MCF5373_08

Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF5373DS Rev. 3, 04/2008 MCF5373 MAPBGA–256 17mm x 17mm MAPBGA–196 15mm x 15mm MCF537x ColdFire® Microprocessor Data Sheet Features • Version 3 ColdFire variable-length RISC processor core • System debug support • JTAG support for system level board testing • On-chip memories – 16-Kbyte unified write-back cache – 32-Kbyte dual-ported SRAM on CPU internal bus, accessible by core and non-core bus masters (e.g., DMA, FEC, and USB host and OTG) • Power management • Embedded Voice-over-IP (VoIP) system solution • SDR/DDR SDRAM Controller • Universal Serial Bus (USB) Host Controller • Universal Serial Bus (USB) On-the-Go (OTG) controller • Synchronous Serial Interface (SSI) • Fast Ethernet Controller (FEC) • Cryptography Hardware Accelerators • Three Universal Asynchronous Receiver Transmitters (UARTs) • I2C Module • Queued Serial Peripheral Interface (QSPI) • Pulse Width Modulation (PWM) module • Real Time Clock • Four 32-bit DMA Timers • Software Watchdog Timer • Four Periodic Interrupt Timers (PITs) • Phase Locked Loop (PLL) • Interrupt Controllers (x2) • DMA Controller • FlexBus (External Interface) • Chip Configuration Module (CCM) • Reset Controller • General Purpose I/O interface QFP–160 28mm x 28mm © Freescale Semiconductor, Inc., 2008. All rights reserved. Table of Contents 1 2 3 MCF537x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . .3 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .4 3.1 PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3.2 USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3.3 Supply Voltage Sequencing and Separation Cautions . .5 3.3.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .5 3.3.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .5 Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .5 4.1 Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 4.2 Pinout—196 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .11 4.3 Pinout—160 QFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .14 5.3 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 5.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .15 5.5 Oscillator and PLL Electrical Characteristics . . . . . . . .16 5.6 External Interface Timing Characteristics . . . . . . . . . . .17 5.6.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 5.7 SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 5.7.1 SDR SDRAM AC Timing Characteristics . . . . . 5.7.2 DDR SDRAM AC Timing Characteristics . . . . . 5.8 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . 5.9 Reset and Configuration Override Timing . . . . . . . . . . 5.10 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.11 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 5.12 I2C Input/Output Timing Specifications . . . . . . . . . . . . 5.13 Fast Ethernet AC Timing Specifications . . . . . . . . . . . 5.13.1 MII Receive Signal Timing . . . . . . . . . . . . . . . . 5.13.2 MII Transmit Signal Timing . . . . . . . . . . . . . . . . 5.13.3 MII Async Inputs Signal Timing . . . . . . . . . . . . 5.13.4 MII Serial Management Channel Timing . . . . . 5.14 32-Bit Timer Module Timing Specifications . . . . . . . . . 5.15 QSPI Electrical Specifications . . . . . . . . . . . . . . . . . . . 5.16 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 5.17 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.1 Package Dimensions—196 MAPBGA . . . . . . . . . . . . . 7.2 Package Dimensions—160 QFP . . . . . . . . . . . . . . . . . Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 22 25 26 27 27 28 30 30 30 31 31 32 32 33 35 35 38 39 40 42 4 5 6 7 8 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 2 Freescale Semiconductor MCF537x Family Comparison 1 MCF537x Family Comparison Table 1. MCF537x Family Configurations Module ColdFire Version 3 Core with EMAC (Enhanced Multiply-Accumulate Unit) Core (System) Clock Peripheral and External Bus Clock (Core clock ÷ 3) Performance (Dhrystone/2.1 MIPS) Instruction/Data Cache Static RAM (SRAM) SDR/DDR SDRAM Controller USB 2.0 Host USB 2.0 On-the-Go Synchronous Serial Interface (SSI) Fast Ethernet Controller (FEC) Cryptography Hardware Accelerators Embedded Voice-over-IP System Solution UARTs I2C QSPI PWM Module Real Time Clock 32-bit DMA Timers Watchdog Timer (WDT) Periodic Interrupt Timers (PIT) Edge Port Module (EPORT) Interrupt Controllers (INTC) 16-channel Direct Memory Access (DMA) FlexBus External Interface General Purpose I/O (GPIO) JTAG - IEEE® 1149.1 Test Access Port Package • — — • • — — 3 • • — • 4 • 4 • 2 • • up to 46 • 160 QFP • • • • • — — 3 • • • • 4 • 4 • 2 • • up to 62 • 196 MAPBGA MCF5372 MCF5372L MCF53721 MCF5373 MCF5373L • up to 180 MHz up to 60 MHz up to 158 • • • up to 180 MHz up to 60 MHz up to 158 • up to 240 MHz up to 80 MHz up to 211 The following table compares the various device derivatives available within the MCF537x family. up to 240 MHz up to 80 MHz up to 211 16 Kbytes 32 Kbytes • • • • • — • 3 • • • • 4 • 4 • 2 • • up to 62 • 196 MAPBGA • — — • • • — 3 • • — • 4 • 4 • 2 • • up to 46 • 160 QFP • • • • • • — 3 • • • • 4 • 4 • 2 • • up to 62 • 196 MAPBGA MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 3 Ordering Information 2 Ordering Information Table 2. Orderable Part Numbers Freescale Part Number MCF5372CAB180 MCF5372LCVM240 MCF53721CVM240 MCF5373CAB180 MCF5373LCVM240 Description MCF5372 RISC Microprocessor MCF5372 RISC Microprocessor MCF53721 RISC Microprocessor MCF5373 RISC Microprocessor MCF5373 RISC Microprocessor Package 160 QFP 196 MAPBGA 196 MAPBGA 160 QFP 196 MAPBGA Speed 180 MHz 240 MHz 240 MHz 180 MHz 240 MHz Temperature –40° to +85° C –40° to +85° C –40° to +85° C –40° to +85° C –40° to +85° C 3 3.1 Hardware Design Considerations PLL Power Filtering To further enhance noise isolation, an external filter is strongly recommended for PLL analog VDD pins. The filter shown in Figure 1 should be connected between the board VDD and the PLLVDD pins. The resistor and capacitors should be placed as close to the dedicated PLLVDD pin as possible. 10 Ω Board IVDD 10 µF 0.1 µF PLL VDD Pin GND Figure 1. System PLL VDD Power Filter 3.2 USB Power Filtering To minimize noise, external filters are required for each of the USB power pins. The filter shown in Figure 2 should be connected between the board EVDD or IVDD and each of the USBVDD pins. The resistor and capacitors should be placed as close to the dedicated USBVDD pin as possible. 0Ω Board EVDD 10 µF 0.1 µF USB VDD Pin GND Figure 2. USB VDD Power Filter MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 4 Freescale Semiconductor Pin Assignments and Reset States NOTE In addition to the above filter circuitry, a 0.01 F capacitor is also recommended in parallel with those shown. 3.3 Supply Voltage Sequencing and Separation Cautions The relationship between SDVDD and EVDD is non-critical during power-up and power-down sequences. SDVDD (2.5V or 3.3V) and EVDD are specified relative to IVDD. 3.3.1 Power Up Sequence If EVDD/SDVDD are powered up with IVDD at 0 V, the sense circuits in the I/O pads cause all pad output drivers connected to the EVDD/SDVDD to be in a high impedance state. There is no limit on how long after EVDD/SDVDD powers up before IVDD must powered up. IVDD should not lead the EVDD, SDVDD, or PLLVDD by more than 0.4 V during power ramp-up or there is high current in the internal ESD protection diodes. The rise times on the power supplies should be slower than 500 us to avoid turning on the internal ESD protection clamp diodes. 3.3.2 Power Down Sequence If IVDD/PLLVDD are powered down first, sense circuits in the I/O pads cause all output drivers to be in a high impedance state. There is no limit on how long after IVDD and PLLVDD power down before EVDD or SDVDD must power down. IVDD should not lag EVDD, SDVDD, or PLLVDD going low by more than 0.4 V during power down or there is undesired high current in the ESD protection diodes. There are no requirements for the fall times of the power supplies. The recommended power down sequence is as follows: 1. 2. Drop IVDD/PLLVDD to 0 V. Drop EVDD/SDVDD supplies. 4 4.1 Pin Assignments and Reset States Signal Multiplexing The following table lists all the MCF537x pins grouped by function. The Dir column is the direction for the primary function of the pin only. Refer to Section 7, “Package Information,” for package diagrams. For a more detailed discussion of the MCF537x signals, consult the MCF5373 Reference Manual (MCF5373RM). NOTE In this table and throughout this document, a single signal within a group is designated without square brackets (i.e., A23), while designations for multiple signals within a group use brackets (i.e., A[23:21]) and is meant to include all signals within the two bracketed numbers when these numbers are separated by a colon. NOTE The primary functionality of a pin is not necessarily its default functionality. Pins that are muxed with GPIO default to their GPIO functionality. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 5 Pin Assignments and Reset States Table 3. MCF5372/3 Signal Information and Muxing MCF5372 MCF5373 160 QFP MCF5372L MCF53271 MCF5373L 196 MAPBGA Voltage Domain Signal Name GPIO Alternate 1 Alternate 2 Reset RESET2 RSTOUT — — — — — — Clock EXTAL XTAL 2 Dir.1 I O EVDD EVDD 95 86 K13 L12 — — — — — — — — — — — — — — — Mode Selection I O I O O EVDD EVDD EVDD EVDD SDVDD 91 93 — — 40 L14 K14 P13 N13 N1 EXTAL32K XTAL32K FB_CLK RCON2 DRAMSEL — — — — — — FlexBus I I EVDD EVDD 72 92 P8 J11 A[23:22] A[21:16] A[15:14] A[13:11] A10 A[9:0] — — — — — — FB_CS[5:4] — SD_BA[1:0]3 SD_A[13:11]3 — SD_A[9:0]3 — — — — — — O O O O O O SDVDD SDVDD 134, 133 132–127 126, 123 120–118 11 7 116–107 A9, B9 C9, D9, A10, B10, C10, D10 A11, B11 C11, A12, B12 A13 A14, B14, B13, C12, D11, C14, C13, D14–D12 J2, J1, K4–K1, L4, L3, N2, P1, P2, N3, L5, P3, N4, P4 F2, F1, G4–G1, H4, H3, L6, M6, N6, P6, L7, M7, N7 P7 J3, M5, H2, P5 M8 E14 L8 SDVDD SDVDD SDVDD SDVDD D[31:16] — SD_D[31:16]4 — I/O SDVDD 27–34, 46–53 D[15:1] — FB_D[31:17]4 — I/O SDVDD 16–23, 57–63 D02 BE/BWE[3:0] OE TA2 R/W — PBE[3:0] PBUSCTL3 PBUSCTL2 PBUSCTL1 FB_D[16]4 SD_DQM[3:0]3 — — — — — — — — I/O O O I O SDVDD SDVDD SDVDD SDVDD SDVDD 64 26, 54, 24, 56 66 106 65 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 6 Freescale Semiconductor Pin Assignments and Reset States Table 3. MCF5372/3 Signal Information and Muxing (continued) MCF5372 MCF5373 160 QFP 12 MCF5372L MCF53271 MCF5373L 196 MAPBGA E2 Voltage Domain SDVDD Signal Name GPIO Alternate 1 Alternate 2 TS PBUSCTL0 DACK0 — Chip Selects FB_CS[5:4] FB_CS[3:2] FB_CS1 FB_CS0 PCS[5:4] PCS[3:2] PCS1 — — — — — — — — — SDRAM Controller Dir.1 O O O O O SDVDD SDVDD SDVDD SDVDD — — 135 136 D8, C8 B8, A8 D7 C7 SD_A10 SD_CKE SD_CLK SD_CLK SD_CS0 SD_DQS3 SD_DQS2 SD_SCAS SD_SRAS SD_SDR_DQS SD_WE — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — O O O O O O O O O O O SDVDD SDVDD SDVDD SDVDD SDVDD SDVDD SDVDD SDVDD SDVDD SDVDD SDVDD 43 14 37 38 15 25 55 44 45 35 13 M2 F4 L1 M1 F3 H1 N5 M3 M4 L2 E1 External Interrupts Port5 IRQ72 IRQ62 IRQ52 IRQ42 IRQ32 IRQ22 IRQ1 2 PIRQ72 PIRQ62 PIRQ52 PIRQ42 PIRQ32 PIRQ22 PIRQ1 2 — USBHOST_ VBUS_EN USBHOST_ VBUS_OC SSI_MCLK — USB_CLKIN DREQ1 2 — — — — — — SSI_CLKIN FEC I I I I I I I EVDD EVDD 102 — — 101 — — 100 F13 F12 F11 G14 G13 G12 G11 EVDD EVDD EVDD EVDD EVDD FEC_MDC FEC_MDIO FEC_COL FEC_CRS PFECI2C3 PFECI2C2 PFECH7 PFECH6 I2C_SCL2 I2C_SDA2 — — — — — — O I/O I I EVDD EVDD EVDD EVDD 4 3 144 145 B1 A1 B6 A6 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 7 Pin Assignments and Reset States Table 3. MCF5372/3 Signal Information and Muxing (continued) MCF5372 MCF5373 160 QFP 146 147 148–151 152 153 154 155 157, 158, 1, 2 MCF5372L MCF53271 MCF5373L 196 MAPBGA A5 B5 C5, D5, A4, B4 C4 A3 B3 A2 D4, C3, B2, C2 Voltage Domain EVDD EVDD EVDD EVDD EVDD EVDD EVDD EVDD Signal Name GPIO Alternate 1 Alternate 2 FEC_RXCLK FEC_RXDV FEC_RXD[3:0] FEC_RXER FEC_TXCLK FEC_TXEN FEC_TXER FEC_TXD[3:0] PFECH5 PFECH4 PFECH[3:0] PFECL7 PFECL6 PFECL5 PFECL4 PFECL[3:0] — — — — — — — — — — — — — — — — USB Host & USB On-the-Go USBOTG_M USBOTG_P USBHOST_M USBHOST_P — — — — — — — — PWM PWM7 PWM5 PWM3 PWM1 PPWM7 PPWM5 PPWM3 PPWM1 — — DT3OUT DT2OUT — — DT3IN DT2IN SSI The SSI signals do not have dedicated bond pads. Please refer to the following pins for muxing: IRQ4 for SSI_MCLK, IRQ1 for SSI_CLKIN, U1CTS for SSI_BCLK, U1RTS for SSI_FS, U1RXD for SSI_RXD, and U1TXD for SSI_TXD I2C I2C_SCL2 I2C_SDA2 PFECI2C1 PFECI2C0 — — U2TXD U2RXD DMA DACK[1:0] and DREQ[1:0] do not have dedicated bond pads. Please refer to the following pins for muxing: TS for DACK0, DT0IN for DREQ0, DT1IN for DACK1, and IRQ1 for DREQ1. QSPI QSPI_CS2 PQSPI5 U2RTS — O EVDD — — — — Dir.1 I I I I I O O O I/O I/O I/O I/O USB VDD USB VDD USB VDD USB VDD — — — — H14 H13 J13 J12 I/O I/O I/O I/O EVDD EVDD EVDD EVDD — — — — E13 E12 E11 F14 I/O I/O EVDD EVDD — — E3 E4 78 N12 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 8 Freescale Semiconductor Pin Assignments and Reset States Table 3. MCF5372/3 Signal Information and Muxing (continued) MCF5372 MCF5373 160 QFP — — 77 75 76 MCF5372L MCF53271 MCF5373L 196 MAPBGA M12 M11 P12 P11 N11 Voltage Domain EVDD EVDD EVDD EVDD EVDD Signal Name GPIO Alternate 1 Alternate 2 QSPI_CS1 QSPI_CS0 QSPI_CLK QSPI_DIN QSPI_DOUT PQSPI4 PQSPI3 PQSPI2 PQSPI1 PQSPI0 PWM7 PWM5 I2C_SCL U2CTS I2C_SDA 2 2 USBOTG_ PU_EN — — — — UARTs U1CTS U1RTS U1TXD U1RXD U0CTS U0RTS U0TXD U0RXD PUARTL7 PUARTL6 PUARTL5 PUARTL4 PUARTL3 PUARTL2 PUARTL1 PUARTL0 SSI_BCLK SSI_FS SSI_TXD2 SSI_RXD2 — — — — — — — — — — — — Dir.1 O O O I O I O O I I O O I EVDD EVDD EVDD EVDD EVDD EVDD EVDD EVDD 143 142 141 140 85 84 83 80 C6 D6 A7 B7 M14 M13 N14 P14 Note: The UART2 signals are multiplexed on the QSPI, DMA Timers, and I2C pins. DMA Timers DT3IN DT2IN DT1IN DT0IN PTIMER3 PTIMER2 PTIMER1 PTIMER0 DT3OUT DT2OUT DT1OUT DT0OUT U2RXD U2TXD DACK1 DREQ02 BDM/JTAG6 JTAG_EN7 DSCLK PSTCLK BKPT DSI DSO DDATA[3:0] PST[3:0] ALLPST — — — — — — — — — — TRST2 TCLK2 TMS2 TDI2 TDO — — — — — — — — — — — — I I O I I O O O O EVDD EVDD EVDD EVDD EVDD EVDD EVDD EVDD I I I I EVDD EVDD EVDD EVDD 8 7 6 5 D1 C1 D2 D3 96 88 70 87 90 74 — — 73 G10 K11 N8 L13 K12 L11 L9, M9, N9, P9 L10, M10, N10, P10 — EVDD MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 9 Pin Assignments and Reset States Table 3. MCF5372/3 Signal Information and Muxing (continued) MCF5372 MCF5373 160 QFP MCF5372L MCF53271 MCF5373L 196 MAPBGA Voltage Domain Signal Name GPIO Alternate 1 Alternate 2 Test TEST 7 — — — Power Supplies Dir.1 I EVDD 124 E10 EVDD — — — — — 9, 69, 71, 81, 94, 103, 139, 160 36, 79, 97, 125, 156 99 11, 39, 41, 67, 105, 121, 137 — 10, 42, 68, 82, 89, 104, 122, 138, 159 98 — E6, E7, F5–F7, G5, H10, J8, K8–K9 E5, J9, K5, K10 J10 E8–E9, F8–F10, J4–J7, H5, K6, K7 H12 G6–G9, H6–H9 IVDD PLL_VDD SD_VDD — — — — — — — — — — — — — — — USB_VDD VSS — — — — — — — — — — PLL_VSS USB_VSS 1 2 3 4 5 6 7 — — — — — — — — — — H11 J14 Refers to pin’s primary function. Pull-up enabled internally on this signal for this mode. The SDRAM functions of these signals are not programmable by the user. They are dynamically switched by the processor when accessing SDRAM memory space and are included here for completeness. Primary functionality selected by asserting the DRAMSEL signal (SDR mode). Alternate functionality selected by negating the DRAMSEL signal (DDR mode). The GPIO module is not responsible for assigning these pins. GPIO functionality is determined by the edge port module. The GPIO module is only responsible for assigning the alternate functions. If JTAG_EN is asserted, these pins default to Alternate 1 (JTAG) functionality. The GPIO module is not responsible for assigning these pins. Pull-down enabled internally on this signal for this mode. NOTE MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 10 Freescale Semiconductor Pin Assignments and Reset States 4.2 1 A FEC_ MDIO FEC_ MDC Pinout—196 MAPBGA 2 FEC_ TXER FEC_ TXD1 FEC_ TXD0 3 FEC_ TXCLK FEC_ TXEN FEC_ TXD2 4 FEC_ RXD1 FEC_ RXD0 FEC_ RXER FEC_ TXD3 5 FEC_ RXCLK FEC_ RXDV FEC_ RXD3 FEC_ RXD2 6 FEC_ CRS FEC_ COL 7 U1TXD 8 FB_CS2 9 A23 10 A19 11 A15 12 A12 13 A10 14 A9 A The pinout for the MCF5373LCVM240, MCF5372LCVM240, and MCF53721CVM240 packages are shown below. B U1RXD FB_CS3 A22/ A18 A14 A11 A7 A8 B C DT2IN U1CTS FB_CS0 FB_CS4 A21 A17 A13 A6 A3 A4 C D DT3IN DT1IN DT0IN U1RTS FB_CS1 FB_CS5 A20 A16 A5 A0 A1 A2 D E SD_WE TS I2C_SCL I2C_SDA IVDD EVDD EVDD SD_VDD SD_VDD TEST PWM3 PWM5 PWM7 TA E F D14 D15 SD_CS0 SD_CKE EVDD EVDD EVDD SD_VDD SD_VDD SD_VDD IRQ5 IRQ6 IRQ7 PWM1 F G D10 D11 D12 D13 EVDD VSS VSS VSS VSS JTAG_ EN IRQ1 IRQ2 IRQ3 IRQ4 G H SD_ DQS3 BE/ BWE1 D8 D9 SD_VDD VSS VSS VSS VSS EVDD PLL_ VSS DRAM SEL TRST/ DSCLK TDO/ DSO QSPI_ CS0 QSPI_ DOUT QSPI_ DIN 11 USBOTG _VDD USB OTG_P USB OTG_M H J D30 D31 BE/ BWE3 SD_VDD SD_VDD SD_VDD SD_VDD EVDD IVDD PLL_ VDD USB USB USBHOST J HOST_P HOST_M _VSS K K D26 D27 D28 D29 IVDD SD_VDD SD_VDD EVDD EVDD IVDD TDI/DSI RESET XTAL L SD_CLK SD_DR_ DQS D24 D25 D19 D7 D3 R/W DDATA3 PST3 RSTOUT TMS/ BKPT EXTAL L M SD_CLK SD_A10 SD_CAS SD_RAS BE/ BWE2 SD_ DQS2 BE/ BWE0 5 D6 D2 OE DDATA2 PST2 QSPI_ CS1 QSPI_ CS2 QSPI_ CLK 12 U0RTS U0CTS M N FB_CLK D23 D20 D17 D5 D1 TCLK/ PSTCLK DDATA1 PST1 XTAL 32K EXTAL 32K 13 U0TXD N P D22 1 D21 2 D18 3 D16 4 D4 6 D0 7 RCON 8 DDATA0 9 PST0 10 U0RXD 14 P Figure 3. MCF5373LCVM240, MCF5372LCVM240, and MCF53721CVM240 Pinout Top View (196 MAPBGA) MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 11 Pin Assignments and Reset States 4.3 Pinout—160 QFP FEC_RXD2 FEC_RXD3 FEC_RXDV FEC_RXCLK FEC_CRS FEC_COL U1CTS U1RTS U1TXD U1RXD 160 EVDD 159 VSS 158 FEC_TXD2 157 FEC_TXD3 156 IVDD 155 FEC_TXER 154 FEC_TXEN 153 FEC_TXCLK 152 FEC_RXER 151 FEC_RXD0 150 FEC_RXD1 EVDD VSS SD_VDD FB_CS0 FB_CS1 A23/FB_CS5 A22/FB_CS4 A21 A20 A19 The pinout for the MCF5372CAB180 and MCF5373CAB180 packages is shown below. A18 A17 A16 A15 IVDD TEST A14 VSS SD_VDD 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 D2 D1 D0 R/W OE SD_VDD VSS EVDD TCLK/PSTCLK EVDD RCON ALL_PST TDO/DSO QSPI_DIN QSPI_DOUT QSPI_CLK QSPI_CS2 IVDD U0RXD SD_VDD VSS SD_A10 SD_CAS SD_RAS D23 D22 D21 D20 D19 D18 D17 D16 BE/BWE2 SD_DQS0/2 BE/BWE0 D7 D6 D5 D4 D3 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 FEC_TXD1 FEC_TXD0 FEC_MDIO FEC_MDC DT0IN DT1IN DT2IN DT3IN EVDD VSS SD_VDD TS SD_WE SD_CKE SD_CS0 D15 D14 D13 D12 D11 D10 D9 D8 BE/BWE1 SD_DQS1/3 BE/BWE3 D31 D30 D29 D28 D27 D26 D25 D24 SD_DR_DQS IVDD SD_CLK SD_CLK SD_VDD FB_CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 • A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 TA SD_VDD VSS EVDD IRQ7 IRQ4 IRQ1 PLL_VDD PLL_VSS IVDD JTAG_EN RESET EVDD XTAL DRAMSEL EXTAL TDI/DSI VSS TRST/DSCLK TMS/BKPT RSTOUT U0CTS U0RTS U0TXD VSS EVDD Figure 4. MCF5372CAB180 and MCF5373CAB180 Pinout Top View (160 QFP) MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 12 Freescale Semiconductor Electrical Characteristics 5 Electrical Characteristics This document contains electrical specification tables and reference timing diagrams for the MCF5373 microcontroller unit. This section contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications of MCF5373. The electrical specifications are preliminary and are from previous designs or design simulations. These specifications may not be fully tested or guaranteed at this early stage of the product life cycle. However, for production silicon, these specifications will be met. Finalized specifications will be published after complete characterization and device qualifications have been completed. NOTE The parameters specified in this MCU document supersede any values found in the module specifications. 5.1 Maximum Ratings Table 4. Absolute Maximum Ratings1, 2 Rating Core Supply Voltage CMOS Pad Supply Voltage DDR/Memory Pad Supply Voltage PLL Supply Voltage Digital Input Voltage 3 Symbol IVDD EVDD SDVDD PLLVDD VIN ID TA (TL - TH) Tstg Value – 0.5 to +2.0 – 0.3 to +4.0 – 0.3 to +4.0 – 0.3 to +2.0 – 0.3 to +3.6 25 – 40 to +85 – 55 to +150 Unit V V V V V mA °C °C Instantaneous Maximum Current Single pin limit (applies to all pins) 3, 4, 5 Operating Temperature Range (Packaged) Storage Temperature Range 1 2 3 4 5 Functional operating conditions are given in Section 5.4, “DC Electrical Specifications.” Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Continued operation at these levels may affect device reliability or cause permanent damage to the device. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (VSS or EVDD). Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, and then use the larger of the two values. All functional non-supply pins are internally clamped to VSS and EVDD. Power supply must maintain regulation within operating EVDD range during instantaneous and operating maximum current conditions. If positive injection current (Vin > EVDD) is greater than IDD, the injection current may flow out of EVDD and could result in external power supply going out of regulation. Ensure external EVDD load shunts current greater than maximum injection current. This is the greatest risk when the MCU is not consuming power (ex; no clock). Power supply must maintain regulation within operating EVDD range during instantaneous and operating maximum current conditions. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 13 Electrical Characteristics 5.2 Thermal Characteristics Table 5. Thermal Characteristics Characteristic Symbol Four layer board (2s2p) Four layer board (2s2p) θJMA θJMA θJB θJC Ψjt Tj 256MBGA 371,2 341,2 273 16 4 4 196MBGA 421,2 381,2 323 19 4 160QFP 491,2 441,2 403 39 12 4 Unit °C/ W °C/ W °C/ W °C/ W °C/ W o Junction to ambient, natural convection Junction to ambient (@200 ft/min) Junction to board Junction to case Junction to top of package Maximum operating junction temperature 1 1,5 51,5 105 1,5 105 105 C 2 3 4 5 θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale recommends the use of θJmA and power dissipation specifications in the system design to prevent device junction temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature specification can be verified by physical measurement in the customer’s system using the Ψjt parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2. Per JEDEC JESD51-6 with the board horizontal. Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance with Psi-JT. The average chip-junction temperature (TJ) in °C can be obtained from: T J = T A + ( P D × Θ JMA ) Eqn. 1 Where: TA QJMA PD PINT PI/O = = = = = Ambient Temperature, °C Package Thermal Resistance, Junction-to-Ambient, °C/W PINT + PI/O IDD × IVDD, Watts - Chip Internal Power Power Dissipation on Input and Output Pins — User Determined For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is: K P D = -------------------------------( T J + 273 ° C ) Eqn. 2 Solving equations 1 and 2 for K gives: K = P D × ( T A × 273 ° C ) + Q JMA × P D 2 Eqn. 3 where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively for any value of TA. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 14 Freescale Semiconductor Electrical Characteristics 5.3 ESD Protection Table 6. ESD Protection Characteristics1, 2 Characteristics ESD Target for Human Body Model 1 Symbol HBM Value 2000 Units V All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. 2 A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification requirements. Complete DC parametric and functional testing is performed per applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. 5.4 DC Electrical Specifications Table 7. DC Electrical Specifications Characteristic Symbol IVDD PLLVDD EVDD SDVDD 1.70 2.25 3.0 USBVDD EVIH EVIL EVOH EVOL SDVIH 1.35 1.7 2 SDVIL VSS – 0.3 VSS – 0.3 VSS – 0.3 SDVOH SDVDD – 0.35 2.1 2.4 — — — 0.45 0.8 0.8 V 3.0 2 VSS – 0.3 EVDD – 0.4 — 1.95 2.75 3.6 3.6 EVDD + 0.3 0.8 — 0.4 V V V V V V SDVDD + 0.3 SDVDD + 0.3 SDVDD + 0.3 V Min 1.4 1.4 3.0 Max 1.6 1.6 3.6 Unit V V V V Core Supply Voltage PLL Supply Voltage CMOS Pad Supply Voltage SDRAM and FlexBus Supply Voltage Mobile DDR/Bus Pad Supply Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) USB Supply Voltage CMOS Input High Voltage CMOS Input Low Voltage CMOS Output High Voltage IOH = –5.0 mA CMOS Output Low Voltage IOL = 5.0 mA SDRAM and FlexBus Input High Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) SDRAM and FlexBus Input Low Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) SDRAM and FlexBus Output High Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) IOH = –5.0 mA for all modes MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 15 Electrical Characteristics Table 7. DC Electrical Specifications (continued) Characteristic SDRAM and FlexBus Output Low Voltage Mobile DDR/Bus Input High Voltage (nominal 1.8V) DDR/Bus Pad Supply Voltage (nominal 2.5V) SDR/Bus Pad Supply Voltage (nominal 3.3V) IOL = 5.0 mA for all modes Input Leakage Current Vin = VDD or VSS, Input-only pins Weak Internal Pull-Up Device Current, tested at VIL Max.1 Input Capacitance 2 All input-only pins All input/output (three-state) pins 1 2 Symbol SDVOL Min — — — Max 0.3 0.3 0.5 1.0 −130 7 7 Unit V Iin IAPU Cin −1.0 −10 — — μA μA pF Refer to the signals section for pins having weak internal pull-up devices. This parameter is characterized before qualification rather than 100% tested. 5.5 Oscillator and PLL Electrical Characteristics Table 8. PLL Electrical Characteristics Num Characteristic PLL Reference Frequency Range Crystal reference External reference Core frequency CLKOUT Frequency2 Crystal Start-up Time3, 4 EXTAL Input High Voltage Crystal Mode5 All other modes (External, Limp) EXTAL Input Low Voltage Crystal Mode5 All other modes (External, Limp) PLL Lock Time 3, 6 Duty Cycle of XTAL Current Total on-chip stray capacitance on XTAL Total on-chip stray capacitance on EXTAL Crystal capacitive load Discrete load capacitance for XTAL reference 3 Symbol Min. Value 12 12 488 x 10−6 163 x 10−6 — VXTAL + 0.4 EVDD/2 + 0.4 — — — 40 1 Max. Value 251 401 240 80 10 — — VXTAL – 0.4 EVDD/2 – 0.4 50000 60 3 1.5 1.5 See crystal spec 2*CL – CS_XTAL – CPCB_XTAL7 Unit 1 fref_crystal fref_ext fsys fsys/3 tcst VIHEXT VIHEXT VILEXT VILEXT tlpll tdc IXTAL CS_XTAL CS_EXTAL CL CL_XTAL MHz MHz MHz MHz ms V V V V CLKIN % mA pF pF 2 3 4 5 7 8 9 10 11 12 pF 13 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 16 Freescale Semiconductor Electrical Characteristics Table 8. PLL Electrical Characteristics (continued) Num Characteristic Discrete load capacitance for EXTAL 14 CLKOUT Period Jitter, 3, 4, 7, 8, 9 Measured at fSYS Max Peak-to-peak Jitter (Clock edge to clock edge) Long Term Jitter Frequency Modulation Range Limit 3, 10, 11 (fsysMax must not be exceeded) VCO Frequency. fvco = (fref * PFD)/4 Cjitter — — Cmod fvco 0.8 350 10 TBD 2.2 540 % fsys/3 % fsys/3 %fsys/3 MHz Symbol CL_EXTAL Min. Value Max. Value 2*CL–CS_EXTAL – CPCB_EXTAL7 Unit pF 17 18 19 1 The maximum allowable input clock frequency when booting with the PLL enabled is 24MHz. For higher input clock frequencies the processor must boot in LIMP mode to avoid violating the maximum allowable CPU frequency. 2 All internal registers retain data at 0 Hz. 3 This parameter is guaranteed by characterization before qualification rather than 100% tested. 4 Proper PC board layout procedures must be followed to achieve specifications. 5 This parameter is guaranteed by design rather than 100% tested. 6 This specification is the PLL lock time only and does not include oscillator start-up time. 7C PCB_EXTAL and CPCB_XTAL are the measured PCB stray capacitances on EXTAL and XTAL, respectively. 8 Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f sys. Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected into the PLL circuitry via PLL VDD, EVDD, and VSS and variation in crystal oscillator frequency increase the Cjitter percentage for a given interval. 9 Values are with frequency modulation disabled. If frequency modulation is enabled, jitter is the sum of Cjitter+Cmod. 10 Modulation percentage applies over an interval of 10 μs, or equivalently the modulation rate is 100 KHz. 11 Modulation range determined by hardware design. 5.6 External Interface Timing Characteristics NOTE All processor bus timings are synchronous; that is, input setup/hold and output delay with respect to the rising edge of a reference clock. The reference clock is the FB_CLK output. All other timing relationships can be derived from these values. Timings listed in Table 9 are shown in Figure 6 and Figure 7. Table 9 lists processor bus input timings. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 17 Electrical Characteristics * The timings are also valid for inputs sampled on the negative clock edge. FB_CLK (80MHz) TSETUP THOLD 1.5V Input Setup And Hold Invalid 1.5V Valid 1.5V Invalid trise Input Rise Time Vh = VIH Vl = VIL tfall Input Fall Time Vh = VIH Vl = VIL FB_CLK B4 B5 Inputs Figure 5. General Input Timing Requirements 5.6.1 FlexBus A multi-function external bus interface called FlexBus is provided with basic functionality to interface to slave-only devices up to a maximum bus frequency of 80MHz. It can be directly connected to asynchronous or synchronous devices such as external boot ROMs, flash memories, gate-array logic, or other simple target (slave) devices with little or no additional circuitry. For asynchronous devices a simple chip-select based interface can be used. The FlexBus interface has six general purpose chip-selects (FB_CS[5:0]) which can be configured to be distributed between the FlexBus or SDRAM memory interfaces. Chip-select, FB_CS0 can be dedicated to boot ROM access and can be programmed to be byte (8 bits), word (16 bits), or longword (32 bits) wide. Control signal timing is compatible with common ROM/flash memories. 5.6.1.1 FlexBus AC Timing Characteristics Table 9. FlexBus AC Timing Specifications The following timing numbers indicate when data is latched or driven onto the external bus, relative to the system clock. Num — FB1 FB2 FB3 Frequency of Operation Clock Period (FB_CLK) Characteristic Symbol fsys/3 tFBCK (tcyc) tFBCHDCV tFBCHDCI Min — 12.5 — 1 Max 80 — 7.0 — Unit Mhz ns ns ns Address, Data, and Control Output Valid (A[23:0], D[31:0], FB_CS[5:0], R/W, TS, BE/BWE[3:0] and OE)1 Address, Data, and Control Output Hold (A[23:0], D[31:0], FB_CS[5:0], R/W, TS, BE/BWE[3:0], and OE)1, 2 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 18 Freescale Semiconductor Electrical Characteristics Table 9. FlexBus AC Timing Specifications (continued) Num FB4 FB5 FB6 FB7 1 Characteristic Data Input Setup Data Input Hold Transfer Acknowledge (TA) Input Setup Transfer Acknowledge (TA) Input Hold Symbol tDVFBCH tDIFBCH tCVFBCH tCIFBCH Min 3.5 0 4 0 Max — — — — Unit ns ns ns ns Timing for chip selects only applies to the FB_CS[5:0] signals. Please see Section 5.7.2, “DDR SDRAM AC Timing Characteristics” for SD_CS[3:0] timing. 2 The FlexBus supports programming an extension of the address hold. Please consult the Reference Manual for more information. NOTE The processor drives the data lines during the first clock cycle of the transfer with the full 32-bit address. This may be ignored by standard connected devices using non-multiplexed address and data buses. However, some applications may find this feature beneficial. The address and data busses are muxed between the FlexBus and SDRAM controller. At the end of the read and write bus cycles the address signals are indeterminate. S0 S1 S2 S3 FB_CLK FB1 FB3 ADDR[23:0] FB2 ADDR[31:X] DATA FB4 FB5 FB_A[23:0] FB_D[31:X] FB_R/W FB_TS FB_CSn, FB_OE, FB_BE/BWEn FB6 FB7 FB_TA Figure 6. FlexBus Read Timing MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 19 Electrical Characteristics S0 S1 S2 S3 FB_CLK FB1 FB3 ADDR[23:0] FB2 FB_A[23:0] FB_D[31:X] FB_R/W FB_TS FB_CSn, FB_BE/BWEn FB_OE FB_TA ADDR[31:X] DATA FB6 FB7 Figure 7. FlexBus Write Timing 5.7 SDRAM Bus The SDRAM controller supports accesses to main SDRAM memory from any internal master. It supports standard SDRAM or double data rate (DDR) SDRAM, but it does not support both at the same time. 5.7.1 SDR SDRAM AC Timing Characteristics The following timing numbers indicate when data is latched or driven onto the external bus, relative to the memory bus clock, when operating in SDR mode on write cycles and relative to SD_DQS on read cycles. The device’s SDRAM controller is a DDR controller that has an SDR mode. Because it is designed to support DDR, a DQS pulse must remain supplied to the device for each data beat of an SDR read. The processor accomplishes this by asserting a signal named SD_SDR_DQS during read cycles. Care must be taken during board design to adhere to the following guidelines and specs with regard to the SD_SDR_DQS signal and its usage. Table 10. SDR Timing Specifications Symbol • SD1 SD3 SD4 SD5 SD6 SD7 SD8 Characteristic Frequency of Operation1 Clock Period Pulse Width 2 Symbol • tSDCK tSDCKH tSDCKH tSDCHACV tSDCHACI tDQSOV 6 Min TBD 12.5 0.45 0.45 — 2.0 — 0.25 × SD_CLK Max 80 TBD 0.55 0.55 0.5 × SD_CLK + 1.0 — Self timed 0.40 × SD_CLK Unit MHz ns SD_CLK SD_CLK ns ns ns ns High3 Pulse Width Low4 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_BA, SD_CS[1:0] - Output Valid Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_BA, SD_CS[1:0] - Output Hold SD_SDR_DQS Output Valid5 SD_DQS[3:0] input setup relative to SD_CLK tDQVSDCH MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 20 Freescale Semiconductor Electrical Characteristics Table 10. SDR Timing Specifications (continued) Symbol SD9 SD10 SD11 SD12 SD13 1 2 3 4 5 6 7 8 Characteristic SD_DQS[3:2] input hold relative to SD_CLK7 Data (D[31:0]) Input Setup relative to SD_CLK (reference only)8 Data Input Hold relative to SD_CLK (reference only) Data (D[31:0]) and Data Mask(SD_DQM[3:0]) Output Valid Data (D[31:0]) and Data Mask (SD_DQM[3:0]) Output Hold Symbol Min Max Unit tDQISDCH Does not apply. 0.5×SD_CLK fixed width. tDVSDCH tDISDCH tSDCHDMV tSDCHDMI 0.25 × SD_CLK 1.0 — 1.5 — — 0.75 × SD_CLK + 0.5 — ns ns ns ns The FlexBus and SDRAM clock operates at the same frequency of the internal bus clock. See the PLL chapter of the MCF5373 Reference Manual for more information on setting the SDRAM clock rate. SD_CLK is one SDRAM clock in (ns). Pulse width high plus pulse width low cannot exceed min and max clock period. Pulse width high plus pulse width low cannot exceed min and max clock period. SD_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This is a guideline only. Subtle variation from this guideline is expected. SD_DQS only pulses during a read cycle and one pulse occurs for each data beat. SDR_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This spec is a guideline only. Subtle variation from this guideline is expected. SDR_DQS only pulses during a read cycle and one pulse occurs for each data beat. The SDR_DQS pulse is designed to be 0.5 clock in width. The timing of the rising edge is most important. The falling edge does not affect the memory controller. Because a read cycle in SDR mode uses the DQS circuit within the device, it is most critical that the data valid window be centered 1/4 clk after the rising edge of DQS. Ensuring that this happens results in successful SDR reads. The input setup spec is provided as guidance. SD1 SD_CLK SD2 SD3 SD5 SD_CSn SD_RAS SD_CAS SD_WE A[23:0] SD_BA[1:0] CMD SD4 ROW COL SD11 SDDM SD12 D[31:0] WD1 WD2 WD3 WD4 Figure 8. SDR Write Timing MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 21 Electrical Characteristics SD1 SD_CLK SD_CSn, SD_RAS, SD_CAS, SD_WE A[23:0], SD_BA[1:0] SD5 SD3 SD2 CMD SD4 3/4 MCLK Reference ROW COL tDQS SDDM SD6 SD_SDR_DQS (Measured at Output Pin) Board Delay SD8 SD_DQS[3:2] (Measured at Input Pin) Board Delay SD7 Delayed SD_CLK SD9 D[31:0] from Memories WD1 WD2 WD3 WD4 NOTE: Data driven from memories relative to delayed memory clock. SD10 Figure 9. SDR Read Timing 5.7.2 DDR SDRAM AC Timing Characteristics When using the SDRAM controller in DDR mode, the following timing numbers must be followed to properly latch or drive data onto the memory bus. All timing numbers are relative to the four DQS byte lanes. Table 11. DDR Timing Specifications Num • DD1 DD2 DD3 DD4 DD5 DD6 DD7 Characteristic Frequency of Operation Clock Period 1 2 Symbol tDDCK tDDSK tDDCKH tDDCKL tSDCHACV tSDCHACI tCMDVDQ tDQDMV Min TBD 12.5 0.45 0.45 — 2.0 — 1.5 Max 80 TBD 0.55 0.55 0.5 × SD_CLK + 1.0 — 1.25 — Unit Mhz ns SD_CLK SD_CLK ns ns SD_CLK ns Pulse Width High Pulse Width Low3 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_CS[1:0] - Output Valid3 Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_CS[1:0] - Output Hold Write Command to first DQS Latching Transition Data and Data Mask Output Setup (DQ-->DQS) Relative to DQS (DDR Write Mode)4, 5 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 22 Freescale Semiconductor Electrical Characteristics Table 11. DDR Timing Specifications (continued) Num DD8 DD9 DD10 Characteristic Data and Data Mask Output Hold (DQS-->DQ) Relative to DQS (DDR Write Mode)6 Input Data Skew Relative to DQS (Input Setup)7 Input Data Hold Relative to DQS 8 Symbol tDQDMI tDVDQ tDIDQ tDQLSDCH tDQRPRE tDQRPST tDQWPRE tDQWPST Min 1.0 — 0.25 × SD_CLK + 0.5ns 0.5 0.9 0.4 0.25 0.4 Max — 1 — — 1.1 0.6 Unit ns ns ns ns SD_CLK SD_CLK SD_CLK DD11 DQS falling edge from SDCLK rising (output hold time) DD12 DQS input read preamble width DD13 DQS input read postamble width DD14 DQS output write preamble width DD15 DQS output write postamble width 1 2 3 4 0.6 SD_CLK 5 6 7 8 SD_CLK is one SDRAM clock in (ns). Pulse width high plus pulse width low cannot exceed min and max clock period. Command output valid should be 1/2 the memory bus clock (SD_CLK) plus some minor adjustments for process, temperature, and voltage variations. This specification relates to the required input setup time of today’s DDR memories. The processor’s output setup should be larger than the input setup of the DDR memories. If it is not larger, the input setup on the memory is in violation. MEM_DATA[31:24] is relative to MEM_DQS[3], MEM_DATA[23:16] is relative to MEM_DQS[2], MEM_DATA[15:8] is relative to MEM_DQS[1], and MEM_[7:0] is relative MEM_DQS[0]. The first data beat is valid before the first rising edge of DQS and after the DQS write preamble. The remaining data beats are valid for each subsequent DQS edge. This specification relates to the required hold time of today’s DDR memories. MEM_DATA[31:24] is relative to MEM_DQS[3], MEM_DATA[23:16] is relative to MEM_DQS[2], MEM_DATA[15:8] is relative to MEM_DQS[1], and MEM_[7:0] is relative MEM_DQS[0]. Data input skew is derived from each DQS clock edge. It begins with a DQS transition and ends when the last data line becomes valid. This input skew must include DDR memory output skew and system level board skew (due to routing or other factors). Data input hold is derived from each DQS clock edge. It begins with a DQS transition and ends when the first data line becomes invalid. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 23 Electrical Characteristics DD1 SD_CLK DD2 DD3 SD_CLK DD5 SD_CSn,SD_WE, SD_RAS, SD_CAS DD4 A[13:0] CMD DD6 ROW COL DD7 DM3/DM2 DD8 SD_DQS3/SD_DQS2 DD7 D[31:24]/D[23:16] WD1 WD2 WD3 WD4 DD8 Figure 10. DDR Write Timing MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 24 Freescale Semiconductor Electrical Characteristics DD1 SD_CLK DD2 DD3 SD_CLK DD5 SD_CSn,SD_WE, SD_RAS, SD_CAS DD4 A[13:0] CL=2 CMD CL=2.5 ROW COL DQS Read Preamble DD10 DD9 SD_DQS3/SD_DQS2 CL = 2 DQS Read Postamble D[31:24]/D[23:16] SD_DQS3/SD_DQS2 CL = 2.5 WD1 WD2 WD3 WD4 DQS Read DQS Read Preamble Postamble D[31:24]/D[23:16] WD1 WD2 WD3 WD4 Figure 11. DDR Read Timing 5.8 Num G1 G2 G3 G4 1 General Purpose I/O Timing Table 12. GPIO Timing1 Characteristic FB_CLK High to GPIO Output Valid FB_CLK High to GPIO Output Invalid GPIO Input Valid to FB_CLK High FB_CLK High to GPIO Input Invalid Symbol tCHPOV tCHPOI tPVCH tCHPI Min — 1.5 9 1.5 Max 10 — — — Unit ns ns ns ns GPIO pins include: IRQn, PWM, UART, and Timer pins. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 25 Electrical Characteristics FB_CLK G1 GPIO Outputs G2 G3 GPIO Inputs G4 Figure 12. GPIO Timing 5.9 Num R1 R2 R3 R4 R5 R6 R7 R8 1 Reset and Configuration Override Timing Table 13. Reset and Configuration Override Timing Characteristic RESET Input valid to FB_CLK High FB_CLK High to RESET Input invalid RESET Input valid Time 1 Symbol tRVCH tCHRI tRIVT tCHROV tROVCV tCOS tCOH tROICZ Min 9 1.5 5 — 0 20 0 — Max — — — 10 — — — 1 Unit ns ns tCYC ns ns tCYC ns tCYC FB_CLK High to RSTOUT Valid RSTOUT valid to Config. Overrides valid Configuration Override Setup Time to RSTOUT invalid Configuration Override Hold Time after RSTOUT invalid RSTOUT invalid to Configuration Override High Impedance During low power STOP, the synchronizers for the RESET input are bypassed and RESET is asserted asynchronously to the system. Thus, RESET must be held a minimum of 100 ns. FB_CLK R1 R3 RESET R2 R4 RSTOUT R4 R8 R5 R6 R7 Configuration Overrides*: (RCON, Override pins]) Figure 13. RESET and Configuration Override Timing NOTE Refer to the CCM chapter of the MCF5373 Reference Manual for more information. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 26 Freescale Semiconductor Electrical Characteristics 5.10 5.11 USB On-The-Go SSI Timing Specifications The MCF5373 device is compliant with industry standard USB 2.0 specification. This section provides the AC timings for the SSI in master (clocks driven) and slave modes (clocks input). All timings are given for non-inverted serial clock polarity (SSI_TCR[TSCKP] = 0, SSI_RCR[RSCKP] = 0) and a non-inverted frame sync (SSI_TCR[TFSI] = 0, SSI_RCR[RFSI] = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timings remain valid by inverting the clock signal (SSI_BCLK) and/or the frame sync (SSI_FS) shown in the figures below. Table 14. SSI Timing – Master Modes1 Num S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 1 2 Description SSI_MCLK cycle time2 SSI_MCLK pulse width high / low SSI_BCLK cycle time3 SSI_BCLK pulse width SSI_BCLK to SSI_FS output valid SSI_BCLK to SSI_FS output invalid SSI_BCLK to SSI_TXD valid SSI_BCLK to SSI_TXD invalid / high impedence SSI_RXD / SSI_FS input setup before SSI_BCLK SSI_RXD / SSI_FS input hold after SSI_BCLK Symbol tMCLK Min 8 × tSYS 45% 8 × tSYS 45% — -2 — -4 15 0 Max — 55% — 55% 15 — 15 — — — Units ns tMCLK ns tBCLK ns ns ns ns ns ns tBCLK All timings specified with a capactive load of 25pF. SSI_MCLK can be generated from SSI_CLKIN or a divided version of the internal system clock (SYSCLK). 3 SSI_BCLK can be derived from SSI_CLKIN or a divided version of SYSCLK. If the SYSCLK is used, the minimum divider is 6. If the SSI_CLKIN input is used, the programmable dividers must be set to ensure that SSI_BCLK does not exceed 4 x fSYS. Table 15. SSI Timing – Slave Modes1 Num S11 S12 S13 S14 S15 S16 S17 S18 1 Description SSI_BCLK cycle time SSI_BCLK pulse width high/low SSI_FS input setup before SSI_BCLK SSI_FS input hold after SSI_BCLK SSI_BCLK to SSI_TXD/SSI_FS output valid SSI_BCLK to SSI_TXD/SSI_FS output invalid/high impedence SSI_RXD setup before SSI_BCLK SSI_RXD hold after SSI_BCLK Symbol tBCLK Min 8 × tSYS 45% 10 3 — -2 10 3 Max — 55% — — 15 — — — Units ns tBCLK ns ns ns ns ns ns All timings specified with a capactive load of 25pF. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 27 Electrical Characteristics S1 S2 S2 SSI_MCLK (Output) S3 SSI_BCLK (Output) S5 S4 S4 S6 SSI_FS (Output) S9 S10 S7 S7 S8 S8 SSI_FS (Input) SSI_TXD S9 S10 SSI_RXD Figure 14. SSI Timing – Master Modes S11 SSI_BCLK (Input) S15 S12 S12 S16 SSI_FS (Output) S13 SSI_FS (Input) S15 S14 S15 S16 S16 SSI_TXD S17 S18 SSI_RXD Figure 15. SSI Timing – Slave Modes 5.12 I2C Input/Output Timing Specifications Table 16. I2C Input Timing Specifications between SCL and SDA Num I1 I2 I3 I4 Characteristic Start condition hold time Clock low period I2C_SCL/I2C_SDA rise time (VIL = 0.5 V to VIH = 2.4 V) Data hold time Min 2 8 — 0 Max — — 1 — Units tcyc tcyc ms ns Table 16 lists specifications for the I2C input timing parameters shown in Figure 16. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 28 Freescale Semiconductor Electrical Characteristics Table 16. I2C Input Timing Specifications between SCL and SDA (continued) Num I5 I6 I7 I8 I9 Characteristic I2C_SCL/I2C_SDA fall time (VIH = 2.4 V to VIL = 0.5 V) Clock high time Data setup time Start condition setup time (for repeated start condition only) Stop condition setup time Min — 4 0 2 2 Max 1 — — — — Units ms tcyc ns tcyc tcyc Table 17 lists specifications for the I2C output timing parameters shown in Figure 16. Table 17. I2C Output Timing Specifications between SCL and SDA Num I11 I2 1 I3 2 Characteristic Start condition hold time Clock low period I2C_SCL/I2C_SDA rise time (VIL = 0.5 V to VIH = 2.4 V) Data hold time I2C_SCL/I2C_SDA fall time (VIH = 2.4 V to VIL = 0.5 V) Clock high time Data setup time Start condition setup time (for repeated start condition only) Stop condition setup time Min 6 10 — 7 — 10 2 20 10 Max — — — — 3 — — — — Units tcyc tcyc µs tcyc ns tcyc tcyc tcyc tcyc I4 1 I5 3 I6 I7 I8 1 1 1 I9 1 1 Output numbers depend on the value programmed into the IFDR; an IFDR programmed with the maximum frequency (IFDR = 0x20) results in minimum output timings as shown in Table 17. The I2C interface is designed to scale the actual data transition time to move it to the middle of the SCL low period. The actual position is affected by the prescale and division values programmed into the IFDR; however, the numbers given in Table 17 are minimum values. 2 Because I2C_SCL and I2C_SDA are open-collector-type outputs, which the processor can only actively drive low, the time I2C_SCL or I2C_SDA take to reach a high level depends on external signal capacitance and pull-up resistor values. 3 Specified at a nominal 50-pF load. Figure 16 shows timing for the values in Table 17 and Table 16. I5 I2 I2C_SCL I1 I2C_SDA I4 I7 I8 I9 I6 I3 Figure 16. I2C Input/Output Timings MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 29 Electrical Characteristics 5.13 Fast Ethernet AC Timing Specifications MII signals use TTL signal levels compatible with devices operating at 5.0 V or 3.3 V. 5.13.1 MII Receive Signal Timing The receiver functions correctly up to a FEC_RXCLK maximum frequency of 25 MHz +1%. The processor clock frequency must exceed twice the FEC_RXCLK frequency. Table 18 lists MII receive channel timings. Table 18. MII Receive Signal Timing Num M1 M2 M3 M4 Characteristic FEC_RXD[3:0], FEC_RXDV, FEC_RXER to FEC_RXCLK setup FEC_RXCLK to FEC_RXD[3:0], FEC_RXDV, FEC_RXER hold FEC_RXCLK pulse width high FEC_RXCLK pulse width low Min 5 5 35% 35% Max — — 65% 65% Unit ns ns FEC_RXCLK period FEC_RXCLK period Figure 17 shows MII receive signal timings listed in Table 18. M3 FEC_RXCLK (input) M4 FEC_RXD[3:0] (inputs) FEC_RXDV FEC_RXER M1 M2 Figure 17. MII Receive Signal Timing Diagram 5.13.2 MII Transmit Signal Timing Table 19 lists MII transmit channel timings. The transmitter functions correctly up to a FEC_TXCLK maximum frequency of 25 MHz +1%. The processor clock frequency must exceed twice the FEC_TXCLK frequency. Table 19. MII Transmit Signal Timing Num M5 M6 M7 M8 Characteristic FEC_TXCLK to FEC_TXD[3:0], FEC_TXEN, FEC_TXER invalid FEC_TXCLK to FEC_TXD[3:0], FEC_TXEN, FEC_TXER valid FEC_TXCLK pulse width high FEC_TXCLK pulse width low Min 5 — 35% 35% Max — 25 65% 65% Unit ns ns FEC_TXCLK period FEC_TXCLK period Figure 18 shows MII transmit signal timings listed in Table 19. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 30 Freescale Semiconductor Electrical Characteristics M7 FEC_TXCLK (input) M5 FEC_TXD[3:0] (outputs) FEC_TXEN FEC_TXER M6 M8 Figure 18. MII Transmit Signal Timing Diagram 5.13.3 MII Async Inputs Signal Timing Table 20. MII Async Inputs Signal Timing Table 20 lists MII asynchronous inputs signal timing. Num M9 Characteristic FEC_CRS, FEC_COL minimum pulse width Min 1.5 Max — Unit FEC_TXCLK period FEC_CRS FEC_COL M9 Figure 19. MII Async Inputs Timing Diagram 5.13.4 MII Serial Management Channel Timing Table 21 lists MII serial management channel timings. The FEC functions correctly with a maximum MDC frequency of 2.5 MHz. Table 21. MII Serial Management Channel Timing Num M10 M11 M12 M13 M14 M15 Characteristic FEC_MDC falling edge to FEC_MDIO output invalid (minimum propagation delay) FEC_MDC falling edge to FEC_MDIO output valid (max prop delay) FEC_MDIO (input) to FEC_MDC rising edge setup FEC_MDIO (input) to FEC_MDC rising edge hold FEC_MDC pulse width high FEC_MDC pulse width low Min 0 — 10 0 Max — 25 — — Unit ns ns ns ns 40% 60% FEC_MDC period 40% 60% FEC_MDC period MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 31 Electrical Characteristics M14 M15 FEC_MDC (output) M10 FEC_MDIO (output) M11 FEC_MDIO (input) M12 M13 Figure 20. MII Serial Management Channel Timing Diagram 5.14 32-Bit Timer Module Timing Specifications Table 22. Timer Module AC Timing Specifications Name T1 T2 Characteristic DT0IN / DT1IN / DT2IN / DT3IN cycle time DT0IN / DT1IN / DT2IN / DT3IN pulse width Min 3 1 Max — — Unit tCYC tCYC Table 22 lists timer module AC timings. 5.15 QSPI Electrical Specifications Table 23. QSPI Modules AC Timing Specifications Table 23 lists QSPI timings. Name QS1 QS2 QS3 QS4 QS5 QSPI_CS[3:0] to QSPI_CLK Characteristic Min 1 — 2 9 9 Max 510 10 — — — Unit tCYC ns ns ns ns QSPI_CLK high to QSPI_DOUT valid. QSPI_CLK high to QSPI_DOUT invalid. (Output hold) QSPI_DIN to QSPI_CLK (Input setup) QSPI_DIN to QSPI_CLK (Input hold) MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 32 Freescale Semiconductor Electrical Characteristics QS1 QSPI_CS[3:0] QSPI_CLK QS2 QSPI_DOUT QS3 QSPI_DIN QS4 QS5 Figure 21. QSPI Timing 5.16 Num J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 J11 J12 J13 J14 1 JTAG and Boundary Scan Timing Table 24. JTAG and Boundary Scan Timing Characteristics1 TCLK Frequency of Operation TCLK Cycle Period TCLK Clock Pulse Width TCLK Rise and Fall Times Boundary Scan Input Data Setup Time to TCLK Rise Boundary Scan Input Data Hold Time after TCLK Rise TCLK Low to Boundary Scan Output Data Valid TCLK Low to Boundary Scan Output High Z TMS, TDI Input Data Setup Time to TCLK Rise TMS, TDI Input Data Hold Time after TCLK Rise TCLK Low to TDO Data Valid TCLK Low to TDO High Z TRST Assert Time TRST Setup Time (Negation) to TCLK High Symbol fJCYC tJCYC tJCW tJCRF tBSDST tBSDHT tBSDV tBSDZ tTAPBST tTAPBHT tTDODV tTDODZ tTRSTAT tTRSTST Min DC 4 26 0 4 26 0 0 4 10 0 0 100 10 Max 1/4 — — 3 — — 33 33 — — 26 8 — — Unit fsys/3 tCYC ns ns ns ns ns ns ns ns ns ns ns ns JTAG_EN is expected to be a static signal. Hence, specific timing is not associated with it. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 33 Electrical Characteristics J2 J3 VIH J3 TCLK (input) J4 VIL J4 Figure 22. Test Clock Input Timing TCLK VIL J5 VIH J6 Data Inputs J7 Input Data Valid Data Outputs J8 Output Data Valid Data Outputs J7 Data Outputs Output Data Valid Figure 23. Boundary Scan (JTAG) Timing TCLK VIL J9 VIH J10 TDI TMS J11 Input Data Valid TDO J12 Output Data Valid TDO J11 TDO Output Data Valid Figure 24. Test Access Port Timing TCLK J14 TRST J13 Figure 25. TRST Timing MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 34 Freescale Semiconductor Current Consumption 5.17 Debug AC Timing Specifications Table 25. Debug AC Timing Specification Num D0 D1 D2 D3 D41 D5 D6 1 Table 25 lists specifications for the debug AC timing parameters shown in Figure 26. Characteristic PSTCLK cycle time PSTCLK rising to PSTDDATA valid PSTCLK rising to PSTDDATA invalid DSI-to-DSCLK setup DSCLK-to-DSO hold DSCLK cycle time BKPT assertion time Min 2 — 1.5 1 4 5 1 Max 2 3.0 — — — — — Units tSYS = 1/fSYS ns ns PSTCLK PSTCLK PSTCLK PSTCLK DSCLK and DSI are synchronized internally. D4 is measured from the synchronized DSCLK input relative to the rising edge of PSTCLK. D0 PSTCLK D1 D2 PSTDDATA[7:0] Figure 26. Real-Time Trace AC Timing D5 DSCLK D3 DSI Current D4 Next DSO Past Current Figure 27. BDM Serial Port AC Timing 6 Current Consumption All current consumption data is lab data measured on a single device using an evaluation board. Table 26 shows the typical power consumption in low-power modes. These current measurements are taken after executing a STOP instruction. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 35 Current Consumption Table 26. Current Consumption in Low-Power Modes1,2 Mode Stop Mode 3 (Stop 11)5 Voltage 3.3 V 1.5 V Stop Mode 2 (Stop 10)4 3.3 V 1.5 V Stop Mode 1(Stop 01)4 3.3 V 1.5 V Stop Mode 0 (Stop 00)4 3.3 V 1.5 V 3.3 V Wait/Doze 1.5 V 3.3 V Run 1.5 V 1 2 3 4 5 58 MHz (Typ)3 3.9 1.04 4.69 2.69 4.72 15.28 21.65 15.47 22.49 26.79 33.61 56.3 64 MHz (Typ)3 3.92 1.04 4.72 2.69 4.73 16.44 21.68 16.63 22.52 28.85 33.61 60.7 72 MHz (Typ)3 4.0 1.04 4.8 2.70 4.81 17.85 24.33 18.06 25.21 30.81 42.3 65.4 80 MHz (Typ)3 4.0 1.04 4.8 2.70 4.81 19.91 26.13 20.12 27.03 34.47 50.5 73.4 80 MHz (Peak)4 4.0 1.08 4.8 2.75 4.81 20.42 Units mA 26.16 20.67 39.8 97.4 62.6 132.3 All values are measured with a 3.30V EVDD, 3.30V SDVDD and 1.5V IVDD power supplies. Tests performed at room temperature with pins configured for high drive strength. Refer to the Power Management chapter in the MCF537x Reference Manual for more information on low-power modes. All peripheral clocks except UART0, FlexBus, INTC0, reset controller, PLL, and edge port off before entering low power mode. All code executed from flash. All peripheral clocks on before entering low power mode. All code is executed from flash. See the description of the low-power control register (LCPR) in the MCF537x Reference Manual for more information on stop modes 0–3. 450 Power Consumption (mW) 400 350 300 250 200 150 100 50 0 58 64 72 fsys/3 (MHz) Figure 28. Current Consumption in Low-Power Modes Stop 0 - Flash Stop 1 - Flash Stop 2 - Flash Stop 3 - Flash Wait/Doze - Flash Run - Flash 80 80(peak) MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 36 Freescale Semiconductor Current Consumption Table 27. Typical Active Current Consumption Specifications1 fsys/3 Frequency Voltage 3.3V 1.333 MHz 1.5V 3.3V 2.666 MHz 1.5V 3.3V 58 MHz 1.5V 3.3V 64 MHz 1.5V 3.3V 72 MHz 1.5V 3.3V 80 MHz 1.5V 1 Typical2 Active (Flash) 7.73 2.87 8.57 4.37 40.10 65.90 44.40 69.50 53.6 74.6 63.0 79.6 Peak3 7.74 3.56 8.60 5.52 49.3 91.70 Unit mA 54.0 97.0 63.7 104.7 73.7 112.9 All values are measured with a 3.30 V EVDD, 3.30 V SDVDD and 1.5 V IVDD power supplies. Tests performed at room temperature with pins configured for high drive strength. 2 CPU polling a status register. All peripheral clocks except UART0, FlexBus, INTC0, reset controller, PLL, and edge port disabled. 3 Peak current measured while running a while(1) loop with all modules active. Figure 29 shows the estimated maximum power consumption. 300 250 200 150 100 50 0 0 Estimated Power Consumption vs. Core Frequency Power Consumption (mW) 40 80 120 160 Core Frequency (MHz) 200 240 Figure 29. Estimated Maximum Power Consumption MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 37 Package Information 7 Package Information NOTE The mechanical drawings are the latest revisions at the time of publication of this document. The most up-to-date mechanical drawings can be found at the product summary page located at http://www.freescale.com/coldfire. This section contains drawings showing the pinout and the packaging and mechanical characteristics of the MCF537x devices. MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 38 Freescale Semiconductor Package Information 7.1 X Y Package Dimensions—196 MAPBGA D Laser mark for pin 1 identification in this area NOTES: 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M, 1994. 3. Dimension B is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Millimeters DIM Min Max Figure 30 shows the MCF5373LCVM240, MCF5372LCVM240, and MCF53721CVM240 package dimensions. M K E A A1 A2 b D E e S 1.32 1.75 0.27 0.47 1.18 REF 0.35 0.65 15.00 BSC 15.00 BSC 1.00 BSC 0.50 BSC Top View 0.20 13X M e Metalized mark for pin 1 identification in this area A B C S 14 13 12 11 10 9 6 5 4 3 2 1 S 13X D E F G H J K L M N 5 A A2 0.30 Z e A1 Z 4 0.15 Z Detail K Rotated 90 ° Clockwise 3 196X P b 0.30 Z X Y 0.10 Z Bottom View View M-M Figure 30. 196 MAPBGA Package Dimensions (Case No. 1128A-01) MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 39 Package Information 7.2 Package Dimensions—160 QFP Figure 31 and Figure 32 show the MCF5372CAB180 and MCF5373CAB180 package dimensions. Top View Figure 31. 160QFP Package Dimensions (Sheet 1 of 2) MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 40 Freescale Semiconductor Package Information Figure 32. 160QFP Package Dimensions (Sheet 2 of 2) MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 41 Revision History 8 Revision History Table 28. MCF5373DS Document Revision History Rev. No. 0 0.1 0.2 • Initial release • Swapped pin locations PLL_VSS (J11->H11) and DRAMSEL (H11->J11) in Table 1. Figure 3 is correct. • Added not to Section 7, “Package Information.” • Added “top view” and “bottom view” where appropriate in mechanical drawings and pinout figures. • Figure 5: Corrected “FB_CLK (75MHz)” label to “FB_CLK (80MHz)” • Changed 160QFP pinouts in Figure 4 and Table 2: Removed IRQ3 pin, shifted pins 89–99 up one pin to 90–100. Pin 89 is now VSS. • Table 2: Rearranged GPIO signal names for FEC pins. • Removed ULPI specifications as the device does not support ULPI. • Updated thermal characteristic values in Table 7. • Updated DC electricals values in Table 7. • Updated Section 3.3, “Supply Voltage Sequencing and Separation Cautions” and subsections. • Updated and added Oscillator/PLL characteristics in Table 8. • Table 9: Swapped min/max for FB1; Removed FB8 & FB9. • Updated SDRAM write timing diagram, Figure 8. • Table 11: Added values for frequency of operation and DD1. • Replaced figure & table Section 5.11, “SSI Timing Specifications,” with slave & master mode versions. • Removed second sentence from Section 5.13.2, “MII Transmit Signal Timing,” regarding no minimum frequency requirement for TXCLK. • Removed third and fourth paragraphs from Section 5.13.2, “MII Transmit Signal Timing,” as this feature is not supported on this device. • Updated figure & table Section 5.17, “Debug AC Timing Specifications.” • Renamed & moved previous version’s Section 5.5 “Power Consumption” to Section 6, “Current Consumption.” Added additional real-world data to this section as well. • Added MCF53721 device information throughout: features list, family configuration table, ordering information table, signals description table, and relevant package diagram titles • Remove Footnote 1 from Table 11. • Changed document type from Advance Information to Technical Data. • Removed cryptography from Table 1 for the MCF53721 device. • Corrected D0 spec in Table 25 from 1.5 x tsys to 2 x tsys for min and max balues. • Updated FlexBus read and write timing diagrams in Figure 6 and Figure 7. • Corrected package information in Table 2 for MCF5373LCVM240 device from “256 MAPBGA” to “196 MAPBGA”. • Removed footnote 2 from the IRQ[7:1] alternate functions USBHOST VBUS_EN, USBHOST VBUS_OC, SSI_MCLK, USB_CLKIN, and SSI_CLKIN signals in Table 6. Substantive Changes Date of Release 11/2005 12/2005 3/2006 0.3 4/2006 1 7/2007 2 8/2007 3 4/2008 MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 42 Freescale Semiconductor Revision History THIS PAGE INTENTIONALLY BLANK MCF537x ColdFire® Microprocessor Data Sheet, Rev. 3 Freescale Semiconductor 43 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. 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RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics as their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. D ocument Number: MCF5373DS Rev. 3 04/2008