Advanced Power MOSFET
FEATURES
! Avalanche Rugged Technology ! Rugged Gate Oxide Technology ! Lower Input Capacitance ! Improved Gate Charge ! Extended Safe Operating Area ! Lower Leakage Current : 10 µA (Max.) @ VDS = -250V ! Lower RDS(ON) : 0.549 Ω (Typ.)
SFF9244
BVDSS = -250 V RDS(on) = 0.8 Ω ID = -6.0 A
TO-3PF
1 2 3
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings
Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ , TSTG TL Characteristic Drain-to-Source Voltage Continuous Drain Current (TC=25 C) Continuous Drain Current (TC=100 C) Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TC=25 C) Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8 ” from case for 5-seconds
o o o
Value -250 -6.0 -4.1
1 O
Units V A A V mJ A mJ V/ns W W/ C
o
24 + 30 _ 450 -6.0 6.0 -4.8 60 0.48 - 55 to +150
O 1 O 1 O 3 O
2
o
C
300
Thermal Resistance
Symbol RθJC RθJA Characteristic Junction-to-Case Junction-to-Ambient Typ. --Max. 2.08 40 Units
o
C/W
Rev. A
SFF9244
Electrical Characteristics (TC=25oC unless otherwise specified)
Symbol BVDSS ∆BV/∆TJ VGS(th) IGSS IDSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Characteristic Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coeff. Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse Drain-to-Source Leakage Current Static Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain( “ Miller “ ) Charge Min. Typ. Max. Units -250 --2.0 ------------------0.22 ------4.8 175 65 14 21 47 18 45 8.7 23.4 ---4.0 -100 100 -10 -100 0.8 -265 100 40 50 105 45 58 --nC ns µA Ω S pF V
o
P-CHANNEL POWER MOSFET
Test Condition VGS=0V,ID=-250µA See Fig 7 VDS=-5V,ID=-250µA VGS=-30V VGS=30V VDS=-250V VDS=-200V,TC=125 C VGS=-10V,ID=-3.0A VDS=-40V,ID=-3.0A
4 O 4 O
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V/ C ID=-250µA V nA
1205 1565
VGS=0V,VDS=-25V,f =1MHz See Fig 5 VDD=-125V,ID=-8.6A, RG=9.1Ω See Fig 13
45 OO
VDS=-200V,VGS=-10V, ID=-8.6A See Fig 6 & Fig 12
45 OO
Source-Drain Diode Ratings and Characteristics
Symbol IS ISM VSD trr Qrr Characteristic Continuous Source Current Pulsed-Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge
1 O 4 O
Min. Typ. Max. Units --------210 1.82 -6.0 -24 -5.0 --A V ns µC
Test Condition Integral reverse pn-diode in the MOSFET TJ=25 C,IS=-6.0A,VGS=0V TJ=25 C,IF=-8.6A diF/dt=100A/µs
4 O
o o
Notes ; 1 O Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature 2 L=20mH, I =-6.0A, V =-50V, R =27Ω *, Starting T =25oC O AS DD G J _ _ _ 3 O ISD
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