CMS2-5.6-4S2

FERROXCUBE DATA SHEET SMD common mode chokes EMI-suppression products Supersedes data of September 2004 2008 Sep 01 Ferroxcube EMI-suppression products SMD COMMON MODE CHOKES FOR EMI-SUPPRESSION General data ITEM Solderability Taping method SPECIFICATION “IEC 60068-2-58”, Part 2, Test Ta, method 1 “IEC 60286-3” , “EIA 481-1-A” and “EIA 481-2” SMD common mode chokes GRADE |Ztyp |(1) at f (Ω ) (MHz) TYPE NUMBER CMS4-11/3/4.8; mass ≈0.6 g 4S2 inner channel 4S2 outer channel 12 23 42 15 30 50 25 100 300 25 100 300 CMS4-11/3/4.8-4S2 Strip material copper (Cu), tin (Sn) plated Grades, parameters and type numbers GRADE |Ztyp |(1) at f (Ω ) (MHz) TYPE NUMBER CMS4-11/3/8.9; mass ≈1.1 g 4S2 inner channel 4S2 outer channel Note 23 45 82 27 58 97 25 100 300 25 100 300 CMS4-11/3/8.9-4S2 CMS2-5.6/3/4.8; mass ≈0.3 g 4S2 21 35 50 25 100 300 CMS2-5.6/3/4.8-4S2 CMS2-5.6/3/8.9; mass ≈0.6 g 4S2 38 60 25 100 CMS2-5.6/3/8.9-4S2 1. Typical values, Zmin is −20%. DC resistance 5 handbook, halfpage 4.75 ±0.3 >1.2 handbook, halfpage >1.1 >1.2 1.33 ±0.2 1.27 ±0.07 3.04 max. 3.04 max. CBW180 0.2 0.2 5.6 ±0.2 a. CMS2-5.6/3/8.9 (side view). Dimensions in mm. b. CMS2-5.6/3/4.8 (side view). Front view (a and b). Fig.1 CMS2-5.6/3/4.8 and CMS2-5.6/3/8.9. 2008 Sep 01 1443 Ferroxcube EMI-suppression products SMD common mode chokes 8.9 −0.5 >5 handbook, halfpage handbook, full pagewidth 4.75 ±0.3 >1.2 >1.1 >1.2 1.33 ±0.2 1.27 ±0.07 3.04 max. 3.04 max. CBW181 0.2 0.2 10.8 ±0.3 a. CMS4-11/3/8.9 (side view). Dimensions in mm. b. CMS4-11/3/4.8 (side view). Front view (a and b). Fig.2 CMS4-11/3/4.8 and CMS4-11/3/8.9. Recommended dimensions of solder lands handbook, halfpage 2.5 ;; ;; ;; ;; 1.8 6.4 2.8 ;; ;; ;; ;; MBG063 handbook, halfpage 6.4 1.9 2.5 ;;;;; ;; ;;;;; ;; ;;;;; ;; ;;;;; ;; 1.8 2.0 0.8 1.9 MBG064 Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm2). Dimensions in mm. Fig.3 Solder lands for reflow soldering of CMS2-5.6/3/4.8. Fig.4 Solder lands for wave soldering of CMS2-5.6/3/4.8. 2008 Sep 01 1444 Ferroxcube EMI-suppression products SMD common mode chokes handbook, halfpage 2.5 ; ; ; 1.8 10.8 7.0 ;; ;; ;; 1.9 CBW291 handbook, halfpage 2.5 ;;;;; ;;;;; ;;;;; 10.8 6.0 1.8 2.5 1.9 CBW292 Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm2). Dimensions in mm. Fig.5 Solder lands for reflow soldering of CMS2-5.6/3/8.9. Fig.6 Solder lands for wave soldering of CMS2-5.6/3/8.9. handbook, halfpage 2.5 ;; ;; ;; ;; ;; ;; ;; 1.8 6.4 2.8 ;; ;; ;; ;; ;; ;; ;; MBG065 handbook, halfpage 1.9 2.5 ;;;;; ;; ;;;;; ;; ;;;;; ;; ;;;;; ;;;; ;;; ;; ;;;;; ;; ;;;;; ;; 1.8 2.0 0.8 1.9 MBG066 6.4 Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm2). Dimensions in mm. Fig.7 Solder lands for reflow soldering of CMS4-11/3/4.8. 1445 Fig.8 Solder lands for wave soldering of CMS4-11/3/4.8. 2008 Sep 01 Ferroxcube EMI-suppression products SMD common mode chokes handbook, halfpage 2.5 ; ; ; ; ; 1.8 10.8 7.0 ;; ;; ;; ;; ;; 1.9 CBW289 handbook, halfpage 2.5 ;;;;; ;;;;; ;;;;; ;;;;; ;;;;; 10.8 6.0 1.8 2.5 1.9 CBW290 Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm2). Dimensions in mm. Fig.9 Solder lands for reflow soldering of CMS4-11/3/8.9. Fig.10 Solder lands for wave soldering of CMS4-11/3/8.9. 2008 Sep 01 1446 Ferroxcube EMI-suppression products Soldering profiles SMD common mode chokes Temp in oC Preheat 480 sec max 255 - 260 oC 217 oC o Soldering 20 - 40 sec 3 C/s max o 6 C/s max o max 200 C min 150 oC 60 - 180 sec 60 - 150 sec 25 oC MFP129 Time in sec Fig.11 Reflow soldering. 300 (°C) 250 235 °C to 260 °C 10 s MLA861 T second wave 200 first wave 5 K/s 2 K/s 150 200 K/s 100 °C to 130 °C 100 forced cooling 50 2 K/s 0 0 50 100 150 200 t (s) 250 Typical values (solid line). Process limits (dotted lines). Fig.12 Double wave soldering. 2008 Sep 01 1447 Ferroxcube EMI-suppression products BLISTER TAPE AND REEL DIMENSIONS SMD common mode chokes K handbook, full pagewidth0 T D0 P0 P2 E cover tape B0 F W MEA613 - 1 A0 P1 direction of unreeling D1 For dimensions see Table 1. Fig.13 Blister tape. Table 1 Physical dimensions of blister tape; see Fig.13 DIMENSIONS (mm) SIZE CMS2-5.6/3/4.8 A0 B0 K0 T W E F D0 D1 P0 P1 P2 5.26 6.07 3.18 0.3 12 1.75 5.5 1.5 ≥1.5 4.0 8.0 2.0 CMS2-5.6/3/8.9 5.99 9.09 3.18 0.33 16 1.75 7.5 1.5 ≥1.5 4.0 8.0 2.0 CMS2-5.6/3/8.9 5.23 11.18 4.5 0.34 24 1.75 11.75 1.5 ≥1.5 4.0 8.0 2.0 CMS4-11/3/8.9 10.13 11.56 4.5 0.36 24 1.75 11.5 1.5 ≥1.5 4.0 16.0 2.0 2008 Sep 01 1448 Ferroxcube EMI-suppression products SMD common mode chokes handbook, full pagewidth W2 20.5 12.75 0.15 N 0 A MSA284 W1 Dimensions in mm. For dimensions see Table 2. Fig.14 Reel. Table 2 Reel dimensions; see Fig.14 DIMENSIONS (mm) SIZE A 12 16 24 330 330 330 N 100 ±5 100 ±5 100 ±5 W1 12.4 16.4 24.4 W2 ≤16.4 ≤20.4 ≤28.4 2008 Sep 01 1449 Ferroxcube EMI-suppression products DATA SHEET STATUS DEFINITIONS DATA SHEET STATUS Preliminary specification Product specification PRODUCT STATUS Development SMD common mode chokes DEFINITIONS This data sheet contains preliminary data. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Production DISCLAIMER Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Ferroxcube customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Ferroxcube for any damages resulting from such application. PRODUCT STATUS DEFINITIONS STATUS Prototype Design-in Preferred Support INDICATION DEFINITION These are products that have been made as development samples for the purposes of technical evaluation only. The data for these types is provisional and is subject to change. These products are recommended for new designs. These products are recommended for use in current designs and are available via our sales channels. These products are not recommended for new designs and may not be available through all of our sales channels. Customers are advised to check for availability. 2008 Sep 01 1450