FM5100-T3

Chip Schottky Barrier Rectifier Formosa MS FM520-T3 THRU FM5200-T3 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-121668 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM520-T3 THRU FM5200-T3 5.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V Package outline Features SMC-T3 • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. 0.264(6.7) 0.248(6.3) • Low profile surface mounted application in order to • • • • • • • • 0.020(0.5) Typ. optimize board space. Low power loss, high efficiency. High current capability, l ow forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. FM520-Τ3-H. 0.185(4.7) 0.170(4.3) 0.067(1.7) 0.059(1.5) 0.047(1.2) Typ. 0.047(1.2) Typ. Mechanical data 0.120(3.05) 0.104(2.65) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AB / SMC-T3 • Terminals : Solder plated, solderable per 0.041(1.05) 0.026(0.65) 0.142(3.60) 0.126(3.20) MIL-STD-750, Method 2026 0.063(1.6) Typ. • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.1443gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave (JEDEC methode) Symbol MIN. TYP. 5.0 A I FSM 150 A Storage temperature T STG SYMBOLS *1 V RRM (V) V RMS*2 (V) *3 VR (V) FM520-T3 20 14 20 FM530-T3 30 21 30 FM540-T3 40 28 40 FM550-T3 50 35 50 FM560-T3 60 42 60 *4 VF (V) Operating temperature T J, ( OC) 0.55 -55 to +125 O 35 20 -65 O +175 C/W C/W O C *1 Repetitive peak reverse voltage *2 RMS voltage 0.70 FM580-T3 80 56 80 FM5100-T3 100 70 100 FM5150-T3 150 105 150 0.90 FM5200-T3 200 140 200 0.92 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 mA 20 R θJA R θJC Junction to ambient Junction to case Typical Thermal resistance 0.5 IR O V R = V RRM T J = 100 C UNIT IO O V R = V RRM T J = 25 C Reverse current MAX. 0.85 *3 Continuous reverse voltage -55 to +150 *4 Maximum forward voltage@I F=5.0A Document ID Page 2 DS-121668 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Rating and characteristic curves (FM520-T3 THRU FM5200-T3) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 6.0 50 3 540-T 2.0 - T3 200 FM5 3.0 3~ 50-T FM5 3~FM 20-T FM5 4.0 1.0 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT INSTANTANEOUS FORWARD CURRENT,(A) 5.0 20V ~ 40V 10 50V ~ 60V 80V ~ 100V 3.0 150V~200V 1.0 0.1 TJ=25 C Pulse Width 300us 1% Duty Cycle .01 200 .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) 150 TJ=25 C 8.3ms Single Half Sine Wave 100 JEDEC method 50 FIG.4 - TYPICAL REVERSE CHARACTERISTICS 0 1 5 10 50 100 100 20V~40V 50V~200V NUMBER OF CYCLES AT 60Hz 10 REVERSE LEAKAGE CURRENT, (mA) PEAK FORWARD SURGE CURRENT,(A) 250 TJ=100°C 1.0 0.1 TJ=25°C 0.01 0.001 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-121668 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM520-T3 THRU FM5200-T3 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM520-T3 FM530-T3 FM540-T3 FM550-T3 FM560-T3 FM580-T3 FM5100-T3 FM5150-T3 FM5200-T3 SS52 SS53 SS54 SS55 SS56 SS58 S510 S515 S520 Suggested solder pad layout SMC-T3 0.016(0.4) 0.112(2.85) 0.063(1.60) 0.142(3.60) 0.197(5.00) 0.063(1.60) 0.025(0.65) 0.175(4.45) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-121668 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM520-T3 THRU FM5200-T3 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMC-T3 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 4.85 6.95 1.85 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-121668 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM520-T3 THRU FM5200-T3 Reel packing PACKAGE SMC-T3 REEL SIZE 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 8.0 6,000 337*337*37 330 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 350*330*360 17.2 48,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o