BAV99

SMD Switching Diode BAL99/BAV99/BAW56/BAV70 Formosa MS List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Thermal Characteristics ................................................................... 3 Electrical Characteristics.................................................................. 3 Rating and characteristic curves........................................................ 4 Pinning information...........................................................................5 Marking........................................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 7 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities...........................................................8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision DS-221906 2008/02/10 2010/11/29 C Page. 8 Formosa MS SMD Switching Diode BAL99/BAV99/BAW56/BAV70 225mW Surface Mount Switching Diode- 70V Features Package outline • Fast speed switching. • For general purpose switching application. • High conductance. • Silicon epitaxial planar chip. • Lead-free parts meet RoHS requirments. • Suffix "-H" indicates Halogen-free part, ex.BAL99-H. (B) (C) (A) 0.063 (1.60) Mechanical data 0.012 (0.30) 0.034 (0.85) 0.020 (0.50) .084(2.10) .068(1.70) 0.110 (2.80) 0.120 (3.04) 0.045 (1.15) SOT-23 0.027 (0.67) 0.013 (0.32) 0.047 (1.20) 0.108 (2.75) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per 0.051 (1.30) 0.003 (0.09) 0.007 (0.18) 0.083 (2.10) 0.035 (0.89) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.008 gram Dimensions in inches and (millimeters) Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER SYMBOL Reverse Voltage BAL99 BAV99 VR BAV70 BAW56 UNIT V 70 Forward Current IF Peak Forward Surge Current I FM 500 mA Non-Repetitive Peak Forward Surge Current @ t=1.0us @ t=1.0s I FSM 2.0 1.0 A SYMBOL MAX. UNIT 100 215 mA 200 Thermal Characteristics PARAMETER Total Device Dissipation FR-5 1 O Board* , T A = 25 C Total Device Dissipation Alumina mW/ OC 1.8 Thermal Resistance Junction to Ambient R θJA 2 mW 225 PD Derate Above 25 OC Substrate* , T A = 25 C Derate Above 25 OC O 556 O mW 300 PD C/W mW/ OC 2.4 Thermal Resistance Junction to Ambient R θJA 417 Operating Junction Temperature Range TJ -55 ~ +150 o C -55 ~ +150 o C Storage Temperature Range T STG O 1. FR-5 = 1.0 x 0.75 x 0.062 in. 2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision DS-221906 2008/02/10 2010/11/29 C Page. 8 C/W Formosa MS SMD Switching Diode BAL99/BAV99/BAW56/BAV70 Electrical Characteristics (AT T =25 C unless otherwise noted) o A PARAMETER SYMBOL MIN. V BR 70 Reverse Breakdown Voltage(I BR=100uAdc) Reverse Voltage Leakage Current (at V R = 70V, T J =25 OC)BAL99/BAV99/BAW56/BAV70 (at V R = 25V, T J =150 OC)BAL99/BAV99/BAW56 (at V R = 25V, T J =150 OC)BAV70 (at V R = 70V, T J =150 OC)BAL99/BAV99/BAW56 (at V R = 70V, T J =150 OC)BAV70 CD Reverse Recovery Time(I F = I R = 10mA,V R = 5.0Vdc, I R(REC) = 1.0mAdc, R L = 100 OHM) Forward Voltage (at I F = 1.0mAdc) (at I F = 10mAdc) (at I F = 50mAdc) (at I F = 150mAdc) V 2.5 30 60 50 100 IR Diode Capacition(V R = 0V, f = 1.0MHz) BAL99/BAV99/BAV70 BAW56 UNIT MAX. µA 1.5 2.0 pF t rr 6.0 ns VF 715 855 1000 1250 mV Recovery Time Equivalent Test Circuit 820 OHM +10V 2K 100uH 0.1 uF IF tr tp t IF 0.1 uF t t rr 10% DUT 50 OHM OUTPUT PULSE GENERATOR 50 OHM INPUT SAMPLING OSCILLOSCOPE 90% VR IR(REC)=1 mA IR OUTPUT PULSE (IF=IR=10mA;measured at IR(REC)=1mA) Notes : 1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA. Notes: Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp >> trr. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision DS-221906 2008/02/10 2010/11/29 C Page. 8 Rating and characteristic curves for each diode (BAL99/BAV99/BAW56/BAV70) FIG.2 - TYPICAL REVERSE FIG.1-TYPICAL FORWARD CHARACTERISTICS T J=150°C T J=85°C T J=25°C REVERSE CURRENT, (uA) INSTANTANEOUS FORWARD CURRENT,(mA) CHARACTERISTICS T J=125°C T J=85°C T J=55°C T J=-40°C T J=25°C FORWARD VOLTAGE,(V) REVERSE VOLTAGE,(V) FIG.3b - TYPICAL DIODE CAPACITANCE BAW56 DIODE CAPACITANCE,(pF) DIODE CAPACITANCE,(pF) FIG.3a - TYPICAL DIODE CAPACITANCE BAL99/BAV99/BAV70 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 REVERSE VOLTAGE,(V) Page 4 Document ID Issued Date Revised Date Revision DS-221906 2008/02/10 2010/11/29 C Page. 8 Formosa MS SMD Switching Diode BAL99/BAV99/BAW56/BAV70 Pinning information Type number Simplified outline Marking code (A) BAL99 (B) Symbol A L4, A6,JF (C) (A) BAV99 C (B) A (B) A (C) C B JC, A1 (C) (A) BAV70 B JG, A7 (A) BAW56 B C (B) A B JA, A4 C (C) Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision DS-221906 2008/02/10 2010/11/29 C Page. 8 Formosa MS SMD Switching Diode BAL99/BAV99/BAW56/BAV70 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision DS-221906 2008/02/10 2010/11/29 C Page. 8 SMD Switching Diode BAL99/BAV99/BAW56/BAV70 Formosa MS Reel packing PACKAGE SOT-23 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 3000 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 CARTON SIZE (m/m) 178 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o