MMA6222AKEGR2

Freescale Semiconductor Technical Data MMA6222AKEG Rev 0, 12/2009 Analog Dual Axis Micromachined Accelerometer The MMA62XXAKEG series of dual axis (X and Y) silicon capacitive, micromachined accelerometers features a full digital signal processing for filtering, trim and data formatting. It has been optimized for analog output and offers an over-damped transducer. Features • • • • • • • • • • • Available in ±20/20g, ±50/50g, or ±100/100g versions. Additional g-ranges between 20 and 100g may be available upon request Full-scale range is independently specified for each axis 400 Hz, 4 Pole, 16 µs sample time, additional filter options are available Ratiometric analog voltage output Capture/hold input for system-wide synchronization support 3.3 or 5 V single supply operation On-chip temperature sensor and voltage regulator Internal self-test Minimal external component requirements Pb-free 20-pin SOIC package Qualified AEC-Q100, Rev. F Grade 2 (-40°C/ +105°C) MMA6222AKEG MMA6255AKEG MMA621010AKEG 2-AXIS ACCELEROMETER KEG SUFFIX (Pb-free) 20-LEAD SOIC CASE 475A-02 PIN CONNECTIONS N/C N/C XOUT VSSA YOUT CAP/HOLD ST VPP CREG RESET 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 N/C N/C CREGA CREGA CREF CREF VCC VSS STATUS SCLK Typical Applications • • • Crash Detection (Airbag) Impact and vibration monitoring Shock detection 20-PIN SOIC PACKAGE N/C: NO INTERNAL CONNECTION ORDERING INFORMATION Device Name MMA6222AEG MMA6222AEGR2 MMA6222AKEG* MMA6222AKEGR2* MMA6255AEG MMA6255AEGR2 MMA6255AKEG* MMA6255AKEGR2* MMA621010AEG MMA621010AEGR2 MMA621010AKEG* MMA621010AKEGR2* X-Axis g-Level 20 20 20 20 50 50 50 50 100 100 100 100 Y-Axis g-Level 20 20 20 20 50 50 50 50 100 100 100 100 Temperature Range -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +105°C Package 475A-02 475A-02 475A-02 475A-02 475A-02 475A-02 475A-02 475A-02 475A-02 475A-02 475A-02 475A-02 Packaging Tubes Tape & Reel Tubes Tape & Reel Tubes Tape & Reel Tubes Tape & Reel Tubes Tape & Reel Tubes Tape & Reel *Part number sourced from a different facility. © Freescale Semiconductor, Inc., 2009. All rights reserved. VCC VCC CREG CREGA CREF 100 nF 1 μF 1 μF 100 nF CS SCLK ST STATUS CS_A SCLK1 I/O I/O CS_D SCLK2 MOSI2 MISO2 CS SCLK DI DO MMA62XXAKEG VSSA VSS VPP/TEST XOUT YOUT Main MCU Deployment IC ADC Safing Sensor(s) Filter / Comparator DEPLOY_EN1 DEPLOY_EN2 Note: If one axis of the MMA62XXAKEG sensor is expected to be used as a confirmation of the other axis, Freescale recommends that MMA62XXAKEG used in conjunction with an additional sensing/safing device for each axis. Figure 1-1 Simplified Airbag Application Diagram 1.1 INTRODUCTION The MMA62XXKEG is trimmed to provide the most accurate voltage representation of acceleration at XOUT and YOUT. This is done by adjusting the signal within the DSP to compensate for errors within the digital-to-analog converters. The SPI is disabled when the device is in normal operating mode, and dedicated ST (self-test activation) and STATUS pin functions are assigned. MMA6222AEG 2 Sensors Freescale Semiconductor 1.2 BLOCK DIAGRAM A block diagram illustrating the major components of the design is shown in Figure 1-2. VPP VCC CREG CREGA CREGA CREF CREF VSS VSSA CONTROL LOGIC ST STATUS SCLK RESET CAP/HOLD VOLTAGE REGULATOR UNIT PROGRAMMABLE DATA ARRAY REFERENCE OSCILLATOR PRIMARY OSCILLATOR CLOCK MONITOR INTERNAL CLOCK g-CELL (Y) SD CONVERTER SINC FILTER Y IN CONTROL IN STATUS OUT DIGITAL OUT SELF-TEST INTERFACE TEMP. SENSOR TEMP DSP (SEE FIGURE 1-2) Y OUT DAC YOUT X IN X OUT g-CELL (X) SD CONVERTER SINC FILTER DAC XOUT Figure 1-2 MMA62XXAKEG Block Diagram CONTROL IN DSP CONTROL OUT OFFSET MONITOR Y IN X IN LOW-PASS FILTER OFFSET, GAIN, LINEARITY ADJUST OUTPUT SCALING TO Y DAC TO X DAC TEMP Figure 1-3 MMA62XXAKEG DSP Block Diagram NOTE: Models of signal chain are available upon request MMA6222AKEG Sensors Freescale Semiconductor 3 1.3 PIN FUNCTIONS The pinout for the MMA62XXAKEG device is illustrated in Figure 1-4. Pin functions are described below. When self-test is active, the output becomes more positive in both axes if ST1 is cleared, or more negative in both axes if ST1 is set. N/C N/C XOUT VSSA YOUT CAP/HOLD ST VPP CREG RESET 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 N/C N/C CREGA CREGA CREF CREF VCC VSS STATUS SCLK 20-PIN SOIC PACKAGE N/C: NO INTERNAL CONNECTION X: +1g Y: 0g X: 0g Y: +1g X: 0g Y: -1g TO CENTER OF GRAVITATION FIELD X: -1g Y: 0g Response to static orientation within 1g field. Figure 1-4 MMA62XXAKEG Pinout MMA6222AEG 4 Sensors Freescale Semiconductor 1.4 1.4.1 PIN FUNCTION DESCRIPTIONS VCC This pin supplies power to the device. Careful printed wiring board layout and capacitor placement is critical to ensure best performance. An external bypass capacitor between this pin and VSS is required, as described in Section 1.5. 1.4.2 VSS VSSA This pin is the power supply return node for the digital circuitry on the MMA62XXKEG device. 1.4.3 This pin is the power supply return node for analog circuitry on the MMA62XXAKEG device. An external bypass capacitor between this pin and VCC is required, as described in Section 1.5. 1.4.4 CREG This pin is connected to the internal digital circuitry power supply rail. An external filter capacitor must be connected between this pin and VSS, as described in Section 1.5. 1.4.5 CREGA These pins are connected in parallel to the internal analog circuitry power supply rail. One or two external filter capacitors must be connected between these pins and VSSA, as described in Section 1.5. Two pins are provided to support redundant connection to the printed wiring board assembly. Redundant external capacitors may be connected to these pins for maximum reliability, as described in Section 1.5. 1.4.6 CREF These pins are connected in parallel to an internal reference voltage node utilized by the analog circuitry. One or two external filter capacitors must be connected between these pins and VSSA, as described shown in Section 1.5. Two pins are provided to support redundant connection to the printed wiring board assembly. Redundant external capacitors may be connected to these pins for maximum reliability, as described in Section 1.5. 1.4.7 VPP This pin should be tied directly to VSS. 1.4.8 SCLK This input may be left unconnected unless it is desired to initiate device reset as described in Section 1.4.9. 1.4.9 RESET This pin may be used to initiate a hardware reset. If RESET is held low and SCLK is held high for 512 μs, the internal reset signal is asserted. An internal pull-up device is connected to this pin. 1.4.10 STATUS This pin provides an indicator of internal status. The STATUS output will be driven to a logic high level should any of the following fault conditions be detected: • Internal parity fault • Over-temperature condition • Internal clock frequency fault • Device reset • Device initialization Immediately following device reset, STATUS is placed in a high impedance state for approximately 800 μs. At the end of this time, STATUS is driven high and a 3ms stabilization delay required by the internal circuitry begins. The STATUS condition may not be cleared during the stabilization delay. Reset is reported by the device so the system can be aware of potential difficulties if unexpected resets occur. Once asserted, the STATUS output will remain high until the ST pin is driven from a logic low to a logic high state. If a fault condition persists, the STATUS output will be driven high again as soon as it is cleared. MMA6222AKEG Sensors Freescale Semiconductor 5 1.4.11 ST This pin performs a dual function. When driven to a logic high level, the internal self-test voltage generator is activated. A low-tohigh transition on this pin will clear the internal STATUS latch. Note that under certain fault conditions, the STATUS latch will be immediately reset, indicating a terminal fault condition. A diagram illustrating operation of the STATUS latch following device initialization is illustrated in Figure 1-5. ST SELF TEST ENABLE VDD D Q R STATUS FAULT DETECT Figure 1-5 ST and STATUS Interaction 1.4.12 CAP/HOLD When this input pin is low, acceleration data is updated by the DSP whenever a data sample becomes available. Upon a low-tohigh transition of CAP/HOLD acceleration data is frozen. Acceleration data is not updated as long as the pin remains at a logic ‘1’ level. This pin may be tied directly to VSS if the hold function is not desired. 1.4.13 XOUT, YOUT Two digital-to-analog converters (DACs) are provided. These converters translate output of the DSP block into voltage levels proportional to the magnitude of the numerical result and ratiometric to VCC. 1.5 EXTERNAL COMPONENTS The connections illustrated in Figure 1-1 are recommended. Careful printed wiring board layout and component placement is essential for best performance. Low ESR capacitors must be connected to CREG and CREGA pins for the best performance. A grounded land area with solder mask should be placed under the package for improved shielding of the device from external effects. If a land area is not provided, no signals should be routed beneath the package. See Figure 1-1. MMA6222AEG 6 Sensors Freescale Semiconductor SECTION 2 PERFORMANCE SPECIFICATION 2.1 MAXIMUM RATINGS Maximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. The device contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep input and output voltages within the range VSS ≤ V ≤ VCC. Ref 1 Supply Voltage 2 CREG, CREGA, CREF 3 VPP 4 SCLK, ST, CAP/HOLD 5 STATUS (high impedance state) 6 XOUT, YOUT (DACEN = 0) 7 Current Drain per Pin Excluding VCC and VSS 8 Acceleration (without hitting internal g-cell stops) 9 Powered Shock (six sides, 0.5 ms duration) 10 Unpowered Shock (six sides, 0.5 ms duration) 11 Drop Shock (to concrete surface) 12 13 14 Electrostatic Discharge Human Body Model (HBM) Charge Device Model (CDM) Machine Model (MM) Rating Symbol VCC VREG VREG VIN VIN VDAC I gmax gpms gshock hDROP VESD VESD VESD Tstg Value -0.3 to +7 -0.3 to +3 -0.3 to +11 -0.3 to VCC + 0.3 -0.3 to VCC + 0.3 -0.3 to VCC + 0.3 10 ±800 ±1500 ±2000 1.2 ±2000 ±500 ±200 -40 to +125 Unit V V V V V V mA g g g m V V V °C (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) 15 Storage Temperature Range Notes: 1. Verified by characterization, not tested in production. 2.2 OPERATING RANGE The operating ratings are the limits normally expected in the application and define the range of operation. Ref Characteristic Symbol VCC VCC TA Min VL +3.15 +4.75 TL -40 Typ +3.3 +5.0 ⎯ Max VH +3.45 +5.25 TH +105 Units V V C (1) (1) (2) Supply Voltage Standard Operating Voltage, 3.3V operating range 16 Standard Operating Voltage, 5V operating range 17 Operating Temperature Range 18 Notes: 1. Characterized at all values of VL and VH. Production test is conducted at typical voltage unless otherwise noted. 2. Parameters tested 100% at final test. MMA6222AKEG Sensors Freescale Semiconductor 7 2.3 ELECTRICAL CHARACTERISTICS VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4 K/min unless otherwise specified Ref 19 20 21 22 23 Characteristic Supply Current Drain Analog-only output configuration Power-On Recovery Threshold (See Figure 2-1) VCC CREG CREGA CREF Power-On Reset Threshold (See Figure 2-1) VCC CREG CREGA CREF Hysteresis (VPOR_N - VPOR_A, See Figure 2-1) VCC CREG CREGA CREF Symbol IDD VPOR_N VPOR_N VPOR_N VPOR_N 2.77 1.80 2.18 1.11 Min Typ ⎯ ⎯ ⎯ ⎯ ⎯ Max 9.0 3.15 2.32 2.50 1.29 Units mA V V V V (1) (2) (2) (2) (2) 24 25 26 27 VPOR_A VPOR_A VPOR_A VPOR_A 2.77 1.80 2.18 1.11 ⎯ ⎯ ⎯ 2.95 2.10 2.31 1.19 V V V V (2) (2) (2) (2) 28 29 30 31 VHYST VHYST VHYST VHYST VDACU VDD V2.5 VREF 0 0 0 0 ⎯ 2.42 2.42 1.20 ⎯ ⎯ ⎯ ⎯ ⎯ 2.50 2.50 1.25 388 300 261 150 2.0 2.58 2.58 1.29 mV mV mV mV V V V V (2) (1) (1) (1) 32 Minimum Functional Voltage (See Figure 2-1) 33 34 35 Internally Regulated Voltages CREG CREGA (3) CREF External Filter Capacitor (CREG, CREGA) Value ESR (including interconnect resistance) Power Supply Coupling (4) Analog output Analog Sensitivity (XOUT, YOUT) 20g Range 35g Range 50g Range 100g Range Sensitivity Error TA = 25°C 40°C ≤ TA ≤ 105°C Offset at 0g Analog output (XOUT, YOUT) * * * * * * 36 37 CREG ESR 800 ⎯ 1000 ⎯ ⎯ 200 nF mΩ (2) (2) 38 39 40 41 42 See Figure 2-2 ASENS ASENS ASENS ASENS ⎯ ⎯ ⎯ ⎯ 23.40 13.40 9.37 4.68 ⎯ ⎯ ⎯ ⎯ mV/V/g mV/V/g mV/V/g mV/V/g (2) (1)(5) (1)(5) (1)(5) (1)(5) 43 44 45 * * * ΔSENS ΔSENS AOUT -8 -8 0.46 × VCC ⎯ ⎯ 0.5 × VCC +8 +8 0.54 × VCC % % V (1)(5) (1)(5) (1)(5) Notes: 1. 2. 3. 4. 5. (#) (*) Parameters tested 100% at final test. Verified by characterization, not tested in production. Tested at VCC = VL and VCC = VH. Power supply ripple at frequencies greater than 900 kHz should be minimized to the greatest extent possible. Devices are trimmed at 100 Hz with 1000 Hz low-pass filter option selected. Indicates a FSL significant parameter (CPK > 1.33). Indicates a FSL critical parameter (CPK > 1.67). MMA6222AEG 8 Sensors Freescale Semiconductor 2.3 ELECTRICAL CHARACTERISTICS (CONTINUED) VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4 K/min unless otherwise specified Ref Characteristic Output value on overrange 46 47 48 49 20g Range 35g Range 50g Range 100g Range Output value on Underrange 50 51 52 53 20g Range 35g Range 50g Range 100g Range gUNDER gUNDER gUNDER gUNDER -20.1 -35.1 -50.1 -100.3 -20.9 -36.6 -52.2 -104.5 -22.2 -38.8 -55.4 -110.7 g g g g (3) (3) (3) (3) gOVER gOVER gOVER gOVER +20.0 +35.0 +50.0 +100.1 +20.9 +36.6 +52.1 +104.3 +22.1 +38.7 +55.3 +110.5 g g g g (3) (3) (3) (3) Symbol Min Typ Max Units Maximum acceleration without saturation of internal circuitry All ranges 54 55 Nonlinearity 56 Noise (1Hz-1kHz) Positive Self Test Output Change (XOUT, YOUT, analog) TA = 25°C 57 58 -40°C ≤ TA ≤ 105°C 59 60 61 62 63 64 65 66 67 Cross-Axis Sensitivity VZX VYX VZY VXY gSAT NLOUT nSD -200 -1 — — — — +200 1 1.1 g % FSR mg/√Hz (3) (3) (3) ΔST ΔST VZX VYX VZY VXY AVLOW AVHIGH OFST GERR DNL INL INL 10 10 -4 -4 -4 -4 — VCC - 0.25 -0.2 -0.3 -2 -3 -3.5 — — — — — — — — — — 18 18 +4 +4 +4 +4 0.25 — +0.2 +0.3 +2 +3 +3.5 % FS % FS % % % % V V %FSR %FSR digit digit digit (1) (1) (3) (3) (3) (3) (2) (2) (2) (2) (2) (2) (3) DAC Characteristics (XOUT, YOUT) Minimum Output Level, IOUT = -200 μA Maximum Output Level, IOUT = 200 μA Offset Error Gain Error Differential Nonlinearity Integral Nonlinearity TA = 25°C 68 69 -40°C ≤ TA ≤ 105°C Output High Voltage STATUS (ILoad = -100 μA) 70 3.15 V ≤ (VCC - VSS) ≤ 3.45 V 71 4.75 V ≤ (VCC - VSS) ≤ 5.25 V Output Low Voltage STATUS (ILoad = 100 μA) 72 3.15 V ≤ (VCC - VSS) ≤ 3.45 V 73 4.75 V ≤ (VCC - VSS) ≤ 5.25 V 74 75 Output Loading (STATUS) Load Resistance Load Capacitance — — VOH VOH 3.25 3.75 — — — — V V (2) (2) VOL VOL ZOUT COUT — — 47 — — — — — 0.4 0.4 — 35 V V kΩ pF (2) (2) (3) (3) Notes: 1. Parameters tested 100% at final test. 2. Parameters tested 100% at unit probe. 3. Verified by characterization, not tested in production. MMA6222AKEG Sensors Freescale Semiconductor 9 2.3 ELECTRICAL CHARACTERISTICS (CONTINUED) VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4 K/min unless otherwise specified Ref 76 77 Characteristic Output Loading (XOUT, YOUT) Load Resistance Load Capacitance Symbol ZOUT COUT Min 25 — Typ — — Max — 60 Units kΩ pF (3) (3) Input High Voltage RESET, SCLK, ST, CAP/HOLD 78 3.15 V ≤ (VCC - VSS) ≤ 3.45 V 79 4.75 V ≤ (VCC - VSS) ≤ 5.25 V Input Low Voltage RESET, SCLK, ST, CAP/HOLD 80 3.15 V ≤ (VCC - VSS) ≤ 3.45 V 81 4.75 V ≤ (VCC - VSS) ≤ 5.25 V Input Current High (at VIH) SCLK, ST, CAP/HOLD VPP/TEST (internal pulldown resistor) Low (at VIL) RESET VIH VIH 1.5 2.5 — — — — V V (2) (2) VIL VIL — — — — 0.85 1.0 V V (2) (2) 82 83 84 85 IIH RIN IIL -30 190 30 -50 270 50 -260 350 260 μA kΩ μA (2) (2) (2) Notes: 2. Parameters tested 100% at unit probe. 3. Verified by characterization, not tested in production. MMA6222AEG 10 Sensors Freescale Semiconductor 2.4 Ref CONTROL TIMING Characteristic DSP Low-Pass Filter (Note 9) Cutoff frequency (Note 10) 86 Filter Option $0C, $1F fC(LPF) 380 400 420 Hz (7) Symbol Min Typ Max Units VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4 K/min unless otherwise specified DSP Low-Pass Filter Cutoff frequency (-3dB, referenced to 0 Hz) 87 Filter $0C, $1F 88 Filter Order Filter $00 - $12 fC(LPF) OLPF tXY fOSC fMON tCSRES nPOLES fC BWGCELL 335 — —— 3.8 3.6 486 — 5 — 353 4 — 4.0 — 512 1 10 3 371 — 10 4.2 4.4 538 — 20 — Hz 1 ms MHz MHz μs unit kHz kHz (7) (7) (1) (1) (7) (7) (1) (7) (1) Power-On Recovery Time 89 Power applied to XOUT, YOUT valid 90 Internal Oscillator Frequency 91 Clock Monitor Threshold 92 Chip Select to Internal Reset (See Figure 2-3) 93 94 DAC Low-Pass Filter Number of Poles Cutoff Frequency 95 Sensing Element Rolloff Frequency (-3 dB) Notes: 1. 2. 3. 4. 7. 9. 10. Parameters tested 100% at final test. Parameters tested 100% at unit probe. Verified by characterization, not tested in production. (*) Indicates a FSL critical parameter (CPK > 1.67). (#) Indicates a FSL significant parameter (CPK > 1.33). Functionality verified 100% via scan. Timing characteristic is directly determined by internal oscillator frequency. Devices are trimmed at 100 Hz with 1000 Hz low-pass filter option selected. Low-pass filter characteristics match those of other Freescale accelerometer devices. Cutoff frequencies shown are -4dB referenced to 0 Hz response, to correspond with previous specifications. MMA6222AKEG Sensors Freescale Semiconductor 11 5.5V VPOR_N VDACU VPOR_A VCC POR tXY XOUT/YOUT DAC OUTPUT UNCERTAIN Figure 2-1 Power-Up Timing Figure 2-2 Power Supply Coupling - DAC Outputs MMA6222AEG 12 Sensors Freescale Semiconductor CS tCSRES INTERNAL RESET SCLK Figure 2-3 CS Reset Timing MMA6222AKEG Sensors Freescale Semiconductor 13 PACKAGE DIMENSIONS MMA6222AEG 14 Sensors Freescale Semiconductor PACKAGE DIMENSIONS MMA6222AKEG Sensors Freescale Semiconductor 15 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http:/www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. MMA6222AKEG Rev. 0 12/2009