FM120-M

Formosa MS Chip Schottky Barrier Rectifier LFM120-M THRU LFM140-M List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-12160L 2008/02/10 2010/03/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier LFM120-M THRU LFM140-M 1.0A Surface Mount Schottky Barrier Rectifiers - 20V-40V Package outline Features • Batch process design, excellent power dissipation offers SOD-123 better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. 0.154(3.9) 0.138(3.5) • Tiny plastic SMD package. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts meet environmental standards of 0.012(0.3) Typ. 0.075(1.9) 0.060(1.5) MIL-STD-19500 /2208 • Suffix "-H" indicates Halogen free parts, ex. LFM120-M-H. 0.067(1.7) 0.051(1.3) Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123 / MINI SMA • Terminals :Plated terminals, solderable per MIL-STD-750, 0.028(0.7) Typ. 0.028(0.7) Typ. Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.018 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) Symbol CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave (JEDEC methode) V R = V RRM T J = 25 OC Reverse current V R = V RRM T J = 100 OC Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature MIN. *1 V RRM (V) V RMS*2 (V) *3 VR (V) LFM120-M 20 14 20 LFM130-M 30 21 30 LFM140-M 40 28 40 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 *4 VF (V) Operating temperature T J, ( OC) 0.45 -55 to +125 MAX. UNIT IO 1.0 A I FSM 30 A 0.2 IR mA 10 CJ pF 160 O +175 -65 T STG SYMBOLS TYP. C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage Page 2 *4 Maximum forward voltage@I F =1.0A Document ID Issued Date Revised Date DS-12160L 2008/02/10 2010/03/10 Revision D Page. 7 Rating and characteristic curves (LFM120-M THRU LFM140-M) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD 50 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) PEAK FORWARD SURGE CURRENT,(A) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT INSTANTANEOUS FORWARD CURRENT,(A) AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 1.2 10 3.0 1.0 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 8.3ms Single Half TJ=25 C Sine Wave .01 JEDEC method .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) FIG.5 - TYPICAL REVERSE CHARACTERISTICS 100 NUMBER OF CYCLES AT 60Hz REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE,(pF) 700 600 500 400 300 200 10 1.0 TJ=75 C .1 TJ=25 C 100 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 .01 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Page 3 Document ID Issued Date Revised Date DS-12160L 2008/02/10 2010/03/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier LFM120-M THRU LFM140-M Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code LFM120-M LFM130-M LFM140-M 12L 13L 14L Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123 0.075 (1.90) 0.055 (1.40) 0.075 (1.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-12160L 2008/02/10 2010/03/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier LFM120-M THRU LFM140-M Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.90 3.90 1.68 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-12160L 2008/02/10 2010/03/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier LFM120-M THRU LFM140-M Reel packing PACKAGE SOD-123 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) 2,500 4.0 BOX (pcs) 25,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*183*123 178 382*262*387 9.5 200,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o