHWHU 5DWLQJV % 8QLWV W W 6 ± ! ! #! 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A TO-220 Tape and Reel Data and Package Dimensions TO-220 Tube Packing Configuration: Figur e 1.0 Packaging Description: TO-220 parts are ship ped normally in tube. The tube is made of PVC plastic treated with anti -stati c agent.These tubes in standard option are placed inside a dissipative plastic bag, barcode labeled, and placed inside a box made of recyclable corrugated pa per. One box contains two ba gs maximum (see fig. 1.0). And one or several o f these boxes are placed inside a labeled shipp ing bo x whic h c omes in different sizes dependi ng on the nu mber of parts ship ped. The other option comes in bulk as described in the Packagin g Information table. The unit s in this option are placed inside a small box laid w ith antistatic bubble sheet. These smaller boxes are individually labeled and placed ins ide a larger box (see fig. 3.0). These larger or intermediate boxes then will b e placed finally inside a labeled shipping box whic h still comes in different sizes depending on the number of units shipped. 45 unit s per Tube 12 Tubes per Bag 2 bag s per Box Conduct ive Plasti c B ag 530mm x 130mm x 83mm Intermediate box TO-220 Packaging Information: Figure 2.0 TO-220 Packaging Information Packaging Option Packaging type Qty per Tube/Box Box Dimension (mm) Max qty per Box Weight per unit (gm) Note/Comments Standard (no f l ow code ) FSCINT Labe l samp le FAIRCHILD SEMICONDUCTOR CORPORATION 1080 uni ts maxi mum quant it y per bo x S62Z BULK 300 LOT: CBVK741B019 QTY: HTB:B 1080 NSID: FDP7060 SPEC: Rail/Tube 45 530x130x83 1,080 1.4378 D/C1: D9842 SPEC REV: QA REV: B2 114x102x51 1,500 1.4378 FSCINT Label (FSCINT) TO-220 bulk Packing Configuration: Figure 3.0 FSCINT Label An ti-stati c Bubbl e Sheet s 530mm x 130mm x 83mm Intermediate box 1500 uni ts maxi mum quant it y per intermediate box 300 units per EO70 box 114mm x 102mm x 51mm EO70 Immed iate Box 5 EO70 boxe s per per Interm ediate Bo x FSCINT Label TO-220 Tube Configuration: Figure 4.0 Note: All dim ensions are in inches 0.123 +0.001 -0.003 0.165 0.080 0.450 ±.030 1.300 ±.015 0.032 ±.003 0.275 F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L F 9852 NDP4060L 0.160 20.000 +0.031 -0.065 0.800 0.275 August 1999, Rev. B TO-220 Tape and Reel Data and Package Dimensions, continued TO-220 (FS PKG Code 37) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 1.4378 September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ CoolFET™ CROSSVOLT™ E2CMOSTM FACT™ FACT Quiet Series™ FAST® FASTr™ GTO™ HiSeC™ DISCLAIMER ISOPLANAR™ MICROWIRE™ POP™ PowerTrench  QFET™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 TinyLogic™ UHC™ VCX™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.