56F801

56F801 Data Sheet Preliminary Technical Data 56F800 16-bit Digital Signal Controllers DSP56F801 Rev. 16 01/2007 freescale.com 56F801 General Description • Up to 30 MIPS operation at 60MHz core frequency • Up to 40 MIPS operation at 80MHz core frequency • DSP and MCU functionality in a unified, C-efficient architecture • MCU-friendly instruction set supports both DSP and controller functions: MAC, bit manipulation unit, 14 addressing modes • Hardware DO and REP loops • 6-channel PWM Module • Two 4-channel, 12-bit ADCs • Serial Communications Interface (SCI) • Serial Peripheral Interface (SPI) • 8K × 16-bit words (16KB) Program Flash • 1K × 16-bit words (2KB) Program RAM • 2K × 16-bit words (4KB) Data Flash • 1K × 16-bit words (2KB) Data RAM • 2K × 16-bit words (4KB) Boot Flash • General Purpose Quad Timer • JTAG/OnCETM port for debugging • On-chip relaxation oscillator • 11 shared GPIO • 48-pin LQFP Package 6 PWM Outputs PWMA RESET IRQA 6 JTAG/ OnCE Port VCAPC VDD 2 4 VSS 5* Digital Reg Analog Reg VDDA VSSA Fault Input 4 4 A/D1 A/D2 VREF ADC Interrupt Controller Low Voltage Supervisor Program Controller and Hardware Looping Unit Address Generation Unit Data ALU 16 x 16 + 36 → 36-Bit MAC Three 16-bit Input Registers Two 36-bit Accumulators Bit Manipulation Unit Quad Timer C Quad Timer D or GPIO Program Memory 8188 x 16 Flash 1024 x 16 SRAM Boot Flash 2048 x 16 Flash Data Memory 2048 x 16 Flash 1024 x 16 SRAM • PAB • • PDB • • • • IPBB CONTROLS 16 PLL 3 XDB2 CGDB XAB1 XAB2 16-Bit 56800 Core Clock Gen or Optional Internal Relaxation Osc. GPIOB3/XTAL GPIOB2/EXTAL • 2 SCI0 or GPIO INTERRUPT CONTROLS 16 COP/ Watchdog COP RESET MODULE CONTROLS ADDRESS BUS [8:0] DATA BUS [15:0] 4 SPI or GPIO Application-Specific Memory & Peripherals IPBus Bridge (IPBB) *includes TCS pin which is reserved for factory use and is tied to VSS 56F801 Block Diagram 56F801 Technical Data, Rev. 16 Freescale Semiconductor 3 Part 1 Overview 1.1 56F801 Features 1.1.1 • • • • • • • • • • • • • • Digital Signal Processing Core Efficient 16-bit 56800 family controller engine with dual Harvard architecture As many as 40 Million Instructions Per Second (MIPS) at 80MHz core frequency Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC) Two 36-bit accumulators including extension bits 16-bit bidirectional barrel shifter Parallel instruction set with unique processor addressing modes Hardware DO and REP loops Three internal address buses and one external address bus Four internal data buses and one external data bus Instruction set supports both DSP and controller functions Controller style addressing modes and instructions for compact code Efficient C compiler and local variable support Software subroutine and interrupt stack with depth limited only by memory JTAG/OnCE debug programming interface 1.1.2 • • Memory Harvard architecture permits as many as three simultaneous accesses to Program and Data memory On-chip memory including a low-cost, high-volume Flash solution — 8K × 16 bit words of Program Flash — 1K × 16-bit words of Program RAM — 2K × 16-bit words of Data Flash — 1K × 16-bit words of Data RAM — 2K × 16-bit words of Boot Flash • Programmable Boot Flash supports customized boot code and field upgrades of stored code through a variety of interfaces (JTAG, SPI) 1.1.3 • • • • • Peripheral Circuits for 56F801 Pulse Width Modulator (PWM) with six PWM outputs, two Fault inputs, fault-tolerant design with deadtime insertion; supports both center- and edge-aligned modes Two 12-bit, Analog-to-Digital Converters (ADCs), which support two simultaneous conversions with two 4-multiplexed inputs; ADC and PWM modules can be synchronized General Purpose Quad Timer: Timer D with three pins (or three additional GPIO lines) Serial Communication Interface (SCI) with two pins (or two additional GPIO lines) Serial Peripheral Interface (SPI) with configurable four-pin port (or four additional GPIO lines) 56F801 Technical Data, Rev. 16 4 Freescale Semiconductor 56F801 Description • • • • • • • Eleven multiplexed General Purpose I/O (GPIO) pins Computer-Operating Properly (COP) watchdog timer One dedicated external interrupt pin External reset pin for hardware reset JTAG/On-Chip Emulation (OnCE™) for unobtrusive, processor speed-independent debugging Software-programmable, Phase Locked Loop-based frequency synthesizer for the controller core clock Oscillator flexibility between either an external crystal oscillator or an on-chip relaxation oscillator for lower system cost and two additional GPIO lines 1.1.4 • • • • Energy Information Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs Uses a single 3.3V power supply On-chip regulators for digital and analog circuitry to lower cost and reduce noise Wait and Stop modes available 1.2 56F801 Description The 56F801 is a member of the 56800 core-based family of processors. It combines, on a single chip, the processing power of a DSP and the functionality of a microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because of its low cost, configuration flexibility, and compact program code, the 56F801 is well-suited for many applications. The 56F801 includes many peripherals that are especially useful for applications such as motion control, smart appliances, steppers, encoders, tachometers, limit switches, power supply and control, automotive control, engine management, noise suppression, remote utility metering, and industrial control for power, lighting, and automation. The 56800 core is based on a Harvard-style architecture consisting of three execution units operating in parallel, allowing as many as six operations per instruction cycle. The microprocessor-style programming model and optimized instruction set allow straightforward generation of efficient, compact code for both DSP and MCU applications. The instruction set is also highly efficient for C compilers to enable rapid development of optimized control applications. The 56F801 supports program execution from either internal or external memories. Two data operands can be accessed from the on-chip Data RAM per instruction cycle. The 56F801 also provides one external dedicated interrupt lines and up to 11 General Purpose Input/Output (GPIO) lines, depending on peripheral configuration. The 56F801 controller includes 8K words (16-bit) of Program Flash and 2K words of Data Flash (each programmable through the JTAG port) with 1K words of both Program and Data RAM. A total of 2K words of Boot Flash is incorporated for easy customer-inclusion of field-programmable software routines that can be used to program the main Program and Data Flash memory areas. Both Program and Data Flash memories can be independently bulk erased or erased in page sizes of 256 words. The Boot Flash memory can also be either bulk or page erased. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 5 A key application-specific feature of the 56F801 is the inclusion of a Pulse Width Modulator (PWM) module. This modules incorporates six complementary, individually programmable PWM signal outputs to enhance motor control functionality. Complementary operation permits programmable dead-time insertion, and separate top and bottom output polarity control. The up-counter value is programmable to support a continuously variable PWM frequency. Both edge- and center-aligned synchronous pulse width control (0% to 100% modulation) are supported. The device is capable of controlling most motor types: ACIM (AC Induction Motors), both BDC and BLDC (Brush and Brushless DC motors), SRM and VRM (Switched and Variable Reluctance Motors), and stepper motors. The PWMs incorporate fault protection and cycle-by-cycle current limiting with sufficient output drive capability to directly drive standard opto-isolators. A “smoke-inhibit”, write-once protection feature for key parameters is also included. The PWM is double-buffered and includes interrupt control to permit integral reload rates to be programmable from 1 to 16. The PWM modules provide a reference output to synchronize the Analog-to-Digital Converters. The 56F801 incorporates an 8 input, 12-bit Analog-to-Digital Converter (ADC). A full set of standard programmable peripherals is provided that include a Serial Communications Interface (SCI), a Serial Peripheral Interface (SPI), and two Quad Timers. Any of these interfaces can be used as General-Purpose Input/Outputs (GPIO) if that function is not required. An on-chip relaxation oscillator provides flexibility in the choice of either on-chip or externally supplied frequency reference for chip timing operations. Application code is used to select which source is to be used. 1.3 State of the Art Development Environment • • Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use component-based software application creation with an expert knowledge system. The Code Warrior Integrated Development Environment is a sophisticated tool for code navigation, compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards will support concurrent engineering. Together, PE, Code Warrior and EVMs create a complete, scalable tools solution for easy, fast, and efficient development. 56F801 Technical Data, Rev. 16 6 Freescale Semiconductor Product Documentation 1.4 Product Documentation The four documents listed in Table 1-1 are required for a complete description and proper design with the 56F801. Documentation is available from local Freescale distributors, Freescale semiconductor sales offices, Freescale Literature Distribution Centers, or online at www.freescale.com. Table 1-1 56F801 Chip Documentation Topic 56800E Family Manual DSP56F801/803/805/807 User’s Manual 56F801 Technical Data Sheet 56F801 Errata Description Detailed description of the 56800 family architecture, and 16-bit core processor and the instruction set Detailed description of memory, peripherals, and interfaces of the 56F801, 56F803, 56F805, and 56F807 Electrical and timing specifications, pin descriptions, and package descriptions (this document) Details any chip issues that might be present Order Number 56800EFM DSP56F801-7UM DSP56F801 56F801E 1.5 Data Sheet Conventions This data sheet uses the following conventions: OVERBAR This is used to indicate a signal that is active when pulled low. For example, the RESET pin is active when low. A high true (active high) signal is high or a low true (active low) signal is low. A high true (active high) signal is low or a low true (active low) signal is high. Signal/Symbol PIN PIN PIN PIN Logic State True False True False Signal State Asserted Deasserted Asserted Deasserted Voltage1 VIL/VOL VIH/VOH VIH/VOH VIL/VOL “asserted” “deasserted” Examples: 1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 7 Part 2 Signal/Connection Descriptions 2.1 Introduction The input and output signals of the 56F801 are organized into functional groups, as shown in Table 2-1 and as illustrated in Figure 2-1. In Table 2-2 through Table 2-12, each table row describes the signal or signals present on a pin. Table 2-1 Functional Group Pin Allocations Functional Group Power (VDD or VDDA) Ground (VSS or VSSA) Supply Capacitors PLL and Clock Interrupt and Program Control Pulse Width Modulator (PWM) Port Serial Peripheral Interface (SPI) Port1 Serial Communications Interface (SCI) Port1 Analog-to-Digital Converter (ADC) Port Quad Timer Module Port JTAG/On-Chip Emulation (OnCE) 1. Alternately, GPIO pins Number of Pins 5 6 2 2 2 7 4 2 9 3 6 Detailed Description Table 2-2 Table 2-3 Table 2-4 Table 2-5 Table 2-6 Table 2-7 Table 2-8 Table 2-9 Table 2-10 Table 2-11 Table 2-12 56F801 Technical Data, Rev. 16 8 Freescale Semiconductor Introduction Power Port Ground Port Power Port Ground Port VDD VSS VDDA VSSA 4 5* 1 1 VCAPC PWMA0-5 2 6 1 EXTAL (GPIOB2) XTAL (GPIOB3) FAULTA0 Other Supply Port PLL and Clock or GPIO 1 1 56F801 1 1 1 1 SCLK (GPIOB4) MOSI (GPIOB5) MISO (GPIOB6) SS (GPIOB7) SPI Port or GPIO 1 1 TXD0 (GPIOB0) RXD0 (GPIOB1) SCI0 Port or GPIO 8 1 ANA0-7 VREF ADCA Port 3 TCK TMS JTAG/OnCE™ Port TDI TDO TRST DE 1 1 1 1 1 1 1 1 TD0-2 (GPIOA0-2) Quad Timer D or GPIO IRQA RESET Interrupt/ Program Control *includes TCS pin which is reserved for factory use and is tied to VSS Figure 2-1 56F801 Signals Identified by Functional Group1 1. Alternate pin functionality is shown in parenthesis. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 9 2.2 Power and Ground Signals Table 2-2 Power Inputs No. of Pins 4 1 Signal Name VDD VDDA Signal Description Power—These pins provide power to the internal structures of the chip, and should all be attached to VDD. Analog Power—This pin is a dedicated power pin for the analog portion of the chip and should be connected to a low noise 3.3V supply. Table 2-3 Grounds No. of Pins 4 1 1 Signal Name VSS VSSA TCS Signal Description GND—These pins provide grounding for the internal structures of the chip, and should all be attached to VSS. Analog Ground—This pin supplies an analog ground. TCS—This Schmitt pin is reserved for factory use and must be tied to VSS for normal use. In block diagrams, this pin is considered an additional VSS. Table 2-4 Supply Capacitors and VPP No. of Pins 2 Signal Name VCAPC Signal Type Supply State During Reset Supply Signal Description VCAPC—Connect each pin to a 2.2 μFor greater bypass capacitor in order to bypass the core logic voltage regulator (required for proper chip operation). For more information, refer to Section 5.2. 2.3 Clock and Phase Locked Loop Signals Table 2-5 PLL and Clock No. of Pins 1 Signal Name EXTAL Signal Type Input State During Reset Input Signal Description External Crystal Oscillator Input—This input should be connected to an 8MHz external crystal or ceramic resonator. For more information, please refer to Section 3.5. Port B GPIO—This multiplexed pin is a General Purpose I/O (GPIO) pin that can be programmed as an input or output pin. This I/O can be utilized when using the on-chip relaxation oscillator so the EXTAL pin is not needed. GPIOB2 Input/ Output Input 56F801 Technical Data, Rev. 16 10 Freescale Semiconductor Interrupt and Program Control Signals Table 2-5 PLL and Clock (Continued) No. of Pins 1 Signal Name XTAL Signal Type Output State During Reset Chipdriven Signal Description Crystal Oscillator Output—This output should be connected to an 8MHz external crystal or ceramic resonator. For more information, please refer to Section 3.5. This pin can also be connected to an external clock source. For more information, please refer to Section 3.5.3. GPIOB3 Input/ Output Input Port B GPIO—This multiplexed pin is a General Purpose I/O (GPIO) pin that can be programmed as an input or output pin. This I/O can be utilized when using the on-chip relaxation oscillator so the XTAL pin is not needed. 2.4 Interrupt and Program Control Signals Table 2-6 Interrupt and Program Control Signals No. of Pins 1 Signal Name IRQA Signal Type Input (Schmitt) State During Reset Input Signal Description External Interrupt Request A—The IRQA input is a synchronized external interrupt request that indicates that an external device is requesting service. It can be programmed to be level-sensitive or negative-edge- triggered. Reset—This input is a direct hardware reset on the processor. When RESET is asserted low, the controller is initialized and placed in the Reset state. A Schmitt trigger input is used for noise immunity. When the RESET pin is deasserted, the initial chip operating mode is latched from the EXTBOOT pin. The internal reset signal will be deasserted synchronous with the internal clocks, after a fixed number of internal clocks. To ensure complete hardware reset, RESET and TRST should be asserted together. The only exception occurs in a debugging environment when a hardware device reset is required and it is necessary not to reset the OnCE/JTAG module. In this case, assert RESET, but do not assert TRST. 1 RESET Input (Schmitt) Input 2.5 Pulse Width Modulator (PWM) Signals Table 2-7 Pulse Width Modulator (PWMA) Signals No. of Pins 6 1 Signal Name PWMA0-5 FAULTA0 Signal Type Output Input (Schmitt) State During Reset Tri-stated Input Signal Description PWMA0-5— These are six PWMA output pins. FAULTA0— This fault input pin is used for disabling selected PWMA outputs in cases where fault conditions originate off-chip. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 11 2.6 Serial Peripheral Interface (SPI) Signals Table 2-8 Serial Peripheral Interface (SPI) Signals No. of Pins 1 Signal Name MISO Signal Type Input/Output State During Reset Input Signal Description SPI Master In/Slave Out (MISO)—This serial data pin is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can be individually programmed as input or output pin. After reset, the default state is MISO. 1 MOSI Input/Output Input SPI Master Out/Slave In (MOSI)—This serial data pin is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge that the slave device uses to latch the data. Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can be individually programmed as input or output pin. After reset, the default state is MOSI. 1 SCLK Input/Output Input SPI Serial Clock—In master mode, this pin serves as an output, clocking slaved listeners. In slave mode, this pin serves as the data clock input. Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can be individually programmed as an input or output pin. After reset, the default state is SCLK. 1 SS Input Input SPI Slave Select—In master mode, this pin is used to arbitrate multiple masters. In slave mode, this pin is used to select the slave. Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can be individually programmed as an input or output pin. After reset, the default state is SS. Input/Output GPIOB6 Input Input/Output GPIOB5 Input Input/Output GPIOB4 Input GPIOB7 Input/Output Input 56F801 Technical Data, Rev. 16 12 Freescale Semiconductor Serial Communications Interface (SCI) Signals 2.7 Serial Communications Interface (SCI) Signals Table 2-9 Serial Communications Interface (SCI0) Signals No. of Pins 1 Signal Name TXD0 GPIOB0 Signal Type Output Input/Output State During Reset Input Input Signal Description Transmit Data (TXD0)—SCI0 transmit data output Port B GPIO—This pin is a General Purpose I/O (GPIO) pin that can be individually programmed as an input or output pin. After reset, the default state is SCI output. 1 RXD0 GPIOB1 Input Input/Output Input Input Receive Data (RXD0)—SCI0 receive data input Port B GPIO—This pin is a General Purpose I/O (GPIO) pin that can be individually programmed as an input or output pin. After reset, the default state is SCI input. 2.8 Analog-to-Digital Converter (ADC) Signals Table 2-10 Analog to Digital Converter Signals No. of Pins 4 4 1 Signal Name ANA0-3 ANA4-7 VREF Signal Type Input Input Input State During Reset Input Input Input Signal Description ANA0-3—Analog inputs to ADC, channel 1 ANA4-7—Analog inputs to ADC, channel 2 VREF—Analog reference voltage for ADC. Must be set to VDDA-0.3V for optimal performance. 2.9 Quad Timer Module Signals Table 2-11 Quad Timer Module Signals No. of Pins 3 Signal Name TD0-2 Signal Type Input/Output Input/Output GPIOA0-2 Input Port A GPIO—This pin is a General Purpose I/O (GPIO) pin that can be individually programmed as an input or output pin. After reset, the default state is the quad timer input. State During Reset Input Signal Description TD0-2—Timer D Channel 0-2 56F801 Technical Data, Rev. 16 Freescale Semiconductor 13 2.10 JTAG/OnCE Table 2-12 JTAG/On-Chip Emulation (OnCE) Signals No. of Pins 1 Signal Name TCK Signal Type Input (Schmitt) Input (Schmitt) State During Reset Input, pulled low internally Signal Description Test Clock Input—This input pin provides a gated clock to synchronize the test logic and shift serial data to the JTAG/OnCE port. The pin is connected internally to a pull-down resistor. 1 TMS Input, pulled Test Mode Select Input—This input pin is used to sequence the JTAG high internally TAP controller’s state machine. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor. Note: Always tie the TMS pin to VDD through a 2.2K resistor. 1 TDI Input (Schmitt) Output Input, pulled Test Data Input—This input pin provides a serial input data stream to the high internally JTAG/OnCE port. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor. Tri-stated Test Data Output—This tri-statable output pin provides a serial output data stream from the JTAG/OnCE port. It is driven in the Shift-IR and Shift-DR controller states, and changes on the falling edge of TCK. 1 TDO 1 TRST Input (Schmitt) Input, pulled Test Reset—As an input, a low signal on this pin provides a reset signal to high internally the JTAG TAP controller. To ensure complete hardware reset, TRST should be asserted whenever RESET is asserted. The only exception occurs in a debugging environment when a hardware device reset is required and it is necessary not to reset the OnCE/JTAG module. In this case, assert RESET, but do not assert TRST. Note: For normal operation, connect TRST directly to VSS. If the design is to be used in a debugging environment, TRST may be tied to VSS through a 1K resistor. 1 DE Output Output Debug Event—DE provides a low pulse on recognized debug events. Part 3 Specifications 3.1 General Characteristics The 56F801 is fabricated in high-density CMOS with 5-volt tolerant TTL-compatible digital inputs. The term “5-volt tolerant” refers to the capability of an I/O pin, built on a 3.3V compatible process technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V and 5V- compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ± 10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings of 3.3V I/O levels while being able to receive 5V levels without being damaged. Absolute maximum ratings given in Table 3-1 are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to the device. 56F801 Technical Data, Rev. 16 14 Freescale Semiconductor General Characteristics The 56F801 DC and AC electrical specifications are preliminary and are from design simulations. These specifications may not be fully tested or guaranteed at this early stage of the product life cycle. Finalized specifications will be published after complete characterization and device qualifications have been completed. CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. Table 3-1 Absolute Maximum Ratings Characteristic Supply voltage All other input voltages, excluding Analog inputs Voltage difference VDD to VDDA Voltage difference VSS to VSSA Analog inputs ANA0-7 and VREF Analog inputs EXTAL, XTAL Current drain per pin excluding VDD, VSS, & PWM ouputs Symbol VDD VIN ΔVDD ΔVSS VIN VIN I Min VSS – 0.3 VSS – 0.3 - 0.3 - 0.3 VSSA– 0.3 VSSA– 0.3 — Max VSS + 4.0 VSS + 5.5V 0.3 0.3 VDDA+ 0.3 VSSA+ 3.0 10 Unit V V V V V V mA Table 3-2 Recommended Operating Conditions Characteristic Supply voltage, digital Supply Voltage, analog Voltage difference VDD to VDDA Voltage difference VSS to VSSA ADC reference voltage1 Ambient operating temperature 1. VREF must be 0.3 below VDDA. Symbol VDD VDDA ΔVDD ΔVSS VREF TA Min 3.0 3.0 -0.1 -0.1 2.7 –40 Typ 3.3 3.3 – – Max 3.6 3.6 0.1 0.1 3.3V 85 Unit V V V V V °C 56F801 Technical Data, Rev. 16 Freescale Semiconductor 15 Table 3-3 Thermal Characteristics6 Value Characteristic Comments Symbol 48-pin LQFP Unit Notes Junction to ambient Natural convection Junction to ambient (@1m/sec) Junction to ambient Natural convection Junction to ambient (@1m/sec) Junction to case Junction to center of case I/O pin power dissipation Power dissipation Junction to center of case Four layer board (2s2p) RθJA RθJMA RθJMA (2s2p) RθJMA RθJC ΨJT P I/O PD PDMAX 50.6 °C/W 2 47.4 39.1 °C/W °C/W 2 1,2 Four layer board (2s2p) 37.9 17.3 1.2 User Determined P D = (IDD x VDD + P I/O) (TJ - TA) /RθJA °C/W °C/W °C/W W W W 1,2 3 4, 5 7 Notes: 1. 2. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p thermal test board. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes (2s2p where s is the number of signal layers and p is the number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is being used with a heat sink. Thermal Characterization Parameter, Psi-JT (ΨJT ), is the "resistance" from junction to reference point thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction temperature in steady state customer environments. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. See Section 5.1 from more details on thermal design considerations. TJ = Junction Temperature TA = Ambient Temperature 3. 4. 5. 6. 7. 56F801 Technical Data, Rev. 16 16 Freescale Semiconductor DC Electrical Characteristics 3.2 DC Electrical Characteristics Table 3-4 DC Electrical Characteristics Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF Characteristic Input high voltage (XTAL/EXTAL) Input low voltage (XTAL/EXTAL) Input high voltage [GPIOB(2:3)]1 Input low voltage [GPIOB(2:3)]1 Input high voltage (Schmitt trigger inputs)2 Input low voltage (Schmitt trigger inputs)2 Input high voltage (all other digital inputs) Input low voltage (all other digital inputs) Input current high (pullup/pulldown resistors disabled, VIN=VDD) Input current low (pullup/pulldown resistors disabled, VIN=VSS) Input current high (with pullup resistor, VIN=VDD) Input current low (with pullup resistor, VIN=VSS) Input current high (with pulldown resistor, VIN=VDD) Input current low (with pulldown resistor, VIN=VSS) Nominal pullup or pulldown resistor value Output tri-state current low Output tri-state current high Input current high (analog inputs, VIN=VDDA)3 Input current low (analog inputs, VIN=VSSA)3 Output High Voltage (at IOH) Output Low Voltage (at IOL) Output source current Output sink current PWM pin output source current4 PWM pin output sink current5 Input capacitance Output capacitance Symbol VIHC VILC VIH[GPIOB(2:3)] VIL[GPIOB(2:3)] VIHS VILS VIH VIL IIH IIL IIHPU IILPU IIHPD IILPD RPU, RPD IOZL IOZH IIHA IILA VOH VOL IOH IOL IOHP IOLP CIN COUT -10 -10 -15 -15 VDD – 0.7 — 4 4 10 16 — — Min 2.25 0 2.0 -0.3 2.2 -0.3 2.0 -0.3 -1 -1 -1 -210 20 -1 Typ — — — — — — — — — — — — — — 30 — — — — — — — — — — 8 12 10 10 15 15 — 0.4 — — — — — — Max 2.75 0.5 3.6 0.8 5.5 0.8 5.5 0.8 1 1 1 -50 180 1 Unit V V V V V V V V μA μA μA μA μA μA KΩ μA μA μA μA V V mA mA mA mA pF pF 56F801 Technical Data, Rev. 16 Freescale Semiconductor 17 Table 3-4 DC Electrical Characteristics (Continued) Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF Characteristic VDD supply current Run7 (80MHz operation) Run7 (60MHz operation) Wait8 Stop Low Voltage Interrupt, external power supply9 Low Voltage Interrupt, internal power supply10 Power on Reset11 VEIO VEIC VPOR Symbol IDDT6 — — — — 2.4 2.0 — 120 102 96 62 2.7 2.2 1.7 130 111 102 70 3.0 2.4 2.0 mA mA mA mA V V V Min Typ Max Unit 1. Since the GPIOB[2:3] signals are shared with the XTAL/EXTAL function, these inputs are not 5.5 volt tolerant. 2. Schmitt Trigger inputs are: FAULTA0, IRQA, RESET, TCS, TCK, TMS, TDI, and TRST. 3. Analog inputs are: ANA[0:7], XTAL and EXTAL. Specification assumes ADC is not sampling. 4. PWM pin output source current measured with 50% duty cycle. 5. PWM pin output sink current measured with 50% duty cycle. 6. IDDT = IDD + IDDA (Total supply current for VDD + VDDA) 7. Run (operating) IDD measured using 8MHz clock source. All inputs 0.2V from rail; outputs unloaded. All ports configured as inputs; measured with all modules enabled. 8. Wait IDD measured using external square wave clock source (fosc = 8MHz) into XTAL; all inputs 0.2V from rail; no DC loads; less than 50pF on all outputs. CL = 20pF on EXTAL; all ports configured as inputs; EXTAL capacitance linearly affects wait IDD; measured with PLL enabled. 9. This low voltage interrupt monitors the VDDA external power supply. VDDA is generally connected to the same potential as VDD via separate traces. If VDDA drops below VEIO, an interrupt is generated. Functionality of the device is guaranteed under transient conditions when VDDA>VEIO (between the minimum specified VDD and the point when the VEIO interrupt is generated). 10. This low voltage interrupt monitors the internally regulated core power supply. If the output from the internal voltage is regulator drops below VEIC, an interrupt is generated. Since the core logic supply is internally regulated, this interrupt will not be generated unless the external power supply drops below the minimum specified value (3.0V). 11. Power–on reset occurs whenever the internally regulated 2.5V digital supply drops below 1.5V typical. While power is ramping up, this signal remains active for as long as the internal 2.5V is below 1.5V typical no matter how long the ramp up rate is. The internally regulated voltage is typically 100 mV less than VDD during ramp up until 2.5V is reached, at which time it self regulates. 56F801 Technical Data, Rev. 16 18 Freescale Semiconductor AC Electrical Characteristics 160 IDD Digital IDD Analog IDD Total 120 IDD (mA) 80 40 0 10 20 30 40 Freq. (MHz) 50 60 70 80 Figure 3-1 Maximum Run IDD vs. Frequency (see Note 7. in Table 3-15) 3.3 AC Electrical Characteristics Timing waveforms in Section 3.3 are tested using the VIL and VIH levels specified in the DC Characteristics table. In Figure 3-2 the levels of VIH and VIL for an input signal are shown. VIH Input Signal Midpoint1 Fall Time Note: The midpoint is VIL + (VIH – VIL)/2. Low High 90% 50% 10% VIL Rise Time Figure 3-2 Input Signal Measurement References Figure 3-3 shows the definitions of the following signal states: • • • • Active state, when a bus or signal is driven, and enters a low impedance state. Tri-stated, when a bus or signal is placed in a high impedance state. Data Valid state, when a signal level has reached VOL or VOH. Data Invalid state, when a signal level is in transition between VOL and VOH. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 19 Data1 Valid Data1 Data Invalid State Data Active Data2 Valid Data2 Data Tri-stated Data3 Valid Data3 Data Active Figure 3-3 Signal States 3.4 Flash Memory Characteristics Table 3-5 Flash Memory Truth Table Mode Standby Read Word Program Page Erase Mass Erase XE1 L H H H H YE2 L H H L L SE3 L H L L L OE4 L H L L L PROG5 L L H L L ERASE6 L L L H H MAS17 L L L L H NVSTR8 L L H H H 1. X address enable, all rows are disabled when XE = 0 2. Y address enable, YMUX is disabled when YE = 0 3. Sense amplifier enable 4. Output enable, tri-state Flash data out bus when OE = 0 5. Defines program cycle 6. Defines erase cycle 7. Defines mass erase cycle, erase whole block 8. Defines non-volatile store cycle Table 3-6 IFREN Truth Table Mode Read Word program Page erase Mass erase IFREN = 1 Read information block Program information block Erase information block Erase both block IFREN = 0 Read main memory block Program main memory block Erase main memory block Erase main memory block 56F801 Technical Data, Rev. 16 20 Freescale Semiconductor Flash Memory Characteristics Table 3-7 Flash Timing Parameters Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF Characteristic Program time Erase time Mass erase time Endurance1 Data Retention1 Symbol Min 20 20 100 10,000 10 Typ – – – 20,000 30 Max – – – – – Unit us ms ms cycles years Figure Figure 3-4 Figure 3-5 Figure 3-6 Tprog* Terase* Tme* ECYC DRET The following parameters should only be used in the Manual Word Programming Mode PROG/ERASE to NVSTR set up time NVSTR hold time NVSTR hold time (mass erase) NVSTR to program set up time Recovery time Tnvs* – 5 – us Figure 3-4, Figure 3-5, Figure 3-6 Figure 3-4, Figure 3-5 Figure 3-6 Figure 3-4 Figure 3-4, Figure 3-5, Figure 3-6 Figure 3-4 Tnvh* Tnvh1* Tpgs* Trcv* – – – – 5 100 10 1 – – – – us us us us Cumulative program HV period2 Program hold time3 Address/data set up time3 Address/data hold time3 Thv Tpgh Tads Tadh – 3 – ms – – – – – – – – – Figure 3-4 Figure 3-4 Figure 3-4 1. One cycle is equal to an erase program and read. 2. Thv is the cumulative high voltage programming time to the same row before next erase. The same address cannot be programmed twice before next erase. 3. Parameters are guaranteed by design in smart programming mode and must be one cycle or greater. *The Flash interface unit provides registers for the control of these parameters. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 21 IFREN XADR XE Tadh YADR YE DIN Tads PROG Tnvs NVSTR Tpgs Thv Tnvh Trcv Tprog Tpgh Figure 3-4 Flash Program Cycle IFREN XADR XE YE=SE=OE=MAS1=0 ERASE Tnvs NVSTR Tnvh Terase Trcv Figure 3-5 Flash Erase Cycle 56F801 Technical Data, Rev. 16 22 Freescale Semiconductor External Clock Operation IFREN XADR XE MAS1 YE=SE=OE=0 ERASE Tnvs NVSTR Tnvh1 Tme Trcv Figure 3-6 Flash Mass Erase Cycle 3.5 External Clock Operation The 56F801 device clock is derived from either 1) an internal crystal oscillator circuit working in conjunction with an external crystal, 2) an external frequency source, or 3) an on-chip relaxation oscillator. To generate a reference frequency using the internal crystal oscillator circuit, a reference crystal external to the chip must be connected between the EXTAL and XTAL pins. Paragraphs 3.5.1 and 3.5.4 describe these methods of clocking. Whichever type of clock derivation is used provides a reference signal to a phase-locked loop (PLL) within the 56F801. In turn, the PLL generates a master reference frequency that determines the speed at which chip operations occur. Application code can be set to change the frequency source between the relaxation oscillator and crystal oscillator or external source, and power down the relaxation oscillator if desired. Selection of which clock is used is determined by setting the PRECS bit in the PLLCR (phase-locked loop control register) word (bit 2). If the bit is set to 1, the external crystal oscillator circuit is selected. If the bit is set to 0, the internal relaxation oscillator is selected, and this is the default value of the bit when power is first applied. 3.5.1 Crystal Oscillator The internal oscillator is also designed to interface with a parallel-resonant crystal resonator in the frequency range specified for the external crystal in Table 3-10. Figure 3-7 shows a recommended crystal oscillator circuit. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal parameters determine the component values required to provide maximum stability and reliable start-up. The crystal and associated components should be mounted as close as possible to the EXTAL and XTAL pins to minimize output distortion and start-up stabilization time. The internal 56F80x oscillator circuitry 56F801 Technical Data, Rev. 16 Freescale Semiconductor 23 is designed to have no external load capacitors present. As shown in Figure 3-8 no external load capacitors should be used. The 56F80x components internally are modeled as a parallel resonant oscillator circuit to provide a capacitive load on each of the oscillator pins (XTAL and EXTAL) of 10pF to 13pF over temperature and process variations. Using a typical value of internal capacitance on these pins of 12pF and a value of 3pF as a typical circuit board trace capacitance the parallel load capacitance presented to the crystal is 9pF as determined by the following equation: CL1 * CL2 CL = CL1 + CL2 + Cs = 12 + 12 12 * 12 + 3 = 6 + 3 = 9pF This is the value load capacitance that should be used when selecting a crystal and determining the actual frequency of operation of the crystal oscillator circuit. EXTAL XTAL Rz fc Recommended External Crystal Parameters: Rz = 1 to 3 MΩ fc = 8MHz (optimized for 8MHz) Figure 3-7 External Crystal Oscillator Circuit 3.5.2 Ceramic Resonator It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system design can tolerate the reduced signal integrity. In Figure 3-8, a typical ceramic resonator circuit is shown. Refer to supplier’s recommendations when selecting a ceramic resonator and associated components. The resonator and components should be mounted as close as possible to the EXTAL and XTAL pins. The internal 56F80x oscillator circuitry is designed to have no external load capacitors present. As shown in Figure 3-7 no external load capacitors should be used. Recommended Ceramic Resonator Parameters: Rz = 1 to 3 MΩ fc = 8MHz (optimized for 8MHz) EXTAL XTAL Rz fc Figure 3-8 Connecting a Ceramic Resonator Note: Freescale recommends only two terminal ceramic resonators vs. three terminal resonators (which contain an internal bypass capacitor to ground). 56F801 Technical Data, Rev. 16 24 Freescale Semiconductor External Clock Operation 3.5.3 External Clock Source The recommended method of connecting an external clock is given in Figure 3-9. The external clock source is connected to XTAL and the EXTAL pin is grounded. 56F801 XTAL EXTAL External Clock VSS Figure 3-9 Connecting an External Clock Signal Table 3-8 External Clock Operation Timing Requirements3 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C Characteristic Frequency of operation (external clock driver)1 Clock Pulse Width3, 4 Symbol fosc tPW Min 0 6.25 Typ — — Max 802 — Unit MHz ns 1. See Figure 3-9 for details on using the recommended connection of an external clock driver. 2. May not exceed 60MHz for the DSP56F801FA60 device. 3. The high or low pulse width must be no smaller than 6.25ns or the chip will not function. 4. Parameters listed are guaranteed by design. VIH External Clock 90% 50% 10% 90% 50% 10% tPW Note: The midpoint is VIL + (VIH – VIL)/2. tPW VIL Figure 3-10 External Clock Timing 3.5.4 Use of On-Chip Relaxation Oscillator An internal relaxation oscillator can supply the reference frequency when an external frequency source or crystal are not used. During a 56F801 boot or reset sequence, the relaxation oscillator is enabled by default, and the PRECS bit in the PLLCR word is set to 0 (Section 3.5). If an external oscillator is connected, the relaxation oscillator can be deselected instead by setting the PRECS bit in the PLLCR to 1. When this occurs, the PRECSS bit in the PLLSR (prescaler clock select status register) data word also sets to 1. If a changeover between internal and external oscillators is required at startup, internal device circuits 56F801 Technical Data, Rev. 16 Freescale Semiconductor 25 compensate for any asynchronous transitions between the two clock signals so that no glitches occur in the resulting master clock to the chip. When changing clocks, the user must ensure that the clock source is not switched until the desired clock is enabled and stable. To compensate for variances in the device manufacturing process, the accuracy of the relaxation oscillator can be incrementally adjusted to within ±0.25% of 8MHz by trimming an internal capacitor. Bits 0-7 of the IOSCTL (internal oscillator control) word allow the user to set in an additional offset (trim) to this preset value to increase or decrease capacitance. The default value of this trim is 128 units, making the power-up default capacitor size 432 units. Each unit added or deleted changes the output frequency by about 0.2%, allowing incremental adjustment until the desired frequency accuracy is achieved. Table 3-9 Relaxation Oscillator Characteristics Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C Characteristic Frequency Accuracy1 Frequency Drift over Temp Frequency Drift over Supply Trim Accuracy 1. Over full temperature range. Symbol Δf Δf/Δt Δf/ΔV ΔfT Min — — — — Typ +2 +0.1 0.1 +0.25 Max +5 — — — Unit % %/oC %/V % 56F801 Technical Data, Rev. 16 26 Freescale Semiconductor External Clock Operation 8.2 8.1 Output Frequency 8.0 7.9 7.8 7.7 7.6 -40 -25 -5 15 35 55 75 85 Temperature (oC) Figure 3-11 Typical Relaxation Oscillator Frequency vs. Temperature (Trimmed to 8MHz @ 25oC) 11 10 9 8 7 6 5 0 10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0 Figure 3-12 Typical Relaxation Oscillator Frequency vs. Trim Value @ 25oC 56F801 Technical Data, Rev. 16 Freescale Semiconductor 27 3.5.5 Phase Locked Loop Timing Table 3-10 PLL Timing Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C Characteristic Symbol fosc fout/2 tplls tplls Min 4 40 — — Typ 8 — 10 100 Max 10 803 — 200 Unit MHz MHz ms ms External reference crystal frequency for the PLL1 PLL output frequency2 PLL stabilization time4 0o to +85oC PLL stabilization time4 -40o to 0oC 1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly. The PLL is optimized for 8MHz input crystal. 2. ZCLK may not exceed 80MHz. For additional information on ZCLK and fout/2, please refer to the OCCS chapter in the User Manual. ZCLK = fop 3. Will not exceed 60MHz for the DSP56F801FA60 device. 4. This is the minimum time required after the PLL setup is changed to ensure reliable operation. 56F801 Technical Data, Rev. 16 28 Freescale Semiconductor Reset, Stop, Wait, Mode Select, and Interrupt Timing 3.6 Reset, Stop, Wait, Mode Select, and Interrupt Timing Table 3-11 Reset, Stop, Wait, Mode Select, and Interrupt Timing1, 5 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF Characteristic RESET Assertion to Address, Data and Control Signals High Impedance Minimum RESET Assertion Duration2 OMR Bit 6 = 0 OMR Bit 6 = 1 RESET De-assertion to First External Address Output Edge-sensitive Interrupt Request Width IRQA, IRQB Assertion to External Data Memory Access Out Valid, caused by first instruction execution in the interrupt service routine IRQA, IRQB Assertion to General Purpose Output Valid, caused by first instruction execution in the interrupt service routine IRQA Low to First Valid Interrupt Vector Address Out recovery from Wait State3 IRQA Width Assertion to Recover from Stop State4 Delay from IRQA Assertion to Fetch of first instruction (exiting Stop) OMR Bit 6 = 0 OMR Bit 6 = 1 Duration for Level Sensitive IRQA Assertion to Cause the Fetch of First IRQA Interrupt Instruction (exiting Stop) OMR Bit 6 = 0 OMR Bit 6 = 1 Delay from Level Sensitive IRQA Assertion to First Interrupt Vector Address Out Valid (exiting Stop) OMR Bit 6 = 0 OMR Bit 6 = 1 Symbol tRAZ tRA 275,000T 128T tRDA tIRW tIDM 33T 1.5T 15T — — 34T — — ns ns ns ns ns Figure 3-13 Figure 3-14 Figure 3-15 Min — Max 21 Unit ns See Figure 3-13 Figure 3-13 tIG 16T — ns Figure 3-15 tIRI tIW tIF 13T 2T — — ns ns Figure 3-16 Figure 3-17 Figure 3-17 — — tIRQ 275,000T 12T ns ns Figure 3-18 — — tII — — 275,000T 12T ns ns Figure 3-18 275,000T 12T ns ns 1. In the formulas, T = clock cycle. For an operating frequency of 80MHz, T = 12.5ns. 2. Circuit stabilization delay is required during reset when using an external clock or crystal oscillator in two cases: • After power-on reset • When recovering from Stop state 3. The minimum is specified for the duration of an edge-sensitive IRQA interrupt required to recover from the Stop state. This is not the minimum required so that the IRQA interrupt is accepted. 4. The interrupt instruction fetch is visible on the pins only in Mode 3. 5. Parameters listed are guaranteed by design. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 29 RESET tRAZ tRA tRDA A0–A15, D0–D15 PS, DS, RD, WR First Fetch First Fetch Figure 3-13 Asynchronous Reset Timing IRQA, IRQB tIRW Figure 3-14 External Interrupt Timing (Negative-Edge-Sensitive) A0–A15, PS, DS, RD, WR tIDM IRQA, IRQB First Interrupt Instruction Execution a) First Interrupt Instruction Execution General Purpose I/O Pin tIG IRQA, IRQB b) General Purpose I/O Figure 3-15 External Level-Sensitive Interrupt Timing 56F801 Technical Data, Rev. 16 30 Freescale Semiconductor Reset, Stop, Wait, Mode Select, and Interrupt Timing IRQA, IRQB tIRI A0–A15, PS, DS, RD, WR First Interrupt Vector Instruction Fetch Figure 3-16 Interrupt from Wait State Timing tIW IRQA tIF A0–A15, PS, DS, RD, WR First Instruction Fetch Not IRQA Interrupt Vector Figure 3-17 Recovery from Stop State Using Asynchronous Interrupt Timing tIRQ IRQA tII A0–A15 PS, DS, RD, WR First IRQA Interrupt Instruction Fetch Figure 3-18 Recovery from Stop State Using IRQA Interrupt Service 56F801 Technical Data, Rev. 16 Freescale Semiconductor 31 3.7 Serial Peripheral Interface (SPI) Timing Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF Characteristic Cycle time Master Slave Enable lead time Master Slave Enable lag time Master Slave Clock (SCK) high time Master Slave Clock (SCK) low time Master Slave Data setup time required for inputs Master Slave Data hold time required for inputs Master Slave Access time (time to data active from high-impedance state) Slave Disable time (hold time to high-impedance state) Slave Data Valid for outputs Master Slave (after enable edge) Data invalid Master Slave Rise time Master Slave Fall time Master Slave 1. Parameters listed are guaranteed by design. Table 3-12 SPI Timing1 Symbol tC 50 25 tELD — 25 tELG — 100 tCH 17.6 12.5 tCL 24.1 25 tDS 20 0 tDH 0 2 tA 4.8 tD 3.7 tDV — — tDI 0 0 tR — — tF — — Min Max — — — — — — — — — — — — — — 15 Unit ns ns ns ns See Figure Figures 3-19, 3-20, 3-21, 3-22 Figure 3-22 Figure 3-22 ns ns ns ns ns ns ns ns ns ns ns Figure 3-22 15.2 4.5 20.4 — — 11.5 10.0 9.7 9.0 ns ns ns ns ns ns ns ns ns Figures 3-19, 3-20, 3-21, 3-22 Figures 3-19, 3-20, 3-21, 3-22 Figures 3-19, 3-20, 3-21, 3-22 Figures 3-19, 3-20, 3-21, 3-22 Figures 3-19, 3-20, 3-21, 3-22 Figures 3-19, 3-20, 3-21, 3-22 Figures 3-19, 3-20, 3-21, 3-22 Figures 3-19, 3-20, 3-21, 3-22 Figure 3-22 56F801 Technical Data, Rev. 16 32 Freescale Semiconductor Serial Peripheral Interface (SPI) Timing SS (Input) SS is held High on master tC tR tCL tCH tCL tF tR tF SCLK (CPOL = 0) (Output) SCLK (CPOL = 1) (Output) tDS tDH tCH MISO (Input) MSB in tDI Bits 14–1 tDV LSB in tDI(ref) MOSI (Output) Master MSB out tF Bits 14–1 Master LSB out tR Figure 3-19 SPI Master Timing (CPHA = 0) SS (Input) tC SS is held High on master tF tR tCL tCH tCL tF SCLK (CPOL = 0) (Output) SCLK (CPOL = 1) (Output) tCH tR tDS tDH MISO (Input) tDV(ref) MSB in tDI Bits 14–1 tDV LSB in MOSI (Output) Master MSB out tF Bits 14– 1 Master LSB out tR Figure 3-20 SPI Master Timing (CPHA = 1) 56F801 Technical Data, Rev. 16 Freescale Semiconductor 33 SS (Input) tC tCL tR tF tELG SCLK (CPOL = 0) (Input) tELD tCH tCL SCLK (CPOL = 1) (Input) tA tCH tR tF tD MISO (Output) tDS Slave MSB out tDH Bits 14–1 tDV Slave LSB out tDI tDI MOSI (Input) MSB in Bits 14–1 LSB in Figure 3-21 SPI Slave Timing (CPHA = 0) SS (Input) tC tCL tR tCH tELD tELG tCL tF SCLK (CPOL = 0) (Input) SCLK (CPOL = 1) (Input) tDV tA tCH tR tF tD MISO (Output) tDS Slave MSB out tDH Bits 14–1 tDV Slave LSB out tDI MOSI (Input) MSB in Bits 14–1 LSB in Figure 3-22 SPI Slave Timing (CPHA = 1) 56F801 Technical Data, Rev. 16 34 Freescale Semiconductor Quad Timer Timing 3.8 Quad Timer Timing Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF Characteristic Timer input period Timer input high/low period Timer output period Timer output high/low period 1. Table 3-13 Timer Timing1, 2 Symbol PIN PINHL POUT POUTHL Min 4T+6 2T+3 2T 1T Max — — — — Unit ns ns ns ns In the formulas listed, T = clock cycle. For 80MHz operation, T = 12.5ns. 2. Parameters listed are guaranteed by design. Timer Inputs PIN PINHL PINHL Timer Outputs POUT POUTHL POUTHL Figure 3-23 Timer Timing 3.9 Serial Communication Interface (SCI) Timing Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF Characteristic Baud Rate1 RXD2 Pulse Width TXD3 Pulse Width Symbol BR RXDPW TXDPW Min Max (fMAX*2.5)/(80) 1.04/BR 1.04/BR Unit Mbps ns ns Table 3-14 SCI Timing4 — 0.965/BR 0.965/BR 1. fMAX is the frequency of operation of the system clock in MHz. 2. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1. 3. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1. 4. Parameters listed are guaranteed by design. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 35 RXD SCI receive data pin (Input) RXDPW Figure 3-24 RXD Pulse Width TXD SCI receive data pin (Input) TXDPW Figure 3-25 TXD Pulse Width 3.10 Analog-to-Digital Converter (ADC) Characteristics Table 3-15 ADC Characteristics Characteristic ADC input voltages Resolution Integral Non-Linearity3 Differential Non-Linearity Monotonicity ADC internal clock5 Conversion range Conversion time Sample time Input capacitance Gain Error (transfer gain)5 Offset Voltage5 fADIC RAD tADC tADS CADI EGAIN VOFFSET 0.5 VSSA — — — 1.00 +10 Symbol VADCIN RES INL DNL Min 01 12 — — Typ — — +/- 4 +/- 0.9 GUARANTEED — — 6 1 5 1.10 +230 5 VDDA — — — 1.15 +325 MHz V tAIC cycles6 tAIC cycles6 pF6 — mV Max VREF2 12 +/- 5 +/- 1 Unit V Bits LSB4 LSB4 56F801 Technical Data, Rev. 16 36 Freescale Semiconductor Analog-to-Digital Converter (ADC) Characteristics Table 3-15 ADC Characteristics (Continued) Characteristic Total Harmonic Distortion5 Signal-to-Noise plus Distortion5 Effective Number of Bits5 Spurious Free Dynamic Range5 Bandwidth ADC Quiescent Current (both ADCs) VREF Quiescent Current (both ADCs) Symbol THD SINAD ENOB SFDR BW IADC IVREF Min 55 54 8.5 60 — — — Typ 60 56 9.5 65 100 50 12 Max — — — — — — 16.5 Unit dB dB bit dB KHz mA mA 1. For optimum ADC performance, keep the minimum VADCIN value > 250mV. Inputs less than 250mV volts may convert to a digital output code of 0 or cause erroneous conversions. 2. VREF must be equal to or less than VDDA - 0.3V and must be greater than 2.7V. 3. Measured in 10-90% range. 4. LSB = Least Significant Bit. 5. Guaranteed by characterization. 6. tAIC = 1/fADIC ADC analog input 3 1 2 4 1. Parasitic capacitance due to package, pin to pin, and pin to package base coupling. (1.8pf) 2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing. (2.04pf) 3. Equivalent resistance for the ESD isolation resistor and the channel select mux. (500 ohms) 4. Sampling capacitor at the sample and hold circuit. Capacitor 4 is normally disconnected from the input and is only connected to it at sampling time. (1pf) Figure 3-26 Equivalent Analog Input Circuit 56F801 Technical Data, Rev. 16 Freescale Semiconductor 37 3.11 JTAG Timing Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF Characteristic TCK frequency of operation2 TCK cycle time TCK clock pulse width TMS, TDI data setup time TMS, TDI data hold time TCK low to TDO data valid TCK low to TDO tri-state TRST assertion time DE assertion time Symbol fOP tCY tPW tDS tDH tDV tTS tTRST tDE Min DC 100 50 0.4 1.2 — — 50 8T Max 10 — — — — 26.6 23.5 — — Unit MHz ns ns ns ns ns ns ns ns Table 3-16 JTAG Timing 1, 3 1. Timing is both wait state and frequency dependent. For the values listed, T = clock cycle. For 80MHz operation, T = 12.5ns. 2. TCK frequency of operation must be less than 1/8 the processor rate. 3. Parameters listed are guaranteed by design. tCY tPW VIH tPW VM TCK (Input) VM = VIL + (VIH – VIL)/2 VM VIL Figure 3-27 Test Clock Input Timing Diagram 56F801 Technical Data, Rev. 16 38 Freescale Semiconductor JTAG Timing TCK (Input) TDI TMS (Input) TDO (Output) tTS tDS tDH Input Data Valid tDV Output Data Valid TDO (Output) tDV TDO (Output) Output Data Valid Figure 3-28 Test Access Port Timing Diagram TRST (Input) tTRST Figure 3-29 TRST Timing Diagram DE tDE Figure 3-30 OnCE—Debug Event 56F801 Technical Data, Rev. 16 Freescale Semiconductor 39 Part 4 Packaging 4.1 Package and Pin-Out Information 56F801 This section contains package and pin-out information for the 48-pin LQFP configuration of the 56F801. VCAPC1 PWMA5 PWMA4 PWMA3 PWMA2 PWMA1 PWMA0 ANA7 ANA6 TDO TD1 TD2 /SS MISO MOSI SCLK TXDO VSS VDD RXD0 DE ORIENTATION MARK PIN 37 PIN 1 ANA5 VDD VSS ANA4 ANA3 VREF ANA2 ANA1 ANA0 FAULTA0 VSS VDD VSSA PIN 25 PIN 13 VDDA RESET IREQA TMS TCS TCK TDO TDI VCAPC2 Figure 4-1 Top View, 56F801 48-pin LQFP Package 56F801 Technical Data, Rev. 16 40 Freescale Semiconductor EXTAL TRST XTAL VSS VDD Package and Pin-Out Information 56F801 Table 4-1 56F801 Pin Identification by Pin Number Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 Signal Name TD0 TD1 TD2 SS MISO MOSI SCLK TXD0 VSS VDD RXD0 DE Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Signal Name TCS TCK TMS IREQA TDI VCAPC2 VSS VDD EXTAL XTAL TDO TRST Pin No. 25 26 27 28 29 30 31 32 33 34 35 36 Signal Name RESET VDDA VSSA VDD VSS FAULTA0 ANA0 ANA1 ANA2 VREF ANA3 ANA4 Pin No. 37 38 39 40 41 42 43 44 45 46 47 48 Signal Name ANA5 ANA6 ANA7 PWMA0 VCAPC1 VDD VSS PWMA1 PWMA2 PWMA3 PWMA4 PWMA5 56F801 Technical Data, Rev. 16 Freescale Semiconductor 41 4X 0.200 AB T-U Z 9 A1 48 37 A DETAIL Y P 1 36 T B B1 12 25 U V AE V1 AE 13 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE AB IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS T, U, AND Z TO BE DETERMINED AT DATUM PLANE AB. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE AC. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE AB. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350. 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076. 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BSC 0.050 0.150 0.090 0.200 0.500 0.700 0° 7° 12 ° REF 0.090 0.160 0.250 BSC 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF GAUGE PLANE Z S1 S 4X T, U, Z DETAIL Y 0.200 AC T-U Z AB G 0.080 AC AC BASE METAL AD M° TOP & BOTTOM DIM A A1 B B1 C D E F G H J K L M N P R S S1 V V1 W AA R 0.250 N J C E F D 0.080 M AC T-U Z H W DETAIL AD AA K L° SECTION AE-AE CASE 932-03 ISSUE F Figure 4-2 48-pin LQFP Mechanical Information Please see www.freescale.com for the most current case outline. 56F801 Technical Data, Rev. 16 42 Freescale Semiconductor Thermal Design Considerations Part 5 Design Considerations 5.1 Thermal Design Considerations An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation: Equation 1: TJ = T A + ( P D × Rθ JA ) Where: TA = ambient temperature °C RθJA = package junction-to-ambient thermal resistance °C/W PD = power dissipation in package Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: Equation 2: Rθ JA = R θ JC + R θ CA Where: RθJA = package junction-to-ambient thermal resistance °C/W RθJC = package junction-to-case thermal resistance °C/W RθCA = package case-to-ambient thermal resistance °C/W RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the device thermal performance may need the additional modeling capability of a system level thermal simulation tool. The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether the thermal performance is adequate, a system level model may be appropriate. Definitions: A complicating factor is the existence of three common definitions for determining the junction-to-case thermal resistance in plastic packages: • Measure the thermal resistance from the junction to the outside surface of the package (case) closest to the chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation across the surface. 56F801 Technical Data, Rev. 16 Freescale Semiconductor 43 • • Measure the thermal resistance from the junction to where the leads are attached to the case. This definition is approximately equal to a junction to board thermal resistance. Use the value obtained by the equation (TJ – TT)/PD where TT is the temperature of the package case determined by a thermocouple. The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back-calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction-to-case thermal resistance. 5.2 Electrical Design Considerations CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. Use the following list of considerations to assure correct operation: • • Provide a low-impedance path from the board power supply to each VDD pin on the controller, and from the board ground to each VSS (GND) pin. The minimum bypass requirement is to place 0.1 μF capacitors positioned as close as possible to the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of the ten VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better performance tolerances. Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND) pins are less than 0.5 inch per capacitor lead. • 56F801 Technical Data, Rev. 16 44 Freescale Semiconductor Electrical Design Considerations • • • Bypass the VDD and VSS layers of the PCB with approximately 100 μF, preferably with a high-grade capacitor such as a tantalum capacitor. Because the controller’s output signals have fast rise and fall times, PCB trace lengths should be minimal. Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VDD and GND circuits. Take special care to minimize noise levels on the VREF, VDDA and VSSA pins. Designs that utilize the TRST pin for JTAG port or OnCE module functionality (such as development or debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means to assert TRST independently of RESET. TRST must be asserted at power up for proper operation. Designs that do not require debugging functionality, such as consumer products, TRST should be tied low. Because the Flash memory is programmed through the JTAG/OnCE port, designers should provide an interface to this port to allow in-circuit Flash programming. • • • 56F801 Technical Data, Rev. 16 Freescale Semiconductor 45 Part 6 Ordering Information Table 6-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor sales office or authorized distributor to determine availability and to order parts. Table 6-1 56F801 Ordering Information Part 56F801 56F801 Supply Voltage 3.0–3.6 V 3.0–3.6 V Package Type Low Profile Plastic Quad Flat Pack (LQFP) Low Profile Plastic Quad Flat Pack (LQFP) Pin Count 48 48 Ambient Frequency (MHz) 80 60 Order Number DSP56F801FA80 DSP56F801FA60 56F801 56F801 3.0–3.6 V 3.0–3.6 V Low Profile Plastic Quad Flat Pack (LQFP) Low Profile Plastic Quad Flat Pack (LQFP) 48 48 80 60 DSP56F801FA80E* DSP56F801FA60E* *This package is RoHS compliant. 56F801 Technical Data, Rev. 16 46 Freescale Semiconductor Electrical Design Considerations 56F801 Technical Data, Rev. 16 Freescale Semiconductor 47 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. This product incorporates SuperFlash® technology licensed from SST. © Freescale Semiconductor, Inc. 2005. All rights reserved. DSP56F801 Rev. 16 01/2007