SL14-M

Formosa MS Chip Low VF Schottky Barrier Rectifier SL12-M THRU SL14-M List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-121653 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Formosa MS Chip Low VF Schottky Barrier Rectifier SL12-M THRU SL14-M 1.0A Low VF Surface Mount Schottky Barrier Rectifiers - 20V-40V Package outline Features • Batch process design, excellent power dissipation offers • • • • • • • • • • SOD-123 better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Tiny plastic SMD package. Low power loss, high efficiency. High current capability, low forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. SL12-Μ-H 0.154(3.9) 0.138(3.5) 0.075(1.9) 0.060(1.5) 0.067(1.7) 0.051(1.3) Mechanical data • • • Epoxy : UL94-V0 rated flame retardant 0.028(0.7) Typ. 0.028(0.7) Typ. Case : Molded plastic, SOD-123 / MINI SMA Terminals :Plated terminals, solderable per MIL-STD-750, Dimensions in inches and (millimeters) Method 2026 • • • 0.012(0.3) Typ. Polarity : Indicated by cathode band Mounting Position : Any Weight : Approximated 0.018 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS MIN. Symbol TYP. MAX. UNIT IO 1.0 A 8.3ms single half sine-wave (JEDEC methode) I FSM 30 A Reverse current V R = V RRM T J = 25 OC IR 1.0 mA Diode junction capacitance f=1MHz and applied 4V DC reverse voltage CJ Forward rectified current See Fig.2 Forward surge current Storage temperature V RMS*2 (V) *3 VR (V) *4 VF (V) SL12-M 20 14 20 0.38 SL13-M 30 21 30 0.40 SL14-M 40 28 40 0.40 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Operating temperature T J, ( OC) -55 to +100 +175 -65 T STG *1 V RRM (V) SYMBOLS pF 130 O C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I F=1.0A Page 2 Document ID Issued Date DS-121653 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Rating and characteristic curves (SL12-M THRU SL14-M) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS /S -M 13 3.0 L1 SL 12 -M 4M 10 SL 1.0 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 LEAD TEMPERATURE (°C) Pulse Width 300us 1% Duty Cycle 0.1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .1 .3 .5 .7 .9 1.1 1.3 PEAK FORWARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) 50 1.5 FORWARD VOLTAGE,(V) FIG.3 - TYPICAL REVERSE 8.3ms Single Half TJ=25 C Sine Wave JEDEC method CHARACTERISTICS 1000 FIG.5-TYPICAL JUNCTION CAPACITANCE 100 350 JUNCTION CAPACITANCE,(pF) REVERSE LEAKAGE CURRENT, (mA) NUMBER OF CYCLES AT 60Hz 10 TJ=75 C TJ=25 C 1 300 250 200 150 100 50 0 .1 0 20 40 60 80 .01 .1 .5 1 5 10 50 100 Revision Page. REVERSE VOLTAGE,(V) PERCENTAGE RATED PEAK REVERSE VOLTAGE http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 .05 100 120 140 Page 3 Document ID Issued Date DS-121653 2008/02/10 Revised Date 2010/03/10 D 7 Formosa MS Chip Low VF Schottky Barrier Rectifier SL12-M THRU SL14-M Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code SL12-M SL13-M SL14-M L2 L3 L4 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123 0.075 (1.90) 0.055 (1.40) 0.075 (1.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-121653 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Formosa MS Chip Low VF Schottky Barrier Rectifier SL12-M THRU SL14-M Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.90 3.90 1.68 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-121653 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Formosa MS Chip Low VF Schottky Barrier Rectifier SL12-M THRU SL14-M Reel packing PACKAGE REEL SIZE 7" SOD-123 REEL (pcs) COMPONENT SPACING (m/m) 4.0 2,500 BOX (pcs) 25,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*183*123 178 382*262*387 9.5 200,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o