FKT38EIHQ0.032768-BAG1K

FKT38 Tuning Fork Crystal (Former NC38LF) STANDARD SPECIFICATIONS PARAMETERS Frequency Range Frequency Tolerance @ 25°C Frequency Stability, ref 25°C (Temperature Coefficient) Temperature Range Turnover (TO) Operating (TOPR) Storage (TSTG) Equivalent Series Resistance (RS) KT38 Load Capacitance (CL) Insulation Resistance @ 100VDC Drive Level Aging per year (@ 25°C) Wave Soldering Temp / Time Moisture Sensitivity Level (MSL) per J-STD-033 Termination Finish Lead (Pb) Free RoHS Compliant REACH Compliance MAX (Unless otherwise noted) 32.768 kHz ±20 PPM DIMENSIONS / MECHANICAL SPECIFICATIONS Dimensions (mm) -0.04 PPM / (∆°C)2 +20°C ~ +30°C (See options below) -40°C ~ +85°C 35 kΩ (See options below) 500MΩ Min 1.0µW ±3 PPM 300°C / 5 Sec (leads only) 1 SnCu Yes Yes, no exemptions Yes Temperature Coefficient Note: Dimensional drawing is for reference to critical specifications defined by size measurements. Certain non-critical visual attributes, such as side castellations, etc. may vary. 0 -20 -40 -60 -80 -100 ppm -120 -140 -160 -180 °C Revised A: 07/29/2020 Page 1 of 4 www.foxonline.com FKT38 Tuning Fork Crystal (Former NC38LF) Available Options & Part Identification for FKT38 Sample PN: FKT38EIHM0.032768 F KT38 Fox Model Number KT38 E I Tolerance Stability E = ±20ppm I = -0.04 PPM/ (∆°C)2 H M 0.032768 Load Capacitance B = 6pF H = 12.5pF Operating Temperature C = 0 ~ +70°C D = -10 ~ +60°C Q = -20 ~ +60°C M = -40 ~ +85°C Frequency (MHz) Values Added Options Blank = Bulk Reliability Test Conditions Please contact Abracon Quality Assurance department Revised A: 07/29/2020 Page 2 of 4 www.foxonline.com FKT38 Tuning Fork Crystal (Former NC38LF) Crystal Unit Handling Precautions 1) Mounting Precautions • Structure-Cylinder crystals are hermetically sealed using glass to metal seals (see figs 1 and 2) • Unbending the lead (1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force may crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of the characteristics and may also break the crystal chip (see Figure 3). (2) Unbend the lead by pressing on the bent part from both the upper and lower sides while holding the bottom of lead tightly (see Figure 4). • Bending the lead (1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6). (2) Always leave a length greater than 2.0mm when bending a lead after soldering (see Figure 7) Soldering directly to the case will reduce the degree of vacuum and may result in deterioration of the characteristics and may break the crystal chip. Make the length from the case to the printed circuit board (L) longer than the case diameter (D) so that the lead wire will not be pulled in case the crystal unit falls over. Revised A: 07/29/2020 Page 3 of 4 www.foxonline.com FKT38 (Former NC38LF) Tuning Fork Crystal 2) Soldering The soldering position must be at the lead wire more than 1.0mm away from the glass seal. Excessive heating time at high temperature may result in deterioration of the characteristics and may break the crystal unit. If crystal unit is unavoidably heated, heat the lead part at 300℃ or lower for 5 seconds or less and please make sure to keep the case below 150℃. 3) Cleaning Since a small, thin crystal chip is used for tuning fork crystal units and the frequency approximates that of an ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning. Revised A: 07/29/2020 Page 4 of 4 www.foxonline.com