FM5100-AL

Formosa MS Chip Schottky Barrier Rectifier FM540-AL＆FM560-AL＆FM5100-AL List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:86-571-86690061 FAX:86-571-86696991 Document ID Page 1 DS-12161U-H1 Issued Date 2015/10/14 Revised Date Revision Page. A 7 Formosa MS Chip Schottky Barrier Rectifier FM540-AL＆FM560-AL＆FM5100-AL 5.0A Surface Mount Schottky Barrier Rectifiers Package outline Features • Batch process design, excellent power dissipation offers • • • • • • • • • SMA-L better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, low forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free parts, ex. FΜ540-ΑL-H. 0.209(5.3) 0.185(4.7) 0.012(0.3) Typ. 0.114(2.9) 0.091(2.3) Mechanical data 0.080(2.0) 0.063(1.6) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AC / SMA-L • Terminals : Solder plated, solderable per 0.032(0.8) Typ. MIL-STD-750, Method 2026 0.032 (0.8) Typ. Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) Symbol CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) MIN. TYP. 5.0 A I FSM 150 A 0.5 IR V R = V RRM T J = 100 OC Thermal resistance Junction to case Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature SYMBOLS FM540-AL FM560-AL *1 V RRM (V) 40 60 UNIT IO V R = V RRM T J = 25 OC Reverse current MAX. R θJC 28 CJ 380 -65 T STG V RMS*2 (V) C/W pF O C *1 Repetitive peak reverse voltage *4 VF (V) Operating temperature T J, ( OC) *2 RMS voltage 40 0.55 -55 to +125 *3 Continuous reverse voltage 60 0.70 42 O +175 *3 VR (V) 28 mA 20 *4 Maximum forward voltage@I F=5.0A -55 to +150 FM5100-AL 100 70 100 http://www.formosams.com/ TEL:86-571-86690061 FAX:86-571-86696991 0.85 Document ID Page 2 DS-12161U-H1 Issued Date 2015/10/14 Revised Date Revision Page. A 7 Rating and characteristic curves (FM540-AL＆FM560-AL＆FM5100-AL ) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 6.0 AL 0- 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 3.0 FM 51 10 1.0 FM 54 0AL 5 FM 2.0 10 FM 56 L& -A AL 0- INSTANTANEOUS FORWARD CURRENT,(A) 60 54 FM 3.0 5 FM 4.0 0AL 00 -A L 50 5.0 1.0 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 .01 200 .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) 150 8.3ms Single Half TJ=25 C Sine Wave 100 JEDEC method 50 FIG.5 - TYPICAL REVERSE CHARACTERISTICS 0 1 5 50 10 100 100 40V 60V&100V NUMBER OF CYCLES AT 60Hz 10 REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE 1400 JUNCTION CAPACITANCE,(pF) PEAK FORWARD SURGE CURRENT,(A) 250 1200 1000 800 600 400 TJ=100°C 1.0 0.1 TJ=25°C 0.01 200 0 .01 .05 .1 .5 1 5 10 50 100 0.001 0 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:86-571-86690061 FAX:86-571-86696991 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Document ID Page 3 DS-12161U-H1 Issued Date 2015/10/14 Revised Date Revision Page. A 7 Formosa MS Chip Schottky Barrier Rectifier FM540-AL＆FM560-AL＆FM5100-AL Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM540-AL FM560-AL FM5100-AL SS54 SS56 S510 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA-L 0.110 (2.80) 0.059 (1.50) 0.110 (2.80) http://www.formosams.com/ TEL:86-571-86690061 FAX:86-571-86696991 Document ID Page 4 DS-12161U-H1 Issued Date 2015/10/14 Revised Date Revision Page. A 7 Formosa MS Chip Schottky Barrier Rectifier FM540-AL＆FM560-AL＆FM5100-AL Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA-L Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.90 5.50 2.10 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:86-571-86690061 FAX:86-571-86696991 Document ID Page 5 DS-12161U-H1 Issued Date 2015/10/14 Revised Date Revision Page. A 7 Formosa MS Chip Schottky Barrier Rectifier FM540-AL＆FM560-AL＆FM5100-AL Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 7" 2,000 4.0 20,000 7" 2,000 4.0 10,000 REEL DIA, (m/m) CARTON SIZE (m/m) 183*155*183 178 382*356*392 160,000 15.5 180*180*80 178 440*410*220 100,000 13.0 INNER BOX (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) SMA-L Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zon e TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o