8609 XXX XX XX XXX XXXXX YY XX
WITH HARPOONS
NO OPTION
NOTES:1. THE ''LF'' PRODUCTS MEET EUROPEAN UNION DIRECTIVES AND OTHER COUNTRY REGULATIONS AS DESCRIBED IN GS-22-008 2. THE HOUSING WILL WITHSTAND EXPOSURE TO 260°C PEAK TEMPERATURE FOR 3.5 SECONDS IN A WAVE SOLDER APPLICATION WITH A 1.6 MM MINIMUM THICK CIRCUIT BOARD 3. LEAD FREE OR RoHS DIRECTIVE LABELING TO BE PROVIDED AS PER GS-14-920 FOR LEAD FREE VERSION.
LINEAR ±0.1 ANGULAR ±1°
Mini K Vandanath Rakhee George Rakhee George K Somasundaram
22/09/2004 22/09/2004 19/05/2005 19/05/2005
8609 SEE TECH. SPEC.
A3
b a
19/06/2005 22/09/2004
TECHNICAL SPECIFICATION MODIFIED AND LEAD FREE NOTE ADDED. DRAWING NO. WAS C-8609-0103 REV. b
DIN STANDARD RECEPTACLE
b a I05-0042 I04-0100 MINI 19/05/2005 MINI 09/11/2004 D\ENGG\EURO\8609
(STRAIGHT SPILL DIN 41612 STYLE-C/2)
C-8609-2017
STATUS:Released
b
8609---8314--5XXXXX, 8609---8324--5XXXXX
PDM: Rev:B
Printed: Sep 09, 2005 .
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