BDS3-4S2

FERROXCUBE DATA SHEET SMD beads EMI-suppression products Supersedes data of September 2004 2008 Sep 01 Ferroxcube EMI-suppression products SMD BEADS FOR EMI SUPPRESSION General data ITEM Solderability Taping method SPECIFICATION “IEC 60068-2-58”, Part 2, Test Ta, method 1 “IEC 60286-3” , “EIA 481-1” and “EIA 481-2” 0.2 ± 0.015 Dimensions in mm. SMD beads Mechanical data 5.3 ± 0.35 1.2 min 1.1 min Strip material copper (Cu), tin (Sn) plated 3.05 ± 0.15 1.27 ± 0.07 1.8 max MBE731 Grades, parameters and type numbers GRADE |Ztyp (Ω ) |(1) at f (MHz) TYPE NUMBER Fig.1 BDS 3/1.8/5.3. BDS 3/1.8/5.3; mass ≈0.1 g (2) 3S1 28 33 25 4S2 25 38 45 10 25 100 25 100 300 0.2 ± 0.015 Dimensions in mm. BDS 3/1.8/5.3-3S1 4.6 ± 0.3 1.2 min 1.1 min 3.05 ± 0.15 1.27 ± 0.07 BDS 3/1.8/5.3-4S2 3 max MGC296 BDS 3/3/4.6; mass ≈0.15 g (2) 3S1 25 45 35 4S2 30 50 55 BDS 3/3/8.9; mass ≈0.3 g 3S1 55 80 55 4S2 65 100 110 3 10 25 25 100 300 (3) BDS3/3/4.6-3S1 Fig.2 BDS 3/3/4.6. BDS3/3/4.6-4S2 8.9 ± 0.35 5 min 1.2 min 3 max 3.05 ± 0.15 1.27 ± 0.07 3 10 25 25 100 300 BDS 3/3/8.9-3S1 0.2 ± 0.015 Dimensions in mm. MGC297 BDS 3/3/8.9-4S2 Fig.3 BDS 3/3/8.9. BDS 4.6/3/8.9; mass ≈0.5 g (3) 4S2 65 100 110 Note 1. Typical values, Zmin is −20%. 2. DC resistance