Freescale Semiconductor Advance Information
Document Number: MC33874
Rev. 8.0, 4/2007
Quad High-Side Switch (Quad 35 mΩ)
The 33874 is one in a family of devices designed for low-voltage automotive and industrial lighting and motor control applications. Its four low RDS(ON) MOSFETs (four 35 mΩ) can control the high sides of four separate resistive or inductive loads. Programming, control, and diagnostics are accomplished using a 16-bit SPI interface. Additionally, each output has its own parallel input for pulse-width modulation (PWM) control if desired. The 33874 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush or motor stall intervals. Such programmability allows tight control of fault currents and can protect wiring harnesses and circuit boards as well as loads. The 33874 is packaged in a power-enhanced 12 x 12 nonleaded Power QFN package with exposed tabs. Features • Quad 35 mΩ High-Side Switches (at 25°C) • Operating Voltage Range of 6.0 V to 27 V with Standby Current < 5.0 µA • SPI Control of Overcurrent Limit, Overcurrent Fault Blanking Time, Output OFF Open Load Detection, Output ON / OFF Control, Watchdog Timeout, Slew Rates, and Fault Status Reporting • SPI Status Reporting of Overcurrent, Open and Shorted Loads, Overtemperature, Undervoltage and Overvoltage Shutdown, Fail-Safe Pin Status, and Program Status • Analog Current Feedback with Selectable Ratio • Analog Board Temperature Feedback • Enhanced -16 V Reverse Polarity VPWR Protection • Pb-Free Packaging Designated by Suffix Code PNA
VDD VDD VPWR VDD
33874
HIGH-SIDE SWITCH
PNA SUFFIX (PB_FREE) 98ARL10596D 24-PIN PQFN (12 x 12)
ORDERING INFORMATION
Device MC33874BPNA/R2 Temperature Range (TA) - 40°C to 125°C Package 24 PQFN
VPWR
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VDD WAKE SO SCLK CS SI MCU I/O I/O I/O I/O I/O I/O A/D GND A/D SI SCLK CS SO RST FS IN0 IN1 IN2 IN3 CSNS TEMP FSI GND HS3 LOAD 3 HS2 LOAD 2 HS1 LOAD 1 VPWR HS0 LOAD 0
Figure 1. 33874 Simplified Application Diagram
* This document contains certain information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD VPWR
VIC
IUP CS SCLK IDWN SO SI RST WAKE FS IN0 IN1 IN2 IN3
SPI 3.0 MHz
Internal Regulator
Over/Undervoltage Protection
VIC
Selectable Slew Rate Gate Drive Selectable Overcurrent High Detection HS[0:3]: 55 A or 40 A Selectable Overcurrent Low Detection Blanking Time 0.15 ms–155 ms Open Load Detection Overtemperature Detection Selectable Overcurrent Low Detection HS[0:3]: 2.8 A–10 A
HS0
Logic
HS0
RDWN
IDWN HS1
HS1
Programmable Watchdog 279 ms–2250 ms
VIC
HS2 HS2
FSI HS3 HS3
Temperature Feedback Selectable Output Current Recopy (Analog MUX) HS[0:3]: 1/7200 or 1/21400
TEMP
GND
CSNS
Figure 2. 33874 Simplified Internal Block Diagram
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Analog Integrated Circuit Device Data Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
Transparent Top View of Package
WAKE TEMP CSNS 1 24 14 GND 23 FSI GND 22 HS2 Definition The Current Sense pin sources a current proportional to the designated HS0 : HS3 output. The IN0 : IN3 high-side input pins are used to directly control HS0 : HS3 highside output pins, respectively. SCLK VDD
RST
IN3
IN2
IN1 3
13 12 11 10 SO GND 16 17
9
8
7
6
5
4
HS3
18
15 VPWR
19 HS1
20 NC
21 HS0
Figure 3. 33874 Pin Connections Table 1. 33874 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 15.
Pin Number 1 2 3 5 6 4 7 8 9 10 11 12 13 Pin Name CSNS IN0 IN1 IN2 IN3 TEMP FS WAKE RST CS SCLK SI VDD Pin Function Output Input Formal Name Output Current Monitoring Serial Inputs
Output Output Input Input Input Input Input Power
Temperature Feedback Fault Status (Active Low) Wake Reset Chip Select (Active Low) Serial Clock Serial Input Digital Drain Voltage (Power)
This pin reports an analog value proportional to the temperature of the GND flag (pins 14, 17, 23). It is used by the MCU to monitor board temperature. This pin is an open drain configured output requiring an external pullup resistor to VDD for fault reporting. This input pin controls the device mode and watchdog timeout feature if enabled. This input pin is used to initialize the device configuration and fault registers, as well as place the device in a low-current sleep mode. This input pin is connected to a chip select output of a master microcontroller (MCU). This input pin is connected to the MCU providing the required bit shift clock for SPI communication. This pin is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device of a daisy-chain of devices. This pin is an external voltage input pin used to supply power to the SPI circuit.
IN0 2
CS
FS
SI
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PIN CONNECTIONS
Table 1. 33874 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 15.
Pin Number 14, 17, 23 15 16 18 19 21 22 20 24 Pin Name GND VPWR SO HS3 HS1 HS0 HS2 NC FSI Pin Function Ground Power Output Output Formal Name Ground Definition These pins are the ground for the logic and analog circuitry of the device.
Positive Power Supply This pin connects to the positive power supply and is the source of operational power for the device. Serial Output High-Side Outputs This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device of a daisy-chain of devices. Protected 35 mΩ high-side power output pins to the load.
N/A Input
No Connect Fail-Safe Input
This pin may not be connected. The value of the resistance connected between this pin and ground determines the state of the outputs after a Watchdog timeout occurs.
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Analog Integrated Circuit Device Data Freescale Semiconductor
ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.
Ratings ELECTRICAL RATINGS Operating Voltage Range Steady-State VDD Supply Voltage Input / Output Voltage (1) SO Output Voltage
(1)
Symbol
Value
Unit
VPWR(SS) -16 to 41 VDD
See note (1)
V -0.3 to 5.5 - 0.3 to 7.0 - 0.3 to VDD + 0.3 2.5 10 41 -16 V V V mA mA V
VSO ICL(WAKE) ICL(CSNS) VHS
WAKE Input Clamp Current CSNS Input Clamp Current HS [0:3] Voltage Positive Negative Output Current (2) Output Clamp Energy ESD Voltage (4) Human Body Model (HBM) Charge Device Model (CDM) Corner Pins (1, 13, 19, 21) All Other Pins (2-12, 14-18, 20, 22-24) THERMAL RATINGS Operating Temperature Ambient Junction Storage Temperature Thermal Resistance (5) Junction to Case Junction to Ambient Peak Pin Reflow Temperature During Solder Mounting (6)
(3)
IHS[0:3] ECL [0:3] VESD
11 85 ± 2000 ± 750 ± 500
A mJ V
°C
TA TJ TSTG RθJC RθJA TSOLDER - 40 to 125 - 40 to 150 - 55 to 150 0.7 VDD, RST = VLOGIC HIGH Sleep State Supply Current (VPWR = 14V, RST < 0.5 V, WAKE < 0.5 V) TA = 25°C TA = 85°C VDD Supply Voltage VDD Supply Current No SPI Communication 3.0 MHz SPI Communication (7) VDD Sleep State Current Overvoltage Shutdown Threshold Overvoltage Shutdown Hysteresis Undervoltage Shutdown Threshold (8) Undervoltage Hysteresis
(9)
Symbol
Min
Typ
Max
Unit
VPWR 6.0 IPWR(ON) – IPWR(SBY) – IPWR(SLEEP) – – VDD(ON) IDD(ON) – – IDDSLEEP VOV VOVHYS VUV VUVHYS VUVPOR – 28 0.2 4.75 – – – – – 32 0.8 5.25 0.25 – 1.0 5.0 5.0 36 1.5 5.75 – 4.75 4.5 1.0 – 5.0 10 50 5.5 – 5.0 – 20 – 27
V mA mA
µA
V mA
µA V V V V V
Undervoltage Power-ON Reset
Notes 7. Not guaranteed in production. 8. The undervoltage fault condition is reported to SPI register as long as the external VDD supply is within specification and the VPWR voltage level does not go below the undervoltage Power-ON Reset threshold. 9. This applies when the undervoltage fault is not latched (IN = [0:3]).
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Analog Integrated Circuit Device Data Freescale Semiconductor
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 27 V, 4.5 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic OUTPUTS (HS0, HS1, HS2, HS3) Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 25°C) VPWR = 6.0 V VPWR = 10 V VPWR = 13 V Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 150°C) VPWR = 6.0 V VPWR = 10 V VPWR = 13 V Output Source-to-Drain ON Resistance
(10)
Symbol
Min
Typ
Max
Unit
RDS(ON) – – – RDS(ON) – – – RSD(ON) – IOCH0 IOCH1 IOCL0 IOCL1 IOCL2 IOCL3 IOCL4 IOCL5 IOCL6 IOCL7 CSR0 CSR1 CSR0_ACC -17 – 17 44 32 8.0 7.1 6.3 5.6 4.6 3.8 3.1 2.2 – – – 55 40 10 8.9 7.9 7.0 5.8 4.8 3.9 2.8 1/7200 1/21400 70 – – – 94 60 60 – – – 55 35 35
mΩ
mΩ
mΩ A 66 48 A 12 10.7 9.5 8.5 7.0 5.8 4.7 3.4 – – – %
IHS = 1.0 A, TA = 25°C, VPWR = -12 V Output Overcurrent High Detection Levels (9.0 V < VPWR < 16 V) SOCH = 0 SOCH = 1 Overcurrent Low Detection Levels (9.0 V < VPWR < 16 V) SOCL[2:0] : 000 SOCL[2:0] : 001 SOCL[2:0] : 010 SOCL[2:0] : 011 SOCL[2:0] : 100 SOCL[2:0] : 101 SOCL[2:0] : 110 SOCL[2:0] : 111 Current Sense Ratio (9.0 V < VPWR < 16 V, CSNS < 4.5 V) DICR D2 = 0 DICR D2 = 1 Current Sense Ratio (CSR0) Accuracy Output Current 2.0 A to 10 A
Notes 10. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR.
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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 27 V, 4.5 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic OUTPUTS (HS0, HS1, HS2, HS3) (continued) Current Sense Ratio (CSR1) Accuracy Output Current 10 A to 20 A Current Sense Clamp Voltage CSNS Open; IHS[0:3] = 11 A Open Load Detection Current (11) Output Fault Detection Threshold Output Programmed OFF Output Negative Clamp Voltage 0.5 A < IHS[0:3] < 2.0 A, Output OFF Overtemperature Shutdown (12) Overtemperature Shutdown Hysteresis
(12)
Symbol
Min
Typ
Max
Unit
CSR1_ACC -19 VCL(CSNS) 4.5 IOLDC VOFD(THRES) 2.0 VCL - 20 TSD TSD(HYS) 155 5.0 – 175 – -16 190 20 3.0 4.0 30 6.0 – 7.0 100 – 19
%
V µA V V
°C °C
Notes 11. Output OFF Open Load Detection Current is the current required to flow through the load for the purpose of detecting the existence of an open load condition when the specific output is commanded OFF. 12. Guaranteed by process monitoring. Not production tested.
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Analog Integrated Circuit Device Data Freescale Semiconductor
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 27 V, 4.5 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic CONTROL INTERFACE (SCLK, SI, SO, IN[0:3], RST, WAKE, FS, CS, FSI) Input Logic High Voltage (13) Input Logic Low Voltage (13) Input Logic Voltage Hysteresis
(14)
Symbol
Min
Typ
Max
Unit
VIH VIL VIN(HYS) IDWN VRST CSO RDWN
0.7 VDD – 100 5.0 4.5 – 100 – 7.0
– – 850 – 5.0 – 200 4.0 – – – 0.2 0 –
– 0.2 VDD 1200 20 5.5 20 400 12 14
V V mV µA V pF kΩ pF V V
Input Logic Pulldown Current (SCLK, SI, IN[0:3], VIN>0.2 VDD)
RST Input Voltage Range
SO, FS Tri-State Capacitance (14) Input Logic Pulldown Resistor (RST) and WAKE Input Capacitance (15) Wake Input Clamp Voltage ICL(WAKE) < 2.5 mA Wake Input Forward Voltage ICL(WAKE) = -2.5 mA SO High-State Output Voltage IOH = 1.0 mA
FS, SO Low-State Output Voltage
(16)
CIN
VCL(WAKE) VF(WAKE)
- 2.0 VSOH 0.8 VDD VSOL – ISO(LEAK) - 5.0 IUP 5.0 RFS – 6.0 15 40 TFEED 3.8 DTFEED -7.2
- 0.3 V – V 0.4 µA 5.0 µA 20 kΩ
IOL = -1.6 mA SO Tri-State Leakage Current
CS > 0.7 VDD, 0