FK13LEIHM0.032768-T3

FK13L 3.2mm x 1.5mm SMD Tuning Fork, Low ESR (Former FX135L) STANDARD SPECIFICATIONS PARAMETERS Frequency Range Frequency Tolerance @ 25°C Frequency Stability, ref 25°C (Temperature Coefficient) Temperature Range Turnover (TO) Operating (TOPR) Storage (TSTG) Equivalent Series Resistance (RS) Load Capacitance (CL) Insulation Resistance @ 100VDC Drive Level Aging per year @ 25°C Maximum Soldering Temp / Time Moisture Sensitivity Level (MSL) per J-STD-033 Termination Finish Seal Method Lead (Pb) Free RoHS Compliant MAX (Unless otherwise noted) 32.768 kHz (See options below) DIMENSIONS / MECHANICAL SPECIFICATIONS -0.04 PPM / (∆°C)2 +20°C ~ +30°C -40ºC ~ +85°C -55°C ~ +125°C 50 kΩ (See options below) 500 MΩ Min 1.0 µW 0.1µW typ ±3 PPM 260°C / 10 Seconds x2 1 Au over Ni Seam Yes Yes Temperature Coefficient Note: Dimensional drawing is for reference to critical specifications defined by size measurements. Certain non-critical visual attributes, such as side castellation’s, etc. may vary. Revised A: 10/17/2019 Page 1 of 3 www.foxonline.com FK13L 3.2mm x 1.5mm SMD Tuning Fork, Low ESR (Former FX135L) TAPE SPECIFICATIONS (mm) A Ø1.5 B 4.0 C 4.0 D 5.5 E 12.0 F 1.0 REEL SPECIFICATIONS (mm) REEL QTY G 2.0 -T3 = 3,000 H Ø13 I Ø21 J Ø60 K Ø180 L 13.0 M 1.2 Available Options & Part Identification for SMD Tuning Fork Crystal K13L Sample PN: FK13LEIHM0.032768-T3 F K13L Fox Model Number E I Tolerance Stability E = ±20 PPM I = -0.04 PPM/ H = ±10 PPM (∆°C)2 H M 0.032768 -T3 Load Capacitance B = 6pF H = 12.5PF Operating Temperature M = -40 ~ +85 °C Frequency (MHz) Values Added Options Blank = Bulk T3 = 3,000 pcs Reliability Test Conditions Please contact Abracon Quality Assurance department Revised A: 10/17/2019 Page 2 of 3 www.foxonline.com FK13L 3.2mm x 1.5mm SMD Tuning Fork, Low ESR (Former FX135L) Crystal Unit Handling Precautions 1) Mounting Precautions • If the board is deformed, such as bending after mounting, peeling of the soldered joint between the crystal resonator and board may occur producing a crack in the ceramic package, leading to loss of vacuum, destruction of the internal element, etc. Especially when repaneling the board on which it is mounted, there is a possibility that a large stress may be applied, please consider board layout and cutting method to minimize stress on products. • When the product is automatically mounted on the board, if a large impact is applied to the crystal resonator, there is a possibility that characteristics may change / deteriorate, or the product may be broken. When mounting automatically, please set conditions considering the shock to the crystal unit. Also, please conduct the mounting test beforehand and confirm that there is no influence on the characteristics to the crystal resonator. • Cracks may occur in the soldered part by repeated harsh temperature changes for a long time when mounting due to the board having a expansion coefficient different from that of the ceramics used in the crystal package. When using under such circumstances, please conduct test beforehand and confirm that there is no influence on the crystal unit. • Ceramic packages are small and thin products. So, if/when you rework after mounting, please give consideration to the selection and handling of the tools to be used. 2) Soldering Following is typical SMD Pb-free reflow profile for soldering: Excessive heating time at high temperature may result in deterioration of the characteristics and may break the crystal unit. For manual rework, heat the lead part at 300℃ or lower for 5 seconds or less. 3) Cleaning Since a small, thin crystal chip is used for tuning fork crystal units and the frequency approximates that of an ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning. Revised A: 10/17/2019 Page 3 of 3 www.foxonline.com