MCF51AC128AVLKE

Freescale Semiconductor Data Sheet: Advance Information Document Number: MCF51AC256 Rev.1 , 06/2008 MCF51AC256 80 LQFP 14 mm × 14 mm 64 LQFP 10 mm × 10 mm MCF51AC256 ColdFire Microcontroller The MCF51AC256 is a member of the ColdFire® family of 32-bit variable-length reduced instruction set (RISC) microcontroller. This document provides an overview of the MCF51AC256 series, focusing on its highly integrated and diverse feature set. The MCF51AC256 series is based on the V1 ColdFire core and operates at processor core speeds up to 50.33 MHz. As part of Freescale’s Controller Continuum®, it is an ideal upgrade for designs based on the MC9S08AC128 series of 8-bit microcontrollers. The MCF51AC256 features the following functional units: • V1 ColdFire core with background debug module • Up to 256 KBytes of flash memory • Up to 32 Kbytes of static RAM (SRAM) • Up to two analog comparators (ACMP) • Analog-to-digital converter (ADC) with up to 24 channels • Controller-area network (CAN) • Cyclic redundancy check (CRC) • Inter-integrated circuit (IIC) • Keyboard interrupt (KBI) • Multipurpose clock generator (MCG) • Rapid general-purpose input/output (RGPIO) • Two serial communications interfaces (SCI) • Up to two serial parallel interfaces (SPI) • Two flexible timer modules (FTM) • Timer pulse-width modulator (TPM) 64 QFP 14 mm × 14 mm This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. © Freescale Semiconductor, Inc., 2008. All rights reserved. Preliminary—Subject to Change Without Notice Table of Contents 1 MCF51AC256 Family Configurations . . . . . . . . . . . . . . . . . . . .3 1.1 Device Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 1.2 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1.3.1 Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 1.4 Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 1.5 Pinouts and Packaging . . . . . . . . . . . . . . . . . . . . . . . . .10 Preliminary Electrical Characteristics . . . . . . . . . . . . . . . . . . .14 2.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .14 2.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .14 2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .15 2.4 Electrostatic Discharge (ESD) Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . .16 2.5 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 2.6 Supply Current Characteristics . . . . . . . . . . . . . . . . . . .22 2.7 Analog Comparator (ACMP) Electricals . . . . . . . . . . . .23 2.8 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .23 2.9 External Oscillator (XOSC) Characteristics . . . . . . . . .26 2.10 MCG Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .27 2.11 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 2.11.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . .29 2.11.2 Timer (TPM/FTM) Module Timing . . . . . . . . . . .30 2.11.3 MSCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 2.12 SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 2.13 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .34 2.14 EMC Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 2.14.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . .35 Mechanical Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . .36 3.1 80-pin LQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . .36 3.2 64-pin LQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . .39 3.3 64-pin QFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . .42 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 Figure 6. Typical IOH vs. VDD–VOH at VDD = 5V (Low Drive, PTxDSn = 0). . . . . . . . . . . . . . . . . . . . . . . Figure 7. Typical IOH vs. VDD–VOH at VDD = 5 V (High Drive, PTxDSn = 1) . . . . . . . . . . . . . . . . . . . . . . Figure 8. ADC Input Impedance Equivalency Diagram . . . . . . . Figure 9. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 10.IRQ/KBIPx Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 11.Timer External Clock . . . . . . . . . . . . . . . . . . . . . . . . . Figure 12.Timer Input Capture Pulse . . . . . . . . . . . . . . . . . . . . . Figure 13.SPI Master Timing (CPHA = 0) . . . . . . . . . . . . . . . . . Figure 14.SPI Master Timing (CPHA = 1) . . . . . . . . . . . . . . . . . Figure 15.SPI Slave Timing (CPHA = 0) . . . . . . . . . . . . . . . . . . Figure 16.SPI Slave Timing (CPHA = 1) . . . . . . . . . . . . . . . . . . 21 21 24 29 30 30 31 33 33 34 34 2 List of Tables Table 1. MCF51AC256 Series Device Comparison . . . . . . . . . . 3 Table 2. MCF51AC256 Series Functional Units . . . . . . . . . . . . . 5 Table 3. Orderable Part Number Summary. . . . . . . . . . . . . . . . . 9 Table 4. Pin Availability by Package Pin-Count . . . . . . . . . . . . . 11 Table 5. Parameter Classifications . . . . . . . . . . . . . . . . . . . . . . 14 Table 6. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . 15 Table 7. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . 15 Table 8. ESD and Latch-up Test Conditions . . . . . . . . . . . . . . . 16 Table 10.DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 9. ESD and Latch-Up Protection Characteristics. . . . . . . 17 Table 11. Supply Current Characteristics. . . . . . . . . . . . . . . . . . 22 Table 12.Analog Comparator Electrical Specifications. . . . . . . . 23 Table 13.5 Volt 12-bit ADC Operating Conditions . . . . . . . . . . . 23 Table 14.5 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) . . . . . . . . . . . . 24 Table 15.Oscillator Electrical Specifications (Temperature Range = –40 to 105×C Ambient) . . . . . 26 Table 16.MCG Frequency Specifications (Temperature Range = –40 to 125×C Ambient) . . . . . 27 Table 17.Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 18.TPM/FTM Input Timing . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 19.MSCAN Wake-up Pulse Characteristics . . . . . . . . . . . 31 Table 20.SPI Electrical Characteristic . . . . . . . . . . . . . . . . . . . . 32 Table 21.Flash Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 22.Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3 4 List of Figures Figure 1. MCF51AC256 Block Diagram . . . . . . . . . . . . . . . . . . . . 4 Figure 2. 80-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 3. 64-Pin QFP and LQFP . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 4. Typical IOH vs. VDD–VOH at VDD = 3V (Low Drive, PTxDSn = 0) . . . . . . . . . . . . . . . . . . . . . . 20 Figure 5. Typical IOH vs. VDD–VOH at VDD = 3V (High Drive, PTxDSn = 1) . . . . . . . . . . . . . . . . . . . . . . 20 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 2 Preliminary—Subject to Change Without Notice Freescale Semiconductor MCF51AC256 Family Configurations 1 1.1 MCF51AC256 Family Configurations Device Comparison Table 1. MCF51AC256 Series Device Comparison MCF51AC256A MCF51AC256B MCF51AC128A Feature 80-pin 64-pin 80-pin 64-pin 80-pin 64-pin 80-pin 64-pin MCF51AC128C The MCF51AC256 series is summarized in Table 1. Flash memory size (Kbytes) RAM size (Kbytes) V1 ColdFire core with BDM (background debug module) ACMP1 (analog comparator) ACMP2 (analog comparator) ADC (analog-to-digital converter) channels (12-bit) CAN (controller area network) COP (computer operating properly) CRC (cyclic redundancy check) RTI DBG (debug) IIC1 (inter-integrated circuit) IRQ (interrupt request input) INTC (interrupt controller) KBI (keyboard interrupts) LVD (low-voltage detector) MCG (multipurpose clock generator) OSC (crystal oscillator) Port I/O2 69 54 Yes 256 32 Yes Yes Yes 24 No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 69 54 16 Yes Yes Yes No Yes No 6 6 2 6 2 2 Yes No Yes No Yes No 6 2 Yes No 69 54 Yes 128 32 or 161 No 69 54 RGPIO (rapid general-purpose I/O) SCI1, SCI2 (serial communications interfaces) SPI1 (serial peripheral interface) SPI2 (serial peripheral interface) FTM1 (flexible timer module) channels FTM2 channels TPM3 (timer pulse-width modulator) channels VBUS (debug visibility bus) Yes No 6 2 Yes No MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 3 MCF51AC256 Family Configurations 1 2 The members of MCF51AC128 with CAN support have 32 K-byte RAM. The other members have 16 K-byte RAM. Up to 16 pins on Ports E and F are shared with the ColdFire Rapid GPIO module. 1.2 VREFH VREFL VDDAD VSSAD Block Diagram PTA7/AD1P17 PTA6/AD1P16 PTA5/ACMP2+ PTA4/ACMP2– PTA3/ACMP2O PTA2 PTA1/RXCAN PTA0/TXCAN PTB7/AD1P7 PTB6/AD1P6 PTB5/AD1P5 PTB4/AD1P4 PTB3/AD1P3 PTB2/AD1P2 PTB1/TPM3CH1/AD1P1 PTB0/TPM3CH0/AD1P0 PTC6/FTM2FLT PTC5/RxD2 PTC4/SS2 PTC3/TxD2 PTC2/MCLK PTC1/SDA1 PTC0/SCL1 PTD7/KBI1P7/AD1P15 PTD6/FTM1CLK/AD1P14 PTD5/AD1P13 PTD4/FTM2CLK/AD1P12 PTD3/KBI1P6/AD1P11 PTD2/KBI1P5/AD1P10/ACMP1O PTD1/AD1P9/ACMP1– PTD0/AD1P8/ACMP1+ PTE7/RGPIO7/SPSCK1 PTE6/RGPIO6/MOSI1 PTE5/RGPIO5/MISO1 PTE4/RGPIO4/SS1 PTE3/RGPIO3/FTM1CH1 PTE2/RGPIO2/FTM1CH0 PTE1/RGPIO1/RxD1 PTE0/RGPIO0/TxD1 PTF7/RGPIO15 PTF6/FTM1FLT/RGPIO14 PTF5/RGPIO13/FTM2CH1 PTF4/RGPIO12/FTM2CH0 PTF3/RGPIO11/FTM1CH5 PTF2/RGPIO10/FTM1CH4 PTF1/RGPIO9/FTM1CH3 PTF0/RGPIO8/FTM1CH2 PTG6/EXTAL PTG5/XTAL PTG4/KBI1P4/AD1P19 PTG3/KBI1P3/AD1P18 PTG2/KBI1P2 PTG1/KBI1P1 PTG0/KBI1P0 PTH6/MISO2 PTH5/MOSI2 PTH4/SPSCK2 PTH3/FTM2CH5/BKPT/AD1P23 PTH2/FTM2CH4/PSTCLK1/AD1P22 PTH1/FTM2CH3/PSTCLK0/AD1P21 PTH0/FTM2CH2/AD1P20 PTJ7/DDATA3 PTJ6/DDATA2 PTJ5/DDATA1 PTJ4/DDATA0 PTJ3/PST3 PTJ2/PST2 PTJ1/PST1 PTJ0/PST0 Figure 1 shows the connections between the MCF51AC256 series pins and modules. VREFH VREFL VDDAD VSSAD Port J: DDATA3DDATA0 PST3VBUS PST0 Port H: PSTCLK BKPT Port B: ADP7ADP0 Port D: ADP15ADP8 Port A: ADP17ADP16 Port G: ADP19ADP18 Port H: ADP23ADP20 Port F: FTM1CH5 FTM1CH4 FTM1CH3 FTM1CH2 Port E: FTM1CH1 FTM1CH0 Port H: FTM2CH5 FTM2CH4 FTM2CH3 FTM2CH2 Port F: FTM2CH1 FTM2CH0 Port B: TPM3CH1 TPM3CH0 Port D: ACMP1O ACMP1 ACMP1– ACMP1+ Port A: ACMP2O ACMP2+ Port C: SDA1 SCL1 Port G: KBIP4 KBIP3 KBIP2 KBIP1 KBIP0 Port D: KBIP7 KBIP6 KBIP5 Port B Port J Port H Port G Port F Port E Port D Port C DBG ADC ACMP2 ACMP2– BKGD/MS BDM IIC1 ColdFire V1 core RESET TPMCLK FTM1 SIM TPMCLK KBI IRQ/ TPMCLK COP LVD IRQ FTM2 MCG OSC Port G: EXTAL XTAL Port A: RXCAN TXCAN FLASH MCF51AC256 = 256 KB MCF51AC128 = 128 KB TPMCLK CAN TPM3 RAM MCF51AC256 = 32 KB MCF51AC128 = 16 KB Port F: RGPIO15 RGPIO14 RGPIO13 RGPIO12 RGPIO11 RGPIO10 RGPIO9 RGPIO8 RGPIO CRC SCI1 Port E: RGPIO7 RGPIO6 RGPIO5 RGPIO4 RGPIO3 RGPIO2 RGPIO1 RGPIO0 Port E: RXD1 TXD1 Port C: RXD2 TXD2 Port E: SS1 SPSCK1 MOSI1 MISO1 Port H: SS2 RTC SCI2 SPI1 VDD VSS VSS VREG SPI2 SPSCK2 MOSI2 MISO2 Figure 1. MCF51AC256 Block Diagram MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 4 Preliminary—Subject to Change Without Notice Freescale Semiconductor Port A MCF51AC256 Family Configurations 1.3 Features Table 2 describes the functional units of the MCF51AC256 series. Table 2. MCF51AC256 Series Functional Units Functional Unit CF1CORE (V1 ColdFire core) BDM (background debug module) DBG (debug) VBUS (debug visibility bus) SIM (system integration module) FLASH (flash memory) RAM (random-access memory) RGPIO (rapid general-purpose input/output) VREG (voltage regulator) COP (computer operating properly) LVD (low-voltage detect) CF1_INTC (interrupt controller) ADC (analog-to-digital converter) FTM1, FTM2 (flexible timer/pulse-width modulators) TPM3 (timer/pulse-width modulator) CRC (cyclic redundancy check) ACMP1, ACMP2 (analog comparators) IIC1 (inter-integrated circuit) KBI (keyboard interrupt) MCG (multipurpose clock generator) Function Executes programs and interrupt handlers Provides single pin debugging interface (part of the V1 ColdFire core) Provides debugging and emulation capabilities (part of the V1 ColdFire core) Allows for real-time program traces (part of the V1 ColdFire core) Controls resets and chip level interfaces between modules Provides storage for program code, constants and variables Provides storage for program variables Allows for I/O port access at CPU clock speeds Controls power management across the device Monitors a countdown timer and generates a reset if the timer is not regularly reset by the software Monitors internal and external supply voltage levels, and generates a reset or interrupt when the voltages are too low Controls and prioritizes all device interrupts Measures analog voltages at up to 12 bits of resolution Provide a variety of timing-based features Provides a variety of timing-based features Accelerates computation of CRC values for ranges of memory Compare two analog inputs Supports standard IIC communications protocol Provides pin interrupt capabilities Provides clocking options for the device, including a phase-locked loop (PLL) and frequency-locked loop (FLL) for multiplying slower reference clock sources Allows a crystal or ceramic resonator to be used as the system clock source or reference clock for the PLL or FLL Supports standard CAN communications protocol Serial communications UARTs capable of supporting RS-232 and LIN protocols Provide 8-bit 4-pin synchronous serial interface Provide 16-bit 4-pin synchronous serial interface OSC (crystal oscillator) CAN (controller area network) SCI1, SCI2 (serial communications interfaces) SPI1 (8-bit serial peripheral interfaces) SPI2 (16-bit serial peripheral interfaces) MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 5 MCF51AC256 Family Configurations 1.3.1 • Feature List 32-bit Version 1 ColdFire® central processor unit (CPU) — Up to 50.33 MHz at 2.7 V – 5.5 V — Provide 0.94 Dhrystone 2.1 DMIPS per MHz performance when running from internal RAM (0.76 DMIPS per MHz when running from flash) — Implements instruction set revision C (ISA_C) On-chip memory — Up to 256 KBytes flash memory read/program/erase over full operating voltage and temperature — Up to 32 KBytes static random access memory (SRAM) — Security circuitry to prevent unauthorized access to SRAM and flash contents Power-Saving Modes — Three low-power stop plus wait modes — Peripheral clock enable register can disable clocks to unused modules, reducing currents; allows clocks to remain enabled to specific peripherals in stop3 mode System protection features — Watchdog computer operating properly (COP) reset — Low-voltage detection with reset or interrupt — Illegal opcode and illegal address detection with programmable reset or exception response — Flash block protection Debug support — Single-wire background debug interface — Real-time debug support, with 6 hardware breakpoints (4 PC, 1 address pair and 1 data) that can be configured into a 1- or 2-level trigger — On-chip trace buffer provides programmable start/stop recording conditions plus support for continuous or PC-profiling modes — Support for real-time program (and optional partial data) trace using the debug visibility bus V1 ColdFire interrupt controller (CF1_INTC) — Support of 40 peripheral I/O interrupt requests plus seven software (one per level) interrupt requests — Fixed association between interrupt request source and level plus priority, up to two requests can be remapped to the highest maskable level + priority — Unique vector number for each interrupt source — Support for service routine interrupt acknowledge (software IACK) read cycles for improved system performance Multipurpose clock generator (MCG) — Oscillator (XOSC); loop-control Pierce oscillator; crystal or ceramic resonator range of 31.25 kHz to 38.4 kHz or 1 MHz to 16 MHz — FLL/PLL controlled by internal or external reference — Trimmable internal reference allows 0.2% resolution and 2% deviation Analog-to-digital converter (ADC) — 24 analog inputs with 12 bits resolution — Output formatted in 12-, 10- or 8-bit right-justified format — Single or continuous conversion (automatic return to idle after single conversion) — Operation in low-power modes for lower noise operation — Asynchronous clock source for lower noise operation — Automatic compare with interrupt for less-than, or greater-than or equal-to, programmable value — On-chip temperature sensor • • • • • • • MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 6 Preliminary—Subject to Change Without Notice Freescale Semiconductor MCF51AC256 Family Configurations • • • • • • Flexible timer/pulse-width modulators (FTM) — 16-bit Free-running counter or a counter with initial and final value. The counting can be up and unsigned, up and signed, or up-down and unsigned — Up to 6 channels, and each channel can be configured for input capture, output compare or edge-aligned PWM mode, all channels can be configured for center-aligned PWM mode – Channels can operate as pairs with equal outputs, pairs with complimentary outputs or independent channels (with independent outputs) – Each pair of channels can be combined to generate a PWM signal (with independent control of both edges of PWM signal) – Deadtime insertion is available for each complementary pair — The load of the FTM registers which have write buffer can be synchronized; write protection for critical registers — Generation of the triggers to ADC (hardware trigger) — A fault input for global fault control — Backwards compatible with TPM Timer/pulse width modulator (TPM) — 16-bit free-running or modulo up/down count operation — Two channels, each channel may be input capture, output compare, or edge-aligned PWM — One interrupt per channel plus terminal count interrupt Cyclic redundancy check (CRC) generator — High speed hardware CRC generator circuit using 16-bit shift register — CRC16-CCITT compliancy with x16 + x12 + x5 + 1 polynomial — Error detection for all single, double, odd, and most multi-bit errors — Programmable initial seed value Analog comparators (ACMP) — Full rail to rail supply operation — Selectable interrupt on rising edge, falling edge, or either rising or falling edges of comparator output — Option to compare to fixed internal bandgap reference voltage — Option to allow comparator output to be visible on a pin, ACMPxO Inter-integrated circuit (IIC) — Compatible with IIC bus standard — Multi-master operation — Software programmable for one of 64 different serial clock frequencies — Interrupt driven byte-by-byte data transfer — Arbitration lost interrupt with automatic mode switching from master to slave — Calling address identification interrupt — Bus busy detection — 10-bit address extension Controller area network (CAN) — Implementation of the CAN protocol — Version 2.0A/B – Standard and extended data frames – Zero to eight bytes data length – Programmable bit rate up to 1 Mbps – Support for remote frames — Five receive buffers with FIFO storage scheme — Three transmit buffers with internal prioritization using a “local priority” concept MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 7 MCF51AC256 Family Configurations • • • — Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, four 16-bit filters, or eight 8-bit filters — Programmable wakeup functionality with integrated low-pass filter — Programmable loopback mode supports self-test operation — Programmable listen-only mode for monitoring of CAN bus — Programmable bus-off recovery functionality — Separate signalling and interrupt capabilities for all CAN receiver and transmitter error states (warning, error passive, bus-off) — Internal timer for time-stamping of received and transmitted messages Serial communications interfaces (SCI) — Full-duplex, standard non-return-to-zero (NRZ) format — Double-buffered transmitter and receiver with separate enables — Programmable baud rates (13-bit modulo divider) — Interrupt-driven or polled operation — Hardware parity generation and checking — Programmable 8-bit or 9-bit character length — Receiver wakeup by idle-line or address-mark — Optional 13-bit break character generation / 11-bit break character detection — Selectable transmitter output polarity Serial peripheral interfaces (SPI) — Master or slave mode operation — Full-duplex or single-wire bidirectional option — Programmable transmit bit rate — Double-buffered transmit and receive — Serial clock phase and polarity options — Slave select output — Selectable MSB-first or LSB-first shifting — 16-bit and FIFO operations in SPI2 Input/Output — 69 GPIOs — 8 keyboard interrupt pins with selectable polarity — Hysteresis and configurable pull-up device on all input pins; Configurable slew rate and drive strength on all output pins — 16-bits Rapid GPIO pins connected to the processor’s local 32-bit platform bus with set, clear, and faster toggle functionality 1.4 Part Numbers MCF 51 AC 256 X V XX E Status (MCF = Fully Qualified ColdFire) (PCF = Product Engineering) Core Family Pb free indicator Package designator Temperature range (V = –40°C to 105°C, C= –40°C to 85°C ) CAN Feature (A: With CAN, B/C: Without CAN) Memory size designator MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 8 Preliminary—Subject to Change Without Notice Freescale Semiconductor MCF51AC256 Family Configurations Table 3. Orderable Part Number Summary Freescale Part Number MCF51AC256AVFUE MCF51AC256BVFUE MCF51AC256AVLKE MCF51AC256BVLKE MCF51AC256AVPUE Description MCF51AC256 ColdFire Microcontroller with CAN MCF51AC256 ColdFire Microcontroller without CAN MCF51AC256 ColdFire Microcontroller with CAN MCF51AC256 ColdFire Microcontroller without CAN MCF51AC256 ColdFire Microcontroller with CAN Flash / SRAM (Kbytes) 256 / 32 256 / 32 256 / 32 256 / 32 256 / 32 256 / 32 128 / 32 128 / 16 128 / 32 128 / 16 128 / 32 128 / 16 Package 64 QFP 64 QFP 80 LQFP 80 LQFP 64 LQFP 64 LQFP 64 QFP 64 QFP 80 LQFP 80 LQFP 64 LQFP 64 LQFP Temperature –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C –40°C to 105°C MCF51AC256BVPUE MCF51AC256 ColdFire Microcontroller without CAN MCF51AC128AVFUE MCF51AC128 ColdFire Microcontroller with CAN MCF51AC128CVFUE MCF51AC128 ColdFire Microcontroller without CAN MCF51AC128AVLKE MCF51AC128CVLKE MCF51AC128AVPUE MCF51AC128 ColdFire Microcontroller with CAN MCF51AC128 ColdFire Microcontroller without CAN MCF51AC128 ColdFire Microcontroller with CAN MCF51AC128CVPUE MCF51AC128 ColdFire Microcontroller without CAN MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 9 MCF51AC256 Family Configurations 1.5 Pinouts and Packaging PTC5 / RxD2 PTC3 / TxD2 PTC2 / MCLK PTH6 / MISO2 PTH5 / MOSI2 PTH4 / SPCK2 PTC1 / SDA1 PTC0 / SCL1 VDD VSS PTG6 / EXTAL PTG5 / XTAL BKGD / MS VREFL VREFH PTD7 / KBI1P7 / AD1P15 PTD6 / FTM1CLK / AD1P14 PTD5 / AD1P13 PTD4/FTM2CLK/AD1P12 PTG4 / KBI1P4 / AD1P19 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 Figure 2 shows the pinout of the 80-pin LQFP. PTE4 / RGPIO4 / SS1 PTE5 / RGPIO5 / MISO1 PTE6 / RGPIO6 / MOSI1 PTE7 / RGPIO7 / SPSCK1 VSS VDD PTJ4 / DDATA0 PTJ5 / DDATA1 PTJ6 / DDATA2 PTJ7 / DDATA3 PTG0 / KBI1P0 PTG1 / KBI1P1 PTG2 / KBI1P2 •PTA0 / TxCAN •PTA1 / RxCAN PTA2 PTA3 / ACMP2O PTA4 / ACMP2– PTA5 / ACMP2+ PTA6 / AD1P16 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 PTC4 / SS2 IRQ / TPMCLK RESET PTF0 / RGPIO8 / FTM1CH2 PTF1 / RGPIO9 / FTM1CH3 PTF2 / RGPIO10 / FTM1CH4 PTF3 / RGPIO11 / FTM1CH5 PTF4 / RGPIO12 / FTM2CH0 PTC6 / FTM2FLT PTF7 / RGPIO15 PTF5 / RGPIO13 / FTM2CH1 PTF6 / RGPIO14 / FTM1FLT PTJ0 / PST0 PTJ1 / PST1 PTJ2 / PST2 PTJ3 / PST3 PTE0 / RGPIO0 / TxD1 PTE1 / RGPIO1 / RxD1 PTE2 / RGPIO2 / FTM1CH0 PTE3 / RGPIO3 / FTM1CH1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 80-Pin LQFP 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 PTG3 / KBI1P3 / AD1P18 PTD3 / KBI1P6 / AD1P11 PTD2 / KBI1P5 / AD1P10 / ACMP1O VSSAD VDDAD PTD1 / AD1P9 / ACMP1– PTD0 / AD1P8 / ACMP1+ PTB7 / AD1P7 PTB6 / AD1P6 PTB5 / AD1P5 PTB4 / AD1P4 PTB3 / AD1P3 PTB2 / AD1P2 PTB1 / TPM3CH1 / AD1P1 PTB0 / TPM3CH0 / AD1P0 PTH3 / FTM2CH5 / BKPT / AD1P23 PTH2 / FTM2CH4 / PSTCLK1 / AD1P22 PTH1 / FTM2CH3 / PSTCLK0 / AD1P21 PTH0 / FTM2CH2 / AD1P20 PTA7 / AD1P17 • TxCAN and RxCAN are not available in the members that do not support CAN Figure 2. 80-Pin LQFP Figure 3 shows the pinout of the 64-pin LQFP and QFP. MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 10 Preliminary—Subject to Change Without Notice Freescale Semiconductor MCF51AC256 Family Configurations 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 PTC4 IRQ / TPMCLK RESET PTF0 / RGPIO8 / FTM1CH2 PTF1 / RGPIO9 / FTM1CH3 PTF2 / RGPIO10 / FTM1CH4 PTF3 / RGPIO11 / FTM1CH5 PTF4 / RGPIO12 / FTM2CH0 PTC6 / FTM2FLT PTF7 / RGPIO15 PTF5 / RGPIO13 / FTM2CH1 PTF6 / RGPIO14 / FTM1FLT PTE0 / RGPIO0 / TxD1 PTE1 / RGPIO1 / RxD1 PTE2 / RGPIO2 / FTM1CH0 PTE3 / RGPIO3 / FTM1CH1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PTC5 / RxD2 PTC3 / TxD2 PTC2 / MCLK PTC1 / SDA1 PTC0 / SCL1 VSS PTG6 / EXTAL PTG5 / XTAL BKGD / MS VREFL VREFH PTD7 / KBI1P7 / AD1P15 PTD6 / FTM1CLK / AD1P14 PTD5 / AD1P13 PTD4 / FTM2CLK / AD1P12 PTG4 / KBI1P4 / AD1P19 64-Pin QFP 64-Pin LQFP PTG3 / KBI1P3 / AD1P18 PTD3 / KBI1P6 / AD1P11 PTD2 / KBI1P5 / AD1P10 /ACMP1O VSSAD VDDAD PTD1 / AD1P9 / ACMP1PTD0 / AD1P8 / ACMP1+ PTB7 / AD1P7 PTB6 / AD1P6 PTB5 / AD1P5 PTB4 / AD1P4 PTB3 / AD1P3 PTB2 / AD1P2 PTB1 / TPM3CH1 / AD1P1 PTB0 / TPM3CH0 / AD1P0 PTA7 / AD1P17 PTE4 / RGPIO4 / SS1 PTE5 / RGPIO5 / MISO1 PTE6 / RGPIO6 / MOSI1 PTE7 / RGPIO7 / SPSCK1 VSS VDD PTG0 / KBI1P0 PTG1 / KBI1P1 PTG2 / KBI1P2 •PTA0 / TxCAN •PTA1 / RxCAN PTA2 PTA3 / ACMP2O PTA4 / ACMP2PTA5 / ACMP2+ PTA6 / AD1P16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 • TxCAN and RxCAN are not available in the members that do not support CAN Figure 3. 64-Pin QFP and LQFP Table 4 shows the package pin assignments. Table 4. Pin Availability by Package Pin-Count Pin Number 80 1 2 3 4 5 6 7 8 64 1 2 3 4 5 6 7 8 Lowest Highest Alt 3 Alt 1 SS2 TPMCLK1 Alt 2 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 11 MCF51AC256 Family Configurations Table 4. Pin Availability by Package Pin-Count (continued) Pin Number 80 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 64 9 10 11 12 — — — — 13 14 15 16 17 18 19 20 21 22 — — — — 23 24 25 26 27 28 29 30 31 32 33 — — — — 34 35 36 Lowest Highest Alt 3 Alt 1 FTM2FLT RGPIO15 RGPIO13 RGPIO14 PST0 PST1 PST2 PST3 RGPIO0 RGPIO1 RGPIO2 RGPIO3 RGPIO4 RGPIO5 RGPIO6 RGPIO7 Alt 2 FTM2CH1 FTM1FLT TxD1 RxD1 FTM1CH0 FTM1CH1 SS1 MISO1 MOSI1 SPSCK1 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 12 Preliminary—Subject to Change Without Notice Freescale Semiconductor MCF51AC256 Family Configurations Table 4. Pin Availability by Package Pin-Count (continued) Pin Number 80 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 1 Lowest Highest Alt 3 64 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 — 60 61 — — — 62 63 64 Alt 1 AD1P3 AD1P4 AD1P5 AD1P6 AD1P7 AD1P8 AD1P9 Alt 2 ACMP1+ ACMP1– KBI1P5 KBI1P6 KBI1P3 KBI1P4 FTM2CLK AD1P13 FTM1CLK KBI1P7 AD1P10 AD1P11 AD1P18 AD1P19 AD1P12 AD1P14 AD1P15 ACMP1O XTAL EXTAL SCL1 SDA1 SPCK2 MOSI2 MISO2 MCLK TxD2 RxD2 TPMCLK, FTM1CLK, and FTM2CLK options are configured via software; out of reset, FTM1CLK, FTM2CLK, and TPMCLK are available to FTM1, FTM2, and TPM3 respectively. 2 TxCAN is available in the member that supports CAN. 3 RxCAN is available in the member that supports CAN. MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 13 Preliminary Electrical Characteristics 2 Preliminary Electrical Characteristics This section contains electrical specification tables and reference timing diagrams for the MCF51AC256 microcontroller, including detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications. The electrical specifications are preliminary and are from previous designs or design simulations. These specifications may not be fully tested or guaranteed at this early stage of the product life cycle. These specifications will, however, be met for production silicon. Finalized specifications will be published after complete characterization and device qualifications have been completed. NOTE The parameters specified in this data sheet supersede any values found in the module specifications. 2.1 Parameter Classification Table 5. Parameter Classifications P C Those parameters are guaranteed during production testing on each individual device. Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations. Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category. Those parameters are derived mainly from simulations. The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding the following classification is used and the parameters are tagged accordingly in the tables where appropriate: T D NOTE The classification is shown in the column labeled “C” in the parameter tables where appropriate. 2.2 Absolute Maximum Ratings Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the limits specified in Table 6 may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this section. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD). MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 14 Preliminary—Subject to Change Without Notice Freescale Semiconductor Preliminary Electrical Characteristics Table 6. Absolute Maximum Ratings Rating Supply voltage Input voltage Instantaneous maximum current Single pin limit (applies to all port pins)1, 2, 3 Maximum current into VDD Storage temperature 1 Symbol VDD VIn ID IDD Tstg Value –0.3 to 5.8 –0.3 to VDD + 0.3 ±25 120 –55 to 150 Unit V V mA mA °C Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp voltages, then use the larger of the two resistance values. 2 All functional non-supply pins are internally clamped to VSS and VDD. 3 Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if the clock rate is very low which would reduce overall power consumption. 2.3 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small. Table 7. Thermal Characteristics Rating Operating temperature range (packaged) Maximum junction temperature Thermal resistance 1,2,3,4 80-pin LQFP 1s 2s2p 64-pin LQFP 1s 2s2p 64-pin QFP 1s 2s2p 1 Symbol TA TJ Value Unit °C °C –40 to 105 150 TBD TBD θJA TBD TBD TBD TBD °C/W Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 15 Preliminary Electrical Characteristics 2 3 Junction to Ambient Natural Convection 1s — Single layer board, one signal layer 4 2s2p — Four layer board, 2 signal and 2 power layers The average chip-junction temperature (TJ) in °C can be obtained from: TJ = TA + (PD × θJA) where: TA = Ambient temperature, °C θJA = Package thermal resistance, junction-to-ambient, °C/W PD = Pint + PI/O Pint = IDD × VDD, Watts — chip internal power PI/O = Power dissipation on input and output pins — user determined For most applications, PI/O VDD VIN VDD VIN VDD) is greater than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if clock rate is very low (which would reduce overall power consumption). All functional non-supply pins are internally clamped to VSS and VDD. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the larger of the two values. The RESET pin does not have a clamp diode to VDD. Do not drive this pin above VDD. MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 19 Preliminary Electrical Characteristics –6.0E-3 –5.0E-3 –4.0E-3 –3.0E-3 –2.0E-3 –1.0E-3 000E+0 Average of IOH VDD–VOH (V) -40°C 25°C 105°C IOH (A) 0 0.3 0.5 0.8 VSupply–VOH 0.9 1.2 1.5 Average of IOH VDD–VOH (V) -40°C 25°C 105°C IOH (A) 0 0.3 0.5 0.8 VSupply–VOH 0.9 1.2 1.5 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Preliminary—Subject to Change Without Notice Freescale Semiconductor Figure 4. Typical IOH vs. VDD–VOH at VDD = 3V (Low Drive, PTxDSn = 0) –20.0E-3 –18.0E-3 –16.0E-3 –14.0E-3 –12.0E-3 –10.0E-3 –8.0E-3 –6.0E-3 –4.0E-3 –2.0E-3 000E+0 Figure 5. Typical IOH vs. VDD–VOH at VDD = 3V (High Drive, PTxDSn = 1) 20 Preliminary Electrical Characteristics Average of IOH –7.0E-3 –6.0E-3 –5.0E-3 VDD–VOH (V) -40°C 25°C 105°C IOH (A) 0.00 0.30 0.50 0.80 VSupply–VOH 1.00 1.30 2.00 Average of IOH VDD–VOH (V) -40°C 25°C 105°C IOH (A) 0.00 0.30 0.50 0.80 VSupply–VOH 1.00 1.30 2.00 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 –4.0E-3 –3.0E-3 –2.0E-3 –1.0E-3 000E+0 Figure 6. Typical IOH vs. VDD–VOH at VDD = 5V (Low Drive, PTxDSn = 0) –30.0E-3 –25.0E-3 –20.0E-3 –15.0E-3 –10.0E-3 –5.0E-3 000E+0 Figure 7. Typical IOH vs. VDD–VOH at VDD = 5 V (High Drive, PTxDSn = 1) Freescale Semiconductor Preliminary—Subject to Change Without Notice 21 Preliminary Electrical Characteristics 2.6 Supply Current Characteristics Table 11. Supply Current Characteristics Num 1 C C Parameter Run supply current3 measured at clock = 2 MHz, fBus = 1MHz) Run supply current3 measured at clock = 16 MHz, fBus = 8 MHz) Run supply current3 measured at clock = 50 MHz, fBus = 25 MHz) Stop2 mode supply current –40 °C 25 °C 105 °C 4 C –40 °C 25 °C 105 °C Stop3 mode supply current –40 °C 25 °C 105 °C 5 C –40 °C 25 °C 105 °C 6 C RTI adder to stop2 or stop34, 25°C S23IDDRTI S3IDDLVD S3IDDOSC S3IDD 3 5 3 5 3 5, 3 0.90 300 300 110 90 5 TBD TBD TBD μA 5 0.90 TBD TBD TBD μA S2IDD 3 0.80 TBD TBD TBD μA 5 0.80 TBD TBD TBD μA (CPU Symbol RIDD RIDD RIDD VDD (V) 5 3 5 3 5 3 Typical1 2.67 2.64 14.8 14.7 42 41.8 Max2 TBD TBD TBD TBD TBD TBD mA mA mA Unit 2 C (CPU 3 C (CPU nA nA μA μA μA 7 8 1 C C LVD adder to stop3 (LVDE = LVDSE = 1) Adder to stop3 for oscillator (ERCLKEN =1 and EREFSTEN = 1) enabled5 Typicals are measured at 25°C. Values given here are preliminary estimates prior to completing characterization. 3 All modules clocks switch on, code run from flash, FEI mode, and does not include any dc loads on port pins. 4 Most customers are expected to find that auto-wakeup from stop2 or stop3 can be used instead of the higher current wait mode. 5 Values given under the following conditions: low range operation (RANGE = 0), low power mode (HGO = 0). 2 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 22 Preliminary—Subject to Change Without Notice Freescale Semiconductor Preliminary Electrical Characteristics 2.7 Num 1 2 3 4 5 6 7 8 Analog Comparator (ACMP) Electricals Table 12. Analog Comparator Electrical Specifications C — T D D D D D D Supply voltage Supply current (active) Analog input voltage Analog input offset voltage Analog Comparator hysteresis Analog input leakage current Analog Comparator initialization delay Bandgap Voltage Reference Factory trimmed at VDD = 3.0 V, Temp = 25°C Rating Symbol VDD IDDAC VAIN VAIO VH IALKG tAINIT VBG 3.0 — — 1.19 Min 2.7 — VSS – 0.3 Typical — 20 — 20 6.0 — — 1.20 Max 5.5 35 VDD 40 20.0 1.0 1.0 1.21 Unit V μA V mV mV μA μs V 2.8 ADC Characteristics Table 13. 5 Volt 12-bit ADC Operating Conditions Characteristic Supply voltage Ground voltage Ref Voltage High Ref Voltage Low Input Voltage Input Capacitance Input Resistance 12 bit mode fADCK > 4MHz fADCK < 4MHz Analog Source Resistance 10 bit mode fADCK > 4MHz fADCK < 4MHz 8 bit mode (all valid fADCK) ADC Conversion Clock Freq. High Speed (ADLPC=0) Low Power (ADLPC=1) fADCK RAS — — — 0.4 0.4 — — — — — 5 10 10 8.0 MHz 4.0 Conditions Absolute Delta to VDD (VDD-VDDAD)2 Delta to VSS (VSS-VSSAD )2 Symb VDDAD ΔVDDAD ΔVSSAD VREFH VREFL VADIN CADIN RADIN Min 2.7 –100 –100 2.7 VSSAD VREFL — — Typical1 — 0 0 VDDAD VSSAD — 4.5 3 Max 5.5 100 100 VDDAD VSSAD VREFH 5.5 5 Unit V mV mV V V V pF kΩ Comment — — — — 2 5 kΩ External to MCU MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 23 Preliminary Electrical Characteristics Typical values assume VDDAD = 5.0 V, Temp = 25°C, fADCK=1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2 DC potential difference. 1 SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZAS RAS VADIN VAS Pad leakage due to input protection ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT RADIN ADC SAR ENGINE + – + – CAS RADIN INPUT PIN RADIN INPUT PIN RADIN CADIN INPUT PIN Figure 8. ADC Input Impedance Equivalency Diagram Table 14. 5 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) Characteristic Supply CurrentADLPC =1ADLSMP=1 ADCO=1 Supply CurrentADLPC =1ADLSMP=0 ADCO=1 Supply CurrentADLPC =0ADLSMP=1 ADCO=1 Supply CurrentADLPC =0ADLSMP=0 ADCO=1 Supply Current Stop, Reset, Module Off Conditions C Symb Min Typical1 Max Unit Comment T IDDAD — 133 — μA T IDDAD — 218 — μA T IDDAD — 327 — μA P IDDAD — 0.582 1 mA IDDAD — 0.011 1 μA MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 24 Preliminary—Subject to Change Without Notice Freescale Semiconductor Preliminary Electrical Characteristics Table 14. 5 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) (continued) Characteristic ADC Asynchronous Clock Source Conversion Time (Including sample time) Sample Time Long Sample (ADLSMP=1) Total Unadjusted Error 12 bit mode 10 bit mode 8 bit mode 12 bit mode Differential Non-Linearity 10 bit mode3 8 bit mode4 12 bit mode Integral Non-Linearity 10 bit mode 8 bit mode 12 bit mode Zero-Scale Error 10 bit mode 8 bit mode 12 bit mode Full-Scale Error 10 bit mode 8 bit mode 12 bit mode Quantization Error 10 bit mode 8 bit mode 12 bit mode Input Leakage Error 10 bit mode 8 bit mode Temp Sensor Voltage Temp Sensor Slope 25°C –40 °C — 25 °C 25 °C — 85 °C D m — 3.638 — D VTEMP25 D EIL D EQ T P T T P T T T T T P T T T T EFS EZS INL DNL ETUE Conditions High Speed (ADLPC=0) T Low Power (ADLPC=1) Short Sample (ADLSMP=0) T Long Sample (ADLSMP=1) Short Sample (ADLSMP=0) T tADS tADC fADACK C Symb Min 2 1.25 — — — — — — — — — — — — — — — — — — — — — — — — — — — Typical1 3.3 2 20 40 3.5 23.5 ±3.0 ±1 ±0.5 ±1.75 ±0.5 ±0.3 ±1.5 ±0.5 ±0.3 ±1.5 ±0.5 ±0.5 ±1 ±0.5 ±0.5 –1 to 0 — — ±1 ±0.2 ±0.1 1.396 3.266 Max 5 MHz 3.3 — — — — — ±2.5 ±1.0 — ±1.0 ±0.5 — ±1.0 ±0.5 — ±1.5 ±0.5 — ±1 ±0.5 — ±0.5 ±0.5 — ±2.5 ±1 — — V LSB2 Pad leakage4 * RAS LSB2 LSB2 VADIN = VDDAD LSB2 VADIN = VSSAD LSB2 LSB2 LSB2 Includes quantization ADCK cycles ADCK cycles Unit Comment tADACK = 1/fADACK See Table 8 for conversion time variances mV/°C MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 25 Preliminary Electrical Characteristics Typical values assume VDDAD = 5.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2 1 LSB = (VREFH - VREFL)/2N 3 Monotonicity and No-Missing-Codes guaranteed in 10 bit and 8 bit modes 4 Based on input pad leakage current. Refer to pad electricals. 1 2.9 Num C External Oscillator (XOSC) Characteristics Table 15. Oscillator Electrical Specifications (Temperature Range = –40 to 105°C Ambient) Rating Oscillator crystal or resonator (EREFS = 1, ERCLKEN = 1) Low range (RANGE = 0) High range (RANGE = 1) FEE or FBE mode 2 High range (RANGE = 1) PEE or PBE mode 3 High range (RANGE = 1, HGO = 1) BLPE mode High range (RANGE = 1, HGO = 0) BLPE mode Symbol flo fhi-fll fhi-pll fhi-hgo fhi-lp C1 C2 Low range (32 kHz to 38.4 kHz) High range (1 MHz to 16 MHz) Series resistor Low range, low gain (RANGE = 0, HGO = 0) Low range, high gain (RANGE = 0, HGO = 1) High range, low gain (RANGE = 1, HGO = 0) High range, high gain (RANGE = 1, HGO = 1) ≥ 8 MHz 4 MHz 1 MHz Crystal start-up time 4 Low range, low gain (RANGE = 0, HGO = 0) Low range, high gain (RANGE = 0, HGO = 1) High range, low gain (RANGE = 1, HGO = 0)5 High range, high gain (RANGE = 1, HGO = 1)5 Square wave input clock frequency (EREFS = 0, ERCLKEN = 1) FEE or FBE mode 2 PEE or PBE mode 3 BLPE mode t t t Min 32 1 1 1 1 Typical1 — — — — — Max 38.4 5 16 16 8 Unit kHz MHz MHz MHz MHz 1 C 2 3 — Load capacitors Feedback resistor — See crystal or resonator manufacturer’s recommendation. 10 1 — — — — — — 0 100 0 0 0 0 200 400 5 15 — — — — — — 0 10 20 — — — — MW RF 4 — RS kΩ CSTL-LP 5 T CSTL-HGO t CSTH-LP CSTH-HGO — — — — ms 6 T fextal 0.03125 1 0 5 16 40 MHz Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value. When MCG is configured for FEE or FBE mode, input clock source must be divisible using RDIV to within the range of 31.25 kHz to 39.0625 kHz. 3 When MCG is configured for PEE or PBE mode, input clock source must be divisible using RDIV to within the range of 1 MHz to 2MHz. 4 This parameter is characterized and not tested on each device. Proper PC board layout procedures must be followed to achieve specifications. 5 4 MHz crystal 1 2 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 26 Preliminary—Subject to Change Without Notice Freescale Semiconductor Preliminary Electrical Characteristics MCU EXTAL XTAL RS RF C1 Crystal or Resonator C2 2.10 Num C 1 2 3 4 5 6 7 MCG Specifications Table 16. MCG Frequency Specifications (Temperature Range = –40 to 125°C Ambient) Rating Symbol fint_ft fint_ut fint_t tirefst fdco_ut fdco_t Δfdco_res_t Min — 25 31.25 — 25.6 32 — Typical 31.25 32.7 — 60 33.48 — ±0.1 Max — 41.66 39.0625 100 42.66 40 ±0.2 Unit kHz kHz kHz μs MHz MHz %fdco Internal reference frequency - factory P trimmed at VDD = 5 V and temperature = 25 °C P P Average internal reference frequency – untrimmed 1 Average internal reference frequency – user trimmed D Internal reference startup time DCO output frequency range untrimmed 1 — value provided for reference: fdco_ut = 1024 X fint_ut D DCO output frequency range - trimmed Resolution of trimmed DCO output D frequency at fixed voltage and temperature (using FTRIM) Resolution of trimmed DCO output D frequency at fixed voltage and temperature (not using FTRIM) Total deviation of trimmed DCO output D frequency over voltage and temperature Total deviation of trimmed DCO output D frequency over fixed voltage and temperature range of 0 – 70 °C D FLL acquisition time 2 D PLL acquisition time 3 8 Δfdco_res_t — ±0.2 0.5 –1.0 ±0.5 — — 0.02 — 0.5665 — ±0.4 %fdco 9 Δfdco_t — ±2 %fdco 10 11 12 13 14 17 18 Δfdco_t tfll_acquire tpll_acquire CJitter fvco fpll_jitter_625ns Dlock — — — — 7.0 — ±1.49 ±1 1 1 0.2 55.0 — ±2.98 %fdco ms ms %fdco MHz %fpll % Long term Jitter of DCO output clock D (averaged over 2ms interval) 4 D VCO operating frequency D Jitter of PLL output clock measured over 625 ns5 D Lock entry frequency tolerance 6 MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 27 Table 16. MCG Frequency Specifications (continued)(Temperature Range = –40 to 125°C Ambient) Num C 19 20 21 22 1 2 Rating 7 Symbol Dunl tfll_lock tpll_lock floc_low Min ±4.47 — — (3/5) x fint Typical — — — — Max ±5.97 tfll_acquire+ 1075(1/fint_t) tpll_acquire+ 1075(1/fpll_ref) Unit % s s kHz D Lock exit frequency tolerance D Lock time — FLL D Lock time — PLL Loss of external clock minimum D frequency – RANGE = 0 — 3 4 5 6 TRIM register at default value (0x80) and FTRIM control bit at default value (0x0). This specification applies to any time the FLL reference source or reference divider is changed, trim value changed or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fBUS. Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected into the FLL circuitry via VDD and VSS and variation in crystal oscillator frequency increase the CJitter percentage for a given interval. 625 ns represents 5 time quanta for CAN applications, under worst case conditions of 8 MHz CAN bus clock, 1 Mbps CAN bus speed, and 8 time quanta per bit for bit time settings. 5 time quanta is the minimum time between a synchronization edge and the sample point of a bit using 8 time quanta per bit. Below Dlock minimum, the MCG is guaranteed to enter lock. Above Dlock maximum, the MCG will not enter lock. But if the MCG is already in lock, then the MCG may stay in lock. Below Dunl minimum, the MCG will not exit lock if already in lock. Above Dunl maximum, the MCG is guaranteed to exit lock. o 7 2.11 AC Characteristics This section describes ac timing characteristics for each peripheral system. Preliminary Electrical Characteristics 2.11.1 Num 1 2 3 4 5 6 7 C D D D D D D D Control Timing Table 17. Control Timing Parameter Bus frequency (tcyc = 1/fBus) Internal low-power oscillator period External reset pulse width (tcyc = 1/fSelf_reset) Reset low drive Active background debug mode latch setup time Active background debug mode latch hold time IRQ pulse width Asynchronous path2 Synchronous path3 KBIPx pulse width Asynchronous path2 Synchronous path3 Port rise and fall time (load = 50 pF)4 Slew rate control disabled (PTxSE = 0), Low Drive Slew rate control enabled (PTxSE = 1), Low Drive Slew rate control disabled (PTxSE = 0), Low Drive Slew rate control enabled (PTxSE = 1), Low Drive tILIH, tIHIL 100 1.5 x tcyc 100 1.5 x tcyc — — ns 2 Symbol fBus tLPO textrst trstdrv tMSSU tMSH Min dc 800 100 66 x tcyc 500 100 Typical1 — Max 24 1500 — — — — Unit MHz μs ns ns ns ns 8 D tILIH, tIHIL — — ns 9 D tRise, tFall — — 11 35 40 75 ns Typical values are based on characterization data at VDD = 5.0 V, 25 °C unless otherwise stated. This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to override reset requests from internal sources. 3 This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case. 4 Timing is shown with respect to 20% V DD and 80% VDD levels. Temperature range –40 °C to 105 °C. 1 2 textrst RESET PIN Figure 9. Reset Timing MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 29 Preliminary Electrical Characteristics tIHIL IRQ/KBIPx IRQ/KBIPx tILIH Figure 10. IRQ/KBIPx Timing 2.11.2 Timer (TPM/FTM) Module Timing Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current bus rate clock. Table 18. TPM/FTM Input Timing NUM 1 2 3 4 5 C — — D D D Function External clock frequency External clock period External clock high time External clock low time Input capture pulse width Symbol fTPMext tTPMext tclkh tclkl tICPW Min DC 4 1.5 1.5 1.5 Max fBus/4 — — — — Unit MHz tcyc tcyc tcyc tcyc tTPMext tclkh TPMxCLK tclkl Figure 11. Timer External Clock tICPW TPMxCHn TPMxCHn tICPW Figure 12. Timer Input Capture Pulse MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 30 Preliminary—Subject to Change Without Notice Freescale Semiconductor Preliminary Electrical Characteristics 2.11.3 Num 1 2 1 MSCAN Table 19. MSCAN Wake-up Pulse Characteristics C D D Parameter MSCAN Wake-up dominant pulse filtered MSCAN Wake-up dominant pulse pass Symbol tWUP tWUP 5 Min Typical1 Max 2 5 Unit μs μs Typical values are based on characterization data at VDD = 5.0 V, 25 °C unless otherwise stated. MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 31 Preliminary Electrical Characteristics 2.12 SPI Characteristics Table 20. SPI Electrical Characteristic Num1 C Characteristic2 Operating frequency 1 D Cycle time 2 D Enable lead time 3 D Master Slave Enable lag time 4 D Master Slave Clock (SPSCK) high time Master and Slave Clock (SPSCK) low time Master and Slave Data setup time (inputs) 7 D Master Slave Data hold time (inputs) 8 9 10 11 D D D D Access time, slave3 Disable time, slave4 Master Slave Data hold time (outputs) 12 1 2 Table 20 and Figure 13 through Figure 16 describe the timing requirements for the SPI system. Symbol Min Max Unit Master Slave Master Slave fop fop tSCK tSCK fBus/2048 dc 2 4 — 1/2 fBus/2 fBus/4 2048 Hz — 1/2 — 1/2 — — — — — tcyc tLead tLead tLag tLag tSCKH tSCKL tSI(M) tSI(S) tHI(M) tHI(S) tA tdis tSO tSO tHO tHO tSCK — 1/2 1/2 tSCK – 25 1/2 tSCK – 25 30 30 tSCK 5 6 D D ns ns ns Master Slave 30 30 0 — 25 25 — — 40 40 — — ns ns ns Data setup time (outputs) ns D Master Slave –10 –10 — — ns Refer to Figure 13 through Figure 16. All timing is shown with respect to 20% VDD and 70% VDD, unless noted; 100 pF load on all SPI pins. All timing assumes slew rate control disabled and high drive strength enabled for SPI output pins. 3 Time to data active from high-impedance state. 4 Hold time to high-impedance state. MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 32 Preliminary—Subject to Change Without Notice Freescale Semiconductor Preliminary Electrical Characteristics SS1 (OUTPUT) 2 SCK (CPOL = 0) (OUTPUT) SCK (CPOL = 1) (OUTPUT) 6 MISO (INPUT) MSB IN2 11 MOSI (OUTPUT) MSB OUT2 7 BIT 6 . . . 1 11 BIT 6 . . . 1 LSB OUT LSB IN 12 2 5 4 3 5 4 NOTES: 1. SS output mode (MODFEN = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 13. SPI Master Timing (CPHA = 0) SS(1) (OUTPUT) 2 2 SCK (CPOL = 0) (OUTPUT) SCK (CPOL = 1) (OUTPUT) MISO (INPUT) 11 MOSI (OUTPUT) MSB OUT(2) 5 4 5 4 6 7 MSB IN(2) BIT 6 . . . 1 12 BIT 6 . . . 1 LSB OUT LSB IN 3 NOTES: 1. SS output mode (MODFEN = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 14. SPI Master Timing (CPHA = 1) MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 33 Preliminary Electrical Characteristics SS (INPUT) 2 SCK (CPOL = 0) (INPUT) 2 SCK (CPOL = 1) (INPUT) 8 MISO (OUTPUT) SLAVE 6 MOSI (INPUT) NOTE: 3 5 4 5 4 11 MSB OUT 7 MSB IN BIT 6 . . . 1 LSB IN BIT 6 . . . 1 12 SLAVE LSB OUT SEE NOTE 9 1. Not defined but normally MSB of character just received Figure 15. SPI Slave Timing (CPHA = 0) SS (INPUT) 2 2 SCK (CPOL = 0) (INPUT) SCK (CPOL = 1) (INPUT) MISO (OUTPUT) SEE NOTE 8 MOSI (INPUT) 5 4 5 4 11 SLAVE 6 MSB IN MSB OUT 7 BIT 6 . . . 1 LSB IN 12 BIT 6 . . . 1 SLAVE LSB OUT 9 3 NOTE: 1. Not defined but normally LSB of character just received Figure 16. SPI Slave Timing (CPHA = 1) 2.13 Flash Specifications This section provides details about program/erase times and program-erase endurance for the Flash memory. Program and erase operations do not require any special power sources other than the normal VDD supply. For more detailed information about program/erase operations, see Chapter 4, “Memory.” MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 34 Preliminary—Subject to Change Without Notice Freescale Semiconductor Preliminary Electrical Characteristics Table 21. Flash Characteristics Num 1 2 3 4 5 6 7 8 9 10 1 2 C — — — — — — — — C C Characteristic Supply voltage for program/erase Supply voltage for read operation Internal FCLK frequency2 Internal FCLK period (1/FCLK) Byte program time (random location)2 Byte program time (burst mode) Page erase time3 Mass erase time2 Program/erase endurance4 TL to TH = –40°C to 105°C T = 25°C Data retention5 2 Symbol Vprog/erase VRead fFCLK tFcyc tprog tBurst tPage tMass Min 2.7 2.7 150 5 Typical1 Max 5.5 5.5 200 6.67 Unit V V kHz μs tFcyc tFcyc tFcyc tFcyc 9 4 4000 20,000 10,000 — — 100,000 100 — — — cycles years tD_ret 15 Typical values are based on characterization data at VDD = 5.0 V, 25°C unless otherwise stated. The frequency of this clock is controlled by a software setting. 3 These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for calculating approximate time to program and erase. 4 Typical endurance for flash was evaluated for this product family on the 9S12Dx64. For additional information on how Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin EB619/D, Typical Endurance for Nonvolatile Memory. 5 Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory. 2.14 EMC Performance Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the MCU resides. Board design and layout, circuit topology choices, location and characteristics of external components as well as MCU software operation all play a significant role in EMC performance. The system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263, AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance. 2.14.1 Radiated Emissions Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test software. The radiated emissions from the microcontroller are measured in a TEM cell in two package orientations (North and East). For more detailed information concerning the evaluation results, conditions and setup, please refer to the EMC Evaluation Report for this device. MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 35 Mechanical Outline Drawings 3 3.1 Mechanical Outline Drawings 80-pin LQFP Package MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 36 Preliminary—Subject to Change Without Notice Freescale Semiconductor Mechanical Outline Drawings MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 37 Mechanical Outline Drawings MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 38 Preliminary—Subject to Change Without Notice Freescale Semiconductor Mechanical Outline Drawings 3.2 64-pin LQFP Package MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 39 Mechanical Outline Drawings MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 40 Preliminary—Subject to Change Without Notice Freescale Semiconductor Mechanical Outline Drawings MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 41 Mechanical Outline Drawings 3.3 64-pin QFP Package MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 42 Preliminary—Subject to Change Without Notice Freescale Semiconductor Mechanical Outline Drawings MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 43 Mechanical Outline Drawings MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 44 Preliminary—Subject to Change Without Notice Freescale Semiconductor Revision History 4 Revision History Table 22. Revision History Revision 1 Initial published Description MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.1 Freescale Semiconductor Preliminary—Subject to Change Without Notice 45 How to Reach Us: Home Page: http://www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. 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RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics as their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. Rev.1 06/2008 Preliminary—Subject to Change Without Notice