33288

Freescale Semiconductor Advance Information Document Number: MC33288 Rev 6.0, 5/2006 Solid State Relay for Automotive Flasher Applications This device is a Dual High-Side Power Switch dedicated for automotive flasher applications. In comparison with mechanical solutions, this device offers higher reliability as well as protection and diagnostic features. The device consists of two 25 mΩ Rdson fully protected high side switches, in a surface mount power package. It interfaces directly with a microcontroller and includes a current recopy function in order to allow the detection of a failed lamp in the application. Features • Junction Temperature Range from -40°C to 150°C • Operating Voltage Range from 8.0 V to 35 V • Maximum Breakdown Voltage greater than 40 V • 25 mΩ RDS(ON) per Channel at 25°C • 8.0 Amps Nominal Current per Channel • 1.2 W Warning Lamp Driver • Overtemperature Protection with Hysteresis • Open Load Detection in ON State • Current Recopy to Monitor Lamp Output Current 33288 SOLID STATE RELAY DH SUFFIX 98ASH70273A 20-LEAD HSOP ORDERING INFORMATION Device MC33288DDH/R2 Temperature Range (TA) -40°C to 125°C Package 20 HSOP • Standby Current < 10 µA at VBAT < 14 V Simplified Application Diagram 5.0 V VPWR 33288 VBAT ST OUT-1 IN-1 WLP IN-2 Cur R OUT-2 GND 21 W 21 W 5W 21 W 5W MCU 1.2 W 21 W 21 W 5W 21 W 5W Figure 1. 33288 Simplified Internal Block Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2006. All rights reserved. TERMINAL CONNECTIONS TERMINAL CONNECTIONS VBAT 21 GND CUR R IN1 NC DNC OUT1 OUT1 OUT1 NC NC 1 2 3 4 5 6 7 8 9 10 21 20 19 18 17 16 15 14 13 12 11 WLP STATUS IN2 NC DNC OUT2 OUT2 OUT2 NC NC VBAT Figure 2. 33288 Terminal Connections Table 1. 33288 Terminal Definitions A functional description of each terminal can be found in the Functional Description section beginning on 7. Terminal Number TAB 2 Terminal Name VBAT CUR R Formal Name Supply Voltage Load Current Sense Definition The backside TAB is connected to the power supply of the MC33288DH. The Current Sense terminal delivers a ratioed amount (1/1000) of the sum of the currents that can be used to generate signal ground referenced output voltages for use by the microcontroller. These are the device input terminals which directly control their associated outputs. 3 18 4, 9, 10, 11, 12, 17 5, 16 6, 7, 8 13, 14, 15 11 19 20 IN1 IN2 NC DNC OUT1 OUT2 GND STATUS WLP INPUT Channel 1 INPUT Channel 2 No Connect Do Not Connect OUTPUT Channel 1 OUTPUT Channel 2 Ground Status for Both Channels These terminals are not used. These terminals must not be connected. They deliver current to the connected loads and are controlled via the IN1 terminals. They deliver current to the connected loads and are controlled via the IN2 terminals, This is the ground terminal of the device. The Fault output is an open drain indication that goes active low when a fault mode (Openload, Overtemperature) is detected by the device. Warning Lamp Output It delivers current through the connected load. 33288 2 Analog Integrated Circuit Device Data Freescale Semiconductor MAXIMUM RATINGS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfuncion or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS VBAT Voltage with Respect to GND : Continuous/Pulse OUT1 and OUT2 Voltage with Respect to GND : Continuous/Pulse OUT1 to VBAT and OUT2 to VBAT Voltage : Continuous/Pulse IN1, IN2, St DC Voltage : Continuous/Pulse CUR R Voltage : Continuous/Pulse ESD All Pins Human Body Model (1) Machine Model (2) OUT1, OUT2 Output Current : Pulse (3) IN1, IN2, STATUS VESD1 VESD2 IOUTP IIN ±2000 ±200 40 ±5.0 A mA VBAT VOUT VOUT VIN VCR -14 to 40 -0.3 to 40 40 -0.3 to 7.0 -0.3 to 7.0 V V V V V V THERMAL RATINGS Junction Temperature Storage Temperature Range Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient Power Dissipation at Tcase 140°C (5) (4) TJ TSTORAGE RθJC RθJA PD -40 to 150 -65 to 150 2.0 25 5.0 °C °C °C/W °C/W W Notes 1. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 2. 3. 4. 5. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). During lamp inrush current. Device mounted on dual side printed circuit board with 70 µm copper thickness and 10 cm2 copper heat sink (2.5 cm2 on top side and 7.5 cm2 on down side). Assuming a 150°C maximum junction temperature. 33288 Analog Integrated Circuit Device Data Freescale Semiconductor 3 STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Charactersitics Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER INPUT Nominal Operating Voltage Functional Operating Voltage Under Voltage Threshold VBAT Standby Supply Current VBAT < 14 V and VIN = 0 V, TJ < 125°C Supply Current in ON State IN1 and IN2 @ 3.5 V, no fault, VBAT < 14 V, TJ < 125°C Drain to Source on Resistance IOUT = 4.0 A, VBAT > 9.0 V and TJ = 25°C Drain to Source on Resistance IOUT = 4.0 A, VBAT > 9.0 V and TJ = 150°C High Current Limitation VOUT > 1.0 V Short Circuit limitation VOUT < 1.0 V, TJ = 25°C Hot Openload Threshold VBAT to Output Breakdown Voltage IN1 and IN2 @ 0 V, VOUT = 0 V, IOUT -0.25 mA VBAT to OUT1 : Leakage Current VIN1 = 0 V, VBAT = 35 V, VOUT1 = 0 V VBAT to OUT2 : Leakage Current VIN2 = 0 V, VBAT = 35 V, VOUT2 = 0 V VIN1, VIN2 : Input Voltage Low Threshold VIN1, VIN2 : Input Voltage High Threshold VIN1, VIN2 : Input Voltage Hysteresis VIN1, VIN2 : Input Current VIN1, VIN2 = 3.5 V Status Output Voltage Ist = 1 mA; Output in Fault Thermal Shutdown Thermal Shutdown Hysteresis TSHUT THYST Vst – 150 – – – 10 0.5 – – °C °C VIL VIH VIH IIN – 18 40 V IOUT-LEAK – – 3.5 0.4 – – – 0.7 10 1.5 – 0.9 V V V µA IOUT-LEAK – – 10 µA IOL VDSS 40 – – µA ILIM – – 4 1 – – A A ILIM – 30 – A RDSON – 30 40 A RDSON – 20 25 mΩ ION – 8 20 mΩ VBAT VBAT Vµ V ISTDBY – 1 10 mA 9 8 6 – – 7 16 35 8 V V V µA 33288 4 Analog Integrated Circuit Device Data Freescale Semiconductor STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Charactersitics(continued) Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Current Recopy Ratio VOUT > VBAT -1.0 V, IOUT from 2.0 A to 4.0 A TJ -40°C to 105°C, VBAT 9.0 V to 16 V Current Recopy Ratio Accuracy VOUT > VBAT -1.0 V, IOUT from 2.0 A to 4.0 A TJ -40°C to 105°C, VBAT 9.0 V to 16 V Extended Current Recopy Ratio VOUT > VBAT -1.0 V, IOUT from 1.0 A to 8.0 A Extended Current Recopy Ratio Accuracy VOUT > VBAT -1.0 V, IOUT from 1.0 A to 8.0 A Current Recopy Clamp Voltage At 10mA Nominal Flasher Frequency Operation Frequency Operation Nominal Flasher Duty Cycle Operation WLP Output Drain to Source on Resistance IOUT = 100 mA, VBAT > 9.0 V and TJ = 25°C WLP Output Drain to Source on Resistance IOUT = 100 mA, VBAT > 9.0 V and TJ = 125°C WLP Output Current Limitation VOUT = 0 V WLP Thermal Shutdown TWSHUT IWLIM – 150 500 – – – °C RWON – – 5.0 mA VCLST FFL FOP DCFL RWON – – 3.2 Ω CREX-AC -20 5.5 – – – – – 1.5 – 50 20 7.0 – 100 – V Hz Hz % Ω CREX – 1/1000 – % % CR-AC -10 – 10 % Symbol CR – 1/1000 – Min Typ Max Unit µA 33288 Analog Integrated Circuit Device Data Freescale Semiconductor 5 DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit MICROCONTROLLER INTERFACE Maximum Output Positive Slew Rate Load = 6.0 Ω Maximum Output Negative Slew Rate Load = 6.0 Ω Turn ON Delay Time Load = 6.0 Ω, from VIN/2 to 10% VOUT Turn OFF Delay Time Load = 6.0 Ω, from VIN/2 to 90% VOUT TDOFF 1.0 40 200 TDON 1.0 30 200 µs tF 0.01 0.3 2.0 µs tR 0.01 0.3 2.0 V/µs V/µs 33288 6 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The MC33288DH is a dual high side switch with appropriate control, protection, and diagnostic features dedicated to automotive flasher applications. The device consists of two independent 25mW power switches and an additionnal 3.2 Ω high-side switch capable of controlling a 1.2 W warning lamp. It interfaces directly with a microcontroller and the package used is a 20-HSOP power small outline, 20 terminals. The MC33288 incorporates a status terminal and a load current sense capability. FUNCTIONAL TERMINAL DESCRIPTIONS SUPPLY VOLTAGE (VBAT) The backside TAB is connected to the power supply of the MC33288DH. In addition to its supply function, this terminal contributes to the thermal behaviour of the device by conducting the heat from the switching MOSFET to the printed circuit board. OUTPUT CHANNEL (OUT1, OUT2) Pins 6, 7, and 8 are the source of the output 1 25 mΩ MOSFET1. Pins 13, 14, and 15 are the source of the output 2 25 mΩ MOSFET2. They deliver current to the connected loads and are controlled via the IN1 and IN2 terminals, respectively . These outputs are current limited and thermally protected. LOAD CURRENT SENSE (CUR R) The Current Sense terminal delivers a ratioed amount (1/ 1000) of the sum of the currents that can be used to generate signal ground referenced output voltages for use by the microcontroller. GROUND (GND) This is the ground terminal of the device. STATUS FOR BOTH CHANNELS (STATUS) The Fault output is an open drain indication that goes active low when a fault mode (Openload, Overtemperature) is detected by the device on either one channel or both channels simultaneously. Its internal structure is an open drain architecture with an internal clamp at 6.0 V. An external pull-up resistor connected to VDD (5.0 V) is needed. INPUT CHANNEL 1/2 (IN1, IN2) These are the device input terminals which directly control their associated outputs. The levels are CMOS compatible. When the input is a logic low, the associated output MOSFET is in the OFF state. When input is high, the MOSFET is turned ON and the load is activated. When both inputs are low, the device is in standby mode and its supply current is reduced. Each input terminal has an internal active pull-down, so that it will not float if disconnected. WARNING LAMP OUTPUT (WLP) This terminal is the source of a 3.2 Ω MOSFET. This output is current limited and thermally protected. It delivers current through the connected load when both IN1 and IN2 inputs are logic high. It is usually used as a warning lamp driver for Flasher application. 33288 Analog Integrated Circuit Device Data Freescale Semiconductor 7 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Power Supply The MC33288 can be directly connected to the supply line. In standby mode (IN1 and IN2 @ OV), the supply current is less than 10 mA for VBAT supply voltage below 14 V. This feature allows a very low supply current on the battery when the car is idle or parked. During the OFF state, the current recopy terminal and the status terminals are in high impedance. In case of loss of (digital) ground, the power MOSFETs turn off in order to safely tie the load current to zero. is up to 48 A per channel. The 48 A value will only occur at the first lamp turn-on. In order to optimise the total system (MC33288, printed circuit board, wiring, fuse etc.), the device incorporates a current limitation at 30 A typical. This means that the first in rush current will be clamped at 30 A. The second lamp turn-on of the flashing cycle will not see any clamping as the lamps have been heated up in the previous cycle. IN1 and IN2 are the two inputs of the device, connected to a microcontroller I/O; they are CMOS compatible. When these inputs are in low state, the device is in standby mode. When any of the inputs are switched to a high level, the associated output MOSFET is turned on. Nominal Voltage and Transient Operation The nominal operation voltage is from 9.0 V to 16 V. The MC33288 is functional over a larger voltage range from 8.0 V to 35 V. The technology used for both power and analog circuitry sustains 40 V DC voltage. Status The device has a single status terminal which reports an overtemperature and an openload condition in the device. This terminal is an open drain structure and needs an external pull-up resistor. The device incorporates overtemperature sense on each output MOSFET in order to independently protect each output. But, the report of the overtemperature is done through one single status terminal, called STATUS, in order to minimize the number of I/O connections of the MCU. Reverse Battery The MC33288 is self protected against reverse battery up to -14 V in a continuous mode. When a negative battery voltage arises, the MOSFETs are internally turned off. The load current flows in the body diode of each MOSFET. The power dissipation within the MC33288DH is then VF x ILOAD, where ILOAD is the total current set by the loads and VF is the forward body diode voltage. VF is 0.5 V typical at 150°C and decreases with temperature with a drop of -2.0 mV/°C. Open Load Function The open load detection is active during the ON phase (hot openload detection). An amplifier measures the differential voltage between VBAT and VOUT. When the load current is below 1.0 A, the openload circuitry will pull down the status output. If the openload condition is present before the device turn-on, the status will be pulled down after a delay due to the rise time of the output. Power Output Switches The device has two independent high-side switches. Each switch is realized with an N-channel power MOSFET and includes current and temperature sensing circuitries. The MOSFET gates are driven by analog circuitry which includes charge pump and fault detection. A specific feature of this device is the output current recopy. Each output has a 25 mΩ RDSON maximum at 25°C. The RDSON value reaches 40 mΩ at 150°C junction temperature. Each output has a parasitic drain to source diode, inherent to the technology. This diode can sustain as much current as the MOSFET. This diode is reversed biased during normal operation of the MOSFET and is forward biased during reverse battery or negative transient pulses. The output MOSFET can each drive 8.0 A nominal. This maximum current condition occurs when up to three 21 W lamps and two small 5.0 W or 7.0 W lamps are connected on each channel, at higher VBAT voltage specification. This is the case when a trailor is attached to the car. As the flasher can operate in warning or hazard operation mode with its two channels on, the MC33288 can drive 16 A total. When lamps are turned on, the inrush current can reach up to 6 times the nominal lamp current. For this particular application, the total inrush current can reach 6 x 8.0 A–that Current Recopy Function Flasher application needs to detect failed lamp. The system must detect one 21 W lamp failing, in the flasher application only, without a trailor. The MC33288 has an output current recopy function which recopies on the CUR R terminal a portion of the output current. Each channel is connected to the same CUR R terminal as the system has to operate in the flasher mode only and not in the warning operation. The MC33288 provides a current recopy of 1/1000 of the main output current, either output left or right. The recopy function has its higher accuracy of ±10% in the usual operation range and an accuracy of ±20% in the total operating range. This allows a precise detection of one 21 W lamp, but also the detection of additional lamps in case of trailor connection. 33288 8 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES This paragraph is boilerplate - you may add to it but, can not change wording. You may change numeric values An external resistor must be connected to the CUR R terminal and then tied to a microcontroller A/D input for analog voltage measurement. The CUR R terminal is internally clamped to protect the MCU A/D input. Down side pcb 8 cm2 Top side pcb 2 cm2 Warning Lamp Driver The warning lamp driver is a 3.2 Ω RDSON maximum high-side MOSFET to control the 1.2 W dashboard warning lamp. This output is current limited and thermally protected-activated only in the warning mode. It is turned on by activation of both right and left inputs (IN1 and IN2). HSOP20 Package The device is assembled into a power surface mount package. This package offers high thermal performances and high current capabilities. It offers 10 terminals on each package sides and an additional terminal which is the package heat sink , called terminal 21. The heak sink acts as the MC33288 power VBAT connection. Thermal via from top to down side pcb external pcb (4x4 cm) Soldering Information This device is packaged in a Surface Mount Power package indended to be soldered directly on the Printed Circuit Board. This device was qualified according to JEDEC standards JESD22-A113-B and J-STD-020A with the reflow conditions applicable for packages with thickness above 2.5 mm: Convection 220°C +5/-0°C VPR 215-219°C IR / Convection 220°C +5/-0°C The maximum peak temperature during the soldering process should not exceed 220°C (+5°C/-0°C). The time at maximum temperature should range from 10 to 40s maximum. Figure 3. Printed Board Layout Example (not to scale) Figure 1 shows an example of printed circuit board layout. It has a total of 10 cm2 additional copper on two sides (2.5 cm2 on the top side and 7.5 cm2 on the down side). With the above layout, thermal resistance junction to ambient of 25°C/W can be achieved, this value being split into: • junction to case : RθJC1 = RθJC2 = 2°C/W • case to ambient : RθCA = 23°C/W Lower value can be reached with the help of larger and thicker copper metal, higher number of thermal via from top to down side pcb and the use of additional thermal via from the circuit board to the module case. Steady State Thermal Model The junction to ambient thermal resistance of the circuit mounted on a printed circuit board can be split into two main parts: junction to case and case to ambient resistances. A simplified steady state model is shown in Figure 2. Chan 1 Junction Temp Node (Volts represent Die Surface Temperature) Thermal Management The junction to case thermal resistance is 2°C/W maximum. The junction to ambient thermal resistance is dependent on the mounting technology and the addition of heat sink. One of the most commonly used mounting techniques consists of using the printed circuit board and the copper lines as heat sink. Temp Node Chan 2 Junction Chan 1 Switch RθJC1 2°C/W Chan 1 Power (W) (1.0A=1W of Power Dissipation) Rthca (1.0Ω=1°C/W) 25°C/W Chan 2 Switch RθJC2 2°C/W Case Temp Node Chan 2 Power (W) Ambient Temp Node (1.0V=1°C) AmbientTemperature Figure 4. Simplified Thermal Model (Electrical Equivalent) 33288 Analog Integrated Circuit Device Data Freescale Semiconductor 9 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Transient Thermal Model A more complete model including thermal capacitance is proposed in Figure 3. Thermal impedance (°C/W) 30 20 5mJ/K 5mJ/K 1mJ/K MOS3 4mJ/K 3.5K/W 3.5K/W MOS1 3K/W 3K/W 450K/W MOS2 3K/W Case 3K/W Control 10 0 0 100 200 300 0.5J/K Ambiant Board 20K/W 6J/K Time (sec.) 400 500 600 700 800 300K/W Figure 5. Transient Thermal Model This gives a thermal impedance versus time (Figure 4), which has been determined with the printed circuit board shown in Figure 1. Figure 6. Junction to Ambiant Thermal Impedance This figure shows that the steady state is reached after about 10 minutes. It also clearly shows that the device can dissipate almost twice the power within one minute compared to the maximum allowed power dissipation in steady state. 33288 10 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS OPERATIONAL MODES TYPICAL APPLICATIONS Battery CB OUT2 OUT2 OUT2 Charge Pump 5.0 V 21+5W Trailor Left Side 21+21+5W Left Side I/O R CHANNEL 2 Left Over Temp Input Trigger Over Current VBATC Open Load St-1 Fault Monitoring CHANNEL 1 Right VBAT Drive & Protect Warning Lamp Driver WLP Current Recopy CR 1 21+21+5W Right Side OUT1 OUT1 OUT1 VBAT Vbat 33288 10 K IN2 St-2 Cr 2 MCU I/O I/O R R R IN1 ST A/D CUR R IN2 Current Copy Resistor RCR R : 10 k typical RCR : 500 Ω to 1 kΩ typical CB : 100 nF to 470 nF RWLP : 100 Ω typical VBAT Vbat RWLP GND 1.2 W 21+5W Trailor Right Side Figure 7. Typical Application - Automotive Flasher 33288 Analog Integrated Circuit Device Data Freescale Semiconductor 11 PACKAGING PACKAGING INFORMATION PACKAGING PACKAGING INFORMATION DH SUFFIX 20-LEAD HSOP PLASTIC PACKAGE 98ASH70273A ISSUE C 33288 12 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGING INFORMATION (CONTINUED) PACKAGING INFORMATION (CONTINUED) DH SUFFIX 20-LEAD HSOP PLASTIC PACKAGE 98ASH70273A ISSUE C 33288 Analog Integrated Circuit Device Data Freescale Semiconductor 13 REVISION HISTORY REVISION HISTORY REVISION 6.0 DATE 5/2005 DESCRIPTION OF CHANGES • • Implemed Revision History page Changed Part Number MC33288DH to MC33288DDH - Noelectrical changes. 33288 14 Analog Integrated Circuit Device Data Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2006. All rights reserved. MC33288 Rev 6.0 5/2006