56852

56852 Data Sheet Technical Data 56800E 16-bit Digital Signal Controllers DSP56852 Rev. 8 01/2007 freescale.com DSP56852 General Description • 120 MIPS at 120MHz • 6K x 16-bit Program SRAM • 4K x 16-bit Data SRAM • 1K x 16-bit Boot ROM • 21 External Memory Address lines, 16 data lines and four chip selects • One (1) Serial Port Interface (SPI) or one (1) Improved Synchronous Serial Interface (ISSI) • One (1) Serial Communication Interface (SCI) • Interrupt Controller • General Purpose 16-bit Quad Timer • JTAG/Enhanced On-Chip Emulation (OnCE™) for unobtrusive, real-time debugging • Computer Operating Properly (COP)/Watchdog Timer • 81-pin MAPBGA package • Up to 11 GPIO 6 VDDIO 6 VDD 3 VSSIO 6 VSS VDDA 3 VSSA JTAG/ Enhanced OnCE Program Controller and Hardware Looping Unit Address Generation Unit 16-Bit 56800E Core Data ALU 16 x 16 + 36 → 36-Bit MAC Three 16-bit Input Registers Four 36-bit Accumulators Bit Manipulation Unit PAB PDB CDBR CDBW Memory Program Memory 6144 x 16 SRAM Boot ROM 1024 x 16 ROM Data Memory 4096 x 16 SRAM R/W Control XDB2 XAB1 XAB2 PAB PDB CDBR CDBW System Bus Control System Address Decoder System Device IPBus Bridge (IPBB) RW Control IPAB IPWDB IPRDB Peripheral Address Decoder Decoding Peripherals A0-16 A17-18 muxed (timer pins) A19 muxed (CS3) D0-D12[12:0] D13-15 muxed (Mode A,B,C) WR Enable RD Enable CS[2:0] muxed (GPIOA) External Address Bus Switch External Data Bus Switch External Bus Interface Unit Peripheral Device Selects Clock resets P O R PLL SCI or GPIOE Bus Control 1 Quad Timer or A17, A18 SSI or SPI or GPIOC COP/ Watchdog Interrupt Controller System Integration Module Clock Generator O S C XTAL EXTAL 2 2 6 IRQA IRQB 3 CLKO RESET muxed (A20) MODE muxed (D13-15) 56852 Block Diagram 56852 Technical Data, Rev. 8 Freescale Semiconductor 3 Part 1 Overview 1.1 56852 Features 1.1.1 • • • • • • • • • • • • • • • • Core Efficient 16-bit engine with dual Harvard architecture 120 Million Instructions Per Second (MIPS) at 120MHz core frequency Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC) Four (4) 36-bit accumulators including extension bits 16-bit bidirectional shifter Parallel instruction set with unique DSP addressing modes Hardware DO and REP loops Three (3) internal address buses and one (1) external address bus Four (4) internal data buses and one (1) external data bus Instruction set supports both DSP and controller functions Four (4) hardware interrupt levels Five (5) software interrupt levels Controller-style addressing modes and instructions for compact code Efficient C Compiler and local variable support Software subroutine and interrupt stack with depth limited only by memory JTAG/Enhanced OnCE debug programming interface 1.1.2 • • Memory Harvard architecture permits as many as three simultaneous accesses to program and data memory On-chip memory includes: — 6K × 16-bit Program SRAM — 4K × 16-bit Data SRAM — 1K × 16-bit Boot ROM 21 External Memory Address lines, 16 data lines and four (4) programmable chip select signals • 1.1.3 • • • • • • • • Peripheral Circuits for DSP56852 General Purpose 16-bit Quad Timer with two external pins* One (1) Serial Communication Interface (SCI)* One (1) Serial Port Interface (SPI) or one (1) Improved Synchronous Serial Interface (ISSI) module* Interrupt Controller Computer Operating Properly (COP)/Watchdog Timer JTAG/Enhanced On-Chip Emulation (EOnCE) for unobtrusive, real-time debugging 81-pin MAPBGA package Up to 11 GPIO * Each peripheral I/O can be used alternately as a General Purpose I/O if not needed 56852 Technical Data, Rev. 8 4 Freescale Semiconductor 56852 Description 1.1.4 • • Energy Information Fabricated in high-density CMOS with 3.3V, TTL-compatible digital inputs Wait and Stop modes available 1.2 56852 Description The 56852 is a member of the 56800E core-based family of controllers. It combines, on a single chip, the processing power of a Digital Signal Processor (DSP) and the functionality of a microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because of its low cost, configuration flexibility, and compact program code, the 56852 is well-suited for many applications. The 56852 includes many peripherals especially useful for low-end Internet appliance applications and low-end client applications such as telephony; portable devices; Internet audio; and point-of-sale systems such as noise suppression; ID tag readers; sonic/subsonic detectors; security access devices; remote metering; and sonic alarms. The 56800E core is based on a Harvard-style architecture consisting of three execution units operating in parallel, allowing as many as six operations per instruction cycle. The microprocessor-style programming model and optimized instruction set allow straightforward generation of efficient, compact DSP and control code. The instruction set is also highly efficient for C-Compilers, enabling rapid development of optimized control applications. The 56852 supports program execution from either internal or external memories. Two data operands can be accessed from the on-chip Data RAM per instruction cycle. The 56852 also provides two external dedicated interrupt lines, and up to 11 General Purpose Input/Output (GPIO) lines, depending on peripheral configuration. The 56852 includes 6K words of Program RAM, 4K words of Data RAM and 1K of Boot RAM. It also supports program execution from external memory. This controller also provides a full set of standard programmable peripherals that include one improved Synchronous Serial Interface (SSI) or one Serial Peripheral Interface (SPI), one Serial Communications Interface (SCI), and one Quad Timer. The SSI, SPI, SCI I/O and three chip selects can be used as General Purpose Input/Outputs when its primary function is not required. The SSI and SPI share I/O, so, at most, one of these two peripherals can be in use at any time. 1.3 State of the Art Development Environment • • Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use component-based software application creation with an expert knowledge system. The Code Warrior Integrated Development Environment is a sophisticated tool for code navigation, compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards will support concurrent engineering. Together, PE, Code Warrior and EVMs create a complete, scalable tools solution for easy, fast, and efficient development. 56852 Technical Data, Rev. 8 Freescale Semiconductor 5 1.4 Product Documentation The four documents listed in Table 1-1 are required for a complete description of and proper design with the 56852. Documentation is available from local Freescale distributors, Freescale semiconductor sales offices, Freescale Literature Distribution Centers, or online at www.freescale.com. Table 1-1 DSP56852 Chip Documentation Topic DSP56800E Reference Manual DSP56852 User’s Manual DSP56852 Technical Data Sheet DSP56852 Errata Description Detailed description of the 56800E architecture, 16-bit controller core processor and the instruction set Detailed description of memory, peripherals, and interfaces of the 56852 Electrical and timing specifications, pin descriptions, and package descriptions (this document) Details any chip issues that might be present Order Number DSP56800ERM DSP56852UM DSP56852 DSP56852E 1.5 Data Sheet Conventions This data sheet uses the following conventions: OVERBAR “asserted” “deasserted” Examples: This is used to indicate a signal that is active when pulled low. For example, the RESET pin is active when low. A high true (active high) signal is high or a low true (active low) signal is low. A high true (active high) signal is low or a low true (active low) signal is high. Signal/Symbol PIN PIN PIN PIN Logic State True False True False Signal State Asserted Deasserted Asserted Deasserted Voltage1 VIL/VOL VIH/VOH VIH/VOH VIL/VOL 1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications. 56852 Technical Data, Rev. 8 6 Freescale Semiconductor Introduction Part 2 Signal/Connection Descriptions 2.1 Introduction The input and output signals of the 56852 are organized into functional groups, as shown in Table 2-1 and as illustrated in Figure 2-1. In Table 3-1, each table row describes the package pin and the signal or signals present. Table 2-1 Functional Group Pin Allocations Functional Group Power (VDD, VDDIO, or VDDA) Ground (VSS, VSSIO,or VSSA) Phase Lock Loop (PLL) and Clock External Bus Signals External Chip Select* Interrupt and Program Control Synchronous Serial Interface (SSI) Port* Serial Communications Interface (SCI) Port* Serial Peripheral Interface (SPI) Port Quad Timer Module Port JTAG/Enhanced On-Chip Emulation (EOnCE) *Alternately, GPIO pins 1. VDD = VDD CORE, VSS = VSS CORE, VDDIO= VDD IO, VSSIO = VSS IO, VDDA = VDD ANA, VSSA = VSS ANA 2. CLKOUT is muxed Address pin A20. 3. Four Address pins are multiplexed with the timer, CS3 and CLKOUT pins. 4. CS3 is multiplexed with external Address Bus pin A19. 5. Mode pins are multiplexed with External Data pins D13-D15 like A17and A18. 6. Four of these pins are multiplexed with SSI. 7. Two of these pins are multiplexed with 2 bits of the External Address Bus A17and A18. Number of Pins 101 101 22 393 34 35 6 2 06 07 6 56852 Technical Data, Rev. 8 Freescale Semiconductor 7 Logic Power VDD VSS 3 3 1 1 RXD(GPIOE0) TXD(GPIOE1) SCI I/O Power VDDIO VSSIO 6 6 1 1 1 1 GPIOC0(STXD) GPIOC1(SRXD) SCLK(GPIOC2)(STCK) SS(GPIOC3)(STFS) MISO(GPIOC4)(SRCK) MOSI(GPIOC5)(SRFS) SPI SSI Analog Power1 VDDA VSSA 1 1 1 1 56852 A0–16 A17(TI/O) Address Bus A18(TI/O) A19(CS3) CLKO(A20) 17 1 1 1 1 1 1 IRQA IRQB Interrupt Request 1 1 XTAL EXTAL Oscillator 1 GPIOA0(CS0) Chip Select GPIOA1(CS1) GPIOA2(CS2) 1 1 1 1 1 Data Bus D0-D12 D13-D15/MODEA-C 13 3 1 1 1 1 RD Bus Control WR 1 1 RESET Reset TCK TDI TDO TMS TRST DE JTAG/Enhanced OnCE Figure 2-1 56852 Signals Identified by Functional Group 56852 Technical Data, Rev. 8 8 Freescale Semiconductor Introduction Part 3 Signals and Package Information All digital inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are enabled by default. Exceptions: 1. When a pin has GPIO functionality, the pull-up may be disabled under software control. 2. Mode pins D13, D14 and D15 have no pull-up. 3. TCK has a weak pull-down circuit always active. 4. Bidirectional I/O pullups automatically disable when the output is enabled. This table is presented consistently with the Signals Identified by Functional Group figure. 1. BOLD entries in the Type column represents the state of the pin just out of reset. 2. Ouput(Z) means an output in a High-Z condition. Table 3-1. 56852 Signal and Package Information for the 81-pin MAPBGA Pin No. E1 J5 E9 D1 J4 F9 C1 H1 J7 G9 B9 A4 B1 G1 J6 J9 C9 A5 B5 B6 Signal Name VDD VDD VDD VSS VSS VSS VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VSSIO VSSIO VSSIO VSSIO VSSIO VSSIO VDDA VSSA VDDA VSSA Analog Power—These pins supply an analog power source Analog Ground—This pin supplies an analog ground. VSSIO I/O Power - GND—These pins provide grounding for all I/O and ESD structures of the chip and should all be attached to VSS. VDDIO I/O Power —These pins provide power for all I/O and ESD structures of the chip, and should all be attached to VDDIO. VSS Logic Power - GND—These pins provide grounding for the internal structures of the chip and should all be attached to VSS. Type VDD Description Logic Power —These pins provide power to the internal structures of the chip, and should all be attached to VDD. 56852 Technical Data, Rev. 8 Freescale Semiconductor 9 Table 3-1. 56852 Signal and Package Information for the 81-pin MAPBGA (Continued) Pin No. E4 F2 F3 F4 F1 G3 G2 J1 H2 H3 J2 H4 G4 J3 F5 H5 E5 F6 Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 TIO0 G5 A18 TIO1 H6 A19 CS3 Output(Z) Input/Output Output(Z) Input/Output Output(Z) Output Address Bus (A17) Timer I/O (0)—Can be programmed as either a timer input source or as a timer output flag. Address Bus (A18) Timer I/O (1)—Can be programmed as either a timer input source or as a timer output flag. Address Bus (A19) External Chip Select 3 —When enabled, a CSx signal is asserted for external memory accesses that fall within a programmable address range. Output clock (CLKO)—User programmable clock out reference Address Bus—A20 Chip Select 0 (CS0) —When enabled, a CSx signal is asserted for external memory accesses that fall within a programmable address range. Port A GPIO (0) —A general purpose IO pin. Type Output(Z) Description Address Bus (A0–A16)—These pins specify a word address for external program or data memory addresses. J8 CLKO A20 Output Output Output D2 CS0 GPIOA0 Input/Output 56852 Technical Data, Rev. 8 10 Freescale Semiconductor Introduction Table 3-1. 56852 Signal and Package Information for the 81-pin MAPBGA (Continued) Pin No. D3 Signal Name CS1 Type Output Description Chip Select 1 (CS1) —When enabled, a CSx signal is asserted for external memory accesses that fall within a programmable address range. Port A GPIO (1) —A general purpose IO pin. Chip Select 2 (CS2)—When enabled, a CSx signal is asserted for external memory accesses that fall within a programmable address range. Port A GPIO (2) —A general purpose IO pin. Data Bus (D0–D12) —specify the data for external program or data memory accesses. D0–D15 are tri-stated when the external bus is inactive. GPIOA1 C3 CS2 Input/Output Output GPIOA2 G7 H7 H8 G8 H9 F8 F7 G6 E8 E7 E6 D8 D7 D9 C8 A9 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 MODE A D14 MODE B D15 MODE C Input/Output Input/Output Input/Output Data Bus (D13–D15) — specify the data for external program or data memory accesses. D0–D15 are tri-stated when the external bus is inactive. Mode Select—During the bootstrap process the MODE A, MODE B, and MODE C pins select one of the eight bootstrap modes. These pins are sampled at the end of reset. Note: Any time POR and EXTERNAL resets are active, the state of MODE A, B and C pins get asynchronously transferred to the SIM Control Register [14:12] ($1FFF08) respectively. These bits determine the mode in which the part will boot up. Note: Software and COP resets do not update the SIM Control Register. E2 RD Output Bus Control– Read Enable (RD)—is asserted during external memory read cycles. When RD is asserted low, pins D0–D15 become inputs and an external device is enabled onto the data bus. When RD is deasserted high, the external data is latched inside the controller. RD can be connected directly to the OE pin of a Static RAM or ROM. 56852 Technical Data, Rev. 8 Freescale Semiconductor 11 Table 3-1. 56852 Signal and Package Information for the 81-pin MAPBGA (Continued) Pin No. E3 Signal Name WR Type Output Description Bus Control–Write Enable (WR)— is asserted during external memory write cycles. When WR is asserted low, pins D0–D15 become outputs and the controller puts data on the bus. When WR is deasserted high, the external data is latched inside the external device. When WR is asserted, it qualifies the A0–A15 pins. WR can be connected directly to the WE pin of a Static RAM. SCI Receive Data (RXD)—This input receives byte-oriented serial data and transfers it to the SCI receive shift register. Port E GPIO (0)—A general purpose I/O pin. SCI Transmit Data (TXD)—This signal transmits data from the SCI transmit data register. Port E GPIO (1)—A general purpose I/O pin. Port C GPIO (0)—This pin is a General Purpose I/O (GPIO) pin when the SSI is not in use. SSI Transmit Data (STXD)—This output pin transmits serial data from the SSI Transmitter Shift Register. Port C GPIO (1)—This pin is a General Purpose I/O (GPIO) pin when the SSI is not in use. SSI Receive Data (SRXD)—This input pin receives serial data and transfers the data to the SSI Receive Shift Register. SPI Serial Clock (SCLK)—In Master mode, this pin serves as an output, clocking slaved listeners. In Slave mode, this pin serves as the data clock input. Port C GPIO (2)—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. SSI Serial Transfer Clock (STCK)—This bidirectional pin provides the serial bit rate clock for the transmit section of the SSI. The clock signal can be continuous or gated. SPI Slave Select (SS)—In Master mode, this pin is used to arbitrate multiple masters. In Slave mode, this pin is used to select the slave. Port C GPIO (3)—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. SSI Serial Transfer Frame Sync (STFS) —This bidirectional pin is used to count the number of words in a frame while transmitting. A programmable frame rate divider and a word length divider are used for frame rate sync signal generation. B4 RXD Input GPIOE0 D4 TXD Input/Output Output(Z) GPIOE1 B2 GPIOC0 Input/Output Input/Output STXD A2 GPIOC1 Output Input/Output SRXD Input A3 SCLK Input/Output GPIOC2 Input/Output STCK B3 SS Input/Output Input GPIOC3 Input/Output STFS Input/Output 56852 Technical Data, Rev. 8 12 Freescale Semiconductor Introduction Table 3-1. 56852 Signal and Package Information for the 81-pin MAPBGA (Continued) Pin No. C4 Signal Name MISO Type Input/Output Description SPI Master In/Slave Out (MISO)—This serial data pin is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. Port C GPIO (4)—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. SSI Serial Receive Clock (SRCK)—This bidirectional pin provides the serial bit rate clock for the receive section of the SSI. The clock signal can be continuous or gated. SPI Master Out/Slave In (MOSI)—This serial data pin is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge that the slave device uses to latch the data. Port C GPIO (5)—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. SSI Serial Receive Frame Sync (SRFS)— This bidirectional pin is used to count the number of words in a frame while receiving. A programmable frame rate divider and a word length divider are used for frame rate sync signal generation. External Interrupt Request A (IRQA)—The IRQA Schmitt trigger input is a synchronized external interrupt request that indicates that an external device is requesting service. It can be programmed to be level-sensitive or negative-edge- triggered. External Interrupt Request B (IRQB)—The IRQB Schmitt trigger input is an external interrupt request that indicates that an external device is requesting service. It can be programmed to be level-sensitive or negative-edge-triggered. External Crystal Oscillator Input (EXTAL)—This input should be connected to an external crystal. If an external clock source other than a crystal oscillator is used, EXTAL must be tied off. Crystal Oscillator Output (XTAL)—This output connects the internal crystal oscillator output to an external crystal. If an external clock source other than a crystal oscillator is used, XTAL must be used as the input. GPIOC4 Input/Output SRCK C5 MOSI Input/Output Input/ Output (Z) GPIOC5 Input/Output SRFS A1 IRQA Input/Output Input C2 IRQB Input A6 EXTAL Input A7 XTAL Input/Output 56852 Technical Data, Rev. 8 Freescale Semiconductor 13 Table 3-1. 56852 Signal and Package Information for the 81-pin MAPBGA (Continued) Pin No. D5 Signal Name RESET Type Input Description Reset (RESET)—This input is a direct hardware reset on the processor. When RESET is asserted low, the controller is initialized and placed in the Reset state. A Schmitt trigger input is used for noise immunity. When the RESET pin is deasserted, the initial Chip Operating mode is latched from the D[15:13] pins. The internal reset signal will be deasserted synchronous with the internal clocks, after a fixed number of internal clocks. To ensure complete hardware reset, RESET and TRST should be asserted together. The only exception occurs in a debugging environment when a hardware reset is required and it is necessary not to reset the JTAG/Enhanced OnCE module. In this case, assert RESET, but do not assert TRST. C6 TCK Input Test Clock Input (TCK)—This input pin provides a gated clock to synchronize the test logic and shift serial data to the JTAG/Enhanced OnCE port. The pin is connected internally to a pull-down resistor. Test Data Input (TDI)—This input pin provides a serial input data stream to the JTAG/Enhanced OnCE port. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor. Test Data Output (TDO)—This tri-statable output pin provides a serial output data stream from the JTAG/Enhanced OnCE port. It is driven in the Shift-IR and Shift-DR controller states, and changes on the falling edge of TCK. Test Mode Select Input (TMS)—This input pin is used to sequence the JTAG TAP controller’s state machine. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor. Note: D6 TRST Input Always tie the TMS pin to VDD through a 2.2K resistor. B7 TDI Input A8 TDO Output C7 TMS Input Test Reset (TRST)—As an input, a low signal on this pin provides a reset signal to the JTAG TAP controller. To ensure complete hardware reset, TRST should be asserted whenever RESET is asserted. The only exception occurs in a debugging environment, since the Enhanced OnCE/JTAG module is under the control of the debugger. In this case it is not necessary to assert TRST when asserting RESET. Outside of a debugging environment RESET should be permanently asserted by grounding the signal, thus disabling the Enhanced OnCE/JTAG module on the device. Note: For normal operation, connect TRST directly to VSS. If the design is to be used in a debugging environment, TRST may be tied to VSS through a 1K resistor. B8 DE Input/Output Debug Even (DE)— is an open-drain, bidirectional, active low signal. As an input, it is a means of entering Debug mode of operation from an external command controller. As an output, it is a means of acknowledging that the chip has entered Debug mode. 56852 Technical Data, Rev. 8 14 Freescale Semiconductor General Characteristics Part 4 Specifications 4.1 General Characteristics The 56852 is fabricated in high-density CMOS with 5-volt tolerant TTL-compatible digital inputs. The term “5-volt tolerant” refers to the capability of an I/O pin, built on a 3.3V compatible process technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V and 5V- compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ±10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings of 3.3V I/O levels while being able to receive 5V levels without being damaged. Absolute maximum ratings given in Table 4-1 are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to the device. The 56852 DC/AC electrical specifications are preliminary and are from design simulations. These specifications may not be fully tested or guaranteed at this early stage of the product life cycle. Finalized specifications will be published after complete characterization and device qualifications have been completed. CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. 56852 Technical Data, Rev. 8 Freescale Semiconductor 15 Table 4-1 Absolute Maximum Ratings Characteristic Supply voltage, core Supply voltage, IO Supply voltage, analog Digital input voltages Analog input voltages (XTAL, EXTAL) Current drain per pin excluding VDD, VSS, VDDA, VSSA,VDDIO, VSSIO Junction temperature Storage temperature range 1. VDD must not exceed VDDIO 2. VDDIO and VDDA must not differ by more that 0.5V Symbol VDD1 VDDIO2 VDDIO2 VIN VINA I Min VSS – 0.3 VSSIO – 0.3 VSSA – 0.3 VSSIO – 0.3 VSSA – 0.3 — Max VSS + 2.0 VSSIO + 4.0 VDDA + 4.0 VSSIO + 5.5 VDDA + 0.3 10 Unit V V V mA TJ TSTG -40 -55 120 150 °C °C Table 4-2 Recommended Operating Conditions Characteristic Supply voltage for Logic Power Supply voltage for I/O Power Supply voltage for Analog Power Ambient operating temperature PLL clock frequency1 Operating Frequency2 Frequency of peripheral bus Frequency of external clock Frequency of oscillator Frequency of clock via XTAL Frequency of clock via EXTAL Symbol VDD VDDIO VDDA TA fpll fop fipb fclk fosc fxtal fextal Min 1.62 3.0 3.0 -40 — — — — 2 — 2 Max 1.98 3.6 3.6 85 240 120 60 240 4 240 4 Unit V V V °C MHz MHz MHz MHz MHz MHz MHz 1. Assumes clock source is direct clock to EXTAL or crystal oscillator running 2-4MHz PLL must be enabled, locked, and selected. The actual frequency depends on the source clock frequency and programming of the CGM module. 2. Master clock is derived from one of the following four sources: fclk = fxtal when the source clock is the direct clock to EXAL fclk = fpll when PLL is selected fclk = fosc when the source clock is the crystal oscillator and PLL is not selected fclk = fextal when the source clock is the direct clock to EXAL and PLL is not selected 56852 Technical Data, Rev. 8 16 Freescale Semiconductor DC Electrical Characteristics Table 4-3 Thermal Characteristics1 Characteristic Thermal resistance junction-to-ambient (estimated) I/O pin power dissipation Power dissipation Maximum allowed PD 1. See Section 6.1 for more detail. 2. TJ = Junction Temperature TA = Ambient Temperature 81-pin MAPBGA Symbol θJA PI/O PD PDMAX Value 36.9 User Determined PD = (IDD × VDD) + PI/O (TJ – TA) / RθJA2 Unit °C/W W W W 4.2 DC Electrical Characteristics Table 4-4 DC Electrical Characteristics Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL < 50pF, fop = 120MHz Characteristic Input high voltage (XTAL/EXTAL) Input low voltage (XTAL/EXTAL) Input high voltage Input low voltage Input current low (pullups disabled) Input current high (pullups disabled) Output tri-state current low Output tri-state current high Output High Voltage at IOH Output Low Voltage at IOL Output High Current at VOH Output Low Current at VOL Input capacitance Output capacitance Symbol VIHC VILC VIH VIL IIL IIH IOZL IOZH VOH VOL IOH IOL CIN COUT Min VDDA – 0.8 -0.3 2.0 -0.3 -1 -1 -10 -10 VDDIO – 0.7 — 8 8 — — Typ VDDA — — — — — — — — — — — 8 12 Max VDDA + 0.3 0.5 5.5 0.8 1 1 10 10 — 0.4 16 16 — — Unit V V V V μA μA μA μA V V mA mA pF pF 56852 Technical Data, Rev. 8 Freescale Semiconductor 17 Table 4-4 DC Electrical Characteristics (Continued) Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL < 50pF, fop = 120MHz Characteristic VDD supply current (Core logic, memories, peripherals) Run Deep Stop2 Light Stop3 VDDIO supply current (I/O circuity) Run Deep Stop2 VDDA supply current (analog circuity) Deep Stop 2 5 1 Symbol IDD4 Min Typ Max Unit — — — IDDIO — — IDDA — VEI VEIH POR — — — 55 0.02 3.4 70 2.5 8 mA mA mA 40 0 60 2.5 50 1.5 50 300 120 2.85 — 2.0 mA μA μA V mV V Low Voltage Interrupt6 Low Voltage Interrupt Recovery Hysteresis Power on Reset7 Note: Run (operating) IDD measured using external square wave clock source (fosc = 4MHz) into XTAL. All inputs 0.2V from rail; no DC loads; outputs unloaded. All ports configured as inputs; measured with all modules enabled. PLL set to 240MHz out. 1. Running Core, performing 50% NOP and 50% FIR. Clock at 120 MHz. 2. Deep Stop Mode - Operation frequency = 4 MHz, PLL set to 4 MHz, crystal oscillator. 3. Light Stop Mode - Operation frequency = 120 MHz, PLL set to 240 MHz, crystal oscillator. 4. IDD includes current for core logic, internal memories, and all internal peripheral logic circuitry. 5. Running core and performing external memory access. Clock at 120 MHz. 6. When VDD drops below VEI max value, an interrupt is generated. 7. Power-on reset occurs whenever the digital supply drops below 1.8V. While power is ramping up, this signal remains active as long as the internal 2.5V is below 1.8V, no matter how long the ramp up rate is. The internally regulated voltage is typically 100mV less than VDD during ramp up until 2.5V is reached, at which time it self-regulates. 56852 Technical Data, Rev. 8 18 Freescale Semiconductor Supply Voltage Sequencing and Separation Cautions 150 EMI Mode5 MAC Mode1 120 90 IDD (mA) 60 30 0 20 40 60 80 100 120 Figure 4-1 Maximum Run IDDTOTAL vs. Frequency (see Notes 1. and 5. in Table 4-4) 4.3 Supply Voltage Sequencing and Separation Cautions Figure 4-2 shows two situations to avoid in sequencing the VDD and VDDIO, VDDA supplies. DC Power Supply Voltage 3.3V VDDIO, VDDA 2 Supplies Stable VDD 1.8V 1 0 Note: 1. VDD rising before VDDIO, VDDA 2. VDDIO, VDDA rising much faster than VDD Time Figure 4-2 Supply Voltage Sequencing and Separation Cautions 56852 Technical Data, Rev. 8 Freescale Semiconductor 19 VDD should not be allowed to rise early (1). This is usually avoided by running the regulator for the VDD supply (1.8V) from the voltage generated by the 3.3V VDDIO supply, see Figure 4-3. This keeps VDD from rising faster than VDDIO. VDD should not rise so late that a large voltage difference is allowed between the two supplies (2). Typically this situation is avoided by using external discrete diodes in series between supplies, as shown in Figure 4-3. The series diodes forward bias when the difference between VDDIO and VDD reaches approximately 2.1, causing VDD to rise as VDDIO ramps up. When the VDD regulator begins proper operation, the difference between supplies will typically be 0.8V and conduction through the diode chain reduces to essentially leakage current. During supply sequencing, the following general relationship should be adhered to: VDDIO > VDD > (VDDIO - 2.1V) In practice, VDDA is typically connected directly to VDDIO with some filtering. 3.3V Regulator VDDIO, VDDA Supply 1.8V Regulator VDD Figure 4-3 Example Circuit to Control Supply Sequencing 4.4 AC Electrical Characteristics Timing waveforms in Section 4.2 are tested with a VIL maximum of 0.8V and a VIH minimum of 2.0V for all pins except XTAL, which is tested using the input levels in Section 4.2. In Figure 4-4 the levels of VIH and VIL for an input signal are shown. VIH Input Signal Midpoint1 Fall Time Note: The midpoint is VIL + (VIH – VIL)/2. Low High 90% 50% 10% VIL Rise Time Figure 4-4 Input Signal Measurement References 56852 Technical Data, Rev. 8 20 Freescale Semiconductor External Clock Operation Figure 4-5 shows the definitions of the following signal states: • • • • Active state, when a bus or signal is driven, and enters a low impedance state Tri-stated, when a bus or signal is placed in a high impedance state Data Valid state, when a signal level has reached VOL or VOH Data Invalid state, when a signal level is in transition between VOL and VOH Data1 Valid Data1 Data Invalid State Data Active Data2 Valid Data2 Data Tri-stated Data Active Data3 Valid Data3 Figure 4-5 Signal States 4.5 External Clock Operation The 56852 system clock can be derived from a crystal or an external system clock signal. To generate a reference frequency using the internal oscillator, a reference crystal must be connected between the EXTAL and XTAL pins. 4.5.1 Crystal Oscillator for Use with PLL The internal oscillator is designed to interface with a parallel-resonant crystal resonator in the frequency range specified for the external crystal in Table 4-6. In Figure 4-6 a typical crystal oscillator circuit is shown. Follow the crystal supplier’s recommendations when selecting a crystal, because crystal parameters determine the component values required to provide maximum stability and reliable start-up. The crystal and associated components should be mounted as close as possible to the EXTAL and XTAL pins to minimize output distortion and start-up stabilization time. Crystal Frequency = 2–4MHz (optimized for 4MHz) EXTAL XTAL Rz Sample External Crystal Parameters: Rz = 10MΩ TOD_SEL bit in CGM may be set to 0 or 1. 0 is recommended. Figure 4-6 Crystal Oscillator 56852 Technical Data, Rev. 8 Freescale Semiconductor 21 4.5.2 High Speed External Clock Source (> 4MHz) The recommended method of connecting an external clock is given in Figure 4-7. The external clock source is connected to XTAL and the EXTAL pin is held at ground (recommended), VDDA, or VDDA/2. The TOD_SEL bit in CGM must be set to 1. 56852 XTAL EXTAL GND,VDDA, External Clock or VDDA/2 (up to 240MHz) Figure 4-7 Connecting a High Speed External Clock Signal using XTAL 4.5.3 Low Speed External Clock Source (2-4MHz) The recommended method of connecting an external clock is given in Figure 4-8. The external clock source is connected to XTAL and the EXTAL pin is held at VDDA/2. The TOD_SEL bit in CGM may be set to 0 or 1. 0 is recommended. 56852 XTAL EXTAL External Clock (2-4MHz) VDDA/2 Figure 4-8 Connecting a Low Speed External Clock Signal using XTAL Table 4-5 External Clock Operation Timing Requirements4 Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL £ 50pF, fop = 120MHz Characteristic Frequency of operation (external clock driver)1 Clock Pulse Width4 External clock input rise time2, 4 External clock input fall time3, 4 Symbol fosc tPW trise tfall Min 0 6.25 — — Typ — — — — Max 240 — TBD TBD Unit MHz ns ns ns 1. See Figure 4-7 for details on using the recommended connection of an external clock driver. 2. External clock input rise time is measured from 10 to 90 percent. 3. External clock input fall time is measured from 90 to 10percent. 4. Parameters listed are guaranteed by design. 56852 Technical Data, Rev. 8 22 Freescale Semiconductor External Memory Interface Timing VIH External Clock 90% 50% 10% tPW tPW 90% 50% 10% tfall trise VIL Note: The midpoint is VIL + (VIH – VIL)/2. Figure 4-9 External Clock Timing Table 4-6 PLL Timing Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL £ 50pF, fop = 120MHz Characteristic External reference crystal frequency for the PLL1 PLL output frequency PLL stabilization time 2 Symbol fosc fclk tplls Min 2 40 — Typ 4 — 1 Max 4 240 10 Unit MHz MHz ms 1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly. The PLL is optimized for 4MHz input crystal. 2. This is the minimum time required after the PLL setup is changed to ensure reliable operation. 4.6 External Memory Interface Timing The External Memory Interface is designed to access static memory and peripheral devices. Figure 4-10 shows sample timing and parameters that are detailed in Table 4-7. The timing of each parameter consists of both a fixed delay portion and a clock related portion; as well as user controlled wait states. The equation: t = D + P * (M + W) should be used to determine the actual time of each parameter. The terms in the above equation are defined as: t parameter delay time D fixed portion of the delay, due to on-chip path delays. P the period of the system clock, which determines the execution rate of the part (i.e. when the device is operating at 120 MHz, P = 8.33 ns). M Fixed portion of a clock period inherent in the design. This number is adjusted to account for possible clock duty cycle derating. W the sum of the applicable wait state controls. See the “Wait State Controls” column of Table 4-7 for the applicable controls for each parameter. See the EMI chapter of the 83x Peripheral Manual for details of what each wait state field controls. 56852 Technical Data, Rev. 8 Freescale Semiconductor 23 Some of the parameters contain two sets of numbers. These parameters have two different paths and clock edges that must be considered. Check both sets of numbers and use the smaller result. The appropriate entry may change if the operating frequency of the part changes. The timing of write cycles is different when WWS = 0 than when WWS > 0. Therefore, some parameters contain two sets of numbers to account for this difference. The “Wait States Configuration” column of Table 4-7 should be used to make the appropriate selection. A0-Axx,CS tRD tARDD tRDA tRDRD tARDA RD tAWR tWRWR WR tWR tWAC tWRRD tRDWR tDWR D0-D15 tDOS tDOH tAD tRDD tDRD Data Out Data In Note: During read-modify-write instructions and internal instructions, the address lines do not change state. Figure 4-10 External Memory Interface Timing 56852 Technical Data, Rev. 8 24 Freescale Semiconductor External Memory Interface Timing Table 4-7 External Memory Interface Timing Operating Conditions: VSS = VSSIO = VSSA = 0 V, VDD = 1.62-1.98 V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL ≤ 50pF, P = 8.333ns Characteristic Address Valid to WR Asserted Symbol tAWR Wait States Configuration WWS=0 WWS>0 WWS=0 WWS>0 WWS=0 D -0.75 -1.50 -0.52 -0.13 -1.86 - 6.03 -1.73 -4.29 -1.71 -2.38 -4.42 -1.44 - 0.51 -2.03 0.00 -0.97 -10.13 -13.22 - 1.06 -9.06 -12.65 -0.70 -0.172 M 0.50 0.69 0.19 0.00 0.00 0.25 0.19 0.50 0.25 0.19 0.50 0.25 0.00 1.00 N/A1 1.00 1.00 1.19 0.00 1.00 1.19 0.25 0.00 0.75 1.00 0.50 0.69 Wait States Controls WWSS Unit ns WR Width Asserted to WR Deasserted tWR WWS ns Data Out Valid to WR Asserted tDWR WWS=0 WWS>0 WWS>0 WWSS ns Valid Data Out Hold Time after WR Deasserted Valid Data Out Set Up Time to WR Deasserted Valid Address after WR Deasserted RD Deasserted to Address Invalid Address Valid to RD Deasserted Valid Input Data Hold after RD Deasserted RD Assertion Width Address Valid to Input Data Valid tDOH tDOS tWAC tRDA tARDD tDRD tRD tAD tARDA tRDD tWRRD tRDRD tWRWR WWS=0 WWS>0 WWSH WWS,WWSS WWSH RWSH RWSS,RWS — RWS RWSS,RWS RWSS RWSS,RWS WWSH,RWSS RWSS,RWSH WWSS, WWSH MDAR, BMDAR, RWSH, WWSS ns ns ns ns ns ns ns Address Valid to RD Asserted RD Asserted to Input Data Valid ns ns ns ns ns WR Deasserted to RD Asserted RD Deasserted to RD Asserted WR Deasserted to WR Asserted -0.47 -0.07 0.10 -0.31 RD Deasserted to WR Asserted tRDWR ns 1. N/A since device captures data before it deasserts RD 2. If RWSS = RWSH = 0, RD does not deassert during back-to-back reads and D = 0.00 should be used. 56852 Technical Data, Rev. 8 Freescale Semiconductor 25 4.7 Reset, Stop, Wait, Mode Select, and Interrupt Timing Table 4-8 Reset, Stop, Wait, Mode Select, and Interrupt Timing Characteristic RESET Assertion to Address, Data and Control Signals High Impedance Minimum RESET Assertion Duration3 RESET Deassertion to First External Address Output Edge-sensitive Interrupt Request Width IRQA, IRQB Assertion to External Data Memory Access Out Valid, caused by first instruction execution in the interrupt service routine IRQA, IRQB Assertion to General Purpose Output Valid, caused by first instruction execution in the interrupt service routine IRQA Low to First Valid Interrupt Vector Address Out recovery from Wait State4 Delay from IRQA Assertion (exiting Stop) to External Data Memory5 Delay from IRQA Assertion (exiting Wait) to External Data Memory Fast6 Normal7 RSTO pulse width8 normal operation internal reset mode 1, 2 Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL < 50pF, fop = 120MHz Symbol tRAZ tRA tRDA tIRW tIDM tIDM -FAST tIG tIG -FAST tIRI tIRI -FAST tIW tIF Min — 30 — 1T + 3 18T 14T 18T 14T 22T 18T 1.5T Max 11 — 120T — — — — — — — — Unit ns ns ns ns ns See Figure 4-11 4-11 4-11 4-12 4-13 ns 4-13 ns 4-14 ns 4-15 4-15 18T 22ET tRSTO — — — — ns ns 4-16 128ET 8ET — — 1. In the formulas, T = clock cycle. For fop = 120MHz operation and fipb = 60MHz, T = 8.33ns. 2. Parameters listed are guaranteed by design. 3. At reset, the PLL is disabled and bypassed. The part is then put into run mode and tclk assumes the period of the source clock, txtal, textal or tosc. 4. The minimum is specified for the duration of an edge-sensitive IRQA interrupt required to recover from the Stop state. This is not the minimum required so that the IRQA interrupt is accepted. 5. The interrupt instruction fetch is visible on the pins only in Mode 3. 6. Fast stop mode: Fast stop recovery applies when external clocking is in use (direct clocking to XTAL) or when fast stop mode recovery is requested (OMR bit 6 is set to 1). In both cases the PLL and the master clock are unaffected by stop mode entry. Recovery takes one less cycle and tclk will continue same value it had before stop mode was entered. 7. Normal stop mode: As a power saving feature, normal stop mode disables and bypasses the PLL. Stop mode will then shut down the master clock, recovery will take an extra cycle (to restart the clock), and tclk will resume at the input clock source rate. 8. ET = External Clock period, For an external crystal frequency of 8MHz, ET=125 ns. 56852 Technical Data, Rev. 8 26 Freescale Semiconductor Reset, Stop, Wait, Mode Select, and Interrupt Timing RESET tRAZ tRA tRDA A0–A20, D0–D15 CS, RD, WR First Fetch First Fetch Figure 4-11 Asynchronous Reset Timing IRQA IRQB tIRW Figure 4-12 External Interrupt Timing (Negative-Edge-Sensitive) A0–A20, CS, RD, WR IRQA, IRQB First Interrupt Instruction Execution tIDM a) First Interrupt Instruction Execution Purpose I/O Pin IRQA, IRQB tIG b) General Purpose I/O Figure 4-13 External Level-Sensitive Interrupt Timing 56852 Technical Data, Rev. 8 Freescale Semiconductor 27 IRQA, IRQB tIRI A0–A20, CS, RD, WR First Interrupt Vector Instruction Fetch Figure 4-14 Interrupt from Wait State Timing tIW IRQA tIF A0–A20, CS, RD, WR First Instruction Fetch Not IRQA Interrupt Vector Figure 4-15 Recovery from Stop State Using Asynchronous Interrupt Timing RESET tRSTO Figure 4-16 Reset Output Timing 56852 Technical Data, Rev. 8 28 Freescale Semiconductor Serial Peripheral Interface (SPI) Timing 4.8 Serial Peripheral Interface (SPI) Timing Table 4-9 SPI Timing1 Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL < 50pF, fop = 120MHz Characteristic Cycle time Master Slave Enable lead time Master Slave Enable lag time Master Slave Clock (SCLK) high time Master Slave Clock (SCLK) low time Master Slave Data setup time required for inputs Master Slave Data hold time required for inputs Master Slave Access time (time to data active from high-impedance state) Slave Disable time (hold time to high-impedance state) Slave Data Valid for outputs Master Slave (after enable edge) Data invalid Master Slave Rise time Master Slave Fall time Master Slave 1. Parameters listed are guaranteed by design. Symbol tC Min Max Unit See Figure 4-17, 4-18, 4-19, 4-20 4-20 25 25 — 12.5 — 12.5 9 12.5 12 12.5 10 2 0 2 5 — — — — — — — — — — — — — — 15 ns ns ns ns tELD tELG 4-20 ns ns ns ns 4-17, 4-18, 4-19, 4-20 4-20 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 4-17, 4-18, 4-19, 4-20 4-17, 4-18, 4-19, 4-20 4-20 tCH tCL tDS tDH tA tD tDV 4-20 4-17, 4-18, 4-19, 4-20 4-17, 4-18, 4-19, 4-20 4-17, 4-18, 4-19, 4-20 4-17, 4-18, 4-19, 4-20 2 — — 0 0 — — — — 9 2 14 — — 11.5 10.0 9.7 9.0 tDI tR tF 56852 Technical Data, Rev. 8 Freescale Semiconductor 29 (Input) SS SS is held High on master tC tR tF tCL tCH tF tR SCLK (CPOL = 0) (Output) SCLK (CPOL = 1) (Output) tDS tCL tDH tCH tCH MISO (Input) MSB in tDI Bits 14–1 tDV LSB in tDI(ref) MOSI (Output) Master MSB out tF Bits 14–1 Master LSB out tR Figure 4-17 SPI Master Timing (CPHA = 0) (Input) SS tC SS is held High on master tF tCL tR SCLK (CPOL = 0) (Output) tCH tCL tF SCLK (CPOL = 1) (Output) tCH tR tDS tDH MISO (Input) tDV(ref) MSB in tDI Bits 14–1 tDV LSB in MOSI (Output) Master MSB out tF Bits 14– 1 Master LSB out tR Figure 4-18 SPI Master Timing (CPHA = 1) 56852 Technical Data, Rev. 8 30 Freescale Semiconductor Serial Peripheral Interface (SPI) Timing (Input) SS tC tCL tELD tCH tCL tR tF tELG SCLK (CPOL = 0) (Input) SCLK (CPOL = 1) (Input) tA tCH tR tF tD MISO (Output) tDS Slave MSB out tDH Bits 14–1 tDV Slave LSB out tDI tDI MOSI (Input) MSB in Bits 14–1 LSB in Figure 4-19 SPI Slave Timing (CPHA = 0) (Input) SS tF tR tCL tCH tELD tELG tCL tDV tA tCH tF tR tD tC SCLK (CPOL = 0) (Input) SCLK (CPOL = 1) (Input) MISO (Output) tDS Slave MSB out Bits 14–1 tDV tDH Slave LSB out tDI MOSI (Input) MSB in Bits 14–1 LSB in Figure 4-20 SPI Slave Timing (CPHA = 1) 56852 Technical Data, Rev. 8 Freescale Semiconductor 31 4.9 Quad Timer Timing Table 4-10 Timer Timing1, 2 Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL ≤ 50pF, fop = 120MHz Characteristic Timer input period Timer input high/low period Timer output period Timer output high/low period 1. Symbol PIN PINHL POUT POUTHL Min 2T + 3 1T + 3 2T - 3 1T - 3 Max — — — — Unit ns ns ns ns In the formulas listed, T = clock cycle. For fop = 120MHz operation and fipb = 60MHz, T = 8.33ns 2. Parameters listed are guaranteed by design. Timer Inputs PIN PINHL PINHL Timer Outputs POUT POUTHL POUTHL Figure 4-21 Timer Timing 56852 Technical Data, Rev. 8 32 Freescale Semiconductor Synchronous Serial Interface (SSI) Timing 4.10 Synchronous Serial Interface (SSI) Timing Table 4-11 SSI Master Mode1 Switching Characteristics Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL < 50pF, fop = 120MHz Parameter STCK frequency STCK period3 STCK high time STCK low time Output clock rise/fall time Delay from STCK high to STFS (bl) high - Master4 Delay from STCK high to STFS (wl) high - Master4 Delay from SRCK high to SRFS (bl) high - Master4 Delay from SRCK high to SRFS (wl) high - Master4 Delay from STCK high to STFS (bl) low - Master4 Delay from STCK high to STFS (wl) low - Master4 Delay from SRCK high to SRFS (bl) low - Master4 Delay from SRCK high to SRFS (wl) low - Master4 STCK high to STXD enable from high impedance - Master STCK high to STXD valid - Master STCK high to STXD not valid - Master STCK high to STXD high impedance - Master SRXD Setup time before SRCK low - Master SRXD Hold time after SRCK low - Master Symbol fs tSCKW tSCKH tSCKL Min Typ Max 152 Units MHz ns ns ns 66.7 33.4 33.4 4 ns -0.1 -0.1 1.0 1.0 -0.1 -0.1 0.1 0.1 1 1 0 0 ns ns ns ns ns ns ns ns ns ns ns ns ns ns tTFSBHM tTFSWHM tRFSBHM tRFSWHM tTFSBLM tTFSWLM tRFSBLM tRFSWLM tTXEM tTXVM tTXNVM tTXHIM tSM tHM -1.0 -1.0 0.1 0.1 -1.0 -1.0 -0.1 -0.1 0 0 -0.1 -4 4 4 Synchronous Operation (in addition to standard internal clock parameters) SRXD Setup time before STCK low - Master SRXD Hold time after STCK low - Master 1. Master mode is internally generated clocks and frame syncs tTSM tTHM 4 4 56852 Technical Data, Rev. 8 Freescale Semiconductor 33 2. Max clock frequency is IP_clk/4 = 60MHz / 4 = 15MHz for a 120MHz part. 3. All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP=0 in SCR2 and RSCKP=0 in SCSR) and a non-inverted frame sync (TFSI=0 in SCR2 and RFSI=0 in SCSR). If the polarity of the clock and/or the frame sync has been inverted, all the timings remain valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS in the tables and in the figures. 4. bl = bit length; wl = word length tSCKH STCK output tSCKW tSCKL tTFSBHM STFS (bl) output tTFSWHM STFS (wl) output tTXVM tTXEM STXD SRCK output tRFSBHM SRFS (bl) output tRFSWHM SRFS (wl) output First Bit tTFSBLM tTFSWLM tTXNVM Last Bit tTXHIM tRFBLM tRFSWLM tSM SRXD tHM tTSM tTHM Figure 4-22 Master Mode Timing Diagram 56852 Technical Data, Rev. 8 34 Freescale Semiconductor Synchronous Serial Interface (SSI) Timing Table 4-12 SSI Slave Mode1 Switching Characteristics Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL ≤ 50pF, fop = 120MHz Parameter STCK frequency STCK period3 STCK high time STCK low time Output clock rise/fall time Delay from STCK high to STFS (bl) high - Slave5 Delay from STCK high to STFS (wl) high - Slave5 Delay from SRCK high to SRFS (bl) high - Slave5 Delay from SRCK high to SRFS (wl) high - Slave5 Delay from STCK high to STFS (bl) low - Slave5 Delay from STCK high to STFS (wl) low - Slave5 Delay from SRCK high to SRFS (bl) low - Slave5 Delay from SRCK high to SRFS (wl) low - Slave5 STCK high to STXD enable from high impedance - Slave STCK high to STXD valid - Slave STFS high to STXD enable from high impedance (first bit) Slave STFS high to STXD valid (first bit) - Slave STCK high to STXD not valid - Slave STCK high to STXD high impedance - Slave SRXD Setup time before SRCK low - Slave Symbol fs tSCKW tSCKH tSCKL Min Typ Max 152 Units MHz ns ns ns 66.7 33.44 33.44 4 ns 29 29 29 29 29 29 29 29 15 15 15 15 15 15 — ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns tTFSBHS tTFSWHS tRFSBHS tRFSWHS tTFSBLS tTFSWLS tRFSBLS tRFSWLS tTXES tTXVS tFTXES tFTXVS tTXNVS tTXHIS tSS -1 -1 -1 -1 -29 -29 -29 -29 — 4 4 4 4 4 4 56852 Technical Data, Rev. 8 Freescale Semiconductor 35 Table 4-12 SSI Slave Mode1 Switching Characteristics (Continued) Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL ≤ 50pF, fop = 120MHz Parameter SRXD Hold time after SRCK low - Slave Symbol tHS Min 4 Typ Max — Units ns Synchronous Operation (in addition to standard external clock parameters) SRXD Setup time before STCK low - Slave SRXD Hold time after STCK low - Slave 1. Slave mode is externally generated clocks and frame syncs 2. Max clock frequency is IP_clk/4 = 60MHz / 4 = 15MHz for a 120MHz part. 3. All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP=0 in SCR2 and RSCKP=0 in SCSR) and a non-inverted frame sync (TFSI=0 in SCR2 and RFSI=0 in SCSR). If the polarity of the clock and/or the frame sync has been inverted, all the timings remain valid by inverting the clock signal STCK/SRCK and/or the frame sync STFS/SRFS in the tables and in the figures. 4. 50 percent duty cycle 5. bl = bit length; wl = word length tTSS tTHS 4 4 — — ? ? tSCKW tSCKH STCK input tTFSBHS STFS (bl) input tTFSWHS STFS (wl) input tFTXES tTXES STXD SRCK input tRFSBHS SRFS (bl) input tRFSWHS SRFS (wl) input tSS SRXD tHS tTSS tTHS tRFSWLS tTXVS First Bit tFTXVS tTXNVS tTXHIS Last Bit tTFSWLS tTFSBLS tSCKL tRFSBLS Figure 4-23 Slave Mode Clock Timing 56852 Technical Data, Rev. 8 36 Freescale Semiconductor Serial Communication Interface (SCI) Timing 4.11 Serial Communication Interface (SCI) Timing Table 4-13 SCI Timing4 Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL ≤ 50pF, fop = 120MHz Characteristic Baud Rate1 RXD2 Pulse Width TXD3 Pulse Width Symbol BR RXDPW TXDPW Min — 0.965/BR 0.965/BR Max (fMAX)/(32) 1.04/BR 1.04/BR Unit Mbps ns ns 1. fMAX is the frequency of operation of the system clock in MHz. 2. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1. 3. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1. 4. Parameters listed are guaranteed by design. RXD SCI receive data pin (Input) RXDPW Figure 4-24 RXD Pulse Width TXD SCI receive data pin (Input) TXDPW Figure 4-25 TXD Pulse Width MSCAN_RX CAN receive data pin (Input) T WAKE-UP Figure 4-26 Bus Wake-up Detection 56852 Technical Data, Rev. 8 Freescale Semiconductor 37 4.12 JTAG Timing Table 4-14 JTAG Timing1, 3 Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.62-1.98V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL ≤ 50pF, fop = 120MHz Characteristic TCK frequency of operation TCK cycle time TCK clock pulse width TMS, TDI data setup time TMS, TDI data hold time TCK low to TDO data valid TCK low to TDO tri-state TRST assertion time DE assertion time 2 Symbol fOP tCY tPW tDS tDH tDV tTS tTRST tDE Min DC 33.3 16.6 3 3 — — 35 4T Max 30 — — — — 12 10 — — Unit MHz ns ns ns ns ns ns ns ns 1. Timing is both wait state and frequency dependent. For the values listed, T = clock cycle. For120MHz operation, T = 8.33 ns 2. TCK frequency of operation must be less than 1/4 the processor rate. 3. Parameters listed are guaranteed by design. tCY tPW VIH tPW VM TCK (Input) VM = VIL + (VIH – VIL)/2 VM VIL Figure 4-27 Test Clock Input Timing Diagram 56852 Technical Data, Rev. 8 38 Freescale Semiconductor JTAG Timing TCK (Input) TDI TMS (Input) TDO (Output) tTS tDS tDH Input Data Valid tDV Output Data Valid TDO (Output) tDV TDO (Output) Output Data Valid Figure 4-28 Test Access Port Timing Diagram TRST (Input) tTRST Figure 4-29 TRST Timing Diagram DE tDE Figure 4-30 Enhanced OnCE—Debug Event 56852 Technical Data, Rev. 8 Freescale Semiconductor 39 4.13 GPIO Timing Table 4-15 GPIO Timing Operating Conditions: VSS = VSSIO = VSSA = 0V, VDD = 1.7-1.9V, VDDIO = VDDA = 3.0–3.6V, TA = –40° to +120°C, CL ≤ 50pF, fop = 120MHz Characteristic GPIO input period GPIO input high/low period GPIO output period GPIO output high/low period Symbol PIN PINHL POUT POUTHL Min 2T + 3 1T + 3 2T - 3 1T - 3 Max — — — — Unit ns ns ns ns GPIO Inputs PIN PINHL PINHL GPIO Outputs POUT POUTHL POUTHL Figure 4-31 GPIO Timing 56852 Technical Data, Rev. 8 40 Freescale Semiconductor GPIO Timing Part 5 56852 Packaging & Pinout Information This section contains package and pin-out information for the 81-pin MAPBGA configuration of the 56852. METALLIZED MARK FOR PIN 1 IDENTIFICATION IN THIS AREA 9 8 7 6 5 4 3 2 1 A D15 TD0 XTAL EXTAL VSSIO VDDIO SCK GPIOC1 IRQA B VDDIO DE TDI VSSA VDDA RXD SS GPIOC0 VSSIO C VSSIO D14 TMS TCK MOSI MISO CS2 IRQB VDDIO D D13 D11 D12 TRST RESET TXD CS1 CS0 VSS E VDD D8 D9 D10 A16 A0 WR RD VDD F VSS D5 D6 A17 A14 A3 A2 A1 A4 G VDDIO D3 D0 D7 A18 A12 A5 A6 VSSIO H D4 D2 D1 A19 A15 A11 A9 A8 VDDIO J VSSIO CLKO VDDIO VSSIO VDD VSS A13 A10 A7 Figure 5-1 Bottom-View, 56852 81-pin MAPBGA Package 56852 Technical Data, Rev. 8 Freescale Semiconductor 41 Table 5-1 56852 Pin Identification by Pin Number Pin No. E4 F2 F3 F4 F1 G3 G2 J1 H2 H3 J2 H4 G4 J3 F5 H5 E5 F6 G5 H6 J8 Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 CLKO Pin No. D2 D3 C3 G7 H7 H8 G8 H9 F8 F7 G6 E8 E7 E6 D8 D7 D9 C8 A9 B8 Signal Name CS0 CS1 CS2 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 DE Pin No. A6 B6 D1 J4 F9 B1 G1 J6 J9 C9 A5 A1 C2 C4 C5 B5 E1 J5 E9 C1 Signal Name EXTAL VSSA VSS VSS VSS VSSIO VSSIO VSSIO VSSIO VSSIO VSSIO IRQA IRQB MISO MOSI VDDA VDD VDD VDD VDDIO Pin No. H1 J7 G9 B9 A4 E2 D5 B4 A3 A2 B3 B2 C6 B7 A8 C7 D6 D4 E3 A7 Signal Name VDDIO VDDIO VDDIO VDDIO VDDIO RD RESET RXD SCK GPIOC1 SS GPIOC0 TCK TDI TDO TMS TRST TXD WR XTAL - 56852 Technical Data, Rev. 8 42 Freescale Semiconductor Thermal Design Considerations Part 6 Design Considerations 6.1 Thermal Design Considerations An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation: Equation 1: TJ = TA + (PD x RθJA) Where: TA = ambient temperature °C RθJA = package junction-to-ambient thermal resistance °C/W PD = power dissipation in package Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: Equation 2: RθJA = RθJC + RθCA Where: RθJA = package junction-to-ambient thermal resistance °C/W RθJC = package junction-to-case thermal resistance °C/W RθCA = package case-to-ambient thermal resistance °C/W RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the device thermal performance may need the additional modeling capability of a system level thermal simulation tool. The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether the thermal performance is adequate, a system level model may be appropriate. A complicating factor is the existence of three common definitions for determining the junction-to-case thermal resistance in plastic packages: • • • Measure the thermal resistance from the junction to the outside surface of the package (case) closest to the chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation across the surface. Measure the thermal resistance from the junction to where the leads are attached to the case. This definition is approximately equal to a junction to board thermal resistance. Use the value obtained by the equation (TJ – TT)/PD where TT is the temperature of the package case determined by a thermocouple. 56852 Technical Data, Rev. 8 Freescale Semiconductor 43 As noted above, the junction-to-case thermal resistances quoted in this data sheet are determined using the first definition. From a practical standpoint, that value is also suitable for determining the junction temperature from a case thermocouple reading in forced convection environments. In natural convection, using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will estimate a junction temperature slightly hotter than actual. Hence, the new thermal metric, Thermal Characterization Parameter, or ΨJT, has been defined to be (TJ – TT)/PD. This value gives a better estimate of the junction temperature in natural convection when using the surface temperature of the package. Remember that surface temperature readings of packages are subject to significant errors caused by inadequate attachment of the sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a 40-gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy. 6.2 Electrical Design Considerations CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. Use the following list of considerations to assure correct operation: • • Provide a low-impedance path from the board power supply to each VDD pin on the device, and from the board ground to each VSS (GND) pin. The minimum bypass requirement is to place six 0.01–0.1μF capacitors positioned as close as possible to the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of the ten VDD/VSS pairs, including VDDA/VSSA. Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND) pins are less than 0.5 inch per capacitor lead. Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for VDD and GND. Bypass the VDD and GND layers of the PCB with approximately 100μF, preferably with a high-grade capacitor such as a tantalum capacitor. Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal. Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VDD and GND circuits. All inputs must be terminated (i.e., not allowed to float) using CMOS levels. • • • • • • 56852 Technical Data, Rev. 8 44 Freescale Semiconductor Electrical Design Considerations • • • Take special care to minimize noise levels on the VDDA and VSSA pins. When using Wired-OR mode on the SPI or the IRQx pins, the user must provide an external pull-up device. Designs that utilize the TRST pin for JTAG port or Enhance OnCE module functionality (such as development or debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means to assert TRST independently of RESET. Designs that do not require debugging functionality, such as consumer products, should tie these pins together. The internal POR (Power on Reset) will reset the part at power on with reset asserted or pulled high but requires that TRST be asserted at power on. • 56852 Technical Data, Rev. 8 Freescale Semiconductor 45 Part 7 Ordering Information Table 7-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor sales office or authorized distributor to determine availability and to order parts. Table 7-1 56852 Ordering Information Part DSP56852 DSP56852 Supply Voltage 1.8–3.3 V 1.8–3.3 V Package Type Mold Array Process Ball Grid Array (MAPBGA) Mold Array Process Ball Grid Array (MAPBGA) Pin Count 81 81 Frequency (MHz) 120 120 Order Number DSP56852VF120 DSP56852VFE * *This package is RoHS compliant. 56852 Technical Data, Rev. 8 46 Freescale Semiconductor Electrical Design Considerations 56852 Technical Data, Rev. 8 Freescale Semiconductor 47 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. This product incorporates SuperFlash® technology licensed from SST. © Freescale Semiconductor, Inc. 2005. All rights reserved. DSP56852 Rev. 8 01/2007