Formosa MS
Chip General Purpose Rectifiers
FM4001-M THRU FM4007-M
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121103
2008/02/10
2011/05/03
E
7
Formosa MS
Chip General Purpose Rectifiers
FM4001-M THRU FM4007-M
1.0A Surface Mount General Purpose
Rectifiers - 50V-1000V
Package outline
Features
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
SOD-123
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Tiny plastic SMD package.
High current capability.
High surge capability.
Glass passivated chip junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free parts, ex. FM4001-M-H.
0.154(3.9)
0.138(3.5)
0.012(0.3) Typ.
0.075(1.9)
0.060(1.5)
Mechanical data
•
•
•
0.067(1.7)
0.051(1.3)
Epoxy : UL94-V0 rated flame retardant
Case : Molded plastic, SOD-123 / MINI SMA
0.028(0.7) Typ.
0.028(0.7) Typ.
Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
•
•
•
Polarity : Indicated by cathode band
Dimensions in inches and (millimeters)
Mounting Position : Any
Weight : Approximated 0.018 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
Symbol
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
V R = V RRM T J = 25 OC
Reverse current
V R = V RRM T J = 125 OC
Thermal resistance
Diode junction capacitance
*1
V RRM
(V)
A
I FSM
30
A
60
30
CJ
15
50
35
50
FM4002-M
100
70
100
FM4003-M
200
140
200
FM4004-M
400
280
400
FM4005-M
600
420
600
FM4006-M
800
560
800
FM4007-M
1000
700
1000
*4
VF
(V)
μA
50
R θJC
FM4001-M
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
5.0
IR
R θJA
*3
VR
(V)
UNIT
1.0
Junction to case
f=1MHz and applied 4V DC reverse voltage
MAX.
IO
T STG
V RMS*2
(V)
TYP.
Junction to ambient
Storage temperature
SYMBOLS
MIN.
O
pF
O
+175
-65
C/W
C
Operating
temperature
T J, ( OC)
*1 Repetitive peak reverse voltage
*2 RMS voltage
1.10
-55 to +150
*3 Continuous reverse voltage
*4 Maximum forward voltage@I F=1.0A
Page 2
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121103
2008/02/10
2011/05/03
E
7
Rating and characteristic curves (FM4001-M THRU FM4007-M)
FIG.1-TYPICAL FORWARD
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
10
3.0
1.0
1.2
1.0
0.8
0.6
P.C.B. Mounted on
0.2" x 0.2" (5 mm x 5 mm)
Copper Pad Areas
0.4
0.2
0
0
20
40
TJ=25 C
60
80
100
120
140
160
180
200
LEAD TEMPERATURE ( C)
Pulse Width 300us
1% Duty Cycle
0.1
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
.01
.6
.7
.8
.9
1.0
1.1
1.2
1.3
FORWARD VOLTAGE,(V)
FIG.3 - TYPICAL REVERSE
CHARACTERISTICS
PEAK FORWAARD SURGE CURRENT,(A)
INSTANTANEOUS FORWARD CURRENT,(A)
50
50
40
30
8.3ms Single Half
TJ=25 C
Sine Wave
20
JEDEC method
10
0
1
100
5
50
10
100
FIG.5-TYPICAL JUNCTION CAPACITANCE
10
35
TJ=125 C
JUNCTION CAPACITANCE,(pF)
REVERSE LEAKAGE CURRENT, (m
A)
NUMBER OF CYCLES AT 60Hz
1.0
.1
TJ=25 C
30
25
20
15
10
5
.01
0
0
20
40
60
80
.01
.05
.1
.5
1
5
10
50
100
100 120 140
REVERSE VOLTAGE,(V)
PERCENTAGE RATED PEAK REVERSE VOLTAGE,(%)
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TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121103
2008/02/10
2011/05/03
E
7
Formosa MS
Chip General Purpose Rectifiers
FM4001-M THRU FM4007-M
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
FM4001-M
FM4002-M
FM4003-M
FM4004-M
FM4005-M
FM4006-M
FM4007-M
A1
A2
A3
A4
A5
A6
A7
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-123
0.075 (1.90)
0.055 (1.40)
0.075 (1.90)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121103
2008/02/10
2011/05/03
E
7
Formosa MS
Chip General Purpose Rectifiers
FM4001-M THRU FM4007-M
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
1.90
3.90
1.68
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-121103
2008/02/10
2011/05/03
E
7
Formosa MS
Chip General Purpose Rectifiers
FM4001-M THRU FM4007-M
Reel packing
PACKAGE
SOD-123
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
2,500
4.0
BOX
(pcs)
25,000
INNER
BOX
REEL
DIA,
CARTON
SIZE
CARTON
APPROX.
GROSS WEIGHT
(m/m)
(m/m)
(m/m)
(pcs)
(kg)
183*183*123
178
382*262*387
9.5
200,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
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