K40P100M100SF2

Freescale Semiconductor Data Sheet: Product Preview Document Number: K40P100M100SF2 Rev. 4, 3/2011 Supports the following: MK40N512VLL100 K40 Sub-Family Data Sheet K40P100M100SF2 Features • Operating Characteristics – Voltage range: 1.71 to 3.6 V – Flash write voltage range: 1.71 to 3.6 V – Temperature range (ambient): -40 to 105°C • Performance – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz • Memories and memory interfaces – Up to 512 KB program flash memory on nonFlexMemory devices – Up to 128 KB RAM – Serial programming interface (EzPort) • Clocks – 3 to 32 MHz crystal oscillator – 32 kHz crystal oscillator – Multi-purpose clock generator • System peripherals – 10 low-power modes to provide power optimization based on application requirements – Memory protection unit with multi-master protection – 16-channel DMA controller, supporting up to 64 request sources – External watchdog monitor – Software watchdog – Low-leakage wakeup unit • Security and integrity modules – Hardware CRC module to support fast cyclic redundancy checks – 128-bit unique identification (ID) number per chip • Human-machine interface – Segment LCD controller supporting up to 40 frontplanes and 8 backplanes, or 44 frontplanes and 4 backplanes – Low-power hardware touch sensor interface (TSI) – General-purpose input/output • Analog modules – Two 16-bit SAR ADCs – Programmable gain amplifier (up to x64) integrated into each ADC – 12-bit DAC – Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input – Voltage reference • Timers – Programmable delay block – Eight-channel motor control/general purpose/PWM timer – Two 2-channel quadrature decoder/general purpose timers – Periodic interrupt timers – 16-bit low-power timer – Carrier modulator transmitter – Real-time clock • Communication interfaces – USB full-/low-speed On-the-Go controller with onchip transceiver – Two Controller Area Network (CAN) modules – Three SPI modules – Two I2C modules – Five UART modules – Secure Digital host controller (SDHC) – I2S module This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. © 2010–2011 Freescale Semiconductor, Inc. Preliminary Table of Contents 1 Ordering parts...........................................................................3 1.1 Determining valid orderable parts......................................3 2 Part identification......................................................................3 2.1 Description.........................................................................3 2.2 Format...............................................................................3 2.3 Fields.................................................................................3 2.4 Example............................................................................4 3 Terminology and guidelines......................................................4 3.1 Definition: Operating requirement......................................4 3.2 Definition: Operating behavior...........................................5 3.3 Definition: Attribute............................................................5 3.4 Definition: Rating...............................................................6 3.5 Result of exceeding a rating..............................................6 3.6 Relationship between ratings and operating requirements......................................................................6 3.7 Guidelines for ratings and operating requirements............7 3.8 Definition: Typical value.....................................................7 3.9 Typical value conditions....................................................8 4 Ratings......................................................................................8 4.1 Thermal handling ratings...................................................9 4.2 Moisture handling ratings..................................................9 4.3 ESD handling ratings.........................................................9 4.4 Voltage and current operating ratings...............................9 5 General.....................................................................................10 5.1 Nonswitching electrical specifications...............................10 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.1.6 5.1.7 5.1.8 Voltage and current operating requirements......10 LVD and POR operating requirements...............11 Voltage and current operating behaviors............12 Power mode transition operating behaviors.......12 Power consumption operating behaviors............13 EMC radiated emissions operating behaviors....16 Designing with radiated emissions in mind.........17 Capacitance attributes........................................17 6.8.7 6.8.8 6.8.9 6.8.10 6.8.6 6.1 Core modules....................................................................19 6.1.1 6.1.2 Debug trace timing specifications.......................19 JTAG electricals..................................................20 6.2 System modules................................................................23 6.3 Clock modules...................................................................23 6.3.1 6.3.2 6.3.3 MCG specifications.............................................23 Oscillator electrical specifications.......................26 32kHz Oscillator Electrical Characteristics.........28 6.4 Memories and memory interfaces.....................................28 6.4.1 6.4.2 Flash (FTFL) electrical specifications.................29 EzPort Switching Specifications.........................30 6.5 Security and integrity modules..........................................31 6.6 Analog...............................................................................31 6.6.1 6.6.2 6.6.3 6.6.4 ADC electrical specifications..............................31 CMP and 6-bit DAC electrical specifications......38 12-bit DAC electrical characteristics...................41 Voltage reference electrical specifications..........44 6.7 Timers................................................................................45 6.8 Communication interfaces.................................................45 6.8.1 6.8.2 6.8.3 6.8.4 6.8.5 USB electrical specifications...............................46 USB DCD electrical specifications......................46 USB VREG electrical specifications...................46 CAN switching specifications..............................47 DSPI switching specifications (low-speed mode)..................................................................47 DSPI switching specifications (high-speed mode)..................................................................48 I2C switching specifications................................50 UART switching specifications............................50 SDHC specifications...........................................50 I2S switching specifications................................51 6.9 Human-machine interfaces (HMI)......................................53 6.9.1 6.9.2 TSI electrical specifications................................53 LCD electrical characteristics.............................54 5.2 Switching specifications.....................................................17 5.2.1 5.2.2 Device clock specifications.................................17 General switching specifications.........................18 7 Dimensions...............................................................................55 7.1 Obtaining package dimensions.........................................55 8 Pinout........................................................................................56 8.1 K40 Signal Multiplexing and Pin Assignments..................56 8.2 K40 Pinouts.......................................................................60 9 Revision History........................................................................61 5.3 Thermal specifications.......................................................18 5.3.1 5.3.2 Thermal operating requirements.........................18 Thermal attributes...............................................19 6 Peripheral operating requirements and behaviors....................19 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 2 Preliminary Freescale Semiconductor, Inc. Ordering parts 1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.freescale.com and perform a part number search for the following device numbers: PK40 and MK40. 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: Q K## M FFF T PP CCC N 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Q K## M Qualification status Kinetis family Flash memory type Description Values • M = Fully qualified, general market flow • P = Prequalification • K40 • N = Program flash only • X = Program flash and FlexMemory Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 3 Terminology and guidelines Field FFF Description Program flash memory size • • • • • • 32 = 32 KB 64 = 64 KB 128 = 128 KB 256 = 256 KB 512 = 512 KB 1M0 = 1 MB Values T PP Temperature range (°C) Package identifier • V = –40 to 105 • C = –40 to 85 • • • • • • • • • • • • • • • • • • FM = 32 QFN (5 mm x 5 mm) FT = 48 QFN (7 mm x 7 mm) LF = 48 LQFP (7 mm x 7 mm) EX = 64 QFN (9 mm x 9 mm) LH = 64 LQFP (10 mm x 10 mm) LK = 80 LQFP (12 mm x 12 mm) MB = 81 MAPBGA (8 mm x 8 mm) LL = 100 LQFP (14 mm x 14 mm) MC = 121 MAPBGA (8 mm x 8 mm) LQ = 144 LQFP (20 mm x 20 mm) MD = 144 MAPBGA (13 mm x 13 mm) MF = 196 MAPBGA (15 mm x 15 mm) MJ = 256 MAPBGA (17 mm x 17 mm) 50 = 50 MHz 72 = 72 MHz 100 = 100 MHz 120 = 120 MHz 150 = 150 MHz CCC Maximum CPU frequency (MHz) N Packaging type • R = Tape and reel • (Blank) = Trays 2.4 Example This is an example part number: MK40N512VMD100 3 Terminology and guidelines 3.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 4 Preliminary Freescale Semiconductor, Inc. Terminology and guidelines 3.1.1 Example This is an example of an operating requirement, which you must meet for the accompanying operating behaviors to be guaranteed: Symbol VDD Description 1.0 V core supply voltage 0.9 Min. 1.1 Max. V Unit 3.2 Definition: Operating behavior An operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 3.2.1 Example This is an example of an operating behavior, which is guaranteed if you meet the accompanying operating requirements: Symbol IWP Description Digital I/O weak pullup/ 10 pulldown current Min. 130 Max. µA Unit 3.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. 3.3.1 Example This is an example of an attribute: Symbol CIN_D Description Input capacitance: digital pins — Min. 7 Max. pF Unit K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 5 Terminology and guidelines 3.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: • Operating ratings apply during operation of the chip. • Handling ratings apply when the chip is not powered. 3.4.1 Example This is an example of an operating rating: Symbol VDD Description 1.0 V core supply voltage –0.3 Min. 1.2 Max. V Unit 3.5 Result of exceeding a rating 40 Failures in time (ppm) 30 20 The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. 10 0 Operating rating Measured characteristic K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 6 Preliminary Freescale Semiconductor, Inc. Terminology and guidelines 3.6 Relationship between ratings and operating requirements go a rh nd lin g in rat g( mi n.) ir qu em en t( n. mi ) ir qu em en t( x ma .) r go ha nd lin g in rat g( x.) ma e gr e gr Op era tin Op era tin Op era tin Op era tin Fatal range - Probable permanent failure Limited operating range - No permanent failure - Possible decreased life - Possible incorrect operation Normal operating range - No permanent failure - Correct operation Limited operating range - No permanent failure - Possible decreased life - Possible incorrect operation Fatal range - Probable permanent failure Handling range - No permanent failure –ȡ ȡ 3.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: • Never exceed any of the chip’s ratings. • During normal operation, don’t exceed any of the chip’s operating requirements. • If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 3.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: • Lies within the range of values specified by the operating behavior • Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. 3.8.1 Example 1 This is an example of an operating behavior that includes a typical value: K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 7 Ratings Symbol IWP Description Digital I/O weak pullup/pulldown current 10 Min. 70 Typ. 130 Max. µA Unit 3.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 5000 4500 4000 3500 IDD_STOP (μA) 3000 2500 2000 1500 1000 500 0 0.90 0.95 1.00 VDD (V) 1.05 1.10 TJ 150 °C 105 °C 25 °C –40 °C 3.9 Typical value conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol TA VDD Description Ambient temperature 3.3 V supply voltage 25 3.3 Value °C V Unit 4 Ratings K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 8 Preliminary Freescale Semiconductor, Inc. Ratings 4.1 Thermal handling ratings Symbol TSTG TSDR Description Storage temperature Solder temperature, lead-free Solder temperature, leaded Min. –55 — — Max. 150 260 245 Unit °C °C Notes 1 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. — Max. 3 Unit — Notes 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol VHBM VCDM ILAT Description Electrostatic discharge voltage, human body model Electrostatic discharge voltage, charged-device model Latch-up current at ambient temperature of 85°C Min. -2000 -500 -100 Max. +2000 +500 +100 Unit V V mA Notes 1 2 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 4.4 Voltage and current operating ratings Symbol VDD IDD VDIO Description Digital supply voltage Digital supply current Digital input voltage (except RESET, EXTAL, and XTAL) Table continues on the next page... Min. –0.3 — –0.3 Max. 3.8 185 5.5 Unit V mA V K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 9 General Symbol VAIO ID VDDA VUSB_DP VUSB_DM VREGIN VBAT Description Analog, RESET, EXTAL, and XTAL input voltage Instantaneous maximum current single pin limit (applies to all port pins) Analog supply voltage USB_DP input voltage USB_DM input voltage USB regulator input RTC battery supply voltage Min. –0.3 –25 VDD – 0.3 –0.3 –0.3 –0.3 –0.3 Max. VDD + 0.3 25 VDD + 0.3 3.63 3.63 6.0 3.8 Unit V mA V V V V V 5 General 5.1 Nonswitching electrical specifications 5.1.1 Voltage and current operating requirements Table 1. Voltage and current operating requirements Symbol VDD VDDA Description Supply voltage Analog supply voltage Min. 1.71 1.71 –0.1 –0.1 1.71 Max. 3.6 3.6 0.1 0.1 3.6 Unit V V V V V Notes VDD – VDDA VDD-to-VDDA differential voltage VSS – VSSA VSS-to-VSSA differential voltage VBAT VIH RTC battery supply voltage Input high voltage • 2.7 V ≤ VDD ≤ 3.6 V • 1.7 V ≤ VDD ≤ 2.7 V VIL Input low voltage • 2.7 V ≤ VDD ≤ 3.6 V • 1.7 V ≤ VDD ≤ 2.7 V VHYS Input hysteresis 0.7 × VDD 0.75 × VDD — — V V — — 0.06 × VDD Table continues on the next page... 0.35 × VDD 0.3 × VDD — V V V K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 10 Preliminary Freescale Semiconductor, Inc. General Table 1. Voltage and current operating requirements (continued) Symbol IIC Description DC injection current — single pin • VIN < VSS DC injection current — total MCU limit, includes sum of all stressed pins • VIN < VSS VRAM VRFVBAT VDD voltage required to retain RAM VBAT voltage required to retain the VBAT register file 0 –0.2 mA 1 0 1.2 TBD –5 — — mA V V Min. Max. Unit Notes 1 1. All functional non-supply pins are internally clamped to VSS, and induce an injection current when VIN is less than VSS. The IIC maximum operating requirement should not be exceeded. If this requirement cannot be met, the input must be current limited to the value specified. 5.1.2 LVD and POR operating requirements Table 2. VDD supply LVD and POR operating requirements Symbol VPOR VLVDH Description Falling VDD POR detect voltage Falling low-voltage detect threshold — high range (LVDV=01) Low-voltage warning thresholds — high range VLVW1H VLVW2H VLVW3H VLVW4H VHYSH VLVDL • Level 1 falling (LVWV=00) • Level 2 falling (LVWV=01) • Level 3 falling (LVWV=10) • Level 4 falling (LVWV=11) Low-voltage inhibit reset/recover hysteresis — high range Falling low-voltage detect threshold — low range (LVDV=00) Low-voltage warning thresholds — low range VLVW1L VLVW2L VLVW3L VLVW4L VHYSL VBG tLPO • Level 1 falling (LVWV=00) • Level 2 falling (LVWV=01) • Level 3 falling (LVWV=10) • Level 4 falling (LVWV=11) Low-voltage inhibit reset/recover hysteresis — low range Bandgap voltage reference Internal low power oscillator period factory trimmed TBD TBD TBD TBD TBD TBD 1.80 1.90 2.00 2.10 40 1.00 1000 TBD TBD TBD TBD TBD TBD V V V V mV V μs TBD TBD TBD TBD TBD 2.70 2.80 2.90 3.00 60 1.60 TBD TBD TBD TBD TBD V V V V mV V 1 Min. TBD TBD Typ. 1.1 2.56 Max. TBD TBD Unit V V 1 Notes K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 11 General 1. Rising thresholds are falling threshold + hysteresis voltage Table 3. VBAT power operating requirements Symbol Description Min. TBD Typ. 1.1 Max. TBD Unit V Notes VPOR_VBAT Falling VBAT supply POR detect voltage 5.1.3 Voltage and current operating behaviors Table 4. Voltage and current operating behaviors Symbol VOH Description Output high voltage — high drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOH = -10mA • 1.71 V ≤ VDD ≤ 2.7 V, IOH = -3mA Output high voltage — low drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOH = -2mA • 1.71 V ≤ VDD ≤ 2.7 V, IOH = -0.6mA IOHT VOL Output high current total for all ports Output low voltage — high drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 10mA • 1.71 V ≤ VDD ≤ 2.7 V, IOL = 3mA Output low voltage — low drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 2mA • 1.71 V ≤ VDD ≤ 2.7 V, IOL = 0.6mA IOLT IIN IOZ RPU RPD Output low current total for all ports Input leakage current (per pin) Hi-Z (off-state) leakage current (per pin) Internal pullup resistors Internal pulldown resistors — — — — — 30 30 0.5 0.5 100 1 1 50 50 V V mA μA μA kΩ kΩ 2 3 1 — — 0.5 0.5 V V VDD – 0.5 VDD – 0.5 — — — 100 V V mA VDD – 0.5 VDD – 0.5 — — V V Min. Max. Unit Notes 1. Measured at VDD=3.6V 2. Measured at VDD supply voltage = VDD min and Vinput = VSS 3. Measured at VDD supply voltage = VDD min and Vinput = VDD 5.1.4 Power mode transition operating behaviors All specifications except tPOR, and VLLSx→RUN recovery times in the following table assume this clock configuration: K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 12 Preliminary Freescale Semiconductor, Inc. General • CPU and system clocks = 100 MHz • Bus clock = 50 MHz • Flash clock = 25 MHz Table 5. Power mode transition operating behaviors Symbol tPOR Description After a POR event, amount of time from the point VDD reaches 1.8V to execution of the first instruction across the operating temperature range of the chip. RUN → VLLS1 → RUN • RUN → VLLS1 • VLLS1 → RUN RUN → VLLS2 → RUN • RUN → VLLS2 • VLLS2 → RUN RUN → VLLS3 → RUN • RUN → VLLS3 • VLLS3 → RUN RUN → LLS → RUN • RUN → LLS • LLS → RUN RUN → STOP → RUN • RUN → STOP • STOP → RUN RUN → VLPS → RUN • RUN → VLPS • VLPS → RUN 1. Normal boot (FTFL_OPT[LPBOOT]=1) — — 4.1 5.8 μs μs — — 4.1 4.2 μs μs — — 4.1 5.9 μs μs — — 4.1 49.2 μs μs — — 4.1 49.3 μs μs — — 4.1 123.8 μs μs Min. — Max. 300 Unit μs Notes 1 5.1.5 Power consumption operating behaviors Table 6. Power consumption operating behaviors Symbol IDDA Description Analog supply current Min. — Table continues on the next page... Typ. — Max. TBD Unit mA Notes 1 K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 13 General Table 6. Power consumption operating behaviors (continued) Symbol IDD_RUN Description Run mode current — all peripheral clocks disabled, code executing from flash • @ 1.8V • @ 3.0V IDD_RUN Run mode current — all peripheral clocks enabled, code executing from flash • @ 1.8V • @ 3.0V IDD_RUN_M Run mode current — all peripheral clocks enabled and peripherals active, code executing AX from flash • @ 1.8V • @ 3.0V IDD_WAIT IDD_WAIT IDD_STOP IDD_VLPR IDD_VLPR IDD_VLPW IDD_VLPS IDD_LLS IDD_VLLS3 Wait mode high frequency current at 3.0 V — all peripheral clocks disabled Wait mode reduced frequency current at 3.0 V — all peripheral clocks disabled Stop mode current at 3.0 V Very-low-power run mode current at 3.0 V — all peripheral clocks disabled Very-low-power run mode current at 3.0 V — all peripheral clocks enabled Very-low-power wait mode current at 3.0 V Very-low-power stop mode current at 3.0 V Low leakage stop mode current at 3.0 V Very low-leakage stop mode 3 current at 3.0 V • 128KB RAM devices IDD_VLLS2 IDD_VLLS1 IDD_VBAT Very low-leakage stop mode 2 current at 3.0 V Very low-leakage stop mode 1 current at 3.0 V Average current when CPU is not accessing RTC registers at 3.0 V — — — — 8 4 2 550 TBD TBD TBD TBD μA μA μA nA 9 — — 55 56 TBD TBD mA mA 4 — — — — — — — — — — 85 85 35 15 0.4 1.25 TBD 1.05 50 12 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA μA μA 6 7 8 2 5 — — 40 42 TBD TBD mA mA 3 Min. Typ. Max. Unit Notes 2 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. 100MHz core and system clock, 50MHz bus clock, and 25MHz flash clock . MCG configured for FEI mode. All peripheral clocks disabled. 3. 100MHz core and system clock, 50MHz bus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled, but peripherals are not in active operation. 4. 100MHz core and system clock, 50MHz bus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled, and peripherals are in active operation. 5. 25MHz core and system clock, 25MHz bus clock, and 12.5MHz flash clock. MCG configured for FEI mode. 6. 2 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks disabled. Code executing from flash. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 14 Preliminary Freescale Semiconductor, Inc. General 7. 2 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks enabled but peripherals are not in active operation. Code executing from flash. 8. 2 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks disabled. 9. Includes 32kHz oscillator current and RTC operation. 5.1.5.1 • • • • • Diagram: Typical IDD_RUN operating behavior The following data was measured under these conditions: MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE) All peripheral clocks disabled except FTFL LVD disabled, USB regulator disabled No GPIOs toggled Code execution from flash Figure 1. Run mode supply current vs. core frequency — all peripheral clocks disabled The following data was measured under these conditions: • MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE) K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 15 General • • • • All peripheral clocks enabled but peripherals are not in active operation LVD disabled, USB regulator disabled No GPIOs toggled Code execution from flash Figure 2. Run mode supply current vs. core frequency — all peripheral clocks enabled 5.1.6 EMC radiated emissions operating behaviors Table 7. EMC radiated emissions operating behaviors Symbol VRE1 VRE2 VRE3 VRE4 Description Radiated emissions voltage, band 1 Radiated emissions voltage, band 2 Radiated emissions voltage, band 3 Radiated emissions voltage, band 4 Frequency band (MHz) 0.15–50 50–150 150–500 500–1000 0.15–1000 Typ. TBD TBD TBD TBD TBD — 2, 3 Unit dBμV Notes 1, 2 VRE_IEC_SAE IEC and SAE level K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 16 Preliminary Freescale Semiconductor, Inc. General 1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/ Wideband TEM (GTEM) Cell Method. 2. VDD = 3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz 3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/Wideband TEM (GTEM) Cell Method. 5.1.7 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to http://www.freescale.com. 2. Perform a keyword search for “EMC design.” 5.1.8 Capacitance attributes Table 8. Capacitance attributes Symbol CIN_A CIN_D Description Input capacitance: analog pins Input capacitance: digital pins Min. — — Max. 7 7 Unit pF pF 5.2 Switching specifications 5.2.1 Device clock specifications Symbol Description Normal run mode fSYS fSYS_USB fBUS fFLASH System and core clock System and core clock when USB in operation Bus clock Flash clock VLPR mode fSYS fBUS System and core clock Bus clock — — Table continues on the next page... 2 2 MHz MHz — 20 — — 100 — 50 25 MHz MHz MHz MHz Min. Max. Unit Notes K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 17 General Symbol fFLASH Description Flash clock Min. — Max. 1 Unit MHz Notes 5.2.2 General switching specifications These general purpose specifications apply to all signals configured for GPIO, UART, CAN, CMT, and I2C signals. Symbol Description GPIO pin interrupt pulse width (digital glitch filter disabled) — Synchronous path GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter enabled) — Asynchronous path GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter disabled) — Asynchronous path External reset pulse width (digital glitch filter disabled) Mode select (EZP_CS) hold time after reset deassertion Port rise and fall time (high drive strength) • Slew disabled • Slew enabled Port rise and fall time (low drive strength) • Slew disabled • Slew enabled 1. 2. 3. 4. The greater synchronous and asynchronous timing must be met. This is the shortest pulse that is guaranteed to be recognized. 75pF load 15pF load — — 32 36 ns ns — — 12 36 ns ns 4 Min. 1.5 100 16 TBD 2 Max. — — — — — Bus clock cycles 3 Unit Bus clock cycles ns ns Notes 1 2 2 5.3 Thermal specifications 5.3.1 Thermal operating requirements Table 9. Thermal operating requirements Symbol TJ TA Description Die junction temperature Ambient temperature Min. –40 –40 Max. 125 105 Unit °C °C K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 18 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 5.3.2 Thermal attributes Board type Symbol Description Thermal resistance, junction to ambient (natural convection) Thermal resistance, junction to ambient (natural convection) Thermal resistance, junction to ambient (200 ft./min. air speed) Thermal resistance, junction to ambient (200 ft./min. air speed) Thermal resistance, junction to board Thermal resistance, junction to case Thermal characterization parameter, junction to package top outside center (natural convection) 100 LQFP Unit TBD TBD TBD TBD TBD TBD TBD °C/W °C/W °C/W °C/W °C/W °C/W °C/W Notes 1 1 1 1 2 3 4 Single-layer RθJA (1s) Four-layer (2s2p) RθJA Single-layer RθJMA (1s) Four-layer (2s2p) — — — 1. RθJMA RθJB RθJC ΨJT Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions—Forced Convection (Moving Air). 6 Peripheral operating requirements and behaviors All digital I/O switching characteristics assume: 1. output pins • have CL=30pF loads, • are configured for fast slew rate (PORTx_PCRn[SRE]=0), and • are configured for high drive strength (PORTx_PCRn[DSE]=1) 2. input pins • have their passive filter disabled (PORTx_PCRn[PFE]=0) 6.1 Core modules 6.1.1 Debug trace timing specifications Table 10. Debug trace operating behaviors Symbol Tcyc Description Clock period Table continues on the next page... Min. Max. Unit MHz Frequency dependent K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 19 Peripheral operating requirements and behaviors Table 10. Debug trace operating behaviors (continued) Symbol Twl Twh Tr Tf Ts Th Description Low pulse width High pulse width Clock and data rise time Clock and data fall time Data setup Data hold Min. 2 2 — — 3 2 Max. — — 3 3 — — Unit ns ns ns ns ns ns Figure 3. TRACE_CLKOUT specifications TRACE_CLKOUT Ts Th Ts Th TRACE_D[3:0] Figure 4. Trace data specifications 6.1.2 JTAG electricals Table 11. JTAG limited voltage range electricals Symbol Description Operating voltage J1 TCLK frequency of operation • Boundary Scan • JTAG and CJTAG • Serial Wire Debug J2 TCLK cycle period Table continues on the next page... 0 0 0 1/J1 10 25 50 — ns Min. 2.7 Max. 3.6 Unit V MHz K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 20 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 11. JTAG limited voltage range electricals (continued) Symbol J3 Description TCLK clock pulse width • Boundary Scan • JTAG and CJTAG • Serial Wire Debug J4 J5 J6 J7 J8 J9 J10 J11 J12 J13 J14 TCLK rise and fall times Boundary scan input data setup time to TCLK rise Boundary scan input data hold time after TCLK rise TCLK low to boundary scan output data valid TCLK low to boundary scan output high-Z TMS, TDI input data setup time to TCLK rise TMS, TDI input data hold time after TCLK rise TCLK low to TDO data valid TCLK low to TDO high-Z TRST assert time TRST setup time (negation) to TCLK high 50 20 10 — 20 0 — — 8 1 — — 100 8 3 — — 25 25 — — 17 17 — — ns ns ns ns ns ns ns ns ns ns ns — — Min. Max. Unit ns Table 12. JTAG full voltage range electricals Symbol Description Operating voltage J1 TCLK frequency of operation • Boundary Scan • JTAG and CJTAG • Serial Wire Debug J2 J3 TCLK cycle period TCLK clock pulse width • Boundary Scan • JTAG and CJTAG • Serial Wire Debug J4 J5 J6 J7 J8 J9 TCLK rise and fall times Boundary scan input data setup time to TCLK rise Boundary scan input data hold time after TCLK rise TCLK low to boundary scan output data valid TCLK low to boundary scan output high-Z TMS, TDI input data setup time to TCLK rise Table continues on the next page... 50 25 12.5 — 20 0 — — 8 3 — — 25 25 — ns ns ns ns ns ns — — 0 0 0 1/J1 10 20 40 — ns ns Min. 1.71 Max. 3.6 Unit V MHz K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 21 Peripheral operating requirements and behaviors Table 12. JTAG full voltage range electricals (continued) Symbol J10 J11 J12 J13 J14 Description TMS, TDI input data hold time after TCLK rise TCLK low to TDO data valid TCLK low to TDO high-Z TRST assert time TRST setup time (negation) to TCLK high Min. 1.4 — — 100 8 Max. — 22.1 22.1 — — Unit ns ns ns ns ns J2 J3 J3 TCLK (input) J4 J4 Figure 5. Test clock input timing TCLK J5 J6 Data inputs J7 Input data valid Data outputs J8 Output data valid Data outputs J7 Data outputs Output data valid Figure 6. Boundary scan (JTAG) timing K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 22 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors TCLK J9 J10 TDI/TMS J11 Input data valid TDO J12 Output data valid TDO J11 TDO Output data valid Figure 7. Test Access Port timing TCLK J14 J13 TRST Figure 8. TRST timing 6.2 System modules There are no specifications necessary for the device's system modules. 6.3 Clock modules K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 23 Peripheral operating requirements and behaviors 6.3.1 MCG specifications Table 13. MCG specifications Symbol fints_ft fints_t Iints tirefsts Δfdco_res_t Description Internal reference frequency (slow clock) — factory trimmed at nominal VDD and 25°C Internal reference frequency (slow clock) — user trimmed Internal reference (slow clock) current Internal reference (slow clock) startup time Resolution of trimmed DCO output frequency at fixed voltage and temperature — using SCTRIM and SCFTRIM Resolution of trimmed DCO output frequency at fixed voltage and temperature — using SCTRIM only Total deviation of trimmed average DCO output frequency over voltage and temperature Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0–70°C Internal reference frequency (fast clock) — factory trimmed at nominal VDD and 25°C Internal reference frequency (fast clock) — user trimmed Internal reference (fast clock) current Internal reference startup time (fast clock) Loss of external clock minimum frequency — RANGE = 00 Loss of external clock minimum frequency — RANGE = 01, 10, or 11 FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS=00) 640 × ffll_ref Mid range (DRS=01) 1280 × ffll_ref Mid-high range (DRS=10) 1920 × ffll_ref High range (DRS=11) 2560 × ffll_ref Table continues on the next page... 80 83.89 100 MHz 60 62.91 75 MHz 40 41.94 50 MHz 31.25 20 — 20.97 39.0625 25 kHz MHz 2, 3 Min. — 31.25 — — — Typ. 32.768 — TBD TBD ± 0.1 Max. — 39.0625 — 4 ± 0.3 Unit kHz kHz µA µs %fdco 1 Notes Δfdco_res_t — ± 0.2 ± 0.5 %fdco 1 Δfdco_t Δfdco_t — + 0.5 - 1.0 ± 3.5 %fdco %fdco 1 — ± 0.5 ± TBD 1 fintf_ft fintf_t Iintf tirefstf floc_low floc_high 3.4 3 — — (3/5) x fints_t (16/5) x fints_t — — TBD TBD — — 4 5 — TBD — — MHz MHz µA µs kHz kHz K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 24 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 13. MCG specifications (continued) Symbol Description Low range (DRS=00) 732 × ffll_ref Mid range (DRS=01) 1464 × ffll_ref Mid-high range (DRS=10) 2197 × ffll_ref High range (DRS=11) 2929 × ffll_ref Jcyc_fll Jacc_fll tfll_acquire FLL period jitter FLL accumulated jitter of DCO output over a 1µs time window FLL target frequency acquisition time PLL fvco Ipll VCO operating frequency PLL operating current • PLL @ 96 MHz (fosc_hi_1=8MHz, fpll_ref=2MHz, VDIV multiplier=48) PLL reference frequency range PLL period jitter PLL accumulated jitter over 1µs window Lock entry frequency tolerance Lock exit frequency tolerance Lock detector detection time 48.0 — — 950 100 — MHz µA 8 — — — TBD TBD — TBD TBD 1 ps ps ms 6 6 7 — 95.98 — MHz — 71.99 — MHz — 47.97 — MHz Min. — Typ. 23.99 Max. — Unit MHz Notes 4, 5 fdco_t_DMX3 DCO output frequency 2 fpll_ref Jcyc_pll Jacc_pll Dlock Dunl tpll_lock 2.0 — — ± 1.49 ± 4.47 — — 400 TBD — — — 4.0 — — ± 2.98 ± 5.97 0.15 + 1075(1/ fpll_ref) MHz ps ps % % ms 11 9, 10 9, 10 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0. 3. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation (Δfdco_t) over voltage and temperature should be considered. 4. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1. 5. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. 6. This specification was obtained at TBD frequency. 7. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 8. Excludes any oscillator currents that are also consuming power while PLL is in operation. 9. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of each PCB and results will vary. 10. This specification was obtained at internal frequency of TBD. 11. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 25 Peripheral operating requirements and behaviors 6.3.2 Oscillator electrical specifications This section provides the electrical characteristics of the module. 6.3.2.1 Symbol VDD IDDOSC Oscillator DC electrical specifications Description Supply voltage Supply current — low-power mode (HGO=0) • 32 kHz • 4 MHz • 8 MHz • 16 MHz • 24 MHz • 32 MHz — — — — — — Min. 1.71 Table 14. Oscillator DC electrical specifications Typ. — Max. 3.6 Unit V 1 500 200 300 700 1.2 1.5 — — — — — — nA μA μA μA mA mA 1 — — — — — — — — — — — — 25 400 800 1.5 3 4 — — — 10 — 1 — — — — — — — — — — — — MΩ MΩ MΩ MΩ μA μA μA mA mA mA 2, 3 2, 3 2, 4 Notes IDDOSC Supply current — high gain mode (HGO=1) • 32 kHz • 4 MHz • 8 MHz • 16 MHz • 24 MHz • 32 MHz Cx Cy RF EXTAL load capacitance XTAL load capacitance Feedback resistor — low-frequency, low-power mode (HGO=0) Feedback resistor — low-frequency, high-gain mode (HGO=1) Feedback resistor — high-frequency, low-power mode (HGO=0) Feedback resistor — high-frequency, high-gain mode (HGO=1) Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 26 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 14. Oscillator DC electrical specifications (continued) Symbol RS Description Series resistor — low-frequency, low-power mode (HGO=0) Series resistor — low-frequency, high-gain mode (HGO=1) Series resistor — high-frequency, low-power mode (HGO=0) Series resistor — high-frequency, high-gain mode (HGO=1) — Vpp5 Peak-to-peak amplitude of oscillation (oscillator mode) — low-frequency, low-power mode (HGO=0) Peak-to-peak amplitude of oscillation (oscillator mode) — low-frequency, high-gain mode (HGO=1) Peak-to-peak amplitude of oscillation (oscillator mode) — high-frequency, low-power mode (HGO=0) Peak-to-peak amplitude of oscillation (oscillator mode) — high-frequency, high-gain mode (HGO=1) 1. 2. 3. 4. 5. — 0 0.6 — — kΩ V Min. — — — Typ. — 200 — Max. — — — Unit kΩ kΩ kΩ Notes — VDD — V — 0.6 — V — VDD — V VDD=3.3 V, Temperature =25 °C See crystal or resonator manufacturer's recommendation Cx,Cy can be provided by using either the integrated capacitors or by using external components. When low power mode is selected, RF is integrated and must not be attached externally. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any other devices. 6.3.2.2 Symbol fosc_lo fosc_hi_1 Oscillator frequency specifications Description Oscillator crystal or resonator frequency — low frequency mode (MCG_C2[RANGE]=00) Oscillator crystal or resonator frequency — high frequency mode (low range) (MCG_C2[RANGE]=01) Oscillator crystal or resonator frequency — high frequency mode (high range) (MCG_C2[RANGE]=1x) Input clock frequency (external clock mode) Input clock duty cycle (external clock mode) Min. 32 3 Table 15. Oscillator frequency specifications Typ. — — Max. 40 8 Unit kHz MHz Notes fosc_hi_2 8 — 32 MHz fec_extal tdc_extal — 40 — 50 50 60 MHz % 1 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 27 Peripheral operating requirements and behaviors Table 15. Oscillator frequency specifications (continued) Symbol tcst Description Crystal startup time — 32 kHz low-frequency, low-power mode (HGO=0) Crystal startup time — 32 kHz low-frequency, high-gain mode (HGO=1) Crystal startup time — 8 MHz high-frequency (MCG_C2[RANGE]=01), low-power mode (HGO=0) Crystal startup time — 8 MHz high-frequency (MCG_C2[RANGE]=01), high-gain mode (HGO=1) Min. — — — Typ. TBD 800 4 Max. — — — Unit ms ms ms Notes 2, 3 — 3 — ms 1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL 2. Proper PC board layout procedures must be followed to achieve specifications. 3. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register being set. 6.3.3 32kHz Oscillator Electrical Characteristics This section describes the module electrical characteristics. 6.3.3.1 Symbol VBAT RF Cpara Cload Vpp 32kHz oscillator DC electrical specifications Description Supply voltage Internal feedback resistor Parasitical capacitance of EXTAL32 and XTAL32 Internal load capacitance (programmable) Peak-to-peak amplitude of oscillation Min. 1.71 — — — — Table 16. 32kHz oscillator DC electrical specifications Typ. — 100 2.5 15 0.6 Max. 3.6 — — — — Unit V MΩ pF pF V 6.3.3.2 Symbol fosc_lo tstart 32kHz oscillator frequency specifications Description Oscillator crystal Crystal start-up time Min. — — Table 17. 32kHz oscillator frequency specifications Typ. 32 1000 Max. — — Unit kHz ms 1 Notes 1. Proper PC board layout procedures must be followed to achieve specifications. 6.4 Memories and memory interfaces K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 28 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.4.1 Flash (FTFL) electrical specifications This section describes the electrical characteristics of the FTFL module. 6.4.1.1 Flash timing specifications — program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 18. NVM program/erase timing specifications Symbol thvpgm4 thversscr Description Longword Program high-voltage time Sector Erase high-voltage time Min. — — — Typ. 20 20 160 Max. TBD 100 800 Unit μs ms ms 1 1 Notes thversblk256k Erase Block high-voltage time for 256 KB 1. Maximum time based on expectations at cycling end-of-life. 6.4.1.2 Symbol Flash timing specifications — commands Description Read 1s Block execution time Min. Table 19. Flash command timing specifications Typ. Max. Unit Notes trd1blk256k trd1sec2k tpgmchk trdrsrc tpgm4 • 256 KB data flash Read 1s Section execution time (flash sector) Program Check execution time Read Resource execution time Program Longword execution time Erase Flash Block execution time — — — — — — — — — 50 1.4 40 35 35 TBD ms μs μs μs μs 2 1 1 1 tersblk256k tersscr • 256 KB data flash Erase Flash Sector execution time Program Section execution time — — 160 20 800 100 ms ms 2 tpgmsec512 tpgmsec1k tpgmsec2k trd1all trdonce tpgmonce • 512 B flash • 1 KB flash • 2 KB flash Read 1s All Blocks execution time Read Once execution time Program Once execution time — — — — — — TBD TBD TBD — — 50 TBD TBD TBD 2.8 35 TBD ms ms ms ms μs μs 1 Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 29 Peripheral operating requirements and behaviors Table 19. Flash command timing specifications (continued) Symbol tersall tvfykey Description Erase All Blocks execution time Verify Backdoor Access Key execution time Min. — — Typ. 320 — Max. 1600 35 Unit ms μs Notes 2 1 1. Assumes 25MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. 6.4.1.3 Flash (FTFL) current and power specfications Description Worst case programming current in program flash Table 20. Flash (FTFL) current and power specfications Typ. 10 Unit mA Symbol IDD_PGM 6.4.1.4 Symbol Reliability specifications Description Table 21. NVM reliability specifications Min. Program Flash Typ.1 Max. Unit Notes tnvmretp10k tnvmretp1k tnvmretp100 nnvmcycp Data retention after up to 10 K cycles Data retention after up to 1 K cycles Data retention after up to 100 cycles Cycling endurance 5 10 15 10 K TBD TBD TBD TBD — — — — years years years cycles 2 2 2 3 1. Typical data retention values are based on intrinsic capability of the technology measured at high temperature derated to 25°C. For additional information on how Freescale defines typical data retention, please refer to Engineering Bulletin EB618. 2. Data retention is based on Tjavg = 55°C (temperature profile over the lifetime of the application). 3. Cycling endurance represents number of program/erase cycles at -40°C ≤ Tj ≤ 125°C. 6.4.2 EzPort Switching Specifications Table 22. EzPort switching specifications Num Description Operating voltage EP1 EP1a EP2 EP3 EP4 EZP_CK frequency of operation (all commands except READ) EZP_CK frequency of operation (READ command) EZP_CS negation to next EZP_CS assertion EZP_CS input valid to EZP_CK high (setup) EZP_CK high to EZP_CS input invalid (hold) Table continues on the next page... Min. 2.7 — — 2 x tEZP_CK 5 5 Max. 3.6 fSYS/2 fSYS/8 — — — Unit V MHz MHz ns ns ns K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 30 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 22. EzPort switching specifications (continued) Num EP5 EP6 EP7 EP8 EP9 Description EZP_D input valid to EZP_CK high (setup) EZP_CK high to EZP_D input invalid (hold) EZP_CK low to EZP_Q output valid (setup) EZP_CK low to EZP_Q output invalid (hold) EZP_CS negation to EZP_Q tri-state Min. 2 5 — 0 — Max. — — 12 — 12 Unit ns ns ns ns ns EZP_CK EP3 EP4 EP2 EZP_CS EP7 EP8 EP9 EZP_Q (output) EP5 EP6 EZP_D (input) Figure 9. EzPort Timing Diagram 6.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 6.6 Analog 6.6.1 ADC electrical specifications The 16-bit accuracy specifications listed in Table 23 and Table 24 are achievable on the differential pins ADCx_DP0, ADCx_DM0, ADCx_DP1, ADCx_DM1, ADCx_DP3, and ADCx_DP3. K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. Freescale Semiconductor, Inc. Preliminary 31 Peripheral operating requirements and behaviors The ADCx_DP2 and ADCx_DM2 ADC inputs are used as the PGA inputs and are not direct device pins. Accuracy specifications for these pins are defined in Table 25 and Table 26. All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. 6.6.1.1 Symbol VDDA ΔVDDA ΔVSSA VREFH VREFL VADIN CADIN 16-bit ADC operating conditions Description Supply voltage Supply voltage Ground voltage ADC reference voltage high Reference voltage low Input voltage Input capacitance • 16 bit modes • 8/10/12 bit modes Conditions Absolute Delta to VDD (VDDVDDA) Delta to VSS (VSSVSSA) Min. 1.71 -100 -100 1.13 VSSA VREFL — — Table 23. 16-bit ADC operating conditions Typ.1 — 0 0 VDDA VSSA — 8 4 Max. 3.6 +100 +100 VDDA VSSA VREFH 10 5 Unit V mV mV V V V pF 2 2 Notes RADIN RAS Input resistance Analog source resistance 13/12 bit modes fADCK < 4MHz ≤13 bit modes — 2 5 kΩ 3 — — 5 kΩ fADCK fADCK Crate ADC conversion clock frequency ADC conversion clock frequency ADC conversion rate 4 1.0 — 18.0 MHz 5 2.0 — 12.0 MHz 6 18.484 — 818.330 Ksps 16 bit modes ≤13 bit modes No ADC hardware averaging Continuous conversions enabled Peripheral clock = 50MHz Table continues on the next page... K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 32 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 23. 16-bit ADC operating conditions (continued) Symbol Crate Description ADC conversion rate Conditions 16 bit modes No ADC hardware averaging Continuous conversions enabled Peripheral clock = 50MHz 1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. DC potential difference. 3. This resistance is external to MCU. The analog source resistance should be kept as low as possible in order to achieve the best results. The results in this datasheet were derived from a system which has