86094488314H85E1LF

8609 XXX XX XX XXX XXXXX YY XX WITH HARPOONS NO OPTION NOTES:1. THE ''LF'' PRODUCTS MEET EUROPEAN UNION DIRECTIVES AND OTHER COUNTRY REGULATIONS AS DESCRIBED IN GS-22-008 2. THE HOUSING WILL WITHSTAND EXPOSURE TO 260°C PEAK TEMPERATURE FOR 3.5 SECONDS IN A WAVE SOLDER APPLICATION WITH A 1.6 MM MINIMUM THICK CIRCUIT BOARD 3. LEAD FREE OR RoHS DIRECTIVE LABELING TO BE PROVIDED AS PER GS-14-920 FOR LEAD FREE VERSION. LINEAR ±0.1 ANGULAR ±1° Mini K Vandanath Rakhee George Rakhee George K Somasundaram 22/09/2004 22/09/2004 19/05/2005 19/05/2005 8609 SEE TECH. SPEC. A3 b a 19/06/2005 22/09/2004 TECHNICAL SPECIFICATION MODIFIED AND LEAD FREE NOTE ADDED. DRAWING NO. WAS C-8609-0103 REV. b DIN STANDARD RECEPTACLE b a I05-0042 I04-0100 MINI 19/05/2005 MINI 09/11/2004 D\ENGG\EURO\8609 (STRAIGHT SPILL DIN 41612 STYLE-C/2) C-8609-2017 STATUS:Released b 8609---8314--5XXXXX, 8609---8324--5XXXXX PDM: Rev:B Printed: Sep 09, 2005 .