RMPA29000

RMPA29000 June 2004 RMPA29000 27–30 GHZ 1 Watt Power Amplifier MMIC General Description The Fairchild Semiconductor’s RMPA29000 is a high efficiency power amplifier designed for use in point to point and point to multi-point radios, and various communications applications. The RMPA29000 is a 3-stage GaAs MMIC amplifier utilizing our advanced 0.15µm gate length Power PHEMT process and can be used in conjunction with other driver or power amplifiers to achieve the required total power output. Features • 23dB small signal gain (typ.) • 30dBm Pout at 1dB compression (typ.) • Circuit contains individual source vias • Chip size 5.20mm x 2.95mm Device Absolute Ratings Symbol Vd Vg Vdg ID PIN TC TSTG RJC Parameter Positive DC Voltage (+5V Typical) Negative DC Voltage Simultaneous (Vd–Vg) Positive DC Current RF Input Power (from 50Ω source) Operating Baseplate Temperature Storage Temperature Range Thermal Resistance (Channel to Backside) Ratings +6 -2 +8 1092 +18 -30 to +85 -55 to +125 20 Units V V V mA dBm °C °C °C/W ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D RMPA29000 Electrical Characteristics (At 25°C), 50Ω system, Vd = +5V, Quiescent current (Idq) = 700mA Parameter Frequency Range Gate Supply Voltage (Vg)1 Gain Small Signal (Pin = -1dBm) Gain Variation vs. Frequency Power Output at 1dBm Compression Power Output Saturated: (Pin = +10.5dBm) Drain Current at Pin = -1dBm Drain Current at P1dB Compression Power Added Efficiency (PAE): at P1dB OIP3 (16dBm/tone) Input Return Loss (Pin = -1dBm) Output Return Loss (Pin = -1dBm) Note: 1. Typical range of negative gate voltages is -0.9 to 0.0V to set typical Idq of 700 mA. Min 27 18 Typ -0.4 23 ±1 30 30.5 700 850 23 37 10 10 Max 30 28.5 Units GHz V dB dB dBm dBm mA mA % dBm dB dB ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D RMPA29000 Application Information CAUTION: THIS IS AN ESD SENSITIVE DEVICE. Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high thermal conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325°C for 15 minutes. Die attachment should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. Recommended wire bonding uses 3mils wide and 0.5mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 12 mils long corresponding to a typical 2 mil gap between the chip and the substrate material. DRAIN SUPPLY (VDA & VDB) MMIC CHIP RF IN RF OUT GROUND (Back of the Chip) GATE SUPPLY (VGA & VGB) Figure 1. Functional Block Diagram 2.946 2.672 1.651 1.461 1.285 0.254 0.0 0.236 0.122 Dimensions in mm 5.210 4.445 5.072 Figure 2. Chip Layout and Bond Pad Locations (Chip Size is 5.210mm x 2.946mm x 50µm Typical. Back of chip is RF and DC Ground) ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D RMPA29000 DRAIN SUPPLY (Vd = +5V) (Connect to both VDA & VDB) 10000pF L 100pF BOND WIRE Ls L MMIC CHIP RF IN RF OUT L GROUND (Back of Chip) 100pF BOND WIRE Ls L 10000pF GATE SUPPLY (Vg) (VGA and/or VGB) Figure 3. Recommended Application Schematic Circuit Diagram ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D RMPA29000 Vg (NEGATIVE) Vd (POSITIVE) 10000pF 2 MIL GAP 100pF 10000pF DIE-ATTACH 80Au/20Sn 100pF 5 MIL THICK ALUMINA 50Ω 5 MIL THICK ALUMINA 50Ω RF INPUT RF OUTPUT 100pF 100pF 10000pF 10000pF L < 0.015" (4 Places) Vg (NEGATIVE) Vd (POSITIVE) Note: Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief. Vd should be biased from 1 supply on both sides as shown. Vg can be biased from either or both sides from 1 supply. Figure 4. Recommended Assembly and Bonding Diagram ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D RMPA29000 Recommended Procedure for Biasing and Operation CAUTION: LOSS OF GATE VOLTAGE (Vg) WHILE DRAIN VOLTAGE (Vd) IS PRESENT MAY DAMAGE THE AMPLIFIER CHIP. The following sequence of steps must be followed to properly test the amplifier. Step 1: Turn off RF input power. Step 2: Connect the DC supply grounds to the ground of the chip carrier. Slowly apply negative gate bias supply voltage of -1.5V to Vg. Step 3: Slowly apply positive drain bias supply voltage of +5V to Vd. Step 4: Adjust gate bias voltage to set the quiescent current of Idq = 700mA. Step 5: After the bias condition is established, the RF input signal may now be applied at the appropriate frequency band. Step 6: Follow turn-off sequence of: (i) Turn off RF input power, (ii) Turn down and off drain voltage (Vd), (iii) Turn down and off gate bias voltage (Vg). Note: An example auto bias sequencing circuit to apply negative gate voltage and positive drain voltage for the above procedure is shown below. D3 D1N6098 +6V D2 D1N6098 R1 3.0k + V+ 0 1 2 C1 0.1µF R3 1.0k * U2 AD820/AD V- LM2941T U1A 7400 3 2 CNT 5 4 IN OUT 3 GND +2.62V R4 1.2k – MMIC_+VDD C3 22µF R2 6.8k 0 0 C2 0.47µF R6 0 1k ADJ 1 R5 3k 0 0 *Adj. For –Vg MMIC_–VG C4 0.1µF R7 8.2k R8 1.0k 0 0 –5V *–5V Off: +3.33V –5V Off: +1.80V 0 C5 0.1µF ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D RMPA29000 Typical Characteristics RMPA29000 SS Gain vs. Frequency Vd = 5V, Idq = 700mA 25 24 23 GAIN (dB) 22 21 20 19 18 26 27 28 29 30 31 FREQUENCY (GHz) RMPA29000 P1dB vs. Frequency Vd = 5V, Idq = 700mA 31.0 30.5 30.0 29.5 29.0 28.5 28.0 25 26 27 28 29 30 31 32 FREQUENCY (GHz) P1dB (dBm) RMPA29000 Power Out vs. Power In Idq = 700mA 31. 00 30.00 29.00 29 GHz 28.00 GAIN (dB) 27.00 26.00 25.00 24.00 28 GHz 23.00 30 GHz 22.00 Fixture Data 21.00 -1.00 1.00 3.00 5.00 Pin (dBm) ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D 27 GHz 7.00 9.00 11.00 RMPA29000 Typical Characteristics (Continued) RMPA29000 Gain vs. Pin Vd = 5V, Idq = 700mA 25. 00 24.50 27 GHz 24.00 23.50 GAIN (dB) 23.00 22.50 22.00 21.50 21.00 20.50 Fixture data 20.00 -1.00 1.00 3.00 5.00 Pin (dBm) 7.00 9.00 11.00 28 GHz 29 GHz 30 GHz RMPA29000 S21, S11, S22 Mag vs. Frequency Vd = 5V, Id = 700mA 30 S21 20 S21, S11, S22 MAG (dB) 10 0 -10 -20 -30 26 27 28 29 30 31 FREQUENCY (GHz) S22 S11 RMPA29000 Ids vs. Pin 1020 970 28 GHz 920 Ids (mA) 870 820 770 720 670 Fixture data 29 GHz 30 GHz 27 GHz 620 -1.00 1.00 3.00 5.00 Pin (dBm) ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. D 7.00 9.00 11.00 RMPA29000 Typical Characteristics (Continued) RMPA29000 OIP3 vs. Output Power/Tone 10 MHz Tone Sep. Vds = 5V, Idq = 700mA 40 38 36 OUTPUT IP3 (dBm) 34 32 30 28 26 24 22 20 10 11 12 13 14 15 16 17 18 19 20 21 22 23 OUTPUT POWER/TONE (dBm) 27 GHz 28 GHz 29 GHz 30 GHz ©2004 Fairchild Semiconductor Corporation RMPA29000 Rev. 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Around the world.™ OPTOPLANAR™ PACMAN™ The Power Franchise POP™ Programmable Active Droop™ Power247™ PowerSaver™ PowerTrench QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I11